Maitiro ekugadzira PCB Layout

PCB Layout Dhizaini Matanho

Yakadhindwa yedunhu bhodhi (PCB) dhizaini dhizaini inyanzvi yeinjiniya yakaoma inosanganisira kurongeka kwezvikamu uye zvinongedzo paPCB kuti uone mashandiro edunhu. Yakagadzirwa zvakanaka PCB dhizaini yakakosha pakuona kwakaringana chiratidzo uye kusimba kwesimba, electromagnetic kuenderana, kudziya kwekutonga, kugadzira, uye kuvimbika kwechigadzirwa. Iri gwara rakazara rinopa nhanho-ne-nhanho nzira yekugadzira inoshanda maPCB marongerwo.Maitirwo ekugadzira PCB marongerwo anosanganisira akati wandei akakosha matanho:

1. Kuronga Kuronga uye Stackup Dhizaini

Usati wanyura mune chaiyo dhizaini, zvakakosha kuita zvine hungwaru kuronga:

• Nzwisisa PCB Specs: Tanga nekujairana nemadimikira ebhodhi, anosanganisira zviyero, layer count, uye density zvinodiwa.
• Schematic Ongororo: Nyatsoongorora schematic yekuona zvikamu zvemhando uye huwandu.
• Kupatsanura: Ronga nzira yekugovanisa bhodhi kuparadzanisa analogi uye zvikamu zvedhijitari zvinobudirira.
• Interface Tsanangudzo: Tsanangura nzvimbo dzekupindirana uye tsvaga yakakwira-kumhanya inodiwa nzira.
• Simba Architecture: Ronga simba rako rekuvaka uye sarudza yako decoupling zano.
• Thermal Kufunga: Ziva yakakwirira-simba zvikamu zvinoda kutonhora.
• Enclosure uye Gungano Zvipinganidzo: Funga nezvezvipingamupinyi zvinounzwa neyakavharirwa uye maitiro egungano.
• Routing Guidelines: Unganidza nhungamiro yenzira kubva kune akakodzera masosi senge IPC nevagadziri vemidziyo yekutanga (OEMs).

Paunenge uchitsanangura iyo layer stackup, funga zvinhu zvakaita sehuwandu hwematanho anodiwa, kusarudzwa kwezvinhu zvedielectric zvinoenderana nekuita, kutsunga kwehuremu hwemhangura kugonesa zvinodikanwa zvazvino, uye kuwedzera kweiyo impedance control layer kana zvichidikanwa. Gadzira ndege dzesimba uye dzepasi, uye nyatsoronga mitsara yezviratidzo. Kana dhizaini yako ichisanganisira kaviri-mativi echikamu chekuisa, sanganisira yemukati yekupisa vias kana maseru sezvinodiwa. Pamusoro pezvo, tsanangura ukobvu, kupedzisa, uye solder mask zvinodiwa kune ekunze maseru. Kuronga kunobudirira uye stackup dhizaini inoisa nhanho yekurongeka kwakanaka kwema sub-system.

2. Component Placement

Kana chikamu chekuronga chapera, danho rinotevera ndiro hurongwa hwekuiswa kwezvikamu:

• Kuunganidza: Masekete ane hukama pamwe chete kuderedza kureba kwekubatanidza uye kubatanidza ruzha.
• Signal Path Optimization: Ita shuwa kuti mambure akakosha ane nzira pfupi dzekufambisa kwemasaini.
• Kuswedera kune High-Speed ​​ICs: Chinzvimbo chepamusoro-speed integrated circuits (ICs) padhuze nekubatanidza kuderedza kuderedzwa kwechiratidzo.
• Component Footprint: Matanidza chikamu chetsoka kudivi rekuisa.
• Heat Source Distribution: Govera zvinhu zvinogadzira kupisa kudzivirira hotspots pabhodhi.
• Test Point Accessibility: Bvumira kupinda kune bvunzo mapoinzi ekugadzirisa matambudziko uye kuyedza zvinangwa.
• Fit Mukati meBoard Outline: Ita shuwa kuti zvikamu zvinokwana mukati mebhodhi reratidziro uye chengetedza kubvumidzwa kwakakodzera pakati pazvo.
• Yakamisikidzwa Oientation: Misa kutaridzika kwezvikamu zvepolarized.
• Rework Accessibility: Funga nezve rework kuwana zvinodiwa, zvichiita kuti zvive nyore kugadzirisa chero nyaya dzinogona kumuka panguva yegungano.
• Partitioned Layout: Tsanangura chaiwo nzvimbo dzekuisa kana dhizaini yako yakakamurwa kuti igare akasiyana mabhuroko anoshanda kana masisitimu.

Kuiswa kwakanaka kwechikamu hakungodzikisi kureba kwekubatanidza asi zvakare kunoderedza kubatanidza ruzha uye kushushikana kwekupisa uku uchifunga nezvezvinodiwa zvegungano.

3. Signal Trace Routing

Nezvikamu zviri munzvimbo, danho rinotevera rinosanganisira nzira yekubatanidza masaini pakati pepini:

• Trace Width and Current: Shandisai hupamhi hwekutsvaga hwakakodzera zvichienderana neiri kutakurwa kudzivirira kudonha kwemagetsi uye kupisa.
• Chiratidzo Kureba: Deredzera kureba kwezviratidzo zvakakosha, kunyanya kune yakakwirira-kumhanya wachi, kuchengetedza chiratidzo chekuvimbika.
• Angle uye Bend Guidelines: Dzivisa 90 ° angles paunenge uchifamba nemararamiro, sezvo anogona kukonzera zviratidzo. Pane kudaro, shandisa 45 ° bend.
• Noise-Sensitive Signals: Chengeta masaini anonzwa ruzha kure nevanogona kuita ruzha kudzivirira kukanganisa.
• Isolation Channels: Gadzira nzira dzekuzviparadzanisa pakati pedhijitari uye analog chiratidzo chekutsvaga kuchengetedza chiratidzo chekuvimbika.
• Impedance Matching: Shandisa impedance yekufananidza matekiniki sezvinodiwa neakakwira-frequency masaini.
• Yepamusoro-Speed ​​Interfaces: Chengetedza zvakanyanya kune nzira yekumhanyisa-kumhanya maficha kudzivirira kuderedzwa kwechiratidzo.
• Test Probe Kuwanikwa: Ita shuwa kuti test probes inogona kuwana yakakosha mapoinzi ekuyera uye kugadzirisa.
• Visual Inspection: Gonesa kuongorora kwekuona kwenzvimbo dzakakosha kuti ufambise kutonga kwemhando.
• Nzvimbo Yekugadzira: Siya nzvimbo yakakwana pakati pematanho kuti ienderane nemaitiro ekugadzira.

Kurongeka kwetrace kwakangwara kwakakosha pakuchengetedza impedance inodzorwa, kuderedza kupindirana kwemagetsi ( EMI ), uye kuchengetedza hunhu hwechiratidzo uku uchivimbisa kuti PCB iri nyore kuyedza nekuongorora.

4. Power Distribution uye Decoupling

Iyo yakanyatsofungwa-out simba yekugovera network yakakosha kune yakagadzikana kushanda kwedunhu rako. Muchikamu chino, iwe unofanirwawo kugadzirisa decoupling:

• Power Distribution: Shandisa simba uye ndege dzepasi kuti zvinyatso kugovera ikozvino mubhodhi rose.
• Kugadziriswa Kwendege: Sarudza pakati pekuparadzana uye ndege dzakatenderedza zvinoenderana nezvinodiwa nedhizaini yako.
• Layer Stackup: Ita shuwa kuti stackup masangweji anoisa chiratidzo pakati pemagetsi ndege.
• Mabatiro eMasimba: Shandisa yakafara trace kana mapolygoni kuona yakaderera-impedance yekubatanidza yekugovera magetsi.
• Yemunharaunda Vias yeSimba: Wedzera yemuno vias muchikamu mapedhi kuti ubatanidze zvishandiso zvakanangana nendege yemagetsi.
• Interlayer Interconnects: Sanganisira mikobvu yekubatanidza pakati pematanho kuti ifambise kufambisa kwesimba.
• Decoupling Capacitors: Isai bypass capacitors padyo neI ICs pane imwechete layer.
• Pfupi Yekutevera Kureba: Chengetedza kureba kwekutsvaga pakati pecapacitor nepini yeIC kusvika kushoma.
• Capacitor Sarudzo: Sarudza akakodzera capacitor kune ese akakwira-frequency (HF) uye yakaderera-frequency (LF) decoupling.
• Bulk Capacitance: Govera yakakwana yakawanda capacitance mukati mebhodhi kuchengetedza yakagadzikana mazinga emagetsi.

Inoshanda simba rekugovera network uye yakanyatso shandiswa decoupling zano rinoona kuendeswa kwesimba rakachena uye rakagadzikana kune zvese zvikamu pabhodhi.

5. Thermal Management

Zvinhu zvinogadzira kupisa zvinoda kutonhora kwakaringana kudzivirira kupisa. Heano maitiro aunofanirwa kugadzirisa thermal management:

• Heatsinks: Ziva zvinhu zvinoda heatsinks nekuda kwesimba rakanyanya kunyura uye ive nechokwadi chekusangana kwakanyanya pakati pezvikamu uye heatsinks.
• Kuyerera Kwemhepo: Ita shuwa kuti pane mhepo yakakwana pamusoro peheatsinks uye mavhavha ekufambisa kupisa.
• Thermal Vias: Pasi pemidziyo inopisa, shandisa thermal kuburikidza kubatsira kubvisa kupisa zvinobudirira.
• Internal Thermal Layers: Batanidza mukati mukati mekupisa kwemukati mukati mebhodhi, yakabatanidzwa ne vias, kuti ipe inobudirira kupisa kupararira.
• Copper Planes: Batanidza ndege dzakakora dzemhangura mudhizaini yako kuti uwedzere rubatsiro mukupararira kwekupisa.
• Thermal Pads: Tsanangura mapedhi anopisa emidziyo inoda kutonhora.
• Spotting Hot Spots: Nyatsoongorora dhizaini yako yenzvimbo dzinopisa uye tembiricha gradient.

Kubudirira kwekutonga kwemafuta kunovimbisa kuti kupisa kunobviswa kubva kune yakakosha-yepamusoro-simba zvikamu, kudzivirira kupisa uye kuve nechokwadi chekuvimbika kwePCB yako.

6. Mechanical Features

Zvimwe zvemechanicha zvinhu uye maficha anowedzerwa kune dhizaini kuti afambise akasiyana mativi ebhodhi:

• Makomba Anokwirisa: Sanganisira maburi ekumisikidza ane dhayamita chaiyo uye annular ring spacing yekunamatira yakachengeteka.
• Zvibatanidza: Wedzera mapendero ekubatanidza, testpoints, zviratidzo, switch, uye chero zvimwe zvinhu zvinodiwa.
• Mechanical Brackets: Kana zvichidikanwa, batanidza mabhureki, zvisungiso, uye zvisimbisi kuti uwedzere kugadzikana kwemichina.
• Component Markings: Maka zviripachena maID ID, polarity, uye ratings sezvinodiwa pakuungana uye kugadzirisa.
• Bhodhi Rondedzero: Sanganisira iyo bhodhi rondedzero ine yakakodzera makona chamfers kuitira nyore kubata uye kusangana.
• Gungano Mirayiridzo: Kana zvichidikanwa, ipa chero mirairo yegungano inodiwa kutungamira maitiro ekugadzira uye kuiswa kwechikamu.

Aya mamechanicha maficha anofambisa kukwira, kuungana, uye kushandiswa kwePCB, kuwedzera kune mashandiro uye kuita kwechigadzirwa chekupedzisira.

7. Kupedzisa Layer Stack

Nemaitiro ekufambisa apera, yave nguva yekupedzisa zvidimbu zvega:

• Ongororo yeLayer: Nyatsoongorora maitirwo ese pamatanho ega uye ronga patsva sezvinodiwa kuti ukwidze dhizaini.
• Kugadzira Spacing Violations: Tarisa uone chero kukanganisa kwenzvimbo kunogona kukanganisa kugadzira kwebhodhi.
• Layer Alignment: Tarisa kuti kurongeka pakati pezvikamu zve vias uye zvimwe zvinhu kwakarurama.
• Reference Markers: Wedzera mareferenzi mamaki kutungamira kurongeka kwezvikamu panguva yekuungana.
• Testpoints: Isa ma testpoints pazvinenge zvakakodzera kuti uongorore imwe neimwe layer.
• Plane Void Area: Tarisa kune chero nzvimbo dzisina ndege dzinogona kukanganisa kuyerera kwazvino.
• Minimum Annular Rings: Tsanangura mashoma annular mhete kuti vias isangane nekugadzira zviyero.
• Margin Compliance: Simbisa kuti miganho kubva kumucheto kwebhodhi inozadzisa zvinodiwa.

Aya matanho anovimbisa kuti yakadzama yemukati layer inovaka yakakwana uye yakagadzirira kubatanidzwa mune yekupedzisira dhizaini.

8. Design Rule Checks

Chikamu chinotevera chinosanganisira kusimbisa marongerwo ePCB zvichienderana nemitemo yakasiyana-siyana yekugadzira:

• Mitemo yeMagetsi: Tarisai nzvimbo yakakwana pakati pematanho, mapadhi, uye ndege zvichienderana nemazinga emagetsi uye zvinodiwa zvekudzivirira.
• Routing Rules: Ita shuwa kuti kuteedzera upamhi, kucheneruka, kuburikidza nehukuru, uye kudzivirira kweacute angles kunosangana nezvinodiwa zvekugadzira.
• Manufacturing Mitemo: Ona kuti dhizaini inotevedzera kugona kwePCB yekugadzira maitiro, senge yakaderera track hupamhi, gomba saizi, uye nzvimbo.

Zvishandiso zvakaita sevakagadziriRule mukati meCadence Allegro inogona kuodha macheki aya, ichienzanisa dhizaini nemaitiro eindasitiri, kusanganisira ayo anobva kuIPC neOEMs. Chero zvikanganiso zvakaonekwa zvinofanirwa kugadziriswa kuti ive nechokwadi chekugadzirwa kwePCB.

9. DFX Analysis

Nhanho inotevera mukuita ndeyekusimbisa dhizaini uchishandisa Dhizaini Yekunakisa (DFx) simulations:

• Chiratidzo Kuvimbika: Ita masimulation kuti utarise zviratidzo zvechiratidzo, crosstalk, uye nyaya dzenguva, uchishandisa IBIS modhi.
• Simba Kuvimbika: Tevedzera kugadzikana kwesimba rekugovera network, kuona resonance nyaya.
• Thermal Analysis: Simbisa tembiricha profiles kuburikidza nekushandisa maturusi akaita seIcePak, kuve nechokwadi chekuti dhizaini inogona kubata kusiyanisa kwekushisa.
• EMI / EMC: Modhi yakavhenekerwa uye yakaitisa emissions yekuongorora electromagnetic interference (EMI) uye electromagnetic kuenderana (EMC).
• Mechanical Kufunga: Ita ongororo yekushushikana, kudedera, uye kuvhunduka macheki kuti ive nechokwadi chekuti bhodhi rinogona kumirisana nemakanika.

Aya masimulation anobatsira kusimbisa kuti dhizaini inosangana nezvinodiwa zvese zvinoshanda uye zvakatemwa isati yaburitswa kugadzirwa.

10. Kugadzirisa Kurongeka

Chikamu chekupedzisira chePCB dhizaini maitiro anosanganisira kugadzirisa chero nyaya dzakaonekwa panguva yekuongorora uye kugadzirisa:

• Trace Tuning: Gadzirisa hupamhi hwekutsvaga, nzvimbo, uye dhizaini stackup zvigadziriso sezvinodiwa.
• Deredza Kubatana: Ita zvigadziriso zvemagadzirirwo kuti uderedze ruzha rwekubatanidza pakati pematanho uye zvikamu.
• Shielding uye Bandgaps: Kana zvichidikanwa, wedzera zvidziviriro uye mabhandigapu kuti uvandudze kutendeseka kwechiratidzo uye kuderedza kupindira.
• Kuparadzira Kupisa uye Kufambiswa Kwemhepo Kuvandudza: Gadzirisa dhizaini kuti uwedzere kupararira kwekupisa uye kuyerera kwemhepo kuitira kutonhora kwakanaka.
• Decoupling Refinement: Gadzirisa iyo decoupling zano zvichibva pane resonance modhi dzakaonekwa panguva yekuongorora.
• Trace Angles uye Impedance Matching: Gadzirisa trace angles uye impedance matching kuti uvandudze chiratidzo chekuvimbika.
• Plane Shape Kugadziriswa: Shandura maumbirwo endege kudzikisa resonant peaks uye kuderedza EMI.
• Signal Rerouting: Dzorerazve masaini sezvinodiwa kugadzirisa EMI uye EMC zvinonetsa.
• Iterative Maitirwo: Ramba uchidzokorora pane dhizaini, kugadzirisa nyaya uye kugadzirisa zvinoenderana nemhinduro yekuongorora kusvika dhizaini yakagadziriswa yawanikwa.

Maitiro Akanakisa eEMC uye RF

Kubudirira pakushanda kwemagetsi anoenderana nemagetsi (EMC) uye mafrequency eredhiyo (RF) kunosanganisira kushandisa nzira dzakasiyana-siyana dzekugadzira dzakanakisa kupfuura kudzora impedance. Heano mamwe maitiro ekuwedzera:

1. Solid Reference Planes: Kuchengetedza ndege dzakasimba uye dzinoenderera mberi kwakakosha pakugadzirisa mafambiro ekudzoka uye kuderedza zvishwe zvepasi. Ndege dzepasi uye dzemagetsi dzinofanirwa kuve dzisina kukanganiswa uye kuchengetwa padyo sezvinobvira kuti zviratidzire maseru ekuderedza loop nzvimbo uye inductance. Izvi zvinobatsira kuderedza kukanganiswa kwemagetsi (EMI) uye kuve nechokwadi chekuvimbika kwechiratidzo.
2. Decoupling Capacitors uye Power Distribution: Kuiswa kwakakodzera kwe decoupling capacitors kwakakosha pakudzikamisa kugovera kwemagetsi uye kuderedza ruzha. Decoupling capacitors inofanirwa kuiswa zvine hungwaru padyo nepini dzesimba dzezvinhu zvinoshanda kuti ipe yakaderera impedance nzira ye-high-frequency ruzha uye mafungu enguva pfupi. Pamusoro pezvo, dhizaini yekugovera simba network ine yakakodzera ndege capacitance kune akasiyana voltage domains inobatsira kudzvinyirira ruzha uye kuchengetedza yakagadzikana kuendesa magetsi.
3. mupise: Kubatanidza mafirita muPCB dhizaini kunogona kudzikisira zvisingadiwe RF masaini uye kukanganisa. Low-pass, high-pass, bhendi-pass, uye bhendi-stop mafirita anogona kushandiswa kupfuudza kana kuvharira mamwe ma frequency range. Aya mafirita anogona kubatanidzwa munzira dzechiratidzo, tambo dzemagetsi, kana RF yekutapurirana mitsara yekusimudzira EMC mashandiro uye kuderedza kukanganiswa kwekunze.
4. kudzivirirwa: Kushandisa nzira dzekudzivirira dzakadai sekudirwa kwemhangura, ndege dzepasi, uye masimbi akavharirwa zvinogona kubatsira kuve nemwaranzi yemagetsi uye kudzivirira kuti isakanganise maseketi ekuvakidzana kana midziyo yekunze. Kudzivirira kunogona kunyanya kukoshesa kune RF maseketi kana anonzwisa analog zvikamu zvinokanganisa kukanganisa. Zvivharo zvinofanirwa kuve zvakadzika pasi zvakanaka kuti zvipe chivharo chekudzivirira chinoshanda.
5. Grounding uye Signal Kuzviparadzanisa nevamwe: Kuve nechokwadi chemaitiro ekugadzirisa kwakakodzera, kusanganisira nyeredzi pasi uye kuparadzaniswa kwechiratidzo, zvakakosha pakuderedza zvishwe zvepasi uye kuderedza kubatanidza ruzha pakati pezvikamu zvakasiyana zvePCB. Kuparadzanisa masaini anonzwisisika eanalog kubva kumasaini edhijitari uye kushandisa mutsauko wekusaina nzira kunogona kuwedzera kusadzivirirwa kune ruzha uye kugadzirisa EMC mashandiro.
6. EMC Kuteerera Kuyedzwa: Kuita zvakakwana EMC kutevedzera bvunzo panguva yekuvandudza kunobatsira kuona uye kugadzirisa zvinogona kuitika EMC nyaya pakutanga kwekugadzira maitiro. Kuyedzwa kwekuteerera kunosanganisira kuisa iyo PCB pasi pemagineti emagetsi minda uye kuongorora mashandiro ayo zvichipesana nezviyero zvemitemo. Nekuona nekugadzirisa nyaya dzeEMC zvine simba, vagadziri vanogona kudzivirira kudhizainazve uye kuve nechokwadi chekuteedzera zvinodiwa.

Nekubatanidza aya akanakisa dhizaini maitiro eEMC neRF muPCB dhizaini uye dhizaini, mainjiniya anogona kusimudzira kuita kwese, kuvimbika, uye kuenderana kwemagetsi emagetsi masisitimu. Inoshanda EMC uye RF dhizaini haingodzikisi njodzi yekukanganiswa kwemagetsi asiwo inobatsira mukushanda kusina musono kwemidziyo yemagetsi munzvimbo dzakasiyana siyana.

mhedziso

Muchidimbu, dhizaini yePCB dhizaini inoda kuronga zvine hungwaru uye nzira yakarongeka inosanganisira kupatsanura, layer stackup, chikamu chekuisa, routing dhizaini, kugovera simba, kudziya kwemafuta, maficha emuchina, dhizaini yekuongorora, DFx kuongororwa, uye kugadzirisa dhizaini. Nekuomerera kune aya akanakisa maitiro, unogona kugadzira inogadzirwa dhizaini yakagadziridzwa yemagetsi, yekupisa, uye mekiniki kuita, zvichikonzera PCB yakavimbika ine yakanakisa siginecha uye simba kuperera kune yakarongwa application.