Kugadzira PCB yeCeramic Base & Masevhisi eSMT Assembly

PCB yesimbi inoshandisa alumina (Al₂O₃), aluminium nitride (AlN), kana silicon nitride (Si₃N₄) sesimbi yemakanika uye insulator yemagetsi — hapana dielectric layer pakati pe copper circuit nenzvimbo yekumisikidza. Kudzivirira kupisa kunotangira pa 0.3°C/W (AlN DBC) kusvika pa 0.8°C/W (alumina DBC), zvichienzaniswa ne 3°C/W yealuminium MCPCB uye 15°C/W yeFR4.

Gwaro iri rinotarisa pane zvinotevera mushure mekusarudzwa kwezvinhu: kubatanidzwa kwemafuta, ukobvu hwepasi, kupedzwa kwenzvimbo, nzira dzekukundikana, kuungana, uye kunyora magadzirirwo.

1) Ceramic Base PCB muThermal Stack

Chigadziko checeramic hachisi chega chinopa kupisa. Chigadziko chimwe chete chiri mudura chinobva panosangana mudziyo kuenda kuchinhu chinotonhodza - uye zvikamu zviri pamusoro nezviri pasi pacho zvinokanganisa zvakananga kuramba kupisa kwesystem.

Pedhi resilicone TIM re50 µm pa3 W/m·K rinowedzera 0.5–1.0°C/W pamusoro pebhodhi reAlN DBC re0.3°C/W, zvichiita kuti ripetwe kaviri. Mumasystem mazhinji, kuchinja kubva kusilicone TIM kuenda kuchinhu chinochinja-chinja kunodzoreredza tembiricha yakawanda yejunction pane kusimudzira kubva kualumina kuenda kuAlN.

Sarudzo nhatu dzezvinotsanangurwa dzinokanganisa stack yese:

• Kufukidza kwemhangura pasi: Mhangura yepasi yakafukidza zvizere inoderedza kuramba kupararira kwechinhu chinopindirana neceramic-to-TIM. Kufukidza zvishoma kunoita kuti pave nenzvimbo dzisina kusimba dzekupisa pasinei nechinhu chiri pasi pevhu.
• Kureba kwemhangura pasi: ≤25 µm TIR inogonesa TIM yakatetepa, ine simba repamusoro (phase-change, solder, silver sinter). Iyi spec imwe chete inogona kushandura TIM conductivity kubva pa3 W/m·K kuenda ku150+ W/m·K.
• Substrate ukobvu: Kutetepa kunoderedza kuramba kwemhepo yakamira asi kunoderedzawo kupararira kwemativi. Kune michina ine madhayi makuru, kutetepa kunogara kuri nani. Kune michina ine madhayi madiki iri pachigadziko chikuru, gadzirai musati masarudza.

2) Sarudzo yeKukora kweSubstrate

Ukobvu hunodzora zvinhu zviviri panguva imwe chete: kuramba kupisa (kutetepa = zviri nani) uye kusimba kwemuchina (ukobvu = hwakasimba). Iyo 0.635 mm yakajairika yakakodzera mashandisirwo mazhinji - asi kwete ese.

Chirambidzo chimwe chete chinokunda kugadziriswa kwekupisa: voltage yekuparadzanisa. Pa 17 kV/mm dielectric strength, 0.635 mm alumina substrate inopa inenge 10 kV working isolation. Mashandisirwo anoda >10 kV haagone kushandisa substrates dzakatetepa pasinei nebhajeti rekupisa.

3) Sarudzo dzeKupedzisa Pamusoro

Kupera kwechinhu pamusoro kunosarudza kugona kusungirira, kugona kusungirira waya, uye nguva yekushanda kwayo pasherufu. Chinofanira kutsanangurwa pamusoro nepazasi zvakasiyana - uye chinofanira kuenderana nehurongwa hwese hwekugadzira, kwete kutanga chete.

Kana zvese zviri zviviri SMT newaya zvichidikanwa pabhodhi rimwe chete, sarudza goridhe rakaoma pamapedhi ese. Kupedzisa kweZonal (ENIG pamapedhi eSMT, goridhe rakaoma pamapedhi emabond) kunodhura zvakanyanya mukuita kupfuura kukosha kwekuchengetedza goridhe.

4) Maitiro Ekutadza Mumunda

Kukundikana kwePCB yeCeramic base kunoitika nekugadzira uye kuburikidza neinterfacial — kwete nemakemikari kana hunyoro seFR4. Nzira nhatu huru dzekutadza kushanda dzinogona kudzivirirwa nekugadzirwa.

Kutsemuka kunokonzerwa nekukwiza ndiko kunonyanya kukundikana mumunda. Kukwiza sikuruu isina simbi kunoshandisa zvinhu zvinorema izvo alumina (kusimba kwekutyoka kwe3–4 MPa·m½) isingagoni kugadzikwa. Kugadzirisa: simbi dzakasungirirwa kana kuti dzakasungirirwa ne epoxy-bonded panzvimbo dzese dzesikuruu; torque remuganho 0.3–0.5 N·m yeM3 kuburikidza nearuminiyamu bushings mu0.635 mm alumina. Kunamira pa cold plate kunobvisa zvachose zvinhu zvinorema zvekukwiza.

Kubviswa kweDBC pasi pekupisa kunoitika kana hunhu hwebond huri mumucheto kana kuti copper geometry ichikonzera kuwanda kwekushushikana. Zvitsuwa zvikuru zvecopper zvakaparadzana zvine mipendero isingatarisirwi zvine njodzi huru. Kugadzirisa: dzivisa copper patch aspect ratios >5:1; taura simba rebond peel ≥20 N/cm²; inoda thermal shock test kuJEDEC JESD22-A104 pakuongororwa kwekutanga.

Kuchekwa kwemucheto uye kupararira kwetsvina kunotanga nekukuvadzwa kwekubata - kuputika kudiki kunounzwa panguva yekupenya kana bhodhi rakadonhedzwa. Kutsemuka uku hakuoneki pakuongororwa asi kunopararira kudunhu rakavhurika pasi pekupisa. Kugadzirisa: makona akachekwa (radius ≥0.3 mm); ≥0.5 mm clearance yemhangura kubva kumucheto kuenda kumucheto; kuonekwa kwetsvina yefluorescent yenzvimbo dzakavimbika zvakanyanya.

Kuneta kwesimbi inosungirirwa pachigadziko kunokanganisa silicon inosungirirwa pachigadziko kualumina — Kusawirirana kweCTE kwe ~3.5 ppm/°C kunoita kuti pave nekunetseka kunopedza SAC305 joints mukati me1,000–3,000 automotive thermal cycles. Gadzirisa: shandisa AlN substrates yeGaN/SiC devices (CTE inosaenderana ~1.1 ppm/°C); tsanangura silver sintering yesimbi inosungirirwa pachigadziko — silver inopiswa inopona 10,000+ cycles pa ΔT = 150°C; inoda ≤5% void fraction neX-ray.

5) Kuungana uye Kubatanidzwa

Magadzirirwo eFR4 akajairika anokuvadza zvinhu zveceramic. Kusiyana kwacho hakusi kwesarudzo yekugadzirisa - kunodzivirira kutsemuka uye kutadza kwemajoini izvo zvakaoma kuona mushure mechiitiko chacho.

Kudzokorora kwemvura: Deredza mwero wemvura kusvika pa1–2°C/s (zvichienzaniswa ne3°C/s yeFR4). Wedzera nzvimbo yekunyorovesa pa150–180°C kusvika kumasekonzi 90–120 kuti uenzanise tembiricha yese mu ceramic usati wapinda mukuyerera kwemvura. Tembiricha yepamusoro uye nguva iri pamusoro pemvura hazvichinji.

Sarudzo dzekubatanidza nechinhu zvichienderana nezvinodiwa zvekuvimbika:

• SAC305 solder: Standard yekushandiswa kusiri kwemotokari; ≤10% chikamu chisina chinhu neX-ray; yakakodzera kutenderera pasi pe3,000 paΔT ≤ 100°C
• AuSn / AuGe eutectic: Mapakeji ekudzivirira kupisa uye kushandiswa pakupisa kwakanyanya; zvinoda mapedhi akapedzwa negoridhe; kuomarara kwemajoini kwakanyanya kupfuura silver sinter
• Kupisa sirivha: Zvakanakira mota nendege; 150–250 W/m·K joint conductivity; hapana njodzi yekunyunguduka kwemvura mumabasa anotevera; inoda mhangura isina chinhu kana Ag finish pama die-attach pads

Kubatana kwemagetsi — zvinobatanidza zvinodzvanywa nepress-fit hazvigone kushandiswa pa ceramic. Sarudzo dzakajairika: misoro yepin yakasungirirwa; zvinobatanidza zvemucheto zvine ma spring contacts; ribhoni/flex cable bonding; tungamira pamusoro pePCB yesystem (shandisa ceramic module sechinhu, gadzira thermal pad uye solder volume ye ceramic mass neCTE).

Kubatanidzwa kweplate inotonhora, kunodzivirira kupisa kwakadzika kusvika kwepamusoro: solder/braze → sinter yesirivha → phase-change TIM ine clamp → thermal grease ine screw clamp.

6) Maitiro Ekunyora Tsanangudzo Yakazara

Magadzirirwo asina kukwana ndiwo anonyanya kukonzera kunonoka kwekutaura uye kutadza kwechinhu chekutanga — kwete kugona kugadzira. RFQ yePCB yeceramic base inoda aya ma parameter gumi nemaviri, ese ari:

1. Substrate zvinhu uye kuchena - Al₂O₃ 96%, Al₂O₃ 99.6%, AlN, kana Si₃N₄
2. Ukobvu hwe substrate ± kushivirira — semuenzaniso, 0.635 mm ± 0.05 mm
3. Maitiro ekugadzira simbi — DBC, firimu gobvu, firimu diki, kana AMB
4. Ukobvu hwemhangura, pamusoro nepazasi — yakatsanangurwa yega; semuenzaniso, 0.3 mm / 0.3 mm yeDBC
5. Kupedzisa pamusoro, kumusoro nepasi — kazhinji kacho hakasiyiwi; kupedzisa kwepasi kunofanira kuenderana nenzira yekunamira plate inotonhora
6. Zviyero zvebhodhi uye kushivirira — sanganisira kona yekona kana radius kana zvichidikanwa
7. Upamhi hushoma hwetrace nenzvimbo — simbisa kuti hazvienderane nekwaniso yemugadziri usati wapedzisa kuronga
8. Kuburikidza nezvinodiwa — dhayamita, zvinhu zvakazara, kupedzisa
9. Zvinodiwa pakuedza magetsi — voltage inoenderera mberi/inopatsanurwa; voltage ye-hi-pot kana zvichidikanwa; nzvimbo yechipiri inowanzosiyiwa
10. Zvinodiwa zvekuita — huwandu hwemhepo inodziya uye madenderedzwa; simba rekubatanidza; chiyero chinoshanda (AEC-Q101, IEC 60068-2-14, MIL-PRF-38534)
11. Kupatsanurwa kwehuwandu — mhando yemuenzaniso nekugadzirwa zvinogona kufamba nenzira dzakasiyana nemitengo yakasiyana uye nguva dzekutanga
12. Kuisa machira muzvikamu zvakasiyana (magadzirirwo ezvikamu zvakawanda) — kutevedzana kwechikamu checeramic neconductor; kuburikidza nekuzadza nekuvhara kweLTCC kana co-fired

7) Zvigadzirwa Zvakabatana

• DBC Substrate: Kuvakwa kwePCB yesimbi yeceramic kunonyanya kushandiswa pakugadzira magetsi emagetsi — mhangura yakabatana nesimbi yeceramic pa ~1,065°C. Kana mainjiniya vachiti "PCB yesimbi yeceramic" yemamodule emagetsi, vanowanzoreva substrate yeDBC ine mapatani.
• Firimu Gobvu Ceramic PCB: Madhairekita akadhindwa nechidzitiro (5–20 µm) anopfurwa pa 850–1,000°C. Mutengo wakaderera pane DBC pakushandisa magetsi ari pakati nepakati; inogonesa ma resistors nema capacitors akabatanidzwa mukati me ceramic base.
• Chikamu cheAMB: Active Metal Brazing inoshandisa Ag-Cu-Ti braze pa800–900°C. Chisungo chakasimba checopper-ceramic kupfuura DBC; chinofarirwa kushandiswa paSi₃N₄ base substrates uye automotive modules dzinoda hupenyu hwe10,000+ thermal cycle.
• LTCC: Ceramic ine layer yakawanda ine ma conductors akaiswa mukati uye vias zvinobatidzwa pamwe chete pa 850–900°C. Inoshandiswa kuma RF modules uye multi-chip packages apo ceramic base iri three-dimensional interconnect structure, kwete chete thermal substrate.
• PCB yeIMS / Metal-Core: Imwe nzira inodhura zvishoma kana bhajeti yekupisa yeceramic isingadiwi. Kudzivirira kupisa kwakakwirira 3–5× kupfuura alumina DBC. Sarudzo chaiyo kana bhajeti yekupisa yashandiswa ichibvumira.
• Ceramic Base PCB Assembly: Kubatanidza simbi, waya, uye kuyerera kwemvura pakupisa kwakanyanya pamwe chete nekugadzirwa kwe substrate kunoderedza njodzi yekubata uye kunoita kuti mashandiro aenderane.

Mibvunzo Inonyanya Kubvunzwa

Ndeupi musiyano uripo pakati pePCB yesimbi yeceramic neDBC substrate?

DBC (Direct Bonded Copper) inzira yesimbi — copper foil inosungirirwa kuceramic pa ~1,065°C. DBC substrates dzese iceramic base PCBs, asi ceramic base PCBs dzinosanganisirawo gobvu film uye thin film constructions. Mumagetsi emagetsi, mazwi maviri aya anowanzo shandiswa achichinjana; muRF applications, thin film paceramic base yakajairika kupfuura DBC.

Ko PCB yesimbi inogona kutsiva PCB yesimbi zvakananga here?

Kwete pasina dhizaini itsva. Ceramic inoda simbi dzakasungirirwa pamaburi ekukwirisa, mwero wekudzikisa mvura zvishoma nezvishoma (1–2°C/s), hapana zvinobatanidza zvinodzvanywa, uye mitemo yakasiyana ye singulation. Kuwedzera kwekupisa kwemhepo ndiko chaiko — 0.3–0.8°C/W vs. 3°C/W yealuminium MCPCB — asi kuchinjana uku kunoda shanduko dzakajeka pakukwirisa, kubatana, uye maitiro ekubatanidza.

Ndeipi finish yepamusoro inodiwa kune SMT uye wire bonding?

Goridhe rakaoma (3–5 µm Ni / 0.5–2.0 µm Au electroplated) rinodiwa. Rutivi rwegoridhe rweENIG rwe ~0.05 µm rwakatetepa zvakanyanya kuti rusakwanise kusungirirwa kwewaya uye runoita kuti bond lift-off isashande zvakanaka. Sarudza goridhe rakaoma pamapedhi ese kana SMT nebondidhe yewaya zviri muchikamu chekubatanidza.

Sei maPCB esimbi eceramic achitsemuka mushure mekupasa bvunzo?

Kupwanyika kwakawanda mushure mekuongorora kunobva mukuita kwekubatanidza, kwete zvikanganiso zve substrate: kugadzika screw isina chinhu, zvisungo zvakapfumbira zvakanyanya, kana nzvimbo dzisina kuenzana dze cold plate. Kupwanyika kudiki kunobva mu singulation — kusingaonekwe pakuongororwa kwakajairika — kunopararirawo kuma open circuits pasi pe thermal cycling. Kuonekwa kwe fluorescent crack pakugadzika simbi kunodzivirira nzira dzese dziri mbiri dzekutadza kushanda.

Ndeipi nguva yekutungamira kwezvigadzirwa zvePCB zveceramic base?

Alumina DBC: Mavhiki 2–4. AlN DBC: Mavhiki 3–5. Firimu gobvu: Mavhiki 3–4. Firimu gobvu: Mavhiki 4–6. Zviyero zvakagadzirwa zvinowedzera vhiki 1–2. Kupa maparamita ese gumi nemaviri eRFQ kunobvisa chikonzero chinowanzo konzera kunonoka.

Ko PCB yesimbi yeceramic yakafanana nePCB inodziya zvakanyanya here?

Kwete. PCB inodziya zvakanyanya inofukidza ceramic, PTFE/girazi, polyimide, uye simbi-core substrates — chero bhodhi rakaongororwa kupfuura muganho weFR4 we130–150°C. Base reCeramic ndiro boka rinoshanda zvakanyanya: tembiricha dzekushanda dziri pamusoro pe300°C, thermal conductivity iri pamusoro pe60–600× kupfuura polymer dielectrics. PTFE inodziya zvakanyanya asi haina mukana wethermal conductivity.

Tora Bhokisi rePCB yako yeCeramic Base