DBC Substrates dzeCeramic PCBs nePower Modules

Zvishandiso zveDBC (Direct Bonded Copper) zvinoshandiswa zvakanyanya mumamodule emagetsi uye mumagadzirirwo emagetsi anopisa zvakanyanya uko kutamiswa kwekupisa kwakanaka uye kupatsanurwa kwemagetsi kwakakosha. Peji rino rinopa pfupiso inoshanda yezvivakwa zveDBC, zvinhu, zvinhu zvekugadzira, uye kuti zvinoenzaniswa sei nedzimwe tekinoroji dzePCB dzeceramic.

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KuHighleap Electronics, tiri vagadziri vePCB vanoshanda zvizere vachipa maPCB eceramic, maDBC substrates, mabhodhi esimbi, maPCB akawanda, uye mabasa ePCB akazara.

DBC substrates ndeimwe yemhinduro dzekuchengetedza kupisa dzatinotsigira pakushandisa simba guru uye kuvimbika kwakanyanya senge magetsi emagetsi, mamota emotokari, uye michina yeindasitiri. Gwaro iri rinotsanangura mashandiro anoita tekinoroji yeDBC, nguva yainofanira kushandiswa, uye kuti inokwana sei mune sarudzo dzakakura dzePCB neceramic PCB.

Wana Quick Quote Iye zvino

Wagadzirira kuongorora hunyanzvi hwedu hwepamusoro here? Shanyira peji redu rakatsaurirwa rekugadzira PCB yeceramic kana kuti dzidza nezvemabasa edu ese ekugadzira PCB.

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1) Chii chinonzi DBC Substrate?

DBC substrate, inozivikanwawo se direct bonded copper substrate , imhando ye ceramic circuit board umo copper foil inosungirirwa zvakananga kune rimwe kana mativi ese e ceramic base material kuburikidza ne high-tempera oxidation process. Kusiyana nenzira dzechinyakare dzePCB dzinoshandisa manamatiro, tekinoroji yeDBC inogadzira metallurgical bond pakati pe copper ne ceramic, zvichikonzera kupisa kwakanyanya uye kuvimbika kwe mechanical.

Nzira yekubatanidza inosanganisira kupisa mhangura neceramic kusvika patembiricha iri pedyo ne copper-oxygen eutectic point (inenge 1065°C). Patembiricha iyi, jira rakatetepa re copper oxide rinoumbwa panzvimbo inopindirana, iro rinozobatana ne ceramic surface kugadzira chisungo chinogara kwenguva refu, chakasimba. Maitiro aya anobvisa kudiwa kwe intermediate bonding agents uye anovimbisa kuti kupisa kwakanyanya pakati pe copper circuit layer ne ceramic substrate.

Zvigadziko zveDBC zvinowanzova nehukobvu hwemhangura hunotangira pa 0.127mm kusvika pa 0.635mm (5 mil kusvika 25 mil), nehukobvu hweceramic hunotangira pa 0.25mm kusvika pa 1.0mm. Musanganiswa uyu unopa simba rakanaka remagetsi rekushandisa magetsi ane simba rakawanda uye kupisa kwakanyanya kune zvishandiso zvemagetsi.

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2) Mashandisirwo Anoitwa DBC Substrates Mukugadzirwa kwePCB

Kunyange zvazvo ma substrate eDBC akafanana nemabhodhi edunhu akadhindwa, maitiro avo ekugadzira akasiyana zvakanyanya nemafambisirwo ebasa ePCB akajairwa . MaPCB echinyakare anoshandisa ma laminate eorganic (akadai seFR-4) ane electroplated kana laminated copper, nepo ma substrate eDBC achida michina yakasarudzika yekubatanidza tembiricha yepamusoro uye maovheni emhepo anodzorwa.

Kubatanidzwa kweDBC substrates mumagetsi kunowanzo tevera nzira iyi: kugadzirira ceramic substrate, copper bonding, circuit patterning kuburikidza ne photolithography uye etching, surface finishing, uye pakupedzisira component installation. Vagadziri vazhinji vemagetsi module vanogamuchira pattern DBC substrates kubva kuvatengesi vane hunyanzvi vakaita seHighleap Electronics, vobva vaita die attach, wire bonding, uye encapsulation munzvimbo dzavo.

Kunzwisisa maitiro ekugadzira DBC kwakakosha kune mainjiniya vanosarudza ma substrates aya, sezvo ma process parameters achikanganisa zvakananga kuvimbika kwe thermal cycling, simba re bond, uye kushanda kwenguva refu munzvimbo dzinoda simba.

3) Mashandisirwo Akajairika eDBC Substrates

Zvishandiso zveDBC zvinoshanda semusana wemagetsi emagetsi mumaindasitiri akasiyana-siyana. Musanganiswa wazvo wakasiyana wekupisa kwakanyanya, kupatsanurwa kwemagetsi kwakanaka, uye kugadzikana kwemakanika zvinoita kuti zvive zvakakosha pakushandisa uko kutonga kupisa kwakakosha.

• IGBT uye Power Modules: Mamodule eInsulated Gate Bipolar Transistor emadhiraivha emota dzeindasitiri, mainverters etraction, uye masisitimu esimba rinodzokororwa anovimba zvakanyanya neDBC substrates. Substrate iyi inopa zvese kupatsanurwa kwemagetsi uye kutamiswa kwekupisa kwakanaka kubva ku semiconductor die kuenda ku cooling system.
• Mota dzeMagetsi Magetsi: Ma EV inverters, ma charger ari mubhazi, uye ma DC-DC converters anoda ma substrates anokwanisa kubata simba rakawanda uku achichengetedza kuvimbika kwemamiriyoni emagetsi anodziya.
• Mwenje we LED une simba guru: Mapakeji e LED anopenya zvakanyanya uye magadzirirwo e COB (Chip-on-Board) anoshandisa ma DBC substrates kudzora kupisa kukuru kunounzwa nema LED arrays akazara.
• Aerospace uye Dziviriro: Masisitimu eradar, ma amplifiers emagetsi, uye ma avionics zvinoda ma substrates anochengetedza mashandiro mukati mekupisa kwakanyanya uye mamiriro ekushanda akaomarara.
• Industrial Automation: Madhiraivha eServo, michina yekuwedera, uye magetsi zvinobatsirwa nekugona kweDBC substrates kubata mafungu emvura akakwira ukuwo zvichichengetedza kugadzikana kwekupisa.
• Renewable Energy Systems: Ma-solar inverters nema-wind turbine converters anoshandisa tekinoroji yeDBC kuti agare akavimbika kwenguva refu mukuisa kunze.

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4) Zvakanakira Mashandiro Akakosha

DBC substrates dzinopa mabhenefiti akakosha anotsanangura kutonga kwavo mukushandiswa kwemagetsi emagetsi:

• Superior Thermal Conductivity: Chisungo chemhangura neceramic chakananga chinoderedza kuramba kwekupisa. Zvishandiso zveAluminium nitride (AlN) DBC zvinogona kuita kuti kupisa kupfuure 170 W/m·K, zvichipfuura zvinhu zvePCB zveorganic.
• Yakakwira Yazvino Kutakura Kugona: Matanda emhangura akakora (anosvika 0.635mm) anogonesa maDBC substrates kutakura ma currents anopfuura 100A, zvichiita kuti akwanise kushandiswa nesimba guru uko ma PCB akajairwa angakundikana.
• Yakanakisa Magetsi Isolation: Zvinhu zveCeramic zvinopa simba re dielectric, zvine mwero we15-20 kV/mm yealumina uye zvakatokwira yealuminum nitride, zvichiita kuti ive yakachengeteka kana paine magetsi akawanda.
• Kuwedzera Kunoenderana Nekupisa: Zvigadziko zveCeramic zvine coefficients of thermal expansion (CTE) zviri pedyo nesilicon pane organic laminates, zvichideredza kushushikana pamajoini anobatana panguva yekupisa.
• Kuvimbika Kwenguva Yakareba: Chisungo chesimbi pakati pemhangura neceramic chinochengetedza kusimba kwezviuru zvenguva dzekupisa, zvichipfuura hupenyu hwezvimwe zvinoshandiswa neadhesive.

5) Zvinhu zveCeramic Zvinoshandiswa muDBC Substrates

Kusarudzwa kwezvinhu zvepasi pevhu zvinokanganisa zvakanyanya mashandiro evhu reDBC. Zvinhu zvitatu zvepasi pevhu zvinotonga pamusika, chimwe nechimwe chine hunhu hwakasiyana hwakakodzera mashandisirwo akasiyana. Kuti uwane kuenzanisa kwakadzama kwezvinhu izvi, ona gwara redu rakatsaurirwa kune zvinhu zvepasi pevhu zveDBC.

5.1 Alumina (Al₂O₃)

Alumina ndiyo ceramic inonyanya kushandiswa pakugadzira DBC substrates nekuda kwemutengo wayo wakanaka uye kushanda zvakanaka. Nekupisa kwe24-28 W/m·K kune 96% purity grades, alumina inokodzera mashandisirwo ayo apo kupisa kwakanyanya hakudiwi. Kuwanikwa kwayo kwakapararira, tekinoroji yekugadzira yakakura, uye mitengo inokwikwidzana zvinoita kuti ive sarudzo yekutanga yemagadzirirwo akawanda emagetsi.

5.2 Aruminiyamu Nitride (AlN)

Aluminum nitride inopa thermal conductivity ye170-230 W/m·K, inenge yakapetwa ka7-10 pane alumina. Izvi zvinoita kuti AlN DBC substrates ive yakakosha pakushandiswa kwesimba guru uko kupisa kuri chinhu chinogumira. Mutengo wepamusoro wezvinhu unonzwisisika mukushandiswa kwakadai seEV traction inverters, high-frequency RF amplifiers, uye aerospace power systems.

5.3 Silicon Nitride (Si₃N₄)

Silicon nitride inosanganisa thermal conductivity iri pakati nepakati (70-90 W/m·K) ine simba remakanika uye kusimba kwekupwanyika. Si₃N₄ DBC substrates dzinoshanda zvakanaka mukushandiswa kunoda kuramba kupisa uye kushushikana kwemakanika, senge masisitimu ekubata anowanzo zununguka uye kudzokorora kupisa. Kunyangwe ichidhura kupfuura alumina, kuvimbika kwakanyanya kwesilicon nitride munzvimbo dzinoda simba kunoita kuti iwedzere kufarirwa mukushandiswa kwemotokari nenjanji.

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6) DBC vs Mamwe Matekinoroji ePCB eCeramic

Musika wePCB weceramic unosanganisira matekinoroji akati wandei kunze kweDBC. Kunzwisisa dzimwe nzira idzi kunobatsira mainjiniya kusarudza mhinduro yakakodzera zvinodiwa zvavo.

6.1 DBC vs AMB (Active Metal Brazing)

Active Metal Brazing inoshandisa simbi ine titanium kuti isanganise mhangura neceramic patembiricha inosvika 850°C. AMB inopa simba rakasimba rekubatanidza kupfuura DBC uye inoita kuti zvidimbu zvemhangura zvakakora (kusvika 0.8mm kana kupfuura). Zvisinei, AMB substrates dzinowanzo dhura kupfuura DBC equivalents uye dzinoda michina yakasarudzika. AMB inosarudzwa pakushandisa kuvimbika kwakanyanya uye kana ukobvu hwemhangura hwakanyanya huchidikanwa.

6.2 DBC vs DPC (Mhangura Yakananga Yakaputirwa)

Tekinoroji yemhangura yakaputirwa zvakananga inosanganisira kuisa mbeu paceramic, ichiteverwa ne electroplating kuti iwedzere ukobvu hwemhangura. DPC inopa resolution yemutsara wakapfava kupfuura DBC asi inongogumira kune zvidimbu zvitete zvemhangura (kazhinji pasi pe 0.1mm). DPC inokodzera mashandisirwo anoda mapatani chaiwo edunhu uye kubatwa kwemagetsi kwakaderera, senge mapakeji e LED nema signal circuits madiki.

6.3 DBC vs LTCC/HTCC

Ceramic ine simba rekupisa kwakaderera (LTCC) uye High-Temperature Co-fired Ceramic (HTCC) zvinogonesa macircuit eceramic ane ma "multilayer ceramic" ane "embedded passives". Kunyange zvazvo matekinoroji aya achipa kuchinjika kwedhizaini, haakwanise kuenzana nekushanda kweDBC pakupisa kana kugona kubata magetsi. Ceramic dzine simba rekupisa kwakabatana dzinowanzo sarudzwa kune RF/microwave applications uye magadzirirwo akaomarara e "multilayer" pane power electronics.

7) Kusarudza Mhinduro Yakakodzera yeDBC Substrate

Kusarudza DBC substrate yakakodzera kunoda kuyera zvinhu zvakawanda zvinosanganisira zvinodiwa nekupisa, zvinodiwa nemagetsi, zvirambidzo zvemakanika, uye bhajeti. Kushanda nemugadziri weDBC substrate ane ruzivo kunoita kuti sarudzo iyi ive nyore.

7.1 Makiyi eKusarudza Maitiro

• Zvinodiwa pakubvisa simba: Verenga kupisa kunogadzirwa nemidziyo yemagetsi uye iva nechokwadi chekuti substrate inogona kuendesa kupisa uku kusystem yekutonhodza pasina kukwira zvakanyanya kwekupisa.
• Operating Voltage: Iva nechokwadi chekuti ukobvu hweceramic uye zvinhu zvinopa voltage yakakwana yekudzivirira dielectric pamwe nemiganhu yakakodzera yekuchengetedza.
• Ikozvino Kubata: Taura ukobvu hwemhangura zvichibva pane zvinodiwa zvakanyanya pakuenderera mberi uye padanho repamusoro, zvichireva kuti kupisa kwacho kwaderera.
• Purogiramu yeThermal Cycling: Funga nezvekuchinja-chinja kwekushisa kunotarisirwa uye huwandu hwenguva yekushanda kwechinhu pakusarudza zvinhu zvedongo.
• Size Constraints: Zvigadziko zveceramic zvine miganhu yehukuru hwekugadzira izvo zvinogona kukanganisa dhizaini yemamodule.
• Zvinangwa zveMutengo: Sarudzo yezvinhu inoenderana nehuwandu hwekugadzira uye mutengo weyuniti unogamuchirika.

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8) Matanho Anotevera: Kugadzira, Kugadzira Prototyping & RFQ

Kunyangwe uri kugadzira pfungwa itsva yemagetsi kana kuwedzera dhizaini iripo yekugadzira huwandu hwemagetsi, Highleap Electronics inopa mhinduro dzakakwana dzeDBC substrate dzakagadzirirwa chikamu chepurojekiti yako.

Kuti pave nekugadzirwa kwekutanga uye kusimbiswa kwedhizaini, sevhisi yedu yeDBC substrate prototyping inopa huwandu hushoma nekukurumidza, zvichiita kuti zviongororwe kakawanda pasina zvibvumirano zvekugadzira.

Kuti muongorore kugona kwedu kukuru kugadzira maPCB eceramic uye mabhodhi ecircuit echinyakare, shanyirai ongororo yedu yekugadzira maPCB eceramic eChina.

8.1 Zvekuisa muRFQ yako

• Mafaira ekugadzira: Mafaira eGerber, DXF, kana mifananidzo yemakanika
• Zvinhu zvinodiwa: Rudzi rweCeramic, ukobvu, ukobvu hwemhangura
• Surface kupera: Zvinodiwa zvekubatanidza tambo nekubatanidza waya
• uwandu: Huwandu hwekutanga uye huwandu hwegore negore hunofungidzirwa
• Hunhu hunodiwa: Chero zvinodiwa zvekuongorora kana bvunzo zvakakosha
• Nguva yakatarwa: Mazuva akakosha ekutumira kana zviitiko zvakakosha zvekusimudzira

Tora Mutengo Wako weDBC Substrate