Gwaro uye Mashandisirwo eCopper Substrate Yakasungirirwa Zvakananga

Substrate yemhangura yakabatana zvakananga


Substrate yemhangura yakabatana zvakananga isimbi yeceramic inogadzirwa nekubatanidza mhangura zvakananga kune ceramic base pakupisa kwakanyanya. Inoshandiswa zvakanyanya mumamodule emagetsi nemamwe magadzirirwo emagetsi anodziya zvakanyanya anoda kutamiswa kwekupisa kwakanaka uye kuvharwa kwemagetsi. Peji rino rinotsanangura mazwi, hukama netekinoroji yeDBC, uye hunhu hwakakosha hunoenderana nekugadzirwa kwePCB nePCB yeceramic.


Zvigadziko zvemhangura zvakasungirirwa zvakananga zvinowanzo shandiswa mumagetsi emagetsi nemamwe magadzirirwo emagetsi ane simba guru uko kutonga kwekupisa uye kupatsanurwa kwemagetsi kwakakosha. KuHighleap Electronics, isu tiri vagadziri vePCB vanoshanda zvizere vachipa maPCB eceramic, maDBC substrates, mabhodhi esimbi, maPCB akawanda, uye masevhisi ePCB akazara. Gwaro iri rinobatsira mainjiniya nemapoka ekutsvaga mari kunzwisisa kuti masubstrates emhangura akasungirirwa zvakananga anoshanda sei uye kuti anokwana sei mukati mesarudzo dzakakura dzePCB nePCB dzeceramic.

Kumbira Mutengo wePCB yako kana Ceramic PCB Project

Dzidza zvakawanda nezve kugona kwedu kugadzira PCB yeceramic kana kuti ongorora mabasa edu ese ekugadzira nekugadzira PCB.


1) Tsanangudzo yeSubstrate yeCopper Yakasungirirwa Yakananga

Substrate yemhangura yakasungirirwa zvakananga isubstrate yemagetsi yakasarudzika ine ceramic insulating layer ine copper foil yakasungirirwa nesimbi kune imwe kana nzvimbo dzese dziri mbiri. Izwi rekuti "direct bond" rinoratidza kuti copper inonamatira zvakananga kuceramic isina intermediate adhesive layers, epoxies, kana mechanical fastening.

Kubatana uku kunoitika pakupisa kwakakwira (kazhinji 1065-1085°C) mumhepo inodzorwa, uko copper oxide iri pakati pechinhu ichi inobatsira kuita kwemakemikari nepamusoro peceramic. Izvi zvinogadzira jira repakati pesimbi rinobatanidza copper neceramics zvachose senge alumina (Al₂O₃), aluminium nitride (AlN), kana silicon nitride (Si₃N₄).

Chimiro chinobuda chinosanganisa kufambiswa kwemagetsi kwemhangura nekufambiswa kwemafuta uye hunhu hwe dielectric hweceramic. Kusiyana nemabhodhi e organic circuit, ma substrates emhangura akabatana zvakananga anochengetedza kugadzikana patembiricha inodarika 300°C uye anogona kutsungirira zviuru zvema thermal cycles pasina delamination.


2) Hukama huripo pakati pemhangura yakabatana zvakananga neDBC

"Direct bonded copper substrate" uye " DBC substrate " zvinoreva tekinoroji imwe chete. DBC ingori chidimbu cheindasitiri chinobva paDirect Bonded Copper. Mazwi ese ari maviri anochinjana mumabhuku ehunyanzvi, matsananguro ekutenga, uye magwaro ekugadzira.

Magwaro einjiniya anogona kushandisa chero izwi zvichienderana nemamiriro ezvinhu uye tsika dzedunhu. Mainjiniya ekuNorth America neEurope vanowanzo shandisa "DBC" mukutaurirana kwakajairika uku vachitsanangura "mhangura yakabatana zvakananga" mumagwaro epamutemo. Vagadziri vekuAsia vanowanzo shandisa "DBC" zvakanyanya. Nyanzvi dzekutenga dzinofanira kuziva mazwi ese ari maviri pakutsvaga ma substrates aya.

Mamwe mazwi ane hukama asi akasiyana dzimwe nguva anokonzera kuvhiringidzika:

  • DCB (Kubatanidza Mhangura Yakananga): Imwe nzira yekutsanangura dzimwe nguva inoshandiswa mumabhuku ehunyanzvi emutauro wechiGerman, ichireva tekinoroji yakafanana.
  • DPC (Mhangura Yakananga Yakaputirwa): Imwe tekinoroji inosanganisira kuisa mhangura yakatetepa panzvimbo pekubatanidza mhangura yakawanda.
  • AMB (Kubata Kwesimbi Inoshanda): Tekinoroji yesimbi yeceramic inoshandisa braze alloys pachinzvimbo chekubatanidza zvakananga neoxidation.

3) Hunhu Hukuru uye Zvakanakira

Zvigadziko zvemhangura zvakasungirirwa zvakananga zvinoratidza hunhu hwakasiyana hunoita kuti zvisiyane nezvinhu zvebhodhi redunhu remazuva ano:

3.1 Thermal Performance

Kubatana kwakananga kunobvisa kuramba kwekupisa pakati pemhangura neceramic. Pamwe chete ne ceramic thermal conductivity inotangira pa 24 W/m·K (alumina) kusvika pa 230 W/m·K (high-purity AlN), direct bonded copper substrates dzinofambisa kupisa zvinobudirira kubva kumagetsi kuenda kuma cooling systems. Kudzivirira kupisa kwakadzika se 0.1°C/W pa square centimeter kunogoneka ne aluminium nitride substrates.

3.2 Magetsi Properties

Zvinhu zveCeramic zvinopa kupatsanurwa kwemagetsi kwakanyanya, uye simba re dielectric rinowanzo pfuura 15 kV/mm. Izvi zvinogonesa ma substrates e copper akabatana zvakananga kuti apatsanure zvakachengeteka ma power circuits ane voltage yakawanda kubva kuma heatsinks akadzika. Kusanganiswa kwe copper gobvu (0.127-0.635mm) uye simba re dielectric rakakwirira kunoita kuti ma substrates aya akwane ma power modules anoshanda pa 1200V, 1700V, kana kupfuura.

3.3 Kuvimbika Kwemakanika

Chisungo chesimbi pakati pemhangura neceramic chinodzivirira kupatsanurwa kwemvura kana paine kushushikana nekupisa. Zvishandiso zvemhangura zvakagadzirwa zvakanaka zvinorarama kupfuura 3,000+ thermal cycles pakati pe -40°C ne +125°C pasina kuora kwebond. Kuvimbika uku kwakakosha pakushandiswa kwemotokari, maindasitiri, uye ndege dzine zvinodiwa zvakanyanya muhupenyu hwese.

3.4 Kugona Kubata Pari Zvino

Ukobvu hwemhangura hwe0.3mm zvichikwira hunogonesa ma substrates emhangura akabatana zvakananga kutakura ma currents anoenderera mberi anopfuura 50A pa circuit trace. Pamwe chete nekuparadza kupisa kwakanaka, izvi zvinobvumira magadzirirwo emamodule emagetsi madiki aisazogoneka nema organic circuit boards.


4) Mashandisirwo Akajairika Emaindasitiri

Zvishandiso zvemhangura zvakasungirirwa zvakananga zvinoshanda zvakanyanya mumaindasitiri akasiyana-siyana uko manejimendi yekupisa, kuvimbika, uye mashandiro emagetsi zvakakosha. Dzidza zvakawanda nezvesarudzo dzezvinhu zveceramic mugwaro redu reDBC ceramic substrate.

4.1 Simba reMagetsi

  • Mamodule eIGBT emadhiraivha emota dzeindasitiri uye masisitimu ekubata
  • Kurongedza michina yemagetsi yeSiC neGaN
  • Ma inverter emagetsi nemachaja ari mubhazi
  • Ma-solar inverters nema-wind turbine converters
  • Midziyo yekushongedza yeindasitiri uye yekudziya inopinza

4.2 RF uye Microwave

  • Ma amplifiers eRF ane simba guru
  • Mamodule ekutumira radar
  • 5G base station magetsi amplifiers

4.3 Mwenje Wemamiriro Akasimba

  • Mapakeji e LED anopenya zvakanyanya
  • COB (Chip-on-Board) LED modules
  • Marambi emotokari uye masisitimu ekuratidzira

5) Mashandisirwo Anoitwa Tekinoroji Iyi Mukugadzirwa kwePCB

Kugadzira substrate yemhangura yakasungirirwa zvakananga kunoda hunyanzvi hwakasiyana nehwemazuva ano hwePCB . Kunyange hazvo maPCB echinyakare achishandisa lamination, kuchera, uye kuputira zvinhu zve organic, ma substrate emhangura akasungirirwa zvakananga anoda:

  • Zvitofu zvinosunga zvinopisa zvakanyanya: Inokwanisa kudzora tembiricha nemazvo pa1065-1085°C nemhepo inodzorwa.
  • Unyanzvi hwekubata neCeramic: Zvigadziko zveceramic zvisina kusimba zvinoda kugadziriswa kwakanyatsogadzirwa uye kubatwa kwacho panguva yese yekugadzirisa.
  • Kemikari yekucheka yakagadzirwa nehunyanzvi: Matanho emhangura akakora anoda nguva yakareba yekucheka uye kugadzirisa mashandiro kuti aite kuti mutsetse unyatsoenderana.
  • Kugona kwekugadzirisa neLaser: Magadzirirwo mazhinji anoda kuchekwa nelaser kana kucheka kuti pave neceramic singulation.

Kushanda nemugadziri weDBC ane ruzivo rwekugadzira substrate kunoita kuti pave neruzivo rwehunyanzvi uhwu uye kuti pave neruzivo rwekuita zvinhu rwakakosha kuti pave nemhando yakanaka.

Kuti munzwisise zvakadzama nezve nzira dzekubatanidza uye ma process parameters, tarisai gwara redu rehunyanzvi pamusoro peDBC process.


6) Dzidza Zvakawanda Nezve DBC Substrates

Highleap Electronics inopa ruzivo rwakakwana kune mainjiniya nevashandi vekutenga zvinhu vanoshanda netekinoroji yemhangura yakabatana zvakananga. Tarisa mapeji edu ane chekuita neizvi kuti uwane ruzivo rwakadzama rwehunyanzvi:

6.1 Kumbira Rutsigiro rwehunyanzvi

Chikwata chedu cheinjiniya chekushandisa chinobatsira pakusarudza zvinhu, kugadzirisa magadzirirwo, uye kugadzira magadzirirwo azvo emapurojekiti esimbi akabatana zvakananga. Kunyangwe muchida nhungamiro pakusarudza zvinhu zveceramic kana rubatsiro pakugadzirisa magadzirirwo enyu kuti agone kugadzirwa, takagadzirira kutsigira purojekiti yenyu.

Bata Rutsigiro rweUinjiniya

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Nzira yekuwana sei quote yePCBs

Rega timhanyire DFM/DFA ongororo yako uye tidzokere kwauri neshumo.

Unogona kurodha mafaera ako zvakachengeteka kuburikidza newebhusaiti yedu.

Isu tinoda ruzivo rwunotevera kuti tikupe iwe quote:

    • Gerber, ODB++, kana .pcb, spec.
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    • uwandu
    • Kuchinja nguva

Pamusoro pekugadzira PCB, isu tinopa huwandu hwakakwana hwemagetsi masevhisi, anosanganisira PCB dhizaini, PCBA (Yakadhindwa Circuit Board Assembly), uye turnkey mhinduro. Kunyangwe iwe uchida rubatsiro neprototyping, dhizaini yekusimbisa, kutsvagisa chikamu, kana kugadzirwa kwakawanda, isu tinopa yekupedzisira-kusvika-kumagumo rutsigiro kuti uve nechokwadi chekubudirira kweprojekiti yako. Kune masevhisi ePCBA, ndapota ipa BOM yako (Bhiri reZvinhu) uye chero mirairo yegungano. Isu tinopawo DFM/DFA ongororo yekukwidziridza zvigadziriso zvako zvekugadzira uye kusangana, kuve nechokwadi chekuita kwakatsetseka kwekugadzira.






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