Copper Coin PCB Manufacturing Process: Kubva Kuchera kusvika kuCoin Embedding

Nhanganyaya: Sei Copper Coin PCB Manufacturing Inoda Precision

Mamodule e semiconductor ane simba guru anoda nzira dzinoshanda dzekubvisa kupisa kuti dzirambe dzakagadzikana uye dzidzivirire kutadza kushanda kwemuchina. Kugadzirwa kwePCB yemari yemhangura kunotarisa zvinodiwa izvi nekubatanidza zvinhu zvakakora zvemhangura zvakananga mu substrate, zvichigadzira migwagwa yekupisa iri munzvimbo dzakasiyana iyo inodarika 390 W/mK zvichienzaniswa nezvinhu zvePCB zvakajairwa, nekudzivirira kupisa kuri pasi pe0.5°C/W kune mashandisirwo e semiconductor emagetsi.

Iyo nzira yekugadzira inoda kurongeka kwakasarudzika pamatanho ese, kubva pakutanga kuumbwa kwegomba kuburikidza nekumisikidzwa kwekupedzisira. Nhanho imwe neimwe inokanganisa zvakananga kushanda kwemafuta uye kuvimbika kwenguva refu. Ichi chinyorwa chinoongorora matanho akakosha ekugadzira anoshandura akajairwa substrates kuita yakakwirira-inoshanda yekupisa manejimendi mhinduro.

Maitiro Ongororo: Copper Coin PCB Manufacturing Workflow

Iyo mhangura yemhangura PCB yekugadzira yekufambisa inoteedzera matanho matanhatu akabatanidzwa anotaridza ekupedzisira kupisa kwekuita:

1. Cavity dhizaini uye kuchera -Kunyatsogadzira machining inogadza hwaro geometry ine dimensional kushivirira mukati me ± 20 μm yekukwana kwemari.
2. Copper coin machining uye kugadzirira pamusoro -Kugadzirira kwechigadzirwa kunovimbisa yakakwana yekupisa yekubata uye michina yekunamatira hunhu panzvimbo dzakakomba.
3. Embedding uye kuenzanisa -Yakanyatsomira inochengetedza nzira yekupisa uye inodzivirira kusimuka kwemashure panguva yekuzogadzirisa.
4. Resin kuzadza uye lamination -Kudzora kusungirirana kunogadzirisa kupisa kwekuwedzera kusawirirana uku uchibvisa voids inokanganisa kupisa kwemafuta.
5. Surface flattening uye planarization -Uniform topology inogonesa kuenderana kutenderera dhizaini kuumbwa munzvimbo dzakamisikidzwa mari.
6. Thermal kuvimbika uye kuongorora -Kuyedza kwakazara kunosimbisa maparamita ekuita uye kutendeseka kwechimiro kusati kwatumirwa.

Kudzora kwemaitiro pamatanho aya kunotarisisa kana chigadzirwa chakapedzwa chinosangana nezvinodiwa zvekupisa uye zvemuchina zvekushandisa zvemagetsi emagetsi.

Cavity Drilling muCopper Coin PCB Manufacturing

Precision Machining Nzira

Cavity kuumbwa inogadza iyo geometric hwaro hwekushanda kwekupisa mumhangura coin PCB kugadzira. CNC nzira uye laser machining inowana kushivirira mukati me ± 20 μm, kuve nechokwadi chakanyatsokwana pakati pemhangura uye kuisa mhangura. Dimensional kutsauka kupfuura chikumbaridzo ichi kunogadzira mapeji anokanganisa kusangana kwekupisa uye kuunza resin voids panguva yekuyamwisa.

Laser ablation inopa yakakwira mupendero tsananguro yeakaoma geometries asi inoda kungwarira parameter optimization kudzivirira substrate charring. Mechanical routing inopa kukurumidza kupinza kweakareruka maumbirwo emhangura uku uchichengetedza kukwana kwakakwana kune mazhinji simba semiconductor application.

Surface Quality Control

Cavity madziro roughness inokanganisa zvakananga kupisa conductivity uye mechanical adhesion pamhangura-substrate interface. Target roughness values ​​kubva 1.6 kusvika 3.2 μm Ra kuenzanisa kupisa kwekubatana ne resin adhesion. Kuwedzeredza kutsvedzerera kunoderedza kupindirana kwemakanika pakati peresin uye madziro emadziro, kuwedzera delamination njodzi panguva yekupisa bhasikoro.

Kuomarara kwakadzorwa kunobatsira kunyorovesa resin ukuwo kuchichengetedza nzira dzinopisa nguva dzose . Kuchenesa mushure mekugadzira kunobvisa tunhu tunogona kukonzera maburi panguva yekuiswa kwemari yemhangura inotevera.

Copper Coin Embedding Process: Critical Assembly Stage

Dimensional Matching uye Fit Control

Iyo copper yekumisikidza maitiro inoda chaiyo dimensional inofananidzwa pakati pedhayamita yemari uye kuvhurwa kwegomba. Kupindira kunokwana kubva pagumi kusvika pamakumi matatu μm kunopa kuchengetedzwa kwemichina uku uchidzivirira kutsemuka kwe substrate panguva yekuiswa. Press-fit nzira dzinoshandisa simba rinodzorwa chigaro chemari chinoputika negomba pasi pasina kukonzeresa substrate kusagadzikana.

Otomatiki ekuona masisitimu anosimbisa kurongeka mukati me ± 25 μm isati yagadziriswa, kudzivirira kusimuka kwemashure panguva yekuyerera kweresin. Misalignment inogadzira asymmetric thermal pathways iyo inoshatisa kushivirira kwese kwese uye kuburitsa nzvimbo dzinopisa munzvimbo mugungano rekupedzisira.

Lamination Parameters muCopper Coin PCB Manufacturing

Kubudirira kwesimbi yemhangura PCB kugadzira kunoenderana neanodzorwa lamination mamiriro anosunga gungano pasina kurwisa:

• Temperature profile control - Ramp rates ye2-3 ° C paminiti inofananidzwa nemafuta ekuwedzera coefficients pakati pemhangura, resin, uye substrate zvinhu zvine tembiricha yepamusoro kubva pa170 ° C kusvika 200 ° C.
• Applied pressure optimization -Kumanikidza pakati pegumi neshanu kusvika makumi maviri neshanu bhaa inoita kuti resin izere inoyerera ichitenderedza mari inotenderedza uku ichidzivirira coin kukwira pamusoro peiyo substrate pamusoro.
• Vacuum-assisted processing -Inobvisa mhepo yakavharirwa iyo inogona kugadzira zvipingamupinyi zvinopisa zvinodzivirira panzvimbo dzakakosha dzemhangura-substrate.

Surface Planarization muCopper Coin PCB Manufacturing

Resin Kuzadza uye Flow Management

Kuzadza kusarudzwa kwezvinhu kunoyera kupisa conductivity nemaitiro ekugadzirisa panguva yemhangura coin embedding process. Thermally conductive epoxies ine ceramic fillers inowana 3-5 W/mK uku ichichengetedza kuyerera kwakakwana panguva yekuyamwisa. Pre-preg zvinhu zvinopa kusimbaradza kwechimiro asi zvinoda kungwarira resin zvemukati kudzora kudzivirira nzara yakatenderedza mari.

Uniform resin kugovera kunobvisa ma voids anokanganisa zvese kupisa uye dielectric kuita. Inodzorwa lamination pressure inovimbisa kuenderana kweresin ukobvu pakati pemhangura coin pamusoro uye padyo ne substrate layers kuitira optimal kutamisa kupisa.

Planarity Achievement Nzira

Post-lamination grinding inobvisa yakawandisa mhangura uye resin kuti iwane kupfava kwepamusoro mukati me ± 15 μm pane pani. Diamond abrasive mavhiri zvishoma nezvishoma anoderedza zvinhu paunenge uchitarisa ukobvu nelaser profilometry. Progressive grit kudzikisa kubva pa400 kusvika 1200 mesh inogadzira mauniform surface topology inokodzera photolithography.

Kemikari-mechanical polishing inopa yekupedzisira kugadzirira kwepamusoro, kubvisa kukuvadzwa kwepasi pevhu kubva kumagetsi ekukuya. Planarity verification isati yaitika yekufungidzira inodzivirira zvikanganiso zvekunyoresa uye inova nechokwadi chekutevedza kuumbwa kwenzvimbo munzvimbo dzine mari dzemhangura dzakamisikidzwa.

Kuvimbika Kuedzwa muCopper Coin PCB Manufacturing

Thermal Performance Validation

Kuedza kwakazara kunosimbisa copper coin PCB yekugadzira mhando kuburikidza neakawanda ekupisa kwekuongorora:

• Thermal cycling evaluation -Kuyedza pakati pe -40 ° C uye 150 ° C ye1000 cycles inoratidza delamination maitiro uye kukanganisa kwechimiro pasi pekunetseka kwekushanda.
• Thermal resistance measurement -Kuyera kwakananga kunoenzanisa kuita chaiko kunopesana nezvinotarwa nedhizaini, kuratidza kubudirira kweyakatsanangurwa yekupisa conductivity kukosha.
• Infrared thermography analysis -Inozivisa nzvimbo dzinopisa dzinoratidza kusakwana kwekupisa kunosangana pacoin-substrate interfaces inoda kugadziridzwa.
• Heat shock test -Kunyanya tembiricha magradients anosimbisa kugadzikana kwechimiro pasi pezvinopisa zvinopisa zvinosangana mumashandisirwo emagetsi ebhasikoro.

Structural Integrity Analysis

Cross-sectional microscopy inoongorora kuumbwa kusingabatsiri, kugovera resin, uye chimiro chemhando munzvimbo yese yemhangura yekumisikidza maitiro. Shear kuyedzwa kunoshandisa lateral mauto kuyera mechini chisungo simba, kunanga ukoshi pamusoro pegumi MPa kudzivirira kudonha kwemari panguva yekupisa kwekushushikana. Microsectioning inoratidza kupinda kweresin mukati memhango yemadziro roughness uye inosimbisa kuzadza kuzere kwakatenderedza mari inotenderera.

Highleap Electronics inoita yakazara kuvimbika kuyedzwa kuti ive nechokwadi chakagadzikana chekushisa uye chemuchina kuita mumhangura coin PCBs mukati mehupenyu hunotarisirwa hwekushanda.

Mhedziso: Precision Manufacturing for High Thermal Reliability

Kubudirira kwesimbi yemhangura PCB kugadzira kunovimba neyakaomesesa maitiro ekudzora kubva kugomba machining kusvika pakupedzisira kuvimbika kuyedzwa. High dimensional precision panguva yekuchera inoumba hwaro hwechokwadi hwekuisa mari yemhangura uye kufambisa kudziya kwemafuta. Inodzorwa kuisirwa uye nhanho dzelamination inovimbisa kusungirirana kwakaringana, kuderedzwa kwewarpage, uye kuenderana kwepasi planarity kune yakavimbika yedunhu kuumbwa. Kusimbisa kwakasimba-kuburikidza nekupisa bhasikoro, kuongorora-chikamu-chikamu, uye kuyedzwa kweshear-inosimbisa ese ari maviri emakanika kutendeseka uye kwenguva refu kupisa kwekuita pasi pekuda kwemamiriro ekushanda.

KuHighleap Electronics , timu yedu yeinjiniya inoshandisa ruzivo rwakakura mukugadzira PCB yesimbi yemhangura uye kugadzirisa maitiro ekuisa zvinhu mumidziyo. Isu tinobatanidza machining eCNC akakodzera, kudzora lamination yepamusoro, uye kuyedzwa kwekuvimbika mukati meimba kuti tive nechokwadi chekuti bhodhi rega rega rinosangana nezvinodiwa zvekupisa uye zvechimiro zvemashandisirwo emagetsi emazuva ano. Maitiro aya anotungamirirwa nemaitiro anoratidza kuzvipira kwedu kuri kuramba kuripo kune hunyanzvi hwehunyanzvi, kuvimbika mukugadzira, uye kuvimbisa mhando pachena kune vatengi vedu vepasi rese.