Girazi reCore PCB reKurongedza Kwepamusoro

PCB yepakati pegirazi ipurasiti yepamusoro inoshandisa jira regirazi rakatetepa panzvimbo pepurasiti ye resin inowanikwa muma substrates eBGA echinyakare. Chikonzero chikuru chekushandisa girazi hachisi chinhu chitsva, asi mashandiro: girazi rinopa coefficient yekuwedzera kwekupisa pedyo nesilicon, warpage yakaderera zvikuru pamapakeji makuru, uye kugadzikana kuri nani kwema interconnects epitch-pitch. Hunhu uhwu hunoita kuti ma substrates epakati pegirazi ave akakosha kune ma AI accelerators, ma CPU anoshanda zvakanyanya, ma chiplet packages, uye mamwe ma assemblies e semiconductor epamusoro uko ma organic substrates anosvika pamiganhu yavo ye mechanical uye routing. Zvinhu zvakakura uye mamiriro ekushanda zviri mukati me tekinoroji yePCB yegirazi.

Kumbira Mutengo wePCB weGlass Core

Chii chinonzi Glass Core PCB?

PCB yepakati pegirazi ipurasitiki inogadzirwa negirazi kwete ne organic laminate yakaita se BT resin kana modified FR-4. Mukugadzira semiconductor yepamusoro, core iyi inoshanda semusana wakasimba we substrate, ichitsanangura kutsetseka, kugadzikana kweukobvu, uye vertical interconnect geometry. Panzvimbo pema vias akaboorwa, girazi rinoshandisa ma vias e through-glass kuendesa masaini uye simba kuburikidza ne substrate thickness.

Girazi pacharo harisi jira remagetsi rinoshanda. Basa raro nderechimiro uye denderedzwa. Matanho ekugovera mhangura uye matanho ekuvaka e dielectric anogadzirwa pamusoro nepasi pepakati pegirazi, nepo girazi richipa hwaro hwakagadzikana hunodiwa pakuvaka jira rakapfava uye jira guru. Mukutaura kwakajeka, PCB yegirazi haina kufanana nebhodhi regirazi rakasimba rinoshandiswa mumagetsi; yakanangidzirwa zvakanyanya kumabasa epamusoro eIC package substrate uko silicon inoenderana uye warpage control zvakakosha.

Ndosaka girazi rePCB riri kukurukurwa zvakanyanya pamwe chete nekurongedza kwe processor yechizvarwa chinotevera. Sezvo saizi dzemapakeji dzichikura uye bump pitch ichiramba ichiderera, chinhu chepakati chinova chinogumira, uye girazi rinopa denga rekushanda rakasiyana pane tekinoroji ye organic substrate.

Nei Glass Core PCB Iri Kutsiva Organic Package Substrates

Zvishandiso zveOrganic package zvave zvichitsigira kurongedza kwema semiconductor kwemakumi emakore, asi mapakeji epamusoro eAI neHPC ari kusundira mberi kupfuura miganhu yakavimbika yemaitiro e organic core. Nyaya inonyanya kukosha ndeyekusawirirana kwe thermal-mechanical. Organic substrate cores inowanzova ne coefficient yekuwedzera kwe thermal pamusoro pe silicon, izvo zvinogadzira kushushikana pa die-to-substrate interface panguva ye reflow uye thermal cycling. Sezvo bump pitch yava nani, kushushikana ikoko kunowedzera kuoma kunwisa pasina kuneta kwe solder uye matambudziko ekuvimbika kwemajoini.

PCB yepakati pegirazi inotarisa izvi nekuswededza substrate CTE pedyo nesilicon. Izvi zvinoderedza kutama kwechikamu panguva yekuchinja kwetembiricha uye zvinobatsira kuchengetedza kuvimbika kwejoini yesolder pakati petsoka huru dze die. Chinhu chechipiri chikuru ndechekudzora warpage. Substrates hombe dzeorganic dzinowanzokotama panguva yekuunganidza nekuda kwekuwedzera kwekupisa kweasymmetrical mukati me stack-up. Pahukuru hwepakeji yepamusoro, warpage iyoyo inogona kugadzira majoini akavhurika kana kusagadzikana kwebump attachment. Girazi rine kugadzikana kuri nani, zvichibvumira mapaneru akatsetseka uye kuumbwa kwakafanana kwekubatana.

Chinhu chechitatu chinotungamira kuenzana kwema "interconnect density". Organic cores dzinoenderana nekuboorwa kwemakanika kuburikidza nemaumbirwo ane saizi huru, nepo magirazi cores achigona kutsigira kuumbwa kwe "vertical interconnect" kwakanaka. Kune kubatanidzwa kwema "chiplet" emazuva ano, uko huwandu hwe "routing density" uye saizi yepakeji inowedzera pamwe chete, musanganiswa we "lower warpage", CTE match iri nani, uye "finer via capacity" ndiyo chikonzero chikuru chinoita kuti PCB yegirazi itange kushandiswa mukutengeserana.

Glass Core PCB vs Organic Core vs Glass Interposer

Girazi rePCB riri pakati pezvinhu zvinogadzirwa ne organic package uye silicon kana glass interposer solutions mumamiriro ezvinhu anodhura. Kana tichienzanisa ne organic core substrate, girazi rinopa warpage yakaderera, kunyudzwa kwemvura kwakaderera, kugadzikana kuri nani, uye kuenderana nekupisa kwakanyanya ne silicon. Kana tichienzanisa ne silicon interposer, zvinhu zvinogadzirwa ne glass core zvinogona kutsigira kugadzirwa kwepaneru yakakura uye kuderedza mutengo wezvose, uku zvichiri kugonesa waya dzakapfava uye kuburikidza nehuremu kupfuura zvinhu zve organic.

Musiyano mukuru uripo pakati pePCB yepakati pegirazi neinterposer yegirazi inzvimbo inoshanda mupakeji. Substrate yepakati pegirazi ndiyo substrate yepakeji pachayo, kusanganisira build-up layers uye board-level connection interface. Interposer yegirazi chinhu chinongoerekana chaiswa pakati pema dies ne substrate kuti chiite ultra-high-density routing. Kana chinangwa chako chiri interposer architecture pane kuvaka substrate, basa re glass interposer PCB rakasiyana.

Chimiro chePCB cheGirazi uye Dhizaini yekuvaka

PCB yegirazi yakajairika inovakwa yakakomberedza jira regirazi rakatetepa, rinowanzova pakati pe0.1 mm kusvika 0.3 mm, ine magirazi anobuda mukati mepakati uye akazadzwa nemhangura kuti akwanise kubatana zvakanaka. Kumativi ese egirazi, ma layers e dielectric ne copper anowedzerwa kugadzira chimiro che package routing. Rutivi rwepamusoro runowanzo tsigira fine-pitch die attach, nepo divi repasi richipa solder ball kana package-level interconnect interface.

Mutemo unonyanya kukosha wekuisa zvinhu muzvikamu zvakasiyana-siyana ndeyekuenzanisa. Girazi pacharo rakagadzikana, asi chikamu chose chinogona kuramba chakakombama kana zvikamu zvekumusoro nepasi zvisina kuenzana. Kuwanda kwemhangura, ukobvu hwe dielectric, uye huwandu hwezvikamu zvinofanirwa kuenderana kumativi ese kuitira kuti kushushikana kwekupisa kurambe kwakaenzana panguva yekudzoreredza mvura uye kuzara kwemvura. Nechikonzero ichi, dhizaini yechikamu chepakati pegirazi haisi yekusarudza girazi chete; zvakare ndeyekudzora dhizaini yakazara yekuvaka yakatenderedza chikamu ichocho.

Kusarudzwa kwezvinhu zvinokoshawo. Girazi reBorosilicate rinowanzo shandiswa nekuti rinopa musanganiswa wakanaka wekugadzikana kwekupisa, hunhu hwemakanika, uye kuenderana kwemaitiro. Musiyano uripo pakati pezvinhu zvePCB substrate zvegirazi zviripo unokosha pakusarudza core yekugadzira package.

Kufunga Nezvekugadzirwa kweTGV neWarpage

Kuburikidza nekugadzira magirazi kuburikidza nedhizaini ndeimwe yenyaya huru dzeinjiniya mukugadzirwa kwePCB yepakati pegirazi. Kureba kweTGV, pitch, aspect ratio, copper filling quality, capture pad size, uye edge keepout zvese zvinokanganisa zvakananga kugadzirwa uye kuvimbika. Zvichienzaniswa nePCB yakajairwa kuburikidza nedhizaini, TGV structures dzinoda kudzorwa kwakasimba nekuti zvinhu zvakatenderedza igirazi rinoputsika kwete organic laminate. Nekuisa pedyo zvakanyanya ne substrate edge kana kuwanda kwakanyanya kwe stress munzvimbo zvinogona kugadzira crack sensitivity panguva yekugadzirisa kana singulation.

Nechikonzero ichocho, dhizaini yeTGV yakabatana zvakanyanya nekudzora kushushikana. Kunyangwe girazi richideredza zvakanyanya kuchinjika kwepakati pechinhu kana zvichienzaniswa nezvinhu zvakasikwa, chinhu chakagadzirwa chinoramba chiine kushushikana kubva mukusawirirana kwemhangura, kunamatira kwakasimba, kupora kwakaderera, uye kutenderera kwekupisa. Dhizaini yakanaka yePCB yepakati pegirazi saka inosanganisa dhizaini yakanaka yeTGV nekugoverwa kwemhangura kwakaringana, matched build-up layers, uye package-level mechanical modeling.

Mukutaura kwechokwadi, chinangwa chekugadzira hachisi chekungogadzira via conductive chete. Chinokosha pakugadzira chimiro chose chepakati nepakuvaka chakagadzikana zvakakwana kuti chibatanidzwe zvakanaka munzvimbo yakazara yepakeji. Ruzivo rwemaitiro ari shure kwegirazi kuburikidza nekugadzirwa runokanganisa zvakananga mhedzisiro iyoyo.

Mashandisirwo uye Mibvunzo Inowanzo bvunzwa Nezve Glass Core PCB

Glass core PCB iri kushandiswa uko ma "conventional package substrates" asingachakwanisi kupa "flatness" yakakwana, "thermal matching", kana "routing density". Chinonyanya kudiwa chinobva ku "AI accelerators", "high-performance CPUs", uye "chiplet-based package architectures" dzine "body size" yakakura uye "fine bump pitch". Ma "package" aya anoda "substrate" inoramba yakatsetseka kuburikidza ne "assembly" uku ichitsigira "high I/O density" uye "die attachment" yakavimbika. Glass core inewo kukosha kuri kukura mukurongedza "high-frequency" uye "RF", uko "dielectric stability" uye "dimensional precision" zvinonyanya kukosha pama "operating frequency" epamusoro. Muzviitiko izvozvo, maitiro emagetsi e " high-frequency glass PCB structures" anova chikamu chehurukuro yekugadzira "package".

Ndeipi mukana mukuru wePCB yegirazi?

Chinhu chikuru chakanakira ndechekuti simbi dzegirazi hadzina warpage yakawanda uye CTE haishande zvakanaka nesilicon. Izvi zvinoita kuti simbi dzegirazi dzive dzakakodzera kupfuura simbi dzeorganic packages dzakakura, dzakapfava.

Ko PCB yepakati pegirazi yakafanana neinterposer yegirazi here?

Kwete. Bhokisi regirazi rePCB ndiro substrate pachayo, nepo interposer iri jira rakasiyana rekugovera patsva rakaiswa pakati pemadhayi nesubstrate.

Sei girazi rePCB rakakosha pamapakeji eAI nemachiplet?

Nekuti mapakeji iwayo anosanganisa saizi yakakura ye substrate, huwandu hwakawanda hwe I/O, uye bump pitch yakanaka. Zvinhu zve organic zvinonetseka kuchengetedza kutsetseka uye kuvimbika mumamiriro ezvinhu akadaro, nepo girazi richishanda zviri nani.

Ko PCB yegirazi inotsiva silicon interposers here?

Haisi mune mamwe magadzirirwo ese. Girazi rinowanzo shandiswa pakati pezvinhu zve organic zvinodhura zvishoma uye zvinogadzirisa interposer zvine simba guru.

Ko girazi rePCB ratova tekinoroji yekugadzira here?

Iri kuchinja kubva pakugadzirwa kwayo kuenda pakugadzirwa kwekutanga kwezvirongwa zvemapurasitiki epamusoro, kunyanya panodiwa saizi yakakura ye substrate uye huwandu hudiki hwekubatanidza zvinhu. Zvinodiwa papurojekiti zvinogona kutumirwa zvakananga kuburikidza nepeji rekotesheni.