Girazi Interposer PCB vs Silicon Interposer

Girazi reinterposer imhando ye "passive redistribution substrate" inoiswa pakati pe "semiconductor dies" ne "package substrate" iri pasi padzo. Basa rayo guru nderekugovera "fine-pitch die connections" mu "routing format" iyo inotevera package inogona kubata, ukuwo ichitakura ma "die-to-die signals", simba, uye pasi munzvimbo yakamanikana. Mukuita, ma "glass interposer" ari kukwezva kutariswa nekuti anopa nzvimbo yepakati pakati pe "silicon interposer" ne "organic interposer": "fine routing" uye "dimensional stability" iri nani pane "organic materials", asi ine mutengo wakaderera uye "panel-format" yakakura kupfuura "wafer-limited silicon". Kuti uwane zvinhu zvakawanda uye mamiriro epuratifomu, ona girazi PCB overview.

Kumbira Mutengo weGlass Interposer

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Chii chinonzi Glass Interposer uye Chii Chinoita?

Mukugadzira ma semiconductor epamusoro, interposer imhando yekugovera patsva iri pakati pema dies ari pamusoro ne substrate yepakeji iri pasi. Glass interposer inoshandisa girazi se base substrate yayo uye inosanganisa mabasa matatu akakosha: kugovaniswa kwesignali yakatwasuka kuburikidza ne fine wiring pamusoro, vertical transfer kuburikidza ne thick substrate, uye pitch transformation pakati pe very fine die bumps uye coarser interconnect structure iri pasi.

Izvi zvinoreva kuti girazi re interposer harisi chinhu chimwe chete ne substrate yakazara yepakeji. Haritsivi pakeji yese yepasi. Asi, rinogara pakati pema dies ne substrate yepakeji, zvichibatsira kuendesa masaini akakora munzvimbo umo waya yemapakeji yakajairika inova yakaoma. Substrate yepakeji iri pasi ichiri kubata kubatanidza kwakakura kwefeni-kunze uye kwebhodhi, nepo interposer ichibata dambudziko re dense local interconnect zvakananga pasi uye pakati pema dies.

Chimiro chegirazi chinowanzo shandiswa chinosanganisira girazi rakatetepa, magirazi anopinda nepakati ekubatanidza akamira, uye machira ekugovera patsva padivi rimwe chete kana ese ari maviri. Nekuti girazi pacharo rinochengetedza magetsi uye rakagadzikana, rinopa puratifomu yakanaka yekubatanidza waya, kushandura pitch, uye kubatanidza magadzirirwo ayo angave akaoma kugadzira pazvinhu zvakajairwa zve organic.

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Girazi Interposer vs Silicon Interposer vs Organic Interposer

Chikonzero chinoita kuti tekinoroji ye glass interposer ikoshe ndechekuti iri pakati nepakati inobatsira zvikuru. Silicon interposer inopa huwandu hwepamusoro hwe routing density, asi inodhura uye inodziviswa nekugadzirwa kwe wafer-scale. Organic interposer inodhura zvishoma uye iri nyore kuyera, asi huwandu hwayo hwe routing density uye diviment stability zvakanyanya. Glass interposer inozadza mukaha wemapakeji anoda huwandu hwakawanda kupfuura hunogona kupihwa ne organic, asi haadi mutengo wakazara uye kuomarara kwe silicon.

Kubva pakusarudza kurongedza, silicon interposer inowanzo sarudzwa kana dhizaini yacho ichida huwandu hwepamusoro hwekugoverwa patsva huripo. Organic interposer inosarudzwa kana mutengo wakanyanya uye huwandu hwenzira huchiramba huri pakati nepakati. Glass interposer inova inoyevedza kana package ichida kugadzikana kuri nani, routing yakanaka, kana mashandiro ekuona pasina kupindira zvizere munzvimbo yemutengo wesilicon-interposer.

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Dhizaini yeGlass Interposer: TGV, RDL, Stack-Up, uye Warpage Control

Dhizaini yegirazi re interposer ndiyo inonyanya kukosha panyaya iyi nekuti kukosha kweinterposer hakuonekwi zvakanyanya nezita rezvinhu asi kunonyanya kuonekwa nekuti chimiro chacho chakagadzirwa sei. Mumapurojekiti chaiwo, girazi re interposer haringoonekwi chete kana richishandisa girazi. Rinoonekwa kana through-substrate interconnect yaro, redistribution layers, stack symmetry, uye package interaction zvinogona kutsigira target die size, bump pitch, signal count, uye assembly process.

1. Ukobvu hwepakati pegirazi uye basa

Girazi rinowanzo chengetwa rakatetepa nekuti interposer ichimiro chekugovera patsva, kwete bhodhi hombe remakanika. Girazi rinofanira kunge rakakora zvakakwana kuti rirambe rakagadzikana panguva yekugadzirisa nekugadzira, asi rakatetepa zvakakwana kuti ritsigire chinangwa kuburikidza ne geometry uye package profile. Mubasa iri, girazi rinoita zvakasiyana nepuratifomu yakazara ye substrate senge glass core PCB , uko girazi rinoumba musana wepakati we package substrate pachayo.

2. Zvivharo zvegirazi semusana wakamira

Magirazi anopinda nepakati pegirazi akakosha nekuti anobatanidza divi renzira rinotenderera rinotarisana nedhie nedivi rinotarisana nepakeji. Mumagirazi anopinda nepakati, aya magirazi anowanzo kuve nenzvimbo dzakamanikana, zvidimbu zvidiki, uye zvinodiwa zvekuzadza zvakanyanya kupfuura mumabasa egirazi akajairika. Kuzadzwa kwakasimba kunowanzo kufarirwa nekuti interposer inofanirwa kutsigira kugoverwa kwakasimba uye kushanda kwakasimba kwemativi pane kungochinja-chinja kubva kumusoro kuenda pasi. Pfungwa yakadzama yemaitiro ari shure kwekubatana uku kwakabatana zvakanyanya negirazi rinopinda nepakati.

3. Dhizaini yechikamu chekugovera patsva

Chikamu chekugoverazve, kana kuti RDL, ndipo panotangira interposer kuita basa rayo rekushandura pitch. Pamusoro, RDL inogamuchira fine-pitch die connections. Pasi, inoshandura masaini iwayo kuenda ku package substrate. Kana ma dies akawanda achigovana interposer imwe chete, RDL network imwecheteyo inoendesawo ma die-to-die connections laterally pamusoro. Izvi zvinoreva kuti nzira yekufambisa inofanira kufunga nezvekutiza kwesignali, kureba kwenzira, chimiro chereferensi, huwandu hwenzvimbo, uye kuti interposer inosangana sei ne organic substrate iri pasi payo.

Mukuita, dhizaini yeinterposer RDL haisi "kungofambisa PCB zvakanaka." Iri pedyo nekugoverwazve kwemapakeji, uko kuwanda kwenzvimbo, symmetry, uye kudyidzana kwezvikamu zvakabatana zvakanyanya nemaitiro ekuunganidza uye warpage. Magadzirirwo anoita seanoshanda zvakanaka emagetsi anogona kunge achiri asina kunaka muchimiro kana zvichiita kuti copper isakanganisika kana kuti stress concentrations isatsigirwe mu interposer stack.

4. Kurongeka kweStack-up uye manejimendi yewarpage

Warpage ndeimwe yenjodzi huru dzeinjiniya mukugadzira magirazi einterposer nekuti pitch yakanaka yebump hairegi mukana wekusawirirana kwegungano. Kana chimiro chekugoverwazve chisina kuenzana, kutonhora kubva patembiricha yegungano kunogona kugadzira curvature yakakwana yekukonzera bump opens, unequality contact, kana goeld loss. Zvinonyanya kukonzera kusawirirana kwemhangura pakati pemativi maviri, mismatch dielectric build-up, underfill behavior, uye kudyidzana nepakeji substrate iri pazasi.

Nechikonzero ichocho, ma "interposer stacks" anowanzo gadzirwa nepfungwa yekuenzana. Maumbirwo ekugoverwazve kwepamusoro nepazasi anofanira kufungwa pamwe chete, kwete ega. Kuenzana kwemhangura, huwandu hwema "layer", uye kurongeka kwemaitiro zvese zvinopesvedzera kutsetseka kwekupedzisira kwe "interposer". Ichi ndicho chimwe chezvikonzero zvikuru zvinoita kuti girazi rikwezve: CTE yaro yakaderera uye kugadzikana kwakanaka kwe "dimensional stack" zvinobatsira kudzora kuchinjika kwema "package" zviri nani pane dzimwe nzira dzeorganic munzvimbo dzakaoma dzema "package".

5. Chiratidzo, simba, uye kuronga kupisa

Kunyangwe interposer isingashande, ichiri kufanira kuita mabasa matatu akasiyana esystem: kugoverwazve kwesignali, kugoverwa kwesimba, uye kudyidzana kwekupisa nezvimwe zviri mupakeji. Izvi hazviwanzo fambisa dhizaini munzira imwe chete. Kufamba kwesignali kwakasimba kunogona kukwikwidzana nekuda kwenzira dzekutumira simba kana kuramba kuri pasi. Saizvozvowo, kurongeka kwebump uye kuiswa kwe die zvinogona kugadzira nzvimbo dzekupisa dzemunharaunda. Dhizaini yakanaka ye interposer saka inoda kurongeka pakati pezvinangwa zvemagetsi, zvemakanika, uye zvekurongedza pane kugadzirisa chimwe chazvo chete.

Ndosaka girazi re interposer richifanira kutariswa sedambudziko rekugadzira package, kwete dambudziko rekugadzirisa mutsetse mudiki chete. Nzira chaiyo yekushandisa pattern, RDL stack, uye build-up arrangement zvinotemerwa nehurongwa hwese hwepackage, kusanganisira die count, die spacing, substrate iri pazasi, uye assembly method.

Mashandisirwo eGlass Interposer mu2.5D, 3D, uye Co-Packaged Optics

Magirazi ekugadzira zvinhu anowanzo kurukurwa kana tichitarisa mapurasitiki epamusoro, asi mhando dzemashandisirwo acho hadzina kufanana. Magirazi ekugadzira zvinhu anogona kushanda mabasa akasiyana zvichienderana nekuti pasuru yacho ndeye 2.5D, 3D, kana photonic-electronic.

Chiplet yekurongedza ye2.5D

Mumapakeji e2.5D, ma "multiple dies" anogara padivi nepadivi pa "interposer", uye "interposer" inobata nzira yakamanikana pakati pawo. Iyi ndeimwe yenzira dzakajeka dzekushandisa tekinoroji ye "glass interposer" nekuti inoda kugoverwa kwakanaka, hunyanzvi hwakagadzikana, uye nzvimbo ye "substrate" inogona kukwidziridzwa.

Zvivakwa zvekutsigira marongero e3D

Mumagadzirirwo e3D, interposer inogona kushanda sechikamu chekugoverazve chinotsigira stack yakabatana zviri vertical. Kukosha pano hakusi kungowanda kwenzira chete asiwo kugadzikana kwemechanical uye kuvimbika kwekubatanidza kwakamira mukati mepakeji yakabatana zvakanyanya.

Kurongedza pamwe chete kwePhotonic-electronic

Chimwe chezvakanakira zvikuru zve tekinoroji yegirazi interposer kujeka kwayo kwemaziso. Iyi hunhu inovhura nzvimbo yekugadzira iyo silicon interposer kana organic substrates dzisingakwanise kutsigira nenzira imwechete. Mumasystem e photonic-electronic co-packaged, mabasa e optical neemagetsi anogona kubatanidzwa papuratifomu imwe chete ye substrate, zvichiita kuti magadzirirwo akamanikana uye anoshanda zvakanaka ekukurukurirana kwepamusoro-soro uye mashandisirwo ekuona.

Mashandisirwo aya anoratidzawo kuti nei magirazi anopindirana asingakwanise kuongororwa chete kuburikidza nekuenzanisa kuri nyore kwemutengo. Mune dzimwe mhinduro dzekurongedza, girazi rinogona kusarudzwa nekuti haridhuri pane silicon. Mune dzimwe nguva, rinosarudzwa nekuda kwehunyanzvi hwaro hwakasiyana, hwakadai se optical access, mafomati makuru e substrate, kana hunhu hwakasiyana hwezvinhu. Mumamiriro ezvinhu aya, girazi haringoshandi seimwe nzira inodhura zvishoma asi se substrate inobvumira sarudzo dzekugadzira dzisingawanikwe nezvimwe zvinhu.

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Mibvunzo Inowanzo bvunzwa Nezve Glass Interposer uye Kuronga Mapurojekiti

Ndeupi musiyano uripo pakati pegirazi remukati negirazi remukati megirazi?

Girazi reinterposer igwaro rekugovera zvinhu zvisina kuvharwa rakaiswa pakati pemadhiri nepasita yepakeji. Girazi repakati pepasita ndiro chimiro chakazara chepasita yepakeji chiri pasi pedhiri kana kuti interposer uye chinozopedzisira chakabatana nebhodhi-level package interface.

Rini girazi re interposer riri nani pane silicon interposer?

Girazi re interposer rinowanzo kwezva kana paki yacho ichida kugoverwazve kwakaderera kupfuura zvinhu zve organic, asi haridi huwandu hwakanyanya hwe silicon interposer. Rinonyanya kunakidza kana panel-scale economics kana optical functionality zvichikosha.

Nderupi ruzivo runodiwa kuti utange chirongwa chekugadzira girazi re interposer?

Chirongwa ichi chinowanzo tanga nehukuru hwema "die", huwandu hwema "die", bump map, target footprint, huwandu hwemasaini, huwandu hwedata, simba rinodiwa, uye chimiro chepakeji chiri pasi pe "interposer". Izvi zvinosarudza huwandu hwe "interposer routing density", kuburikidza nestrategy, uye nzira ye "stack-up direction".

Zvinoshandiswa pakupinza magirazi zvinogona kubatanidzwa nenzira dzakajairwa dze flip-chip here?

Zvinogona kubatanidzwa muhurongwa hwepamusoro hwekugadzira zvinhu, asi nzira yekushandisa zvinhu nekutsigira zvinhu inofanira kuratidza maitiro egirazi asina kusimba. Kuronga kugadzira zvinhu kunowanzo ongororwa pamwe chete nenzira yakafara yekugadzirwa kwezvinhu mukugadzira magirazi ePCB.

Purojekiti inofanira kutaurwa sei?

Mashoko anobatsira anowanzo tanga nehurongwa hwepakeji pane chikumbiro chezviyero chete. Kana uine ruzivo rwakadzama, bump map, footprint target, kana zvirambidzo zvekubatanidza, zvitumire kuburikidza nepeji remashoko kuitira kuti girazi rigone kuongororwa zvichienderana nezvinodiwa chaizvo pakeji.