Kuburikidza neGirazi kuburikidza neGirazi PCB Design

Girazi rinopinda negirazi (TGV) ikubatana kwemagetsi kwakamira kunoumbwa kuburikidza negirazi. Mukugadzira PCB yegirazi, inobvumira masaini, simba, pasi, kana kupisa kufamba nepakati pegirazi kuitira kuti substrate ikwanise kutsigira mafambiro pakati penzvimbo, ma layers, uye nzvimbo dzinoshanda. Izvi zvinoita kuti mafambiro egirazi apinde negirazi ave chinhu chakakosha mukugadzirwa kwePCB yegirazi, magadzirirwo epakati pegirazi, mafambiro einterposer-style, uye maRF circuits uko kutsamira, kugadzikana kwezvikamu, uye kubatana kwakadzorwa zvese zvinokosha. Sechikamu chekugadzira PCB yegirazi , mafambiro egirazi haasi chinhu chekugadzira chete, asiwo chinhu chekufambisa nekubatanidza chinoumba mashandisirwo esubstrate yese.

Kumbira Mutengo weGlass PCB

Zvinoreva Kuburikidza neGlasi muGirazi rePCB

Mukugadzirwa kwePCB yegirazi, nzira yekupinda negirazi ndiyo nzira yekubatanidza zvinhu zvemuchina wekufambisa magetsi pamusoro nepazasi pechinhu chegirazi. Pasina iyo, girazi rinogona kungotsigira nzira iri nyore yekupfuura nepamusoro. Kana nzira yekupinda negirazi yangoiswa, dhizaini yacho inogona kutanga kushandisa nzvimbo dzese dziri pasi pechinhu nenzira yakarongeka, uye girazi rinova chikamu chehurongwa hwedunhu hwakakwana pane kungoshanda sechitsigiro chakasimba.

Ndosaka nzira yegirazi isingagoni kunzwisiswa segomba rinopinda negirazi chete. Inzira yekugadzira ine simba remagetsi, remakanika, uye rekuita. Buri riri mugirazi, simbi iri mukati maro, chimiro chepad chakaripoteredza, uye nzira yakabatana naro zvese zvinoshanda pamwe chete.

• Basa remagetsi: inobatanidza zviratidzo, pasi, simba, kana nzira dzinopisa nepakati pegirazi
• Basa remakanika: inofanira kunge inoenderana ne substrate yakaoma uye yakaoma
• Basa rekufambisa: inoita kuti mativi ese egirazi agovane mabasa edunhu
• Basa rekubatanidza: inotsigira marongero akaomarara kupfuura nzira yegirazi ine mativi maviri

Basa reKufambisa reVias yeKupfuura neGirazi muGirazi PCBs

Basa guru rekushandisa girazi rinopinda nepakati nderekufambisa nzira dzemagetsi nepakati pe substrate kuitira kuti dhizaini isangogumira pane imwe nzvimbo. MuPCB yegirazi, nzvimbo yekufambisa inowanzova yakamanikana kupfuura mubhodhi remazuva ano rine layer yakawanda nekuti dhizaini yacho ingangoda kuchengetedza nzvimbo ye optical, kugadzirisa conductor density nokungwarira, kana kutsigira mabasa akasiyana kumativi akasiyana e substrate. Kushandisa girazi rinopinda nepakati kunobatsira kugadzirisa dambudziko iroro nekuwedzera vertical routing kune layout strategy.

Izvi zvinonyanya kubatsira kana mativi epamusoro nepasi egirazi akapihwa mabasa akasiyana. Rutivi rumwe runogona kushandiswa pakutumira masaini emagetsi zvakanaka, nepo divi rakapesana richigona kushandiswa pakutarisa pasi, kugovera simba, zvivakwa zvekudzivirira, nzira dzekupisa, kana ma "interconnect pads" makuru.

Sezvo kuwanda kwenzira yekufambisa zvinhu kuchiwedzera, kuburikidza nenzvimbo, pitch, uye pad transition zvinotanga kukanganisa kurongeka kwese kwecircuit. Ichi ndicho chimwe chikonzero nei through-glass via planning zvakabatana zvakanyanya nekugadzirwa kwePCB yegirazi , uko kuburikidza nekugadzirwa, conductor patterning, uye kushandiswa kwepamusoro zvinofanirwa kushanda pamwe chete.

Nei Girazi Richichinja Nekugadzira Logic

Girazi rinopinda negirazi harigone kubatwa nenzira imwecheteyo neburi rinopinda negirazi riri mubhodhi reFR-4 nekuti girazi rinochinja magadzirirwo aro. Ma laminates eorganic anoboorwa uye anoputirwa muPCB yakakura, uye ma vias avo anowanzo shandiswa sezvinhu zvakajairwa zvekuisa. Girazi rakasiyana. Rakasimba, harina kusimba, rakagadzikana zvakanyanya, uye harinyanyi kushivirira kukuvara kwemucheto kana kutanga kupwanyika kusingadzoreki.

Izvi zvinoreva kuti via haisi kungochinja magetsi chete asiwo chiitiko chemakanika munharaunda. Kuburikidza nekuiswa, nzvimbo yepakati, kurodha simbi munzvimbo, uye hukama hwekukora zvese zvinoda kutariswa zvakanyanya kupfuura muzvirongwa zveFR-4 zvakajairika.

Kubatanidzwa kwesimbi uye kuvaka-up

Kugadzira simbi chinhu chakakosha pakugadzira girazi kuburikidza nekushanda nekuti gomba riri mugirazi rinongoshanda chete mushure mekunge rachinjwa kuita chimiro chakagadzikana chekufambisa. Mukugadzira, kugadzira simbi kunokanganisa zvinopfuura kuenderera mberi kwemagetsi. Kunokanganisawo kubatana, kuramba, kufambirana kwemaitiro, kutsetseka kwepamusoro penzira, uye kuti vertical interconnect inobatanidza sei sisitimu yekufambisa simbi kumativi ese e substrate.

Nechikonzero ichocho, kugadzirwa kwesimbi kunofanirwa kutorwa sechikamu chekugadzira kwete sedanho rekugadzira riri pasi chete.

1. Kuumbwa kwekuvhura: nzira inopinda nepakati inogadzirwa mugirazi ine geometry inodzorwa
2. Kugadzirira kwepamusoro: pamusoro pegirazi pakagadzirirwa kunamira kwesimbi kwakavimbika
3. Kuunganidzwa kwembeu nekufambisa mvura: iyo via inova dhairekitori inoshandisika yakatwasuka
4. Kubatanidzwa nehurongwa: ma "via joins pads", ma "traces", uye ma "build-up" ari kumativi ese

Izvi zvinova zvinonetsa zvikuru kana via iri chikamu che substrate yakaunganidzwa pane kuti ive circuit yegirazi ine mativi maviri. Ndosaka dhizaini ye through-glass via yakabatana zvakanyanya ne glass core PCB structures, uko vertical interconnect, build-up balance, uye substrate stability zvinofanirwa kufungwa pamwe chete.

Kufunga Nezvekugadzira Magadzirirwo eGlass Core, Interposer, uye RF

Magadzirirwo egirazi rinopinda nepakati anoenderana zvakanyanya nerudzi rwemagadzirirwo egirazi ari kuvakwa. Pfungwa imwecheteyo yekupinda nepakati inogona kuita mabasa akasiyana zvichienderana nekuti substrate yacho yakagadzirirwa kubatanidzwa kwemapakeji, kufambiswa kwemashoko pakati pemagetsi, kana mashandiro eRF.

Zvivako zvepakati pegirazi

Mumagirazi emukati megirazi, via inowanzova chikamu chehurongwa hwekubatanidza hune denser package-style. Kushanda zvakanaka kwenzira, build-up symmetry, vertical transition quality, uye substrate flatness zvese zvinokosha pamwe chete.

Maumbirwo eInterposer

Mumarongerwo emhando ye interposer, via inoshanda sechikamu chehurongwa hwekugovera patsva uko kuwanda kweconductor uye kunyatsorongeka kwelayout ndizvo zvinonyanya kukosha pabasa re substrate. Iyi ndiyo mhando yenzvimbo iyo marongerwo ePCB e glass interposer anovimba nema through-glass vias sechikamu che routing network kwete se connections dzakaparadzana.

Zvivako zveRF

MuRF uye microwave structures, via inogona kuva chikamu chekudzika, kudzivirira, kushandura mareferensi, kana kufamba kwechiratidzo kunodzorwa kuburikidza negirazi body. Mumagadzirirwo aya, via geometry haigone kuparadzaniswa kubva ku pad structure, return path, conductor arrangement, uye encircled dielectric behavior. Ndosaka through-glass via planning ichiwanzoonekwa pamwe chete ne high-frequency glass PCB requirements.

Mashandisirwo uye Mibvunzo Inowanzo bvunzwa

Magirazi anoshandiswa kuburikidza negirazi anotsigira mashandisirwo ePCB egirazi nekubvumira substrate kutakura mabasa anopfuura rimwe chete edunhu panguva imwe chete. Mune mamwe marongero, anobatanidza masaini pakati penzvimbo mbiri dzebhodhi regirazi rakaoma. Mune mamwe, anobatsira kuparadzanisa mashandiro esignal, ground, uye power kumativi akasiyana esubstrate. Mumagadzirirwo ane chekuita nemapakeji akawandisa, anotsigira kushanduka kwakamira mukati me network yekubatanidza yakabatana.

Zvinobatsirawo kana nzira dzemagetsi dzichifanira kubatanidzwa nezvimwe zvinodiwa padanho repasi pevhu. Zvimwe zvivakwa zvinopenya kana kuti zvinopenya zvishoma zvinoda kuiswa kwemuchina wekufambisa mhepo kuti zvitariswe nokungwarira uku zvichichengetedza kubatana kwemagetsi kuburikidza nesubstrate. Mamwe magadzirirwo ane chekuita nekupisa kana chiedza anoda nzira dzakatwasuka dzinotsigira nzira dzekufambisa mhepo uye kufamba kwekupisa. Ndokusaka magirazi anobudawo muzvikamu zvePCB zvegirazi re LED.

Sezvo tekinoroji yedunhu regirazi ichiramba ichikura, magirazi anopinda negirazi anoramba ari chimwe chezvinhu zvinoita kuti kuwedzera ikoko kukwanisike. Anobvumira girazi kushanda kwete se substrate yakasimba kana yakajeka chete, asi sechikamu chesystem yekubatanidza ine simba repamusoro yekurongedza, RF routing, uye kubatanidzwa kwemagetsi kwakasarudzika. Zvinodiwa zvepurojekiti zvinogona kutumirwa zvakananga kuburikidza nepeji rekotesheni.