Zvishandiso zvePCB zveMabhodhi eMultilayer

PCB ine ma layer akawanda — 18, 24, 32 layer kana kupfuura — ndeimwe yezvigadzirwa zvinonyanya kudiwa nemugadziri, uye zvinhu zvayakavakirwa ndizvo zvinonyanya kukosha kana ikabudirira. Layer imwe neimwe inowedzera huwandu hwema interfaces emidziyo anofanira kubatana zvakanaka, ma registry tolerances anofanira kubata mu stack, uye huwandu hwe laminate ne prepreg zvinoshandiswa nebhodhi. Muna 2026, ma high-layer-count boards anonzwawo kushomeka kwezvinhu zvakanyanya, nekuti anowanzoda ma grade mashoma muhuwandu hwakawanda. Gwaro iri rinofukidza zvinodiwa nezvinhu, core uye prepreg selection, goal and warpage challenges, uye supply reality.

Zvinodiwa pakugadzira magadzirirwo emhando yepamusoro

Magadzirirwo ehuwandu hwepamusoro anoisa zvinodiwa nezvinhu zvisingadiwi nemabhodhi ane zvidimbu zvakaderera. Kugadzikana kwehukuru kwakakosha: chinhu chinofanira kuchengetedza zviyero zvaro kuburikidza nematanho akawanda ekuisa lamination kuitira kuti zvinhu zviri mukati mezvikamu zvinyore zvakanaka kune mumwe nemumwe uye kumaburi akaboorwa. Z-axis CTE inofanira kudzorwa, nekuti kana bhodhi rakawanda uye rakakora, kuwedzera kwez-axis kunoitika kuburikidza nekupisa, maburi akaputirwa. Ukobvu hwe dielectric hwakafanana uye Dk mupaneru zvakakosha pakudzora impedance pama signal layers akawanda. Uye resin system inofanira kubatana zvakavimbika layer-to-layer pasina voids kana resin starvation.

Kune mabhodhi ane nhamba yepamusoro-soro — maAI servers, maswichi ekumhanya-mhanya — zvinodiwa izvi zvinosanganiswa nechinodiwa chekurasikirwa kushoma, zvichisundira dhizaini kusvika padanho repakati-kurasikirwa kana kurasikirwa kushoma pamatanho echiratidzo. Ndosaka zvinodiwa zvezvinhu zvine nhamba yepamusoro-soro uye zvinoshanda zvakanyanya zvichiwanzopindirana. Mamiriro ekushandisa ari muAI server PCB materials uye kumashure kwedhizaini mugwaro redu rekugadzira PCB rine nhamba yakawanda.

Sarudzo yeCore uye Prepreg

Bhodhi rine machira akawanda rinochinjanisa mafomu maviri: macores (laminate yakanyatsogadzirwa nemhangura kumativi ese, inotakura chiratidzo chemukati uye ma plane layers) uye prepreg (jira regirazi rakaiswa resin rechikamu cheB rinosunga macores pamwe chete panguva yekukanda uye kuyerera kuti azadze pakati pezvinhu). Kusarudza ese ari maviri nemazvo kwakakosha. Musoro unogadza ukobvu hwe dielectric yemukati uye impedance yema signal layers anotakura; prepreg inogadza ukobvu hwe bond-layer uye inofanira kuva ne resin yakakwana kuti ibude uye izadze pasina kudya kana kugadzira ma voids.

Kune mabhodhi ane masherufu akawanda, sarudzo yeprepreg inonyanya kukosha nekuti kune masherufu akawanda ekubatanidza, uye rimwe nerimwe mukana wekuti pave nechinhu chisina kunaka kana kuti chinokanganisa impedance. Hunhu hwe resin uye kuyerera kwemvura zvinofanirwa kuenzaniswa nehuremu hwe copper feature pa masherufu ari pedyo - masherufu emukati ane mhangura yakawanda anoda prepreg ne resin yakakwana yekuzadza nzvimbo dziri pakati pemasherufu. Core ne prepreg zvinofanirawo kugovera sisitimu yezvinhu zvinoenderana kuti zvibatane zvakavimbika. Zvinhu zvakakosha zviri mu prepreg material yedu ye multilayer PCB guide uye PCB laminate construction overview.

Kufunga Nezvekubereka KweLamination

Kuwanda kwelamination kunoderera sezvo nhamba yelamination ichikwira, nekuti kutenderera kwega kwega kwelamination uye chimiro chega chega chezvinhu zvinowedzera mukana wekuti pave nezvikanganiso - kusava nechinhu, delamination, resin fasting, kana registration error - uye zvikanganiso zvinosangana pamusoro pe stack. Mabhodhi ane layer-count anowanzoda sequential lamination (kuvaka sub-assemblies mu multiple press cycles), izvo zvinowedzera thermal uye mechanical stress pane zvinhu uye huwandu hwematanho ekunyoresa anofanira kuchengetwa.

Sarudzo yezvinhu zvinokanganisa goho iri zvakananga. Sisitimu ye resin ine chimiro che lamination chakatsanangurwa zvakanaka, prepreg ine kuyerera kwakakodzera kwehuwandu hwezvinhu, uye stack-up yakaenzana zvese zvinokwidza goho rekutanga. Kusiyana neizvi, prepreg isina kuenzana kana stack-up isina kuenzana inoderedza goho, uye pabhodhi rinodhura re high-layer-count kurasikirwa kwegoho kunodhura - mune zvinhu zvakaraswa (izvo zvisingawanikwe uye zvinodhura muna 2026) uye mukuparara kwezvinhu zvakazvigadzira. Kuderedza kushandiswa kwe premium-CCL uye kubvisa ma lamination cycles asina kukodzera kuburikidza ne smart stack-up design saka kunovandudza zvese mutengo ne goho. Sequential-lamination background iri mu sequential lamination mu HDI PCB.

Kutarisira Warpage uye Kunyoresa

Warpage nekunyoresa ndidzo nzira mbiri dzekutadza kwemakanika idzo huwandu hwakawanda hwema layer hunokonzeresa kuipa, uye dzese dziri mbiri dzinotungamirirwa nezvinhu. Warpage inokonzerwa neasymmetry — unbalanced copper distribution, asymmetric stack-ups, kana mismatched material expansion — iyo inoita kuti bhodhi rikotame parinotonhora kubva pakukanda. Dziviriro idzi i symmetric stack-up (kuenzanisa copper ne dielectric pamusoro pe centerline), zvinhu zvakafanana kuburikidza ne stack, uye controlled lamination cooling. Warpage inokosha nekuti bhodhi rakakotama rinokonzera matambudziko ekubatanidza: kusanyoresa zvakanaka kwe solder-paste uye kukanganisa kwezvikamu.

Kunyoresa — kurongeka kwakarurama kwezvikamu zvemukati memadziro pamwe chete uye kumaburi akaboorwa — kunoderera sezvo zvikamu zvakawanda zvichiwedzera kufamba panguva yekurovera. Zvinhu zvine kugadzikana kwakanyanya uye kufamba kushoma pasi pekupisa kwemadziro zvinochengeta kunyoresa zviri nani, ndosaka kugadzikana kwezvikamu kuri chinhu chakakosha chinodiwa nezvinhu zvakawanda. Kunyoresa kwakasimba ndiko zvakare kunobvumira mhete diki dze annular uye zvinhu zvakapfava pamabhodhi ane density yakakura. Dhizaini yacho inotsanangurwa mugwaro redu reHDI stack-up design.

Matambudziko Enguva Yekutungamirwa Kwezvinhu

Mabhodhi ane mativi akawanda anotarisana nemufananidzo wakaoma wenguva yekuiswa kwezvinhu nekuda kwezvikonzero zviviri. Chekutanga, anowanzoda magiredhi akaganhurirwa - mabhodhi ane mativi akawanda anoshandisa laminate inorasikirwa nepakati kusvika kune yakaderera, iyo inotora mavhiki 14-18 kweM6/M7 uye mavhiki 20+ (kugoverwa chete) kweM8/M9. Chechipiri, anoshandisa zvinhu zvakawanda pabhodhi pane magadzirirwo emadziro akaganhurirwa, saka zvinodiwa pakugoverwa zvakakura uye zvakaoma kuzadza kubva pakuwanikwa kwakaganhurirwa.

Chikamu chehuwandu hwepamusoro-soro chiri kukurawo nekukurumidza — mabhodhi akawanda-soro-soro (18+ layers) ari pakati pezvikamu zvePCB zviri kukura nekukurumidza, zvichitungamirirwa nemasevha eAI uye network inokurumidza — izvo zvinowedzera kumanikidzwa kwezvinodiwa pamagiredhi chaiwo akanyanya kuganhurirwa. Mhinduro inoshanda yakafanana neyemamwe mabhodhi ane miganhu: fungidzira nekukurumidza, zadzisa giredhi rechipiri, ronga zvibvumirano zvezvinhu mavhiki 16-20 pamberi pemagiredhi epamusoro, uye shandisa ma hybrid stack-ups apo dhizaini inobvumira kudzikamisa huwandu hwegiredhi risingawanzo kuwanikwa. Maitiro ekutungamira-nguva ari mugwaro redu rePCB laminate lead time uye mamiriro ekugovera muPCB material deficit Hub.

Maitiro Ekuongorora Kuunganidzwa Kwemugadziri

Kune bhodhi rine nhamba yepamusoro, ongororo ye stack-up yemugadziri ndiyo danho guru remhando uye mutengo. Inosimbisa zvinhu zvakawanda panguva imwe chete: kuti impedance pane yega yega controlled-impedance layer inoverengerwa ne laminate chaiyo Dk uye inosangana nekushivirira; kuti stack-up yakaenzana pakudzora warpage; kuti core uye prepreg selection bonds zvinozadza density ye feature; kuti lamination plan (kusanganisira chero sequential lamination) yakanaka; uye kuti grade yezvinhu yakatarwa inowanikwa - kana ine qualified equivalent - zvichienderana nekugoverwa kwazvino.

Nekuti mabhodhi ane machira akawanda anodhura uye zvinhu zvacho hazviwanikwe, kubata dambudziko rekuisa zvinhu muchimiro che "stack-up", "impedance", kana "kuwanikwa" usati wagadzira kwakachipa kupfuura kuriwana mu "lamination" yakakundikana kana "out-of-tolerance board". Highleap Electronics inopa maverengero akasimbiswa ekuisa zvinhu muchimiro che "stack-up" ichishandisa "measured laminate Dk values" uye ongororo ye "pre-fabrication" inosanganisira "impedance", "symmetry", "core/prepreg bonding", uye kuwanikwa kwezvinhu zve "high-layer-count designs".

Tora Ongororo yeHigh-Layer-Count PCB Stack-Up

Highleap Electronics inogadzira mabhodhi ane zvidimbu zvakawanda zvichienderana nezvinodiwa izvi. Ona kugona kwedu kugadzira maPCB ane zvidimbu zvakawanda , PCB ine zvidimbu gumi nezvitanhatu , uye 28-layer PCB , pamwe chete nereferensi yePCB ine zvidimbu gumi nezviviri.

Mibvunzo Inowanzo bvunzwa Nezvezvinhu zvePCB

Ndezvipi zvinhu zvinonyanya kukosha pamabhodhi ane maturikidzana akawanda->

Kugadzikana kwehukuru (kuchengetedza kunyoreswa kuburikidza nematanho akawanda e lamination), z-axis CTE inodzorwa (yekuvimbika kweburi rinopinda), ukobvu hwe dielectric hwakafanana uye Dk (yekudzora impedance), uye sisitimu ye resin inosunga zvakavimbika pasina ma voids kana nzara.

Ndeupi musiyano uripo pakati pecore ne prepreg->

Chinhu chikuru chakagadzirwa nesimbi yakapfava ine mhangura kumativi ese, iine chiratidzo chemukati uye zvikamu zvakatsetseka. Prepreg ijira regirazi rakaiswa muB-stage resin rinosunga simbi pamwe chete panguva yekuputira uye rinoyerera kuti rizadze pakati pezvinhu zvemhangura. Zvose zvinofanira kusarudzwa nemazvo kuti zvisapararire uye zvibatane zvakavimbika.

Sei goho re lamination richiderera sezvo huwandu hwe layer huchikwira->

Kutenderera kwega kwega kwekugadzika kwelamination uye chimiro chezvinhu zvinowedzera mukana wekuti pave nechinhu chisina chinhu, chidimbu, kushaya resin, kana kukanganisa kunyoresa, uye izvi zvinosanganiswa mu stack. Mabhodhi ane layer-count anowanzoda sequentially lamination, zvichiwedzera stress uye nhanho dzekunyoresa. Zvinhu zvinoenderana zvakanaka uye stack-ups dzakaringana zvinowedzera goho.

Mapurisa anodzorwa sei pamabhodhi ane nhamba yepamusoro-soro->

Nekuunganidzwa kwakaenzana kunoenzanisa mhangura ne dielectric pakati pemutsetse, kufananidza zvinhu kuburikidza nepakati pemurwi, uye kudzora kutonhora kwe lamination. Warpage inokosha nekuti bhodhi rakakotama rinokonzera kunyoreswa kwe solder-paste uye matambudziko ekuisa zvikamu pamusangano.

Sei mabhodhi ane maturikirwo akawanda achitarisana nenguva dzakaipa dzekushandisa zvinhu->

Nekuti kazhinji zvinoda mamakisi akaganhurirwa (mavhiki 14-18 eM6/M7, mavhiki makumi maviri zvichikwira ekugoverwa - chete eM8/M9) uye zvinoshandisa zvinhu zvakawanda pabhodhi rega rega, zvichiita kuti zvinodiwa pakugoverwa zvive zvakakura uye zvakaoma kuzadza. Kufanotaura nekukurumidza uye kukodzera giredhi rechipiri kwakakosha.