Mhando dzeIC Package dzakatsanangurwa: BGA vs QFN vs QFP, uye Maitiro Ekusarudza PCB Yako

Pakeji yeIC ichinhu chakakomberedza chipu chesilicon chinoidzivirira uye chinoibatanidza nebhodhi — uye pakeji yaunosarudza (BGA, QFN, QFP, nedzimwe) inoumba saizi yebhodhi, maitiro ekupisa, maitiro ekubatanidza, uye mutengo. Kusarudza chaiyo chisarudzo chekugadzira seyemagetsi. Gwaro iri rinotsanangura mhando huru dzepakeji yeIC, kuti dzinozivikanwa dzinoenzaniswa sei, kuti kurongedza kunokanganisa sei kusanganisa, uye kuti Highleap Electronics inounganidza sei mhando yega yega yepakeji zvakavimbika.

1. Chii chinonzi IC package uye chii chinoita kuti ishande?

Pakeji yeIC inodzivirira inovhara die ye semiconductor uye inopa kubatana kwemagetsi - leads, pini, kana mabhora - kubva kuchip kuenda kuPCB. Inoita zvinhu zvitatu: inodzivirira silicon isina kusimba kubva mukukuvadzwa kwemuviri uye kwezvakatipoteredza, inofambisa kubatana kudiki kwedie kuenda kunzvimbo inopinzwa nebhodhi, uye inopa nzira yekupisa kubva muchip. Pasina kurongedza, die isina chinhu haigone kubatwa, kubatanidzwa, kana kutonhodzwa mukugadzirwa kwakajairika.

Pakeji iyi inotsanangurawo kuti chip inounganidzwa sei pabhodhi — ingave ine mapini ekupinza maburi, leads dzekuisa pamusoro, kana mabhora akawanda pasi payo. Sarudzo yekurongedza iyi inoenderana nebhodhi rese: saizi yaro, dhizaini yekupisa, maitiro ekubatanidza, uye zvinodiwa pakuongorora. Nekuti pakeji iri pamuganhu uri pakati pechip nebhodhi, yakabatana zvakanyanya netekinoroji ye substrate yezvikamu zvepamusoro, zvakaita seIC -substrate PCBs uye BGA substrates dzinoburitsa kubatana kwe die mukati mepakeji pachayo.

2. Mhando dzemapakeji eIC: through-hole, leaded SMT, uye array

Mapakeji eIC anowira mumhuri nhatu dzakakura: through-hole (mapini akaiswa mumaburi, senge DIP), leaded surface-mount (leads soldered to the surface, senge QFP neSOIC), uye array packages (connections dziri pasi, senge BGA neQFN). Mhuri yega yega inomiririra danho rekuenda kudiki uye connection density yakakura, uye mhuri inonyanya kuraira nzira yekubatanidza:

Mapakeji ane maburi ndiwo makuru uye ari nyore kushandisa nemaoko asi anoshandisa nzvimbo yakawanda; mapakeji eSMT ane maburi ane maburi anowanikwa pamucheto wawo; uye mapakeji earray anoisa ma connections pasi pemuviri kuti ave nehuwandu hwakanyanya uye hudiki. Nekufamba kwenguva, maitiro aya ave ari ekuti mapakeji earray awane density yakakura uye diki. Nekufamba kwenguva, maitiro aya ave ari ekuti mapakeji earray awane density sezvo zvishandiso zvichiderera, izvo zvinosimudzira kudiwa kwekuunganidza nekuongorora - kutengeserana kwacho kwakaongororwa muzvikamu zvinotevera, uye kunoonekwa mukuenzanisa mapakeji senge BGA vs LGA.

3. BGA vs QFN vs QFP: musiyano uripi?

QFP ine ma leads anotangira kumativi ese mana kuti zvive nyore kuongorora, QFN ine ma pads pamucheto wepasi asina ma leads akatambanudzwa kuti aite nhanho diki, uye BGA ine mabhora akawanda e solder pasi pese kuti pave nehuwandu hwakawanda hwekubatanidza. Musiyano uripo ndewekuti ma connections ari kupi uye kuti anowanikwa nyore sei, izvo zvinochinjana kuongororwa zvichienderana nehuwandu:

• QFP (Quad Flat Package) ine tambo dzemapapiro egull-wing kumativi ese mana; tambo dzinoonekwa uye dziri nyore kuongorora nekugadzirisa, zvichiita kuti zvive nyore kuunganidza — ruzivo rwuri muchinyorwa chino Mapakeji eQFN vs QFP.
• QFN (Quad Flat No-lead) ine mapedhi ari pamucheto wepasi uye kazhinji ine thermal pad iri pakati, isina tambo dzakatambanudzwa — diki uye dziri nani pakupisa, asi majoini ari pasi pemuviri uye akaoma kuongorora, akafukidzwa ne BGA inopesana neQFN.
• BGA (Ball Grid Array) inoshandisa mabhora akasiyana-siyana e solder pasi pese, zvichipa kubatana kwakawanda munzvimbo diki - asi joint yega yega yakavanzwa, zvichida X-ray kuti ionekwe, sezvakakurukurwa mu BGA soldering.

Maitiro acho akajeka: sezvaunofamba neQFP → QFN → BGA, huwandu hwetsoka nekubatana hunovandudzika ukuwo kugona kuongorora kuchiramba kuchioma. Dambudziko rekuongorora ndiro rinoita kuti mapakeji akavanzika ade kugona kusimbisa kunotsanangurwa zvinotevera.

4. Mashandiro anoita rudzi rwepakeji yeIC package pamusangano wePCB

Rudzi rweIC package runosarudza maitiro ekubatanidza uye nzira yekuongorora: mapakeji ane lead anogona kuiswa uye kuongororwa zvakananga, nepo mapakeji e array akadai seBGA neQFN achida kuiswa kwakanyatsojeka, kudzoreredzwa kwemvura, uye kuongororwa kweX-ray nekuti majoini awo akavanzwa pasi pemuviri. Saka kurongedza isarudzo yekugadzira, kwete yemagetsi chete - inoisa zvinofanirwa kuitwa netambo nekuongorora:

• SMT Inotungamirirwa (QFP, SOIC) nzvimbo dziri nyore uye mapfundo ayo anoonekwa otomatiki optical kuongorora, zvichiita kuti ive inokanganwira zvikuru kuvaka.
• QFN inoda kunamatwa kwakanyatsonaka uye jira rakanaka rekupisa, rine majoini akavanzwa kumucheto nepasi anowanzo fanirwa neX-ray.
• BGA inoda kuiswa kwakanyatsorongeka uye chimiro chekudzokororazve chakadzorwa kuitira kuti mabhora aputsike nemazvo, uye majoini ayo akavanzika zvakakwana anogona kusimbiswa chete ne X-ray kuongorora — moyo wevanhu vakavimbika Musangano weBGA.
• Kuburikidza neburi inoshandisa wave kana selective soldering uye ndiyo iri nyore kuigadzira nemaoko uye kuongorora.

Chidzidzo ndechekuti kusarudza paki yakakora kunokuisa muhurongwa hwekugadzira hunokwanisa uchishandisa X-ray, saka paki yacho nehurongwa hwekugadzira zvinofanira kusarudzwa pamwe chete pane kuti paki yacho isarudzwe yoga.

5. Maitiro ekusarudza pasuru yeIC yakakodzera

Sarudza package yeIC nekuenzanisa nzvimbo yebhodhi, zvinodiwa pakupisa, kugona kwekubatanidza, uye mutengo uchienzaniswa nekuwanikwa kwechikamu — package diki haisiyo nguva dzose yakanakisisa kana ichimanikidza kuvaka kwakaoma uye kunodhura kupfuura zvinodiwa nechigadzirwa chako. Kazhinji chip imwe chete inowanikwa mumapakeji akati wandei, zvichiita kuti iyi ive sarudzo chaiyo yekugadzira. Zvinhu zvekuyera:

• Nzvimbo yebhodhi. Magadzirirwo akaomarara, akakora anosundira kuQFN neBGA; mabhodhi akakura anogona kushandisa mapakeji ane mutobvu ari nyore kubatanidza.
• Zvinodiwa pakupisa. Mapakeji ane machira ekupisa kana miviri mikuru anoderedza kupisa zviri nani, izvo zvinokosha kune zvikamu zvinoda simba.
• Kugona kuunganidza. Zvikamu zveBGA nezvidimbu zvepitch zvakapfava zvinoda tambo yekudzokororazve ine X-ray; kana zviripo, hazvina dambudziko — kana zvisiri, package ine lead yakachengeteka.
• Mutengo uye kuwanikwa. Kusarudzwa kwepakeji kunokanganisa mari yezvikamu pamwe nemari yekubatanidza, uye chikamu chimwe chete chinogona kuchengetwa mumapakeji akati wandei.

Nzira yakanakisisa ndeyekusimbisa kuti pasuru inokodzera dhizaini uye maitiro ekugadzira akarongwa pakutanga - zvakanaka muongororo yekugadzirwa - saka hauzvipire kupasuru iyo maitiro ako ekugadzira asingagoni kuvaka kana kuongorora zvakavimbika.

6. Maunganidzirwo anoitwa Highleap mhando dzese dzeIC package

Highleap inounganidza mhando dzese dzeIC package — through-hole, leaded surface-mount, QFN, uye BGA — nekuisa, kuyererazve, uye kuongorora zvinodiwa nechimwe nechimwe, kusanganisira X-ray yemajoini akavanzwa. Majoini ane lead anoiswa uye anoongororwa nemaziso, zvikamu zveQFN zvinowana paste neprofiles zvinodzorwa, uye maBGA anoiswa nemazvo uye anodzoserwa kune profile inoumba majoini ebhora reruzha, ozosimbiswa neX-ray.

Nekuti kusarudza mapakeji kunoita kuti pave nematambudziko pakubatanidza, ongororo yekugadzira isati yagadzirwa inoongorora kuti tsoka, ma thermal pads, uye pitch zvinovakwa here uye kuti kuongororwa kwakakodzera kwakarongwa - kubata njodzi dzine chekuita nepakeji usati watanga. Highleap inoita izvi mukati me turnkey assembly , ichivhara kuwanikwa, kuiswa, kusungirirwa, uye kuongororwa kwemarudzi ese emapakeji, uye inotsigira bhodhi risina chinhu kuburikidza nekugadzira PCB . Paunokumbira mutengo, nyora mapakeji eIC pabhodhi - kunyanya chero zvikamu zveBGA kana fine-pitch - uye pitch diki, saka maitiro akakodzera uye kuongororwa zvinoongororwa.

7. Mibvunzo Inowanzo bvunzwa nezve pasuru yeIC

Ndeupi musiyano uripo pakati peIC package nechip iri mukati?

Chip (die) ndicho chinhu chisina chinhu chinoita basa racho; package ndiyo imba inoidzivirira, inofefetera kubatana kwayo nepitch inoiswa pabhodhi, uye inobatsira kubvisa kupisa. Package ndiyo inoita kuti chip ibatike uye igone kusungirirwa.

Ndeipi IC package iri nyore kuisanganisa nemaoko?

Mapakeji anoburitswa nepakati pemaburi akaita seDIP ndiwo ari nyore, achiteverwa nemapakeji ane lead surface-mount akadai seSOIC neQFP ane leads dzinosvikika. QFN neBGA, dzine connections pasi pemuviri, dzakaoma kana kuti hadzigoneke nemaoko uye dzinoda kudzoserwa mvura.

Sei BGA ichida kuongororwa kweX-ray?

Nekuti mabhora eBGA anosungirirwa akavigwa pasi pepakeji, hapana kamera inogona kuaona. X-ray inoona nemuviri wese kuti ione majoini ebhora uye kuona maburi kana mapfupi, inova ndiyo nzira chete isingaparadze yekusimbisa kuungana kweBGA.

Chii musiyano uripo pakati peQFN nethermal pad?

QFN imhando yepakeji ine mapedhi pamucheto wayo wepasi; padhi rekupisa ndiro padhi resimbi hombe riri pakati pemaQFN akawanda (nemamwe mapakeji) anopinza kupisa mubhodhi. Padhi rekupisa rinofanira kunge rakasungirirwa zvakanaka kuti ribvise kupisa uye kuti rive nesimba remuchina.

Chip imwe chete inogona kuuya mumapakeji akasiyana here?

Ehe — maIC akawanda anowanikwa mumhando dzakasiyana dzemapakeji, zvichikubvumidza kuti uchinje nzvimbo yebhodhi, mashandiro ekupisa, kuoma kwekubatanidza, uye mutengo. Izvi zvinoita kuti kusarudza pakeji kuve sarudzo chaiyo yedhizaini pane kuva chinhu chakasimba chechip.

Kusarudzwa kwepakeji kunokanganisa here mutengo wePCB?

Ehe — mapakeji akakora seBGA anogona kuda mapuranga akawanda kuti aendeswe, maficha akapfava, uye kuongororwa kweX-ray, zvese izvi zvinowedzera mutengo, nepo mapakeji ane lead akachipa kuunganidza. Sarudzo yepakeji inokanganisa zvese mutengo wezvikamu uye wekugadzira.