Yako PCB Manufacturing Nyanzvi - Highleap Electronic

Zvishandiso zvePCB zveMabhodhi eMultilayer

Zvishandiso zvePCB zveMabhodhi eMultilayer

Tafura yezviri mukati Zvinodiwa pakugadzira zvinhu zveHigh Layer Count Designs Core and Prepreg Selection Lamination Kufunga nezveKugadzira Zvibereko Kutarisira Warpage neKunyoresa Zvinhu Matambudziko eNguva Yekutungamira Mugadziri Stack-Up Ongororo Maitiro eHigh Layer Count PCB Materials FAQs A...

Yakaderera DD Yakaderera DD PCB Zvinhu zveMasaini Ekumhanya Kwakanyanya

Yakaderera DD Yakaderera DD PCB Zvinhu zveMasaini Ekumhanya Kwakanyanya

Mufananidzo 1. Kusarudzwa kwezvinhu zvePCB zvinorasikirwa zvishoma zvemabhodhi anomhanya zvakanyanya. Papeji rino Zvinoreva Kuderedza Kurasikirwa kweChiratidzo Kuenzanisa Zvinhu zveDk Zvishoma neDk Zvishoma neFR4 Kufunga Nezvekugadzirwa Kwezvinhu Mari Nenguva Yekutungamira Zvinhu zveDk Zvishoma neDk Zvinowanzo bvunzwa Nhamba mbiri...

10 Layer High-Speed ​​PCB Engineering yeDDR5 nePCIe

10 Layer High-Speed ​​PCB Engineering yeDDR5 nePCIe

Mufananidzo 1. PCB ine nhanho gumi inomhanya yeDDR5 nePCIe routing. Tafura yeZviri Mukati Tanga neChannel, Kwete Protocol Label Zvinoitwa neData Rate - uye Hazvikuudze - Kuvaka Insertion - Loss and Discontinuity Budget Sarudza Zvinhu, Copper uye Geometry Pamwe Chete ...

Kudzora Kusagadzikana kwePCB kweLayer 10 uye Kusimbiswa kweTDR

Kudzora Kusagadzikana kwePCB kweLayer 10 uye Kusimbiswa kweTDR

Mufananidzo 1. Kuponi yekudzora impedance yePCB ine layer gumi uye kusimbiswa kweTDR. Tafura yeZviri Mukati Impedance Inodzorwa Ipfungwa Yekuunganidzwa uye Tsananguro Yemaitiro Zvinodiwa Zvinodiwa Pamberi Pekuti Trace Geometry Igone Kuburitswa Microstrip Yekupindirana Kwemagetsi Imwe Chete, Yemhando Yekusarongeka uye Yekusiyana,...

Dhizaini yePCB Stackup yeLayer 10 yeImpedance nePlanes

Dhizaini yePCB Stackup yeLayer 10 yeImpedance nePlanes

Mufananidzo 1. Kuunganidzwa kwePCB yezvikamu gumi (10 layer) ye impedance uye kuronga plane. Zviri Mukati Sarudza Architecture yezvikamu Usati Wasarudza Ukobvu hweDielectric Three Inobatsira 10 Layer Stackup Archetypes Muenzaniso weReference-Plane-Rich 10 Layer Press-Out, Copper and Impedance Closure...

Mitemo gumi yeLayer PCB Routing yeDDR5, PCIe neCrosstalk

Mitemo gumi yeLayer PCB Routing yeDDR5, PCIe neCrosstalk

Mufananidzo 1. Mitemo gumi yePCB routing yeDDR5 PCIe uye crosstalk. Tafura yeZviri Mukati Freeze the Electrical Rules Before Routing Begins Layer Assignment and Return-Path Continuity Differential Pairs: Geometry, Skew and Transitions DDR5 and Other Parallel Memory...

Mugadziri wePCB weLayer 10 weRigid, Flex uye Rigid-Flex

Mugadziri wePCB weLayer 10 weRigid, Flex uye Rigid-Flex

Mufananidzo 1. Kugona kugadzira PCB ine zvidimbu gumi. Zviri Mukati 10 Mugadziri wePCB ine zvidimbu gumi weMabhodhi Akaomesesa, Akapfava uye Akaomesa Mabhodhi Maitiro Ekusarudza Mugadziri wePCB ane zvidimbu gumi 10 PCB DFM, Kusarudzwa Kwezvinhu uye Rutsigiro Rwedhizaini Usati Wagadzirwa 10 Layer...