Kugadzira PCB yeTUC TU-933+ yeSuper-Lost-Lost High-Speed ​​​​Sistimu

TUC TU-933+ PCB inoreva bhodhi redunhu rinomhanya zvakanyanya kana kuti RF rakadhindwa rakagadzirwa neThunderClad 3+ material system—TU-933+ laminate uye TU-933P+ prepreg. TUC inogadzira zvinhu zvepasi. Highleap Electronics haigadziri laminate; isu tinogadzira PCB uye tinounganidza PCBA.

TUC inotaura pachena kuti TU-933+ inoshandiswa pakombiyuta ine simba shoma uye inogona kushandiswa pakushanda nesimba, pamafoni, pamabhazi, pamaseva uye paRF applications. Highleap inoshandisa kugadzirwa kwezvinhu zvakatenderwa nevatengi sechikamu chenzira yakakwana uye kugadzirwa kwezvinhu.

Highleap inogona kugadzira TU-933+ PCB here? Ehe, mushure mekusimbisa TU-933+/TU-933P+ yakagadzirwa, copper profile, stackup, impedance, zvinodiwa muchiteshi uye kuwanikwa kwezvinhu. Tinotsigira kugadzirwa kwePCB isina chinhu uye turnkey kana consigned.

Chii chinonzi TU-933+ PCB Material?

TU-933+ ndiyo laminate iri muTUC's ThunderClad 3+ system; TU-933P+ ndiyo prepreg inoenderana. TUC inonyora dielectric constant inomiririra ye3.08 uye dissipation factor ye0.0020 pa10 GHz , pamwe chete nemaitiro akagadzikana eDk/Df, kuramba hunyoro, kuwedzera kweZ-axis yakaderera, kugadzikana kwedimensional uye kuramba kweCAF.

Mutengi haafanire kunyatsonzwisisa mazwi ese ehunyanzvi muchikamu chino. Chinokosha ndechekuti mafaira anoratidza dunhu raanoda uye kuti fekitori igone kuona zvinhu zvinokonzeresa kugadzirwa. Highleap inoronga ongororo nenyanzvi dzakakodzera uye inotsanangura mhedzisiro yacho maererano nekukwanisika, mutengo, nguva yekutungamira uye kugamuchirwa.

Kubva kudivi refekitori, zita racho rinotsanangura kirasi yekushandisa, kwete zvirevo zvakakwana zvekutenga. Mutengo wekutenga unozovimbika chete mushure mekunge dhizaini yabatanidzwa nezvinhu zviripo, mhangura, maburi, kupedzwa kwepamusoro uye zvinodiwa pakuyedza. Mainjiniya akapihwa basa anobata shanduro iyoyo uye anodzosera chete sarudzo dzisina kugadziriswa dzinoda mvumo yevatengi.

Nei TU-933+ Ichishandiswa mu112G-Class uye High-Layer-Count PCBs

Kurasikirwa kwechiteshi chepasi

Df yakaderera inoderedza kurasikirwa kwe dielectric, nepo mhangura isina chimiro chakanaka uye nzira inodzorwa inoderedza kurasikirwa kwe conductor. Zvese zvinofanira kumiririrwa mu channel model.

Kuenderana kwehuwandu hwakawanda

Sisitimu yethermoset yakagadzirirwa ma multilayer akaomarara uye yakagadziriswa FR-4, zvichiita kuti ive yakakodzera kune dense server uye switch architectures.

Kuvimbika kwekupisa

Kuungana nekugadzirisa zvinhu zvisina mutobvu kunoda kugadzikana kwezvinhu, kuvimbika kwemaburi akaiswa uye kudzora hunyoro paPCB yese.

Dimensional control

Ukobvu hwakagadzikana uye kufamba kwepaneru zvinobatsira kunyoresa, impedance uye kurongeka kwekuboorera kumashure pamabhodhi makuru.

Kune vatengi, mhedzisiro yekutengeserana yekusarudza inokurumidza kuitika: sarudzo inochinja kuwanikwa kwemari, nguva yekutungamirira, kugona kwekugadzirisa uye chiyero chekuyedza. Kusarudza mari shoma kunogona kukonzera kurasikirwa kusingaenderane kunokonzerwa nekutsiviwa kwemhangura kana kukanganisa lamination mu stackups dzakasimba; kusarudza mari yakawanda kupfuura zvinodiwa nechiteshi kunowedzera mutengo pasina kuwedzera goho. Mainjiniya wedu anotsanangura kuti kuchinjana uku muchirongwa, kwete sehurukuro yezvinhu zvakajairika.

Kusarudzwa kunofanira kutanga nechinhu chinorema chinodziviswa. Mhinduro inokumbirwa inoruramiswa kana ichivandudza zvakananga back-drilled kana HDI kuburikidza nekugadzira, low-loss laminate uye prepreg selection kana low-profile copper; haibatsiri zvakanyanya kana muganhu chaiwo uri connector, kuburikidza ne transition, thermal path kana assembly feature. Izvi zvinodzivirira zvinhu zvepamusoro kuti zvisashandiswe senzira yekugadzirisa dambudziko rechannel chaiyo kana reliability.

Kwanoshandiswa maPCB eTU-933+

Mapurojekiti akajairika anosanganisira maseva eAI neHPC, makadhi eswitch nerouter line, mapuratifomu ekuchengetera zvinhu, mabackplanes ekumhanya-mhanya, nzvimbo dzenharembozha, maRF subsystems uye ma test fixtures ekumhanya-mhanya. Sarudzo chaiyo yezvinhu zvinoenderana nehurefu hwese hwechiteshi uye kurasikirwa kwacho—kwete label yechigadzirwa chete.

Nzira pfupi

Chinhu chinodhura zvishoma uye chisingadhuri chinogona kugutsa bhajeti. Kushandisa TU-933+ pasina chikonzero chakayerwa kunogona kuwedzera njodzi yemutengo uye kutenga.

Nzira refu kana kuti dzakapfuma mukubatanidza

TU-933+ inova yakakosha zvikuru kana ongororo yekuiswa-kurasikirwa kwechinhu ichi ichiratidza kuti kurasikirwa kwe dielectric nemhangura kuri kudya margin yesystem.

Fekitori inofanirawo kutaura kuti imwe chivakwa chingave chakakodzera riini. Kusanyatsotsanangurwa kunogona kusiya zvakawanda kuburikidza nemastubs, kurasikirwa kwakakwana kana kuvimbika kwekupisa kusina kusimba. Kunyatsotsanangurwa kunogona kuwedzera mutengo wezvinhu uye nguva yekutsvaga pasina kugadzirisa kusagadzikana kwekubatanidza, kubuda kana kudzoka. Highleap inogona kuenzanisa sarudzo dzinogadzirwa, asi zvinhu zvakatenderwa uye hwaro hwekukodzera zvinoramba zviri pasi pekutonga kwekuchinja kwevatengi.

Mhedzisiro inoshanda chisarudzo chakajeka chekusaenda/kusaenda: shandisa mhinduro yakakumbirwa kana zvinodiwa pakuita kana kutevedzera zvinodiwa; sarudza chivakwa chakareruka chakatenderwa kana chisingade. Kutonga ikoko kunoitwa kubva pabhodhi nedata rechigadzirwa, kwete kubva pakufungidzira kuti zvirevo zvepamusoro-soro zvinogara zvichigadzira PCB yakanakisa.

Migumisiro yekurapa TU-933+ sekuvandudzwa kuri nyore kweFR-4

• Profile yemhangura isiriyo: Kurasikirwa nechiteshi kunogona kutadza kutevedzera kunyangwe kana sisitimu ye resin iri chaiyo.
• Magirazi asina kudzorwa kana huwandu hwe resin: kupindira, kutsveyama uye ukobvu hwakadzvanywa zvinogona kusiyana.
• Yakareba kuburikidza nematanda: resonance uye kurasikirwa nekudzoka zvinogona kutonga kuvandudzwa kwezvinhu.
• Kusanyoresa zvakanaka kwemuchina wekumashure: Kudzora kudzika kusina kunaka kunogona kusiya stub yakawandisa kana kukuvadza danda raunoda.
• Peji rehondo remusangano: Mabhodhi makuru, ane zvidimbu zvakawanda anoda kuenzana kwemhangura, maturusi ekutsigira uye kudzora mapurofayiri.
• Kutsiva kusina kutenderwa: giredhi rakafanana rekuti "kurasikirwa kwakanyanya" harina kuenzana otomatiki.

Njodzi idzi dzinofanira kuderedza kushanda nesimba kunodiwa kuti munhu abate fekitori, kwete kuisimudza. Kana Highleap yangogamuchira mafaira eGerber kana edhizaini, tinotarisa kunyoresa nekudzora mapuratifomu, kuburitswa kwekugadzirwa kwakavakirwa pamakuponi, kuteverwa kwekuvaka kwakatenderwa uye hukama hwekukobvu hwakadzvanywa uye impedance. Sarudzo dzinokanganisa mashandiro, kutevedzera mitemo, mutengo kana kutumira chete ndidzo dzinodzoserwa kumutengi.

Mhinduro yakakura yakadai sekusimbaradza kushivirira kwese kunowanzova kutambisa mari. Chiito chakarurama chinoenderana nekuti chikonzero chikuru chiri resin fill ine layer-count, back-drilled kana HDI kuburikidza ne architecture, low-loss laminate uye prepreg selection kana low-profile copper. Target controls inovandudza goho uye inoita kuti root count itevedzerwe pasina kushandura dhirowa rese kuita special process inodhura zvisina basa.

TU-933+ Stackup uye Kuronga Channel

Highleap inoongorora stackup senzira yekuratidza kuvimbika uye yekugadzira. Kuburitswa kwacho kunofanirwa kuratidza zvivakwa zvepakati/prepreg, copper profile, girazi style uko kunodzorwa, kupedzwa kwecopper, impedance, pair geometry, back drilling uye coupon methodology.

Zvinhu zvakasiyana-siyana zvehunyanzvi muchikamu chino hazvigone kuongororwa zvakazvimirira. Kuchinja kwezvakacherwa kumashure kana HDI kuburikidza nezvivakwa kunogona kuchinja mhedzisiro yesarudzo yelaminate yakaderera uye prepreg, nepo copper yakaderera uye high-layer-count resin fill zvichikanganisa geometry uye mhedzisiro yebvunzo inoonekwa pabhodhi rapera. Highleap inoongorora kuvakwa chaiko kwekugadzira saka stackup uye muripo zvinobva pazvinhu zvinotengwa kwete mienzaniso yemazita.

Mabhodhi eTU-933+ ane mativi akawanda anoda resin yakakwana yekuzadza mapatani emhangura yakakora ukuwo achichengetedza ukobvu hwe dielectric hunoshandiswa mu channel model. Mapairi e critical layer anofanira kushandisa copper profile yakatenderwa, uye kuburikidza nema stubs anofanira kutarisirwa kuburikidza ne HDI, blind vias kana back drilling kana zvakakodzera. Stackup inodawo copper yakaenzana uye practical press cycles kuitira kuti mashandiro emagetsi asagadzire warpage inodzivisika kana lamination njodzi.

Kugona Kwekugadzira PCB yeHighleap TU-933+

Highleap inotsigira mabhodhi akaomarara ane ma layer-count akawanda, HDI structures , sequential lamination, via-in-pad, back drilling, controlled impedance uye fine-line manufacturing . Puratifomu yedu yakaburitswa ine high-frequency frequency inosanganisira impedance verification, AOI, electrical test, cross-section inspection uye sarudzo yeS-parameter kana insertion-loss test ye critical channels.

Miganhu yekukwanisa kuita zvinhu inoenderana nehukuru hwebhodhi, ukobvu hwese, kugoverwa kwemhangura, huwandu hwema layer uye TU-933+ yakagadzirwa. Nhamba yekugona kwakajairika haisi iyo inotsiva purojekiti DFM.

Mhinduro dzekugadzira dzinoratidzwa sezviito zvakananga. CAM yenguva dzose uye sarudzo dzemaitiro dzinogara dziri muHighleap; mibvunzo inotumirwa kumutengi chete kana akachinja mashandiro, hunhu, mutengo kana nguva yekutungamirira. Muenzaniso uyu webasa unochengetedza kugadzirwa kwakaoma kuti kusave mutoro wekutarisira kutenga.

Ruzivo rwekugadzira rwakatenderwa runochengetwa kuti rudzokororwe. Kuzivikanwa kwezvinhu, kukura, nzira yekuboorera, chinangwa chekuputira uye nzira yekuongorora zvinoramba zvichidzorwa nekuchinja. Izvi zvinodzivirira chigadzirwa kubva mukukanganiswa kwelamination mu dense stackups kana back-drill kana via-stub zvikanganiso zvinokonzerwa nemaitiro asina kunyorwa kana shanduko yekugovera.

TU-933+ PCB Assembly yeMasevha, Maswichi uye Telecom Hardware

Kushanda kwebhodhi rinomhanya zvakanyanya kunogona kukuvara panguva yekubatanidza nekugadziriswa kwemadziro, kusarongeka kwekubatanidza , kuvharirwa kweBGA , kugadziriswa zvakanyanya kana kusvibiswa. Highleap inopa stencil engineering, SPI, SMT placement, controlled reflow, AOI, X-ray, press-fit kana through-hole processing uye functional testing kana zvigadziriso nemaitiro zvichipihwa.

Kune ma backplanes makuru nemakadhi emutsara, ongororo yekubatanidza inosanganisira maturusi ekutsigira, kuisirwa kweheavy-connector, kuongororwa kweBGA escape, thermal mass uye miganhu yekugadzirisa patsva.

Kugadzira kunotanga nekugadzirwa kwebhodhi risina chinhu. Warpage, copper balance, pad finish, via condition uye thermal mass zvinokanganisa kudhinda, kuisa uye kuyererazve. Highleap inoongorora PCB ne component layout pamwe chete kuitira kuti bhodhi rinosangana nemiedzo yebhodhi risina chinhu risave PCBA ine goho shoma mushure mekunge zvikamu zvine mutengo wakakwira zvaiswa.

Kuongorora kunosarudzwa zvichienderana nepakeji uye njodzi yekukanganisika. SPI inodzora kuiswa kwepaste, AOI inotarisa nzvimbo inoonekwa uye maficha e solder, uye X-ray inoshandiswa panowanikwa majoini akavanzwa. Ma interfaces chaiwo e optical, RF kana mechanical angadawo fixtures, datum checks kana mirairo yekubata vatengi.

Tumira Mafaira eBhodhi Kutanga kuti uwane Mutengo weTU-933+ PCB

Tanga nekutumira mafaira eGerber kana mafaira ekugadzira ePCB . Hamufanirwe kuronga runyorwa rwakasiyana rwezvinodiwa zve stackup, copper, back-drill uye kurasikirwa usati wataura nesu. Kana zvinyorwa izvozvo zvatova mukati mepakeji yekugadzira, tinozvishandisa zvakananga.

Mumwe mainjiniya anoronga ongororo yehunyanzvi

Mainjiniya wenyu weHighleap akazvipira achashanda nemi mumwe nemumwe uye achaongorora zvinodiwa neTU-933+ kuvaka, impedance, back drilling uye assembly nechikwata chedu chehunyanzvi hweinjiniya. Tichatsanangura chero dambudziko nenzira inoshanda uye tichakumbira mafaira anodiwa chete padanho rinotevera. Kana PCBA ichidikanwa, BOM nedata rekuisa zvinogona kutevera mushure mekunge PCB yatanga kuongorora.

Mainjiniya akapihwa basa anochengetedza kutaurirana kwese munzira imwe chete yepurojekiti. Zvinhu, zvinhu zvakaunganidzwa, CAM, kugadzira, mhando uye mibvunzo yekubatanidza zvinobatanidzwa kuitira kuti mutengi asafanirwe kuendesa matambudziko ehunyanzvi pakati pemadhipatimendi akawanda efekitori.

Mutengo weTU-933+ PCB uye Vatyairi veLead-Time

Zvinonyanya kukonzera mari inguva yekuiswa kwezvinhu, kuwanda kwezvikamu, kushandiswa kwepaneru, kucheneswa kwezvikamu, mhangura isina kusimba, kupindira kwakasimba, kucherwa kwemusana, nzvimbo yekukopera, chiyero chekuyedza uye njodzi yekukohwa. Mutengo wePCBA unoenderana nehuwandu hweBGA, kugadziriswa kweconnector, kuwanikwa kwezvikamu, kudzika kwekuongorora uye bvunzo inoshanda.

Highleap inosimbisa kuwanikwa kwezvinhu zviripo uye haivimbise nguva yakatarwa yekushanda isati yaongorora kuvakwa chaiko.

Nguva yekushanda inowanzo dzorwa nekuwanikwa kwezvinhu, mhangura yakakosha, huwandu hushoma hwemutengesi, kugadziriswa kwakatevedzana kana hunhu hwekunze. Mainjiniya anoona chirambidzo chaicho chenguva uye anotarisa kana imwe nzira yakatenderwa inogona kuchibvisa pasina kuchinja zvinodiwa zvechigadzirwa.

Kuderedzwa kwemutengo kunofanira kubvisa kuomarara kusingakoshi, kwete kudzora kunodzivirira mashandiro. Highleap inoongorora mashandisirwo epaneru, kuvaka kwechikamu chisina kukosha, kuburikidza nekuvaka uye chiyero chekuyedza. Chero chikumbiro chinoshandura zvinhu zvakatenderwa, mhangura, stackup kana qualification chinodzoserwa kuti chibvumidzwe nevatengi.

Kuvakwa kwelaminate chaiyo, prepreg uye mhangura kunogona kuva nemigumisiro yakakura pane purogiramu yebhodhi. Kuwanda kwezvikamu, saizi huru yepaneru, kutenderera kwakawanda kwelamination, kubhoborwa kwemusana uye kudonhedzwa kwemari zvinowedzera nguva yekushanda uye kuderedza goho repaneru. Highleap inogona kuenzanisa zvivakwa zvakatenderwa uye kuona kuti kuoma kuri kutsigira zvinodiwa nechiteshi uye kuti zvinogona kubviswa kupi pasina kunetesa dhizaini.

Kushanda Nekukurumidza Kwakanyanya Kunoda Kuburitswa Kwekugadzirwa Kwakadzorwa

TU-933+ inogona kuchengetedza muganho wechiteshi, asi chete kana zvinhu, mhangura, girazi, stackup, vias, connectors uye assembly zvichidzorwa sesystem imwe chete. Highleap Electronics inopa nzira yekugadzira, yekubatanidza uye yekuedza; TUC inoramba iriyo mugadziri wezvinhu.

Kuponi inofanira kumiririra chinhu chiri kudzorwa. Layer pair, copper, dielectric thickness, routing geometry uye panel position zvinofanira kuenderana ne critical circuit. Mainjiniya edu anosimbisa kana standard impedance coupon yakakwana kana kuti dedicated loss, resonator kana customer test structure ichidiwa.

Bvunzo yemagetsi yakajairika inoongorora kuvhurwa nekupfupika, asi hairatidzi zvese zvinodiwa pakushanda. Zvichienderana nedhizaini, chirongwa ichi chinogonawo kushandisa impedance, microsection, back-drill verification, optional insertion-loss coupons uye PCBA inspection. Highleap inosiyanisa kusimbiswa kwekugadzirwa kubva pakukodzera kwezvigadzirwa zvakakwana saka chiyero chebvunzo chakataurwa chinoenderana nesarudzo inotarisirwa kutsigira mhedzisiro.

Mibvunzo Inonyanya Kubvunzwa

TU-933+ yakafanana neTU-933 here?

Kwete. Giredhi chaiyo uye prepreg inoenderana nayo inofanira kutsanangurwa. Mazita akafanana haabvumidze kutsiviwa.

Ko Highleap inogadzira TU-933+ laminate?

Kwete. TUC inogadzira laminate ne prepreg. Highleap inogadzira maPCB nema PCB assemblies ichishandisa zvinhu zvakatenderwa.

Ko TU-933+ yakakodzera here 112G PCB channels?

Inogona kukodzera, asi sarudzo inofanira kunge yakavakirwa pakurasikirwa kwechiteshi chose, kusvika kwacho, mhangura, mavhiya uye dhizaini yekubatanidza.

Ndinoda tafura yekurongedza zvinhu nekutarisa kumashure here ndisati ndataura neHighleap?

Kwete. Tumira mafaira eGerber kana mafaira ePCB kutanga. Mainjiniya weHighleap achaongorora bhodhi rimwe nerimwe osimbisa ruzivo rwekugadzika, mhangura, impedance uye back-drill nechikwata chemainjiniya.

Unogona here kugadzira mabhodhi eTU-933+ ane mativi akawanda?

Ehe. Tinotsigira SMT, BGA, through-hole, press-fit, AOI, X-ray uye functional test zvichibva pa assembly package.

Ndiani anobatsira kusimbisa ruzivo rwekugadzira TU-933+ rwusipo?

Mainjiniya weHighleap anoshanda newe zvakananga uye anotungamira ongororo ye stackup, copper, impedance, back drilling, kugadzira uye kuunganidza zvinhu nechikwata chedu chehunyanzvi hweinjiniya.