Inqubo Yokukhiqiza ye-PCB Yezingqimba Eziyi-10 Kusukela ku-DFM Kuya Ekuhlolweni

Ibhodi lesifunda eliphrintiwe elinezingqimba eziyishumi lenziwa ngokulandelana okulawulwayo lapho yonke imisebenzi ithinta okulandelayo. Isinxephezelo sobuciko esingaphakathi sithinta ukubhaliswa ngemva kokuncibilikisa; ukuncibilikisa kunquma ukujiya kwe-dielectric kanye nokuqondanisa kokubhoboza; ukubhoboza kanye nokuncibilikisa kuthinta ukunamathela kwethusi; ukuplata kushintsha i-geometry yomqhubi oqediwe; kanye nokuhlolwa kokugcina kukagesi nokwakheka kuqinisekisa ukuthi inqubo eqoqiwe ihlale ngaphakathi kwefasitela lokuklama elikhishwe. Ukuphatha le misebenzi njengohlu lokuhlola oluzimele kufihla iqiniso lokukhiqiza elibaluleke kakhulu: isivuno sezingqimba eziningi sidalwa ngokuphatha ukuxhumana phakathi kwezinyathelo.

Lesi sihloko sichaza inqubo evamile eqinile enezingqimba eziyishumi kuqala, bese sichaza ukuthi ukwakheka kwe-HDI, okuqinile, okuxubile kanye nezinto ezikhethekile kuhluka kuphi. Asivezi izinga lokushisa elilodwa lokucindezela eliqinile, isivinini esisodwa sokubhoboza esijwayelekile noma uhlelo olulodwa lokuhlola oluyimpoqo, ngoba lawo mapharamitha ancike ohlelweni lwezinto ezikhethiwe, i-geometry yebhodi, ukucaciswa komkhiqizo kanye nenqubo yefektri efanelekile. Umhambi oqondene nephrojekthi udalwa ngemuva kokubuyekezwa kwe-DFM futhi uba yimiyalelo yokukhiqiza elawulayo.

I-Highleap Electronics inikeza ukwenziwa kwe-PCB enezingqimba eziningi , kodwa ikhasimende kanye nomenzi kumele bachaze ndawonye i-stackup ekhishwe, ukubekezelelana, ngezakhiwo, isigaba sokwamukelwa kanye namadokhumenti. Ukubuka konke okubanzi kobunjiniyela be-PCB enezingqimba eziyi-10 kuchaza izinketho ze-stackup kanye nokuthengwa; leli khasi lilandela ibhodi ekukhiqizweni.

Ukukhishwa Kobunjiniyela: Okumele Kuxazululwe Ngaphambi Kokukhiqiza

Ukukhiqizwa akuqali lapho amafayela e-Gerber efika. Kuqala lapho idatha engenayo isiguqulwe yaba iphakheji yokwenziwa evunyiwe, ehambisanayo ngaphakathi. Amaphutha amaningi abiza kakhulu anezingqimba eziyishumi aqala ngaphambi kokuthwebula izithombe: ungqimba olungachazwanga nge-start, ububanzi bomkhondo obuphikisana nethusi eliqediwe, i-stackup engasondeli ekujikeni okudingekayo, noma ukushintshwa kwezinto ezishintsha i-impedance ngemva kokuba ukwakheka kuqandisiwe.

Isethi yedatha ivame ukudingeka

• Idatha yesendlalelo se-Gerber X2, ODB++ noma i-IPC-2581 enohlelo lwesendlalelo olucacile;
• Amafayela okubhoboza e-NC kanye nomzila ahlukaniswe ngohlobo lwembobo kanye nesendlalelo sokuqala/sokuma;
• umdwebo wokwenziwa onobukhulu obuqediwe, ithusi eliqediwe, uhlaka lwebhodi, ukubekezelelana, ukuqeda kanye nezidingo zokwamukelwa;
• imikhawulo ye-stackup noma ye-stackup, okuhlanganisa izendlalelo zereferensi ye-impedance;
• ithebula le-controlled-impedance elinesendlalelo, i-geometry, i-target kanye nokubekezelelana;
• ngokugcwalisa, ukubhoboza emuva, isinki esiphikisayo, ukubopha onqenqemeni, amanothi okufaka umgodi ocijile noma okujula lapho kufanele khona;
• ukucaciswa kwezinto kanye nenqubomgomo yokushintshana;
• izidingo zephaneli noma uhlu lokulethwa;
• ukumaka, ukulandelela, ukulandelelwa kanye nezidingo zombiko;
• iphrofayili yokuhlanganisa noma izidingo ezikhethekile zokuthembeka uma zithinta ukufaneleka kwebhodi elingenalutho.

Ukuhlolwa kwe-CAM kanye ne-DFM

Ithimba le-CAM liqinisekisa ukuhambisana kwe-netlist, ukuvuleka kokubhoboza kuya kuthusi, izindawo ezizungezile, ukubhaliswa kwe-solder-mask, isikhala sethusi kuya emaphethelweni, ukuqondiswa, ukubekwa kwekhuphoni, ibhalansi yethusi kanye nokusebenzisana phakathi kohlaka lwebhodi kanye nephaneli yokukhiqiza ehlongozwayo. Izakhiwo ze-impedance ezilawulwayo zibalwa kabusha kusetshenziswa ukwakhiwa kwezinto ezihlongozwayo kanye nethusi eliqediwe. Lapho umhlinzeki eshintsha ububanzi bomugqa noma isikhala ukuze kuhlangatshezwane ne-impedance, ushintsho kufanele lubuyiselwe ukuze luvunywe kunokuba lufakwe buthule kudatha yokukhiqiza.

Kwibhodi elinezingqimba eziyishumi, umphumela we-DFM kufanele uphendule okungenani imibuzo emihlanu:

1. Ingabe isitaki esihlongozwayo singakhiwa sibe nobukhulu obuqediwe kanye nokubekezelelana?
2. Ingabe zonke izakhiwo ezibholiwe zingahlangabezana nezidingo zokubhalisa, indandatho ehlanganisiwe kanye nesilinganiso sokulingana?
3. Ingabe i-geometry yomqhubi edingekayo isengaqoshwa ngemva kokufakwa kweplati edingekayo?
4. Ingabe amanani e-impedance angatholakala ngokwakhiwa kwezinto ezitholakalayo?
5. Ingabe izivivinyo nemibiko ecacisiwe iyafana nesigaba somkhiqizo kanye nemibhalo yokuthenga?

Umklamo wephaneli yokukhiqiza

Ibhodi ngalinye lifakwe kuphaneli yokukhiqiza enezimbobo zamathuluzi, izinhloso zokubhalisa, ukweba amaplati, amakhuphoni, izakhiwo zokuhlola kanye nemingcele yenqubo. Ukuqondiswa kwephaneli kungathinta ukunyakaza kobukhulu, isiqondiso sokweluka ingilazi, isivuno sendlela kanye nokugoba/ukujika. Iphaneli akuyona nje indlela yokufaka izingcezu ezengeziwe eshidini; iyimoto yenqubo esetshenziswa ngokuthwebula izithombe, ukubhoboza, ukubhoboza kanye nemishini yokuhlola.

Ukuthwebula Izithombe Zezingqimba Zangaphakathi, Ukuqopha kanye ne-AOI

Iphethini ngayinye yethusi yangaphakathi iqala enkabeni embozwe ngethusi. Inkabeni iyahlanzwa, imbozwe nge-photoresist, ithathwe izithombe, ithuthukiswe, iqoshwe futhi ihlutshulwe. Ububanzi bomqhubi oqediwe buwumphumela wokubuyiselwa kobuciko, ukujiya kwethusi, i-resistance chemistry, ukuvezwa, isimo sonjiniyela, i-etchant chemistry kanye ne-spray dynamics. Isitatimende esibanzi sokuthi yonke i-trace ibambeke ekubekezeleleni okukodwa ngakho-ke siyadukisa; ikhono lincike ku-geometry kanye nokwakhiwa kwethusi.

Ukulungiswa kwezinto kanye nokuhlonza

Ama-cores akhishwa ngohlobo lwezinto, ukujiya, isisindo sethusi, isitayela sengilazi kanye nenqwaba. Amaphrojekthi ezinto ezilawulwayo angadinga ukuhlonza okuhle kanye nokulandelela indawo ngaphambi kokuba amaphaneli angene ezithombeni. Ukungcola kwendawo, ukubola noma umonakalo wokugcina kunganciphisa ukunamathela kwe-photoresist kanye namandla e-interlaminar bond kamuva, ngakho-ke izidingo zokuphatha nokubhaka zilandela isiqondiso sokucubungula somhlinzeki we-laminate kanye nenqubo efanelekile yefektri.

Izithombe eziqondile ze-laser

Ukuthwebula izithombe ngokuqondile nge-laser kuveza ukumelana okuvela emisebenzini yobuciko yedijithali futhi kugwema amaphutha amakhulu ahlobene nabachwepheshe bamafilimu. Uhlelo luvumelanisa iphethini nezinhloso zephaneli futhi lusebenzisa isinxephezelo sesikali esithathwe emlandweni wezinto ezibonakalayo kanye nenqubo. Amandla okubhalisa ancike kusayizi wephaneli, ukujiya okuyinhloko, ukuqina kwezinto, ikhwalithi yenhloso kanye nemishini esetshenziswayo; akufanele kwehliswe kube yinani elilodwa le-micrometer elijwayelekile.

Isinxephezelo sokusika kanye nokuqhuba

Ithusi elingaphakathi lisuswa ngamakhemikhali ezindaweni ezingavikelekile. Ngenxa yokuthi ukugqwala kuhlasela nezindonga zomqhubi, umsebenzi wobuciko we-CAM wandiswa ngenani elifanele ukujiya kwethusi kanye nenqubo yokugqwala. Imigqa emincane ethusini elijiyile idinga isinxephezelo esengeziwe futhi ingakha amaphrofayili e-trapezoidal athinta impedance. Lesi esinye sezizathu zokuba ububanzi bomugqa ojwayelekile kufayela lomklamo bungabi ububanzi bomsebenzi wobuciko bokukhiqiza bokugcina.

Ukuhlola okuzenzakalelayo

I-AOI iqhathanisa iphaneli eliqoshwe ngedatha yedijithali evunyiwe kanye nokuvulwa kwamafulegi, ama-shorts, ama-nick, ama-protrusion, ithusi elisele kanye nezinye izinto ezingavamile zephethini. I-AOI ivame ukusetshenziswa kuwo wonke amaphaneli angaphakathi, kodwa ukwamukelwa kwe-AOI akubonisi ikhwalithi ye-dielectric, ubuqotho be-plating noma ukuthembeka kwebhodi eliqediwe. Amaphutha atholakele ayabuyekezwa ngaphansi kwezinqubo ezilawulwayo. Izinqubomgomo zokulungisa kufanele zichazwe uhlelo lwekhwalithi yefektri kanye nezidingo zamakhasimende; ukulungiswa komqhubi ofihliwe akumele kuthathwe njengokwamukelekayo kumkhiqizo onokwethenjelwa kakhulu.

Ukwelashwa Kwebhondi, Ukubeka I-Layup kanye Nokushiswa Kwe-Lamination

Ngemva kokwamukelwa kwengqimba yangaphakathi, izindawo zethusi zilungiselelwa ukubopha ohlelweni lwe-resin. Ukwelashwa kumele kuhlinzeke ngokunamathela ngaphandle kokudala iphrofayili eningi eyonakalisa ukulahleka komqhubi wesivinini esikhulu. Izinqubo ze-oxide ezivamile, i-oxide encishisiwe kanye ne-oxide-alternative zonke zingafaneleka uma zifaneleka ngezinto ezikhethiwe.

Ukwakhiwa kwezakhiwo ze-layup

I-stack enezingqimba eziyishumi ingakhiwa kusuka kuma-cores amaningana kanye nama-interfaces angaphambi kokulungiswa, noma kusuka ekuhlanganisweni kwama-cores kanye ne-foil yethusi yangaphandle. Akukho mfuneko evamile "yama-cores amahlanu." Inombolo incike ekwakhiweni kwe-stackup. Isibonelo, eminye imiklamo isebenzisa ama-cores amane anezinhlangothi ezimbili ze-L2-L9 kanye ne-foil yangaphandle, kanti eminye isebenzisa ukubhanqa okuhlukene kwe-core ukulawula ukutholakala kwe-dielectric noma ukwakhiwa okufihliwe. Ishidi lokubeka kumele lifane ngqo nohlelo lwesendlalelo oluvunyiwe futhi likhombe izinto, isitayela sengilazi, okuqukethwe kwe-resin, ithusi kanye nokuqondiswa kwayo yonke i-interface.

Kungani iresiphi yokucindezela okuhleliwe ingalungile

Izinga lokushisa lokucindezela, ingcindezi, i-vacuum, i-ramp, ukuhlala kanye nokuphola kukhethwa ezidingweni zomhlinzeki we-laminate cure kanye neresiphi efanelekile yomenzi. Isitatimende esijwayelekile esifana nokuthi “200 deg C, 350 psi imizuzu engama-90” asifaneleki kuzo zonke izinhlelo ze-high-Tg FR-4, i-PPE elahlekelwa kancane, i-polyimide, ama-hybrid asekelwe ku-PTFE noma izakhiwo ezixubile. Umjikelezo wokwelapha kumele ufeze ukugeleza kwe-resin, ukususwa kwe-void kanye nokwelashwa okuphelele ngaphandle kokucindezelwa ngokweqile, ukuntuleka kwe-resin noma ukunyakaza okungalawulwa kobukhulu.

Izilawuli ze-lamination

• izinto kanye nokuqinisekiswa kwenqwaba ngaphambi kokubekwa phansi;
• ukuphathwa kwegumbi elihlanzekile noma indawo elawulwayo efanele inqubo;
• ukuqondisa incwadi kanye nokubuyekezwa kwe-copper-balance;
• ukuqapha i-vacuum kanye nephrofayili yabezindaba;
• ukubikezela ukugeleza kwe-resin kanye nokujiya;
• ukuhlolwa kwenhloso yokubhalisa ngemva kokunyathelisa;
• ukujiya kwephaneli okuqediwe kanye nokuhlolwa komnsalo/ukujika;
• ikhuphoni noma ukuhlukaniswa kwesihloko sokuqala uma kudingeka.

Amaphutha avamile okulamina

Ama-voids angabangelwa umoya ovalelekile, ukungcola noma ukugeleza kwe-resin okunganele. Ukuntuleka kwe-resin kwenzeka lapho ithusi eliminyene, izici zokugcwalisa okukhulu noma ukucindezela ngokweqile kushiya i-dielectric enganele. Ukususwa kwe-delamination kungavela ekulungisweni okungekuhle kwendawo, umswakama, izinto ezingahambisani noma ukulungiswa okungalungile. Ukugeleza kwe-resin okweqile kungashintsha ukujiya kwe-dielectric kanye ne-impedance. Ukubhaliswa okungalungile kwengqimba yangaphakathi kungavela ekulinganisweni kobuciko, amathuluzi, ukunyakaza kwephaneli noma ukwakhiwa okungalingani. Iphutha ngalinye linembangela ehlukile; akukho okuxazululwa ngokucaphuna i-Tg ephakeme kuphela.

Ukubhoboza Okwenziwa Ngomshini, Ukubhoboza Nge-Laser kanye nezici Ezilawulwa Ngokujula

Ukubhoboza kusungula i-geometry yokuxhumeka kwezingqimba eziphakathi. Idatha yokwenziwa kufanele ihlukanise imigodi egqitshwe ngamapulangwe, imigodi engagqitshwe ngamapulangwe, imigodi egqitshwe ngamapulangwe, imigodi yemishini engaboni, ama-laser microvia, ama-back-drill, ama-countersink kanye nemizila ejulile elawulwayo. Ukuhlanganisa lokhu kube ithebula elilodwa lokubhoboza elingahlukanisiwe kuwumthombo ovamile wemibuzo yokukhiqiza kanye namathuluzi angalungile.

Ukubhola ngomshini

Amathuluzi e-Carbide akhethwa ngosayizi wembobo oqediwe, izinto zokwakha, i-panel stack, ikhwalithi yodonga edingekayo kanye nokubekezelelana kwesimo. Isivinini se-spindle, ukudla okungenayo, umthwalo we-chip, izinto zokusekela kanye nezinto zokungena ziyizinto eziguquguqukayo zenqubo kunokuba zibe amanani aqinile. Ukubhola okuncane kakhulu kwemishini kungadinga ukunqwabelana kwephaneli okuncishisiwe kanye nokuphila kwamathuluzi okufushane. Izinto ezigcwaliswe nge-ceramic noma ezivame kakhulu zingandisa ukuguguleka futhi zifune i-geometry yamathuluzi ehlukile. Umhlinzeki kumele futhi acabangele isabelo se-plating: ububanzi obubholiwe bukhulu kunobubanzi bembobo obuqediwe.

Ukubhaliswa kokubhoboza kanye nokungcola

Imbobo ebholiwe kumele ihlale ngaphakathi kwendawo yokubamba ungqimba lwangaphakathi ngemuva kokuhlanganiswa kwazo zonke izithombe, i-lamination kanye nokubekezelelana kokubhoboza. Amabhodi amakhulu, imigodi emincane kanye nokubalwa kwezingqimba eziphakeme kunciphisa umkhawulo wendandatho ye-annular etholakalayo. Ukushisa kanye nesenzo somshini ngesikhathi sokubhoboza kungagcoba i-resin phezu kwethusi elingaphakathi eliveziwe, ngakho-ke ukulungiswa kodonga lwembobo kubalulekile ngaphambi kokwenziwa kwensimbi.

Laser imishini

Ama-microvia e-HDI ngokuvamile akhiwa ngezinqubo ze-CO2, UV noma ze-laser ezihlanganisiwe ezikhethiwe zesakhiwo se-dielectric nesethusi. Izinhlelo ze-CO2 zisetshenziswa kabanzi kuma-dielectric asekelwe ku-resin, ngokuvamile ngokulungiselela ukuvula ithusi; i-UV ingacubungula ithusi ne-dielectric ngokulawula okuncane. Indlela engcono kakhulu incike kusayizi wembobo, ukujula kwethagethi, ukuqinisa, indlela yokuvula ithusi, i-throughput kanye nemishini efanelekile. UBlanket uthi ubude be-wavelength obulodwa buhlala budingeka ukuze kube nobubanzi obuthile obuthile kufanele kugwenywe.

Ukubhola emuva

Ukubhoboza ngemuva kususa ingxenye engasetshenziswanga yembobo efakwe ipulasitiki ngemuva kokuthi ukuxhumeka kwengqimba yebhodi sekwaziwe. Ububanzi bethuluzi, uhlangothi lokungena, ukujula kokuma kanye ne-stub evumelekile esele kumele kubhalwe phansi. I-stub eseleyo efinyelelekayo incike endaweni yengqimba, ukujiya kwebhodi, indlela yokulawula ukujula, ukubhaliswa kanye nokuqinisekiswa. Umthetho "ongama-mil amane ukusuka kungqimba yesignali" awufanele; umklamo udinga ukuvuleka okuphephile kungqimba exhunyiwe ngenkathi uhlangabezana nomgomo we-stub yesiteshi.

Ezinye izici zokujula okulawulwayo

Ama-counterbore, ama-countersink, imigodi, amaphakethe ezinhlamvu zemali kanye neziteshi eziqondiswa ukujula zidinga idatha yemishini ehlukene kanye nezincazelo zokubekezelelana. Ukulandelana kwazo kungathinta i-plating, i-solder mask kanye nephrofayili yokugcina. I-depth callout kufanele ibone ubuso be-datum, ukujula kwethagethi noma ukujiya okusele, ukubekezelelana nokuthi isici si-plated yini.

I-Desmear, ithusi elingenama-electro kanye ne-electroplating

Ngemva kokubhoboza, udonga lwembobo alukwazi ukudonsa amanzi futhi lungase lube nezinsalela ze-resin, ukuphuma kwengilazi kanye nemfucumfucu yemishini. Ukulungiswa kwembobo nodonga kanye nokwakheka kwensimbi kudala indlela yokudonsa amanzi lapho ukufakelwa kwe-electroplating kamuva kwakheka khona kuze kube ugqinsi oludingekayo.

Ukuhlanza kanye nokulungisa isimo

Izinqubo ezihlala njalo, i-plasma noma ezihlanganisiwe zisusa i-smear futhi zilungise i-dielectric. I-chemistry kumele ihambisane nesistimu ye-resin; ukucubungula ngokweqile kungahlasela i-dielectric noma i-glass interfaces, kuyilapho ukucubungula okungaphansi kungashiya ukungcola kuthusi olungaphakathi futhi kwenze buthaka ukuxhumana. Ukwakheka kokulahlekelwa okuphansi kanye nezinto ezixubile kungadinga ukulungiswa okukhethekile ngoba i-resin chemistry yazo ihlukile ku-FR-4 evamile.

Isendlalelo sokuqala sokuqhuba

Ithusi elingenama-electron noma inqubo efanelekile yokwenza insimbi eqondile ibeka ifilimu encane eqhubayo odongeni olulungisiwe lwembobo. Inhloso ukudala ukuhanjiswa okuqhubekayo kokufakwa kwe-electrolytic. Ubukhulu obubodwa obujwayelekile abuyona yonke izinqubo; ukumbozwa, ukunamathela kanye nokuqhubeka kubaluleke kakhulu kunokucaphuna inombolo ejwayelekile ngaphandle kwencazelo ebusayo.

Ukufakwa kwethusi nge-electrolytic

Ukufaka i-electroplating kwakha ithusi emgqonyeni kanye nasethusini elingaphezulu eliveziwe. Amandla okuphonsa aba nzima kakhulu njengoba isilinganiso sesici sembobo sikhula. Ubuningi bamanje, ukushukuma, ikhemikhali kanye nokusatshalaliswa kwamanje kwephaneli kulawulwa ngakho isikhungo sembobo sithola ithusi elanele ngaphandle kokwakheka ngokweqile kwendawo. Ukwamukelwa komkhiqizo kuhlolwa ngokuhambisana nencazelo yokusebenza ebusayo kanye nemibhalo yokuthenga, hhayi ngokuhambisana nenani lokumaketha elihlukile.

Ukugcwaliswa kwe-Microvia

Ama-microvia agcwele asebenzisa i-plating chemistry eyenzelwe ukugcwalisa ngokuthanda kusukela phansi ngenkathi kunciphisa izikhala, imithungo kanye nethusi elingaphezulu kakhulu. Uma enye i-microvia izobekwa ngaphezulu, indawo egcwele kumele ibe yi-planar eyanele ye-dielectric elandelayo kanye ne-target pad. I-dimple noma i-bump evumelekile kanye nendlela yokuhlola kufanele ichazwe. Inqubo ye-microvia egcwele ihlukile ekuxhumeni imbobo nge-resin bese ubeka isivalo phezu kwayo.

Ukuthwebula Izithombe Zezingqimba Zangaphandle, Ukucwebezela Amaphethini Nokuqopha

Ukucutshungulwa kwesendlalelo sangaphandle kuhlukile ekucutshungulweni kwesendlalelo sangaphakathi ngoba izimbobo ezifakwe amapulangwe kanye nabaqhubi bomphezulu bavame ukwakhiwa ngesikhathi sokufakwa kwephethini. Inqubo evamile ifaka isithombe sephethini yangaphandle, amapulangwe ethusi ezindaweni eziveziwe, ifaka ukumelana kwe-etch njenge-tin, ihlubula i-photoresist, iqopha ithusi eliyisisekelo elingafuneki bese isusa ukumelana kwe-etch. Ezinye izinqubo ezifanelekile zingasetshenziswa, kodwa ukulandelana kumele kugcine izidingo zodonga lwembobo kanye nomqhubi.

Ithusi eliqediwe kumele laziwe ngaphambi kokuba umsebenzi wobuciko ukhishwe

Umqhubi wangaphandle akalingani nobukhulu befoyili yokuqala. Ukufakwa kwemigodi kanye nokufakwa kwephethini kwengeza ithusi, kanti izinqubo zokugcwalisa noma zokufaka i-wrap zingangeza okwengeziwe. Ngakho-ke amandla omugqa omncane kumele ahlolwe ngokumelene nethusi elingaphezulu eliqediwe, hhayi inani lefoyili yekhathalogi. Lokhu kubaluleke kakhulu kumabhodi e-HDI, lapho ukufakelwa okuphindaphindiwe kunganciphisa ifasitela lokusika.

Ungqimba lwangaphandle lwe-AOI

Ngemva kokugqwala, izendlalelo zangaphandle zihlolwa ngokubona ukuthi azivuleki, zifushane, umonakalo womqhubi, iziphambeko zethusi ezisele kanye nephedi. Idatha ye-AOI ayithathi indawo yokuhlolwa kukagesi ngoba amanye amaphutha angase afihlwe, aqhutshwe ngezikhathi ezithile noma ahlobene nokuxhumeka kwemigodi. Kuyisigaba esisodwa kusu lokuqinisekisa olunezendlalelo.

Ukufakwa komngcele kanye ne-castellations

Amaphethelo acwebezelwe kanye nezimbobo ezicwebezelwe zidinga ukuthi iphrofayili kanye nochungechunge lwe-plating kuhlanganiswe. Izindawo zokufaka i-edge-plating zingase ziqondiswe ngaphambi kokufaka i-plating bese ziqedwa kamuva. Ama-castella adinga ukubekwa kwemigodi kanye nomzila wokugcina oshiya i-geometry ye-half-hole ecwebezelwe ecacisiwe. Lezi zici kufanele ziboniswe emdwebweni futhi azikwazi ukucatshangwa ngokuphephile kusukela kumsebenzi wobuciko wethusi kuphela.

Imaski ye-Solder, i-Legend, i-Surface Finish kanye ne-Profiling

Ukulungiswa kanye nokuthwetshulwa kwezithombe zemaski yesolder

Ubuso bethusi buyahlanzwa, kufakwa imaski ewuketshezi ethwebula izithombe, yomiswe nge-tack, ifakwe izithombe, ithuthukiswe futhi ilashwe ngokuphelele. Ukubhaliswa kwemaski kuhlolwa ngosayizi wephedi, isu lomhlaba elichazwe ngemaski noma elingachazwanga ngemaski, ngezidingo zokufaka amatende kanye nephimbo lengxenye. Ububanzi bobukhulu bemaski obungaguquki abufanele yonke i-inki, isici nendawo; imininingwane yomkhiqizo kanye nezinto ezivunyiwe kulawula isidingo.

Inganekwane nokumaka

Inganekwane kumele ihlale ikude nama-pad asobala, amaphuzu okuhlola kanye nezindawo ezibalulekile. Ukuhlelwa kwe-serialing, ikhodi yosuku, ikhodi ye-lot, uphawu lwe-UL kanye nezihlonzi zamakhasimende kufakwa ngokuya ngohlelo lokudweba nokulandelela lokukhiqiza. Okuqukethwe kokumaka kufanele kuvunyelwe ngaphambi kokukhiqiza ngoba ukwengeza noma ukuhambisa amakhodi ngemva kokukhiqiza kungase kwephule umsebenzi wobuciko olawulwa ngamakhasimende.

Ukukhetha okungaphezulu

Ukuphela kuvikela ithusi eliveziwe futhi kunikeza isikhombimsebenzisi sokunamathisela, ukubopha ucingo noma ukuxhumana okugugile. Ukukhetha kusekelwe endleleni yokuhlanganisa, ukuphakama kwengxenye, isitoreji, ukulahleka kwe-RF, ukugugile kokuxhumana kanye nezidingo zomthetho.

• ENIG: i-planar futhi isetshenziswa kabanzi ekuhlanganiseni i-fine-pitch. Izidingo kufanele zibhekisele ekubuyekezweni okusebenzayo kwe-IPC-4552 kunokuthembela ekuqineni kokumaketha okulula.
• I-ENEPIG: isekela ukugoqa kanye nezinhlelo zokusebenza ezithile zokubopha izintambo uma zichazwe futhi zilawulwa ngaphansi kwe-IPC-4556.
• I-OSP: isivikelo esincane semvelo esifanele izimo zokuhlanganisa nokuphatha ezihambisanayo.
• Ithini lokucwilisa lesiliva noma lokucwilisa: ekhethelwe ukuhlanganiswa okuthile, ukulingana kokucindezela noma izidingo zikagesi, kanye nezilawuli zokugcina nokuphatha.
• I-HASL: Iqinile ezinhlelweni eziningi ezimbobo kanye nezinhlelo zokusebenza ezinkulu kodwa ayilingani kakhulu kunezokugcina ukucwiliswa.
• Igolide eliqinile elifakwe ngogesi: isetshenziswa ngokukhetha ezingxingweni ezigugile njengeminwe esemaphethelweni; ubukhulu be-nickel negolide buchazwe kuhlelo lokusebenza lokuxhumana.

Ukuqinisekiswa kobukhulu bokuqedwa kulandela incazelo yokuqeda efanele kanye nohlelo lokusampula oluvunyelwene ngalo. Akufanele kukhangiswe njengokulinganisa kwe-XRF kwephedi ngayinye noma ibhodi ngalinye ngaphandle kokuthi lokho kuyadingeka futhi kwenziwa ngempela.

Iphrofayili yokugcina

Ukuqondisa, ukubhoboza, ukusika nge-laser noma ukufaka amaphuzu angu-V kuhlukanisa ibhodi noma kudala uhlu lokulethwa. Umdwebo kufanele uchaze ubukhulu bokugcina, ukubekezelelana komphetho, amathebhu, imigqa yokuqhekeka, ubukhulu obusele be-V kanye nemikhawulo yengxenye kuya komphetho. Ukugoba kanye nokusonta kuhlolwa ebhodini eliqediwe noma uhlu ngaphansi kwezimfuneko zokwamukelwa ezibusayo.

Ukuhlolwa Kukagesi, i-TDR kanye nokuqinisekiswa Kwesakhiwo

Ukuqhubeka kukagesi kanye nokuhlukaniswa

Ukuhlolwa kukagesi okungagcwele kuqinisekisa ukuthi amanethiwekhi ahlosiwe axhunyiwe futhi amanethiwekhi angahlosiwe ahlala ehlukanisiwe. Imishini yokuhlola endiza ivame kakhulu kuma-prototypes kanye nomthamo ophansi ngoba igwema i-fixture ezinikele. Ukuhlolwa kwe-fixture kungathuthukisa i-throughput ukuze kube nomthamo wokukhiqiza ozinzile. Amapharamitha okuhlola, idatha kanye nokumbozwa kufanele kuhambisane nencazelo yokuthenga kanye nezidingo ze-IPC-9252 ezisebenzayo. Izindleko ze-throughput kanye ne-fixture zincike ekwakhiweni futhi akufanele zishiwo njengezindinganiso ezijwayelekile.

Ukuqinisekiswa kwe-TDR impedance

Amabhodi okulawula ukuvimba aqinisekiswa kumakhuphoni aklanyelwe kusetshenziswa i-reflectometry yesizinda sesikhathi. Ikhuphoni kumele liphinde likhiqize ungqimba olufanele, ithusi, i-dielectric kanye nokucushwa kwereferensi eduze ngokwanele ukumela isakhiwo somkhiqizo. I-IPC-TM-650 2.5.5.7A ichaza izindlela zokulinganisa i-TDR, kuyilapho i-geometry yekhuphoni, imvamisa yokuhlolwa, ukubekezelelana kokwamukelwa kanye nokubika kulawulwa yimibhalo ye-oda. Akukho mthetho ojwayelekile wokuthi i-+/-5% idinga "ikhuphoni elilodwa ngesigamu sephaneli" noma i-+/-3% idinga "eyodwa ngekota yephaneli."

Ukuhlolwa kwe-Microsection kanye nesakhiwo

Amakhuphoni amele ayalungiswa, apholishwe futhi ahlolwe ukuze kutholakale ukubhaliswa kwezingqimba, ithusi elinodonga lwemigodi, ukuxhumana kwangaphakathi, isimo se-dielectric, ukugcwaliswa kwe-microvia, i-wrap plating kanye nezinye izici zesakhiwo. Uhlelo lwesampula luvela ekuchazeni komkhiqizo olawulayo kanye nemibhalo yokuthenga. I-IPC-A-600 iyincazelo eboniswe ngezimo zokwamukelwa ezibonakalayo; izidingo zangempela zokusebenza zivela ekuchazeni okufana ne-IPC-6012, IPC-6013 noma i-IPC-6018.

Ukuhlolwa kokushisa kwangaphambili kanye nokuthembeka

Eminye imikhiqizo idinga ukugeleza kabusha kokulingisa ukuhlanganiswa, ukucindezeleka kokushisa, ukushaqeka kokushisa noma ukujikeleza okuqashwe ngogesi ngaphambi kokuhlolwa kwesakhiwo. Indlela kumele ibizwe futhi kuchazwe iphrofayili, inani lokudalulwa, ikhuphoni kanye nenqubo yokwehluleka. “I-microsection yemijikelezo emithathu,” “i-IST yemijikelezo eyi-1,000” kanye nemishwana efanayo akuzona izinto ezithatha indawo yohlelo lokuthembeka olubhaliwe.

Indlela Izinto Ezihlanganisiwe Ezishintsha Ngayo Ukugeleza Kwe-HDI, I-Rigid-Flex kanye ne-Hybrid

Ukwakheka okulandelanayo kwe-HDI

I-HDI iphinda i-lamination, ukubhoboza nge-laser, ukuhlanza, ukwenza insimbi futhi ngokuvamile igcwalisa ithusi ezingeni ngalinye lokwakheka. I-subassembly ephakathi ingase ibe nama-via agqitshwe. Njengoba ukujula kokwakheka kukhuphuka, isinxephezelo sokubhalisa, ithusi elingaphezulu kanye nokunyakaza kobukhulu kuba nzima kakhulu ukulawula. Umhlahlandlela wobunjiniyela be-HDI onezingqimba eziyi-10 uchaza ukuthi i-1+8+1, 2+6+2 kanye ne-3+4+3 zihluke kanjani.

Ukwakhiwa okuqinile okuguquguqukayo

Ukucubungula okuqinile kungenisa ama-polyimide cores, i-coverlay, izinto ezinamathelayo noma ezinamathelayo, izindawo eziqinile ezikhethiwe, izinto zokubopha ezigeleza kancane kanye nokuguqulwa okulawulwayo okuguquguqukayo kuya kokuqinile. Izimo zokucindezela zikhethwa ohlelweni lwezinto ezivunyiwe; izinga lokushisa eliphezulu elihlanganisiwe alisebenzi kuzo zonke izakhiwo. Uchungechunge lokwenziwa kumele luvikele izindawo eziguquguqukayo eziveziwe, lulawule ukugeleza kwe-resin futhi lulondoloze i-geometry yethusi yendawo egobile. Ukuhlolwa kokugoba noma i-dynamic-flex qualification iyadingeka kuphela uma kuchazwe yizidingo zomklamo kanye nomkhiqizo, hhayi ngokuzenzakalelayo kukho konke ukuthunyelwa okuqinile.

Izinto ezixubile zesivinini esiphezulu kanye ne-RF

Ama-stackup e-hybrid ahlanganisa izinto nezinhlelo ezahlukene ze-resin, izinketho zethusi, ukunyakaza kobukhulu kanye nokwelashwa kobuso. Ukuhambisana kwebhondi kanye nokwandiswa kwe-z-axis kumele kuhlolwe. Ukubhoboza kanye nokususa i-demear kungadinga izilungiselelo ezithile zezinto, futhi imodeli ye-impedance kumele isebenzise umklamo wangempela we-Dk we-dielectric ngayinye. Izinto ezicubungula "njenge-FR-4" zisadinga isinxephezelo sazo esifanelekile kanye nedatha yokucindezela.

Ithusi elisindayo, izinhlamvu zemali zethusi kanye nezici ezifakiwe

Isinxephezelo sokushintsha kwe-etch esindayo sethusi, ukugcwaliswa kwe-resin kanye nebhalansi yendiza. Izinhlamvu zemali noma ama-inlays afakiwe aletha imishini yokukhanda ephaketheni, ukubopha kanye nokulawula i-planarity. Izingxenye ezifakiwe ezingasebenzi noma ezisebenzayo zidinga ukwakheka kwenqubo ehlukile kanye nokucaciswa okubusayo. Lezi kufanele ziphathwe njengezinhlobo ezithuthukisiwe, ezingafakwanga kalula esitatimendeni sokuthi ukugeleza okujwayelekile okukodwa kusekela zonke izici ezikhethekile.

Amarekhodi Ekhwalithi, Ukulandelela kanye Nokukhishwa Kokuthunyelwa

Amarekhodi alethwe ngokuthunyelwa kufanele achazwe ku-oda lokuthenga noma esivumelwaneni sekhwalithi. I-oda lezentengiselwano elijwayelekile lingadinga isitifiketi sokuhambisana nokuqinisekiswa kokuhlolwa kukagesi. Uhlelo olulawulwayo lwezokwelapha, lwezimoto, lwezindiza noma lokuvikela lungadinga izitifiketi zezinto ezibonakalayo, ukulandeleka kwezindawo, izingxenye ezincane, idatha yokuqeda, imiphumela ye-impedance, amarekhodi esihloko sokuqala noma amafomu athile amakhasimende. Akulungile ukusho ukuthi ukuthunyelwa ngakunye okunezingqimba eziyishumi kuhlanganisa ngokuzenzakalelayo yonke imibiko engenzeka.

Izigaba ezijwayelekile zamarekhodi

• isitifiketi sokuthobela imithetho;
• isitifiketi noma isifinyezo sokuhlolwa kukagesi;
• Umbiko we-TDR wezigaba ezithile ze-impedance;
• ukuhlonza izinto kanye nokulandeleka kwezindawo lapho kudingeka khona;
• umbiko wesigaba esincane ngaphansi kohlelo lokusampula oluvunyelwene ngalo;
• idatha yokulinganisa indawo lapho kudingeka ngokwesivumelwano;
• ukubhoboza emuva noma ukuqinisekiswa kokujula okulawulwayo kwezici ezibalulekile;
• I-RoHS, i-REACH noma ezinye izimemezelo ezisebenza kumkhiqizo onikeziwe;
• amarekhodi esihloko sokuqala noma eziqu;
• idatha yokulandelela ukulandelela kanye nokulandelela indawo yokukhiqiza.

Izinga lokulandelela kanye nokugcinwa

I-IPC-1782 inikeza uhlaka lwamazinga okulandelela, kodwa ayidali umthetho owodwa wokugcina weminyaka eyishumi kuyo yonke i-PCB. Isikhathi sokugcina, ubuncane bedatha kanye nokufinyelela kunqunywa yinkontileka yamakhasimende, uhlelo lokulawula kanye nenqubo yekhwalithi yomhlinzeki. Isilinganiso kufanele sibonise noma yikuphi ukugcinwa okungajwayelekile noma izidingo zerekhodi ledijithali ngoba zithinta ububanzi bokuphatha kanye nokuhlolwa.

Ukukhishwa kokugcina

Ukukhishwa kokuthunyelwa kuqinisekisa ukuthi imisebenzi nokuhlolwa okudingekayo kuqediwe, ukungaguquguquki kuyaxazululwa, ubuningi buyahambisana, ukupakisha kuvikela ukuqeda kanye nezimo ezithinta umswakama lapho kufanele khona, futhi imibhalo edingekayo inamathiselwe noma iyatholakala. Indlela yokupakisha, ukuvala nge-vacuum, i-desiccant, inkomba yomswakama kanye nophawu lokuphila eshalofini kuncike ekuqedeni, isikhathi sokugcina kanye nencazelo yamakhasimende.

Cela Isibuyekezo Sokukhiqiza se-PCB Yezingqimba Eziyi-10