Ubunjiniyela be-PCB be-HDI obunezingqimba eziyi-10 be-Microvias kanye ne-BGA Escape

I-PCB ye-HDI enezingqimba eziyi-10 ayichazwa nje ngokuba nezingqimba zethusi eziyishumi noma i-BGA encane. Iyibhodi eliphrintiwe elinezingqimba eziyishumi elisebenzisa ubuchwepheshe obuhlanganisiwe obuphezulu obuyi-microvias ezibhobozwe nge-laser, ukuxhumana okungaboni noma okufihliwe, nge-via-in-pad, ukwakheka okulandelanayo, i-geometry yomqhubi omncane, noma inhlanganisela yalokhu-ukudala iziteshi zokuqondisa umzila umklamo ojwayelekile onamapulangwe angenakunikezwa ngaphakathi kwendawo yebhodi etholakalayo. Ngakho-ke ukwakheka kwe-HDI okuzwakalayo kuqala ngenkinga yokuqondisa umzila nokuthembeka, hhayi ngokubhala okunesitayela kokwakheka.

I-Highleap Electronics ikhiqiza amabhodi ajwayelekile kanye ne-HDI multilayer futhi ibukeza ukwakheka okuphelele kokuxhumana ngaphambi kokuba kukhishwe i-stackup. Ukubuyekezwa kufanele kuxhume izinqumo ezine ezivame ukuphathwa ngokwehlukana: isu lokuphuma kwephakheji, inani lamazinga okwakha, ukwakhiwa kwezinto zokwakha kanye ne-dielectric, kanye nohlelo lokufaneleka. I- DFM ethile yephrojekthi kanye nokubuyekezwa kwe-stackup kuyiphuzu elifanele lokuqinisekisa lezo zinqumo. Ulwazi olujwayelekile lwefektri luyatholakala ekhasini lokukhiqiza le-HDI PCB , kuyilapho lesi sihloko sigxile ekukhetheni kobunjiniyela obunezingqimba eziyishumi.

Uma Ibhodi Elinezingqimba Eziyi-10 Lidinga I-HDI Ngempela

I-HDI iyafaneleka uma ixazulula umkhawulo wobuningi obulinganiswayo, kagesi, wemishini noma wokuthembeka. Akufanele ifakwe ngoba nje umkhiqizo uqukethe i-BGA engu-0.5 mm, usebenzisa isikhombikubona esisheshayo, noma uchazwa njengomklamo wekhwalithi ephezulu. Amanye amaphakheji angu-0.5 mm anamaphethini amaningi okususa abantu futhi angaphunyuka ngezinga elilodwa le-microvia. Amanye amaphakheji endaweni efanayo anezinkundla zebhola ezigcwele, izizinda zamandla eziningi kanye nama-pair amaningi asheshayo, futhi angadinga amazinga amabili okwakheka noma inani elihlukile lezendlalelo. Imephu yephinikhodi yephakheji ibaluleke okungenani njengephini elijwayelekile.

Izizathu ezivamile zokusebenzisa i-HDI ebhodini elinezingqimba eziyishumi

• Ukuphunyuka kwephakheji: Imigqa yangaphakathi ye-BGA ayikwazi ukufinyelelwa ngephedi elitholakalayo elidlula emgodini kanye ne-antipad geometry.
• Ukubuyiselwa kwesiteshi somzila: Amasimu amakhulu adlula ngendlela adla isikhala esiningi kakhulu ezingqimbeni eziningi kanye namandla amabhulokhi noma izindiza zokubhekisela.
• Izinguquko ezimfushane eziqondile: ama-microvia ayizimpumputhe anganciphisa ngokungadingekile ngobude kanye nokungena kwe-parasitic lapho ungqimba lwesignali esiqondiwe luseduze nohlangothi lwengxenye.
• Ukubekwa ngaphakathi kwephedi: i-microvia egcwele futhi ehleliwe iyadingeka ngqo endaweni yengxenye ukuze kulondolozwe ukuminyana kwe-feni.
• Imvilophu encane yomshini: uhlaka lwebhodi alukwazi ukukhula futhi izendlalelo ezengeziwe zomzila zingadala ukujiya okungamukeleki, izindleko noma imikhawulo yesilinganiso.
• Ukuxhumeka okuhlukanisiwe: Izindawo ezikhethiwe zidinga i-HDI kuyilapho izindawo ezinobuningi obuphansi zingahlala zivamile, zivumela ukwakhiwa kwe-HDI engaphelele kunesixazululo esinezingqimba zonke.

Amacala lapho i-HDI ingase ingabi yimpendulo yokuqala engcono kakhulu

Uma ukuminyana kubangelwa ukuqondiswa kabi kwezingxenye, izinguquko zezendlalelo ezingadingekile, ama-antipad amakhulu kakhulu, ukugcina izinto eziningi noma isu lokusebenzisa amandla ngendlela engasebenzi kahle, ukwengeza ama-microvia kungase kufihle inkinga yokwakheka kunokuyixazulula. Ukwandisa uhlaka lwebhodi kancane, ukushintsha inketho yokususa abantu be-BGA, ukuhambisa iqembu lesignali elilodwa kolunye uhlangothi, noma ukusebenzisa ibhodi evamile enezendlalelo eziyishumi nambili kungaba yingozi ephansi kunokuphoqelela ukwakheka kwe-HDI eyinkimbinkimbi enezendlalelo eziyishumi. Ukubuyekezwa komklamo kufanele kuqhathaniswe lezi zindlela ngaphambi kokuba ikilasi lokukhiqiza lilungiswe.

Indlela Yokufunda Nokukhetha 1+8+1, 2+6+2 kanye no-3+4+3

Ku-notation evamile ye-symmetric A+B+A , u-“A” ngamunye uyinani lezingqimba zethusi ezakhelwe ngaphakathi ezingezwe ngaphandle kwe-subassembly ephakathi ye-“B”. Izinombolo zengeza ekubalweni kwengqikithi ye-copper-layer. Ngakho-ke u-1+8+1, u-2+6+2 no-3+4+3 konke kuyizakhiwo ze-layer eziyishumi. I-notation ngokwayo ayichazi uxhumano ngalunye lwe-via, inani eliqondile lemisebenzi yokucindezela, imisebenzi ye-layer, noma ukuthi i-subassembly ephakathi iqukethe ama-via angcwatshwe yini. Leyo mininingwane ingeye-design yokukhiqiza kanye ne-stackup evunyiwe.

Ungakhethi i-buildup kusuka ku-pitch ye-BGA kuphela

Isinqumo sokwakheka kumele senziwe ngocwaningo lokuphunyuka oluqediwe. Okungenani, lolo cwaningo kufanele lubonise inani lemigqa yesignali okumele ishiye iphakheji, amandla kanye nomhlabathi ngokubeka, isikhala phakathi kwamabili, ukuqhubeka kwendiza yokubhekisela, isiqondiso se-feni ehlosiwe kungqimba ngayinye yesignali, kanye nenani lemizila etholakalayo phakathi kwama-pad aseduze noma ngokusebenzisa izindawo. Ibhodi elingu-2+6+2 alilona “elingcono” ngokuzenzakalelayo kune-1+8+1; lifaneleka kuphela uma izinga lesibili lokwakheka lidala ukufinyelela komzila okunganikezwa yizinga lokuqala.

Ukuxhumana kwanoma yiluphi ungqimba kuyisinqumo esihlukile

I-HDI yanoma iyiphi ingqimba ngokuvamile isebenzisa ama-microvia agcwele ukuxhumanisa ama-layer pair alandelanayo kulo lonke isakhiwo. Inikeza ukuguquguquka okuphezulu kokuqondisa okuqondile kodwa futhi idala ama-interface agcwele kakhulu, ama-process loops amaningi kanye namathuba amaningi okubhalisa noma amaphutha okuxhumana. Akufanele isetshenziswe njengesithasiselo esizenzakalelayo sokuqedela ukwakheka kokuphunyuka. Uma kudingeka i-any-layer, umdwebo kufanele ubonise okuvunyelwe ngama-stack, ukuphakama kwama-stack okungavunyelwe, imithetho ye-skip-via kanye nemoto yokuhlola ukuthembeka.

I-Microvia Geometry, Ama-Capture Pads kanye ne-Via-in-Pad

Imithetho ye-Microvia kumele ivumelane nomenzi wezinto ngokuhambisana nobukhulu be-dielectric, uhlelo lwe-laser, ukwelashwa kwe-foil, inqubo yokugcwalisa ithusi kanye nekhono lokubhalisa. Umthetho we-"75 μm via one-225 μm pad" awuphephile kuwo wonke ama-laminate noma kuwo wonke amazinga okwakheka. Ukuvulwa okufanayo kwe-laser okungajwayelekile kungaveza izimo zokungena ezihlukile, eziphakathi nendawo kanye ne-target-pad lapho uhlelo lwe-resin, isitayela sengilazi noma i-foil yethusi kushintsha.

Amapharamitha afanele ukubuyekezwa komklamo we-HDI

• Ukuvulwa kwe-laser kanye ne-geometry eqediwe: chaza ukuthi ubukhulu buwukuvulwa kobuciko, ububanzi bokungena obujwayelekile, ububanzi obuphezulu obuqediwe noma ububanzi obuncane bokuhlosiwe.
• Ubukhulu be-Dielectric: sebenzisa ubukhulu be-dielectric obucindezelwe endaweni ye-microvia, hhayi inani lekhathalogi ye-prepreg engacindezelwanga.
• Isilinganiselo: umenzi kufanele aqinisekise ifasitela layo elifanele lokujula nobubanzi. Umklamo ogcina izinto ngendlela ehlelekile uvame ukugwema ukwenza i-via ibe nzulu kunobubanzi bayo obusebenzayo.
• Bamba umhlaba: linganisa ubukhulu be-laser, indawo edingekayo ye-annular, isabelomali sokubhalisa kanye nekhono lenqubo ye-target-pad.
• I-Antipad: ukunquma kusukela ekususweni kukagesi, ukusebenzisana kwensimu ye-impedance kanye nokubhaliswa kokwenziwa; akusikho ukunwetshwa okuqinile kwephedi yokubamba.
• Ukugcwaliswa kwethusi: chaza indlela yokugcwalisa, i-dimple noma i-bump evumelekile, imfuneko yokuhlelwa kwepulani nokuthi i-via izosekela yini enye i-microvia noma indawo yengxenye.
• Ithusi elingaphezulu ngemva kokugcwaliswa: hlola ukuthi i-wrap plating kanye ne-fill plating kwandisa yini ithusi langaphandle noma elinqwabelene ngale kwefasitela lokuqopha elinemigqa emincane.

Iwindi lokuqala elisebenzayo - hhayi umthetho wokukhishwa

Imiklamo eminingi ye-HDI yokukhiqiza isebenzisa ama-laser microvias cishe ububanzi obungu-75-125 μm ububanzi kanye nama-dielectric acindezelwe acishe abe ngu-50-100 μm. Lawa manani awusizo ezifundweni zokubekwa kwasekuqaleni, kodwa awayona imvume yokwenziwa. Umklamo oseduze nomphetho walelo fasitela ungaba yinto engakhiqiziki ngemva kokukhethwa kokwakhiwa kwengilazi yangempela, okuqukethwe kwe-resin, ithusi eliqondiwe kanye nethusi eliqediwe. Impendulo evunyiwe ye-stackup kanye ne-DFM kumele idlule amanani omtapo wolwazi ojwayelekile.

I-Via-in-pad, igcwaliswe nge-via kanye ne-capped via ayiwona amagama angashintshaniswayo

I-A via ebekwe ngaphakathi kwendawo yengxenye ngokuvamile idinga ukugcwaliswa futhi ihlelwe ngendlela yokuthi i-solder ingangeni emgodini futhi i-assembly pad ihlale ithambekile. Kwi-HDI microvia, ukugcwaliswa kwethusi kuvame ukusetshenziswa lapho i-via isekela i-BGA pad noma enye i-microvia ehlanganisiwe. I-resin-filled and copper-capped mechanical via iyisakhiwo esihlukile esinokucatshangelwa okuhlukile kokucubungula nokuthembeka. Amanothi okwenziwa kufanele akhombe uhlobo lwe-via, izinto zokugcwalisa, izidingo ze-cap, ukucindezeleka kobuso okwamukelekayo kanye nendlela yokuhlola.

Izakhiwo ezingenamhlaba noma ezincane kakhulu zidinga iziqu ezihlukile

Imiklamo enciphisa noma eqeda izindawo ezivamile zokubamba, esebenzisa ama-conductors angeziwe amancane kakhulu, noma esebenza ngendlela efana ne-substrate akufanele inikezwe njengesandiso esijwayelekile se-HDI ejwayelekile yokususa. Idinga ukubuyekezwa kwamandla athile enqubo, imithetho yobuciko ezinikele, izindlela zokuhlola kanye nendlela yokukhiqiza evunyelwene ngayo. Ukubalwa kwezingqimba eziyishumi akwenzi isakhiwo se-SLP sitholakale ngokuzenzakalelayo.

Ama-Microvia Ahlanganisiwe, Ahlanganisiwe Futhi Aweqiwe

Ama-microvia adidekile

Ama-microvia aqinile ancishisiwe emazingeni okwakha alandelanayo futhi axhunywe yisigaba esifushane somqhubi kungqimba oluphakathi. Asebenzisa indawo yokuqondisa eningi kune-stack eqondile, kodwa agwema ukubeka yonke i-interface ku-axis efanayo futhi ngokuvamile enza kube lula ukugcwaliswa kwethusi. Lapho i-geometry yephakheji ivumela i-offset ngaphandle kokuphazamisa ukuphuma kwesignali noma ukuqhubeka kwendiza, izakhiwo eziqinile zivame ukuba yindawo yokuqala enobungozi obuphansi.

Ama-microvias astakiwe

Ama-microvia ahlanganisiwe abeka ama-via agcwele ngokulandelana ku-axis efanayo. Agcina indawo encane kakhulu yokuxhumanisa okuqondile futhi kungadingeka ngaphansi kwamaphakheji agcwele igridi egcwele. Ukuthembeka kwawo kuncike kokungaphezu kobubanzi: ukulungiswa kwephedi eliqondiwe, ikhwalithi yokugcwalisa ithusi, ukuhlanzeka kwesixhumi, isakhiwo seplati, ukuvezwa okuphindaphindiwe kwe-lamination kanye nenani lamazinga ahlanganisiwe konke kubalulekile. Okuhlangenwe nakho kwemboni kuthole ukwehluleka okufihliwe kokuxhumana kwezinye izakhiwo ezihlanganisiwe, ngakho-ke umklamo akufanele uphathe i-microsection eyamukelekayo ngokubonakalayo njengobufakazi bokuthembeka kuphela.

Yeqa ama-microvia

I-skip microvia idlula ezingqimbeni ezingaphezu kweyodwa ze-dielectric ukuze ifinyelele endaweni eseduze. Akuyona nje inguqulo ejulile ye-extra-layer via. I-laser kumele isuse izakhiwo eziningi ze-resin/glass ngenkathi igcina ubuqotho be-target-pad, futhi ukujula okwandisiwe kunganciphisa ifasitela lenqubo efanelekile. Ama-skip vias kufanele asetshenziswe kuphela lapho umenzi eqinisekisile inhlanganisela eqondile ye-dielectric, ukujula, ukuvulwa kanye nesakhiwo se-target. Umdwebo kufanele usho ukuthi ama-skip vias avunyelwe yini; akufanele avele ngokusikisela.

Izakhiwo ezihlanganisiwe

Ibhodi lingasebenzisa ama-microvia ahlanganisiwe ezindaweni eziningi, ama-stacked pair kuphela lapho kudingeka khona umzila, ama-mechanical vias afihliwe engxenyeni ephakathi, kanye nemigodi yokungena yezixhumi. Lo mklamo ohlanganisiwe uvame ukonga kakhulu futhi uqine kakhulu kunokuphoqelela isitayela esisodwa kuwo wonke umklamo. Nokho, udinga imephu ye-via ekhomba ngokucacile izendlalelo zokuqala nezokumisa futhi ivimbele ukunqwabelana ngengozi kuma-interface angafaneleki.

Ukugeleza Kwenqubo Yokulayina Okulandelanayo kanye Ne-HDI

Ukwakheka okulandelanayo kuyiluphu yokukhiqiza ephindaphindwayo, hhayi i-lamination eyodwa elandelwa ukubhoboza nge-laser. Ipheya ngalinye elisha elengeziwe le-dielectric/copper kumele lifakwe i-laminate, libhaliswe, lithathwe isithombe njengoba kudingeka, libhobozwe nge-laser, lihlanzwe, lifakwe insimbi futhi - lapho elinye i-microvia lizobekwa khona ngaphezu kwalo - ligcwaliswe futhi lihlelwe ngaphambi kokuba kufakwe izinga elilandelayo lokwakheka.

Ukugeleza okumele okungu-2+6+2

1. Yakha i-subassembly ephakathi enezingqimba eziyisithupha. Izendlalelo zangaphakathi ziyathathwa izithombe, ziqoshwe futhi zihlolwe. Uma isikhungo siqukethe ama-vias agqitshwe phansi, ukubhoboza, ukwenziwa kwensimbi kanye ne-sublamination eyengeziwe kungadingeka ngaphambi kokuba isikhungo siqedwe.
2. Engeza i-buildup pair yokuqala. Ama-dielectric kanye nethusi le-L2 kanye ne-L9 afakwe esikhungweni. Isinxephezelo sokubhalisa sisekelwe ekuhambeni okulinganisiwe kusuka ku-subassembly ephakathi.
3. Dala ama-microvia asezingeni lokuqala. Ukubhoboza nge-laser i-L2-L3 kanye ne-L9-L8, bese uhlanza, ucwebe ngensimbi bese uwafaka noma uwagcwalise ngokwesakhiwo sezinga elilandelayo.
4. Engeza i-buildup pair yesibili. Faka i-laminate L1 kanye ne-L10 phezu kwezindawo ezilungisiwe.
5. Dala ama-microvia angaphandle. Ukubhoboza nge-laser L1-L2 kanye ne-L10-L9. Qedela ngokugcwalisa/ukuhlela lapho ingxenye ifika khona.
6. Yenza izimbobo ezisele ezidlulayo noma ezijulile ezilawulwayo. Ukubhoboza ngomshini, ukususwa kwe-desmear kanye nokucubungula imigodi efakwe ipulasitiki kuhlelwa ngokulandelana ukuze kulondolozwe isakhiwo sethusi esivunyiwe.
7. Imisebenzi ephelele yengqimba yangaphandle, imaski, ukuqeda, iphrofayili kanye nokuhlola.

Lesi sibonelo sihilela umshini wokucindezela ophakathi nendawo kanye nomshini wokucindezela ophindwe kabili. Ukuwubiza ngokuthi ibhodi "lemijikelezo emibili" noma "lemijikelezo emithathu" ngaphandle kokuchaza ukuthi umshini wokucindezela ophakathi uyabalwa yini kudala ukudideka kokuthenga kanye nobunjiniyela. Isilinganiso kanye nomhambi kufanele basho ukulandelana kwenqubo yangempela kunokuthembela ku-shorthand.

Yiziphi izinguquko eziphindaphindwayo ze-lamination

• Ukunyakaza kobukhulu kuyaqoqana. Ukukala umsebenzi wobuciko kanye nesinxephezelo sokubhoboza kumele kusekelwe ohlelweni lwezinto ezibonakalayo, ukuqondiswa kwephaneli kanye nomlando wenqubo olinganisiwe.
• Ukugeleza kwe-resin kuba nzima kakhulu. Izici zethusi ezigcwele, ukuminyana kwendiza kanye nokungalingani kwethusi kwendawo kungadala ukuntuleka kwe-resin noma ukujiya kwe-dielectric okungalingani.
• Ithusi elingaphezulu lingakheka. Ukugoqa okuphindaphindiwe, ukugcwalisa kanye nokufaka amaphaneli kunganciphisa ikhono lokuqopha ama-conductor angaphandle noma akhiwe kahle.
• Umlando wokushisa uyanda. Ukukhethwa kwezinto kumele kucabangele ukuvezwa okufanelekile kokucindezela nokuhlanganiswa, kodwa izinga lokushisa lokubola lodwa alinqumi ukufaneleka.
• Isabelomali sokubhalisa siqinile. Inqwaba ejulile incike ezithombeni eziningana ezibhaliswe ngokuzimela, amaphethini e-laser kanye nama-target pad.

Uchungechunge oluphelele lokwenziwa luchazwe kumhlahlandlela wenqubo yokukhiqiza i-PCB enezingqimba eziyi-10 . Inhloso yomdwebo we-HDI ukwenza inqubo icace: i-via ngayinye kumele ibe nengqimba yokuqala, ungqimba wokumisa, isimo sokugcwalisa kanye nobudlelwano obuvunyelwe nama-vias angenhla nangaphansi kwayo.

Ukuhlela Ukuphunyuka kwe-BGA ngeMephu Yokuphonsa kanye ne-Pin

I-pitch yephakheji iyipharamitha yokuhlola ewusizo, kodwa ayikwazi ukubikezela ukwakheka okudingekayo ngokwayo. Ukuphunyuka kokugcina kuncike kububanzi bomhlaba, isu le-solder-mask, ukususwa kwabantu bebhola, inani lemigqa, ukusatshalaliswa kwamandla/komhlaba, izidingo ze-differential-pair, intamo evunyelwe ukuya phansi, izendlalelo zesignali ezitholakalayo nokuthi imizila ingadlula yini phakathi kwezindawo noma ama-microvia capture pads.

0.8 mm ukuphakama

Ama-BGA amaningi angu-0.8 mm angahanjiswa nge-feniout evamile yethambo lenja kanye nama-vias abholwe ngomshini, ikakhulukazi uma iphakheji ingeyona igridi egcwele. I-HDI ingase ibe usizo ekunciphiseni ukuvaleka kwe-through-via, ukulondoloza izindiza zokubhekisela, noma ukufinyeza izinguquko ezikhethiwe zesivinini esikhulu, kodwa akufanele kucatshangwe ukuthi kuyadingeka.

0.65 mm ukuphakama

Ku-0.65 mm, zombili izixazululo ezivamile neze-HDI zingenzeka. Ukwakheka kwe-1+8+1 okune-via-in-pad kungenza kube lula ukufaka i-fanaut, kodwa ukukhetha kuncike ekutheni imigqa yangaphakathi ingafinyelelwa yini ngaphandle kokwephula izidingo ze-annular-ring, i-solder-mask noma i-routing-channel. Iphethini yamandla-nge-ndlela ivame ukunquma impumelelo ngaphezu kwenani lesignali.

0.5 mm ukuphakama

I-BGA egcwele engu-0.5 mm ivame ukuzuza nge-microvia-in-pad. Izinga elilodwa lokwakheka linganele iphakheji enabantu noma inani elincane lemigqa; i-matrix egcwele ebanzi ingadinga amazinga amabili noma isabelo sesendlalelo esibuyekeziwe. Akuphephile ukuthembisa ukuthi yonke iphakheji yemigqa engu-16 ingaphunyuka ngo-2+6+2 ngaphandle kokubuyekeza imephu yephini, amakilasi amabili kanye nokusatshalaliswa kwamandla.

0.4 mm ukuphakama

Ku-pitch engu-0.4 mm, i-geometry yokubamba indawo, incazelo ye-solder-mask, i-escape neck-down kanye ne-copper-fill planarization iba yinto ebalulekile. I-HDI enamazinga amaningi ivamile, kodwa i-3+4+3 ayidingeki ngokuzenzakalelayo. Amanye amaphakheji angaphunyuka ngamazinga amabili okwakheka kanye nokususwa kwabantu ngokucophelela; amanye adinga noma yiluphi ungqimba, ama-conductor amahle noma inqubo efana ne-substrate. Indlela yokukhiqiza kumele iqinisekiswe ngaphambi kokuba iphethini yomhlaba kanye nomtapo wolwazi iqandiswe.

Ngaphansi kwe-0.4 mm iphimbo

Amaphakheji angaphansi kuka-0.4 mm angasusa umklamo kusuka ku-HDI evamile yokususa uye ekukhiqizweni okufana nokwengeziwe noma okufana ne-substrate okuguquliwe. Lokho kushintsha kuthinta ukuma komqhubi, ukujiya kwethusi, ukuhlolwa, ukubhaliswa kwemaski ye-solder, ifomethi yephaneli kanye neziqu zomhlinzeki. Kufanele kuphathwe njengesigaba senqubo ehlukile kunokukhangiswa njengenketho evamile "ye-microvia encane".

Lokho okufanele kunikezwe yisifundo sokuphunyuka

• umdwebo we-feniout wesendlalelo ngesendlalelo se-quadrant yephakheji exinene kakhulu;
• umtapo wolwazi we-microvia kanye nomhlaba wokubamba oxhumene ne-stackup ehlongozwayo;
• inani leziteshi zokuhambisa ezisebenzisekayo ngesendlalelo ngasinye;
• ugesi kanye nomhlabathi ngokwabelana, okuhlanganisa umthelela wokulwa nama-pad ezindizeni;
• ukuhlonza indiza ebhekisela kuyo yonke indlela yesivinini esikhulu;
• uxhumano olujulile oludingekayo olungaboni kanye nanoma yikuphi okungenakugwenywa ngokusebenzisa izitaki;
• uhlu lwezinto ezicatshangelwayo ezidinga ukuvunyelwa ngumenzi.

Izinto zokwakha, i-Impedance kanye nobuqotho besignali

Ukukhethwa kwezinto ze-HDI kuyinqubo ehlanganisiwe, ukuthembeka kanye nesinqumo sikagesi. Isici sokushabalalisa esiphansi asikwenzi ngokuzenzakalelayo i-laminate ifanele ukwakheka okulandelanayo, futhi izinga lokushisa eliphezulu lokubola aliqinisekisi ngokuzenzakalelayo ukuthembeka kwe-microvia. Ukwakhiwa okuqondile kwe-core kanye nokwangaphambi kokulungiswa, ukwelashwa kwe-copper-foil, ukugeleza kwe-resin, ukuzinza kobukhulu, impendulo ye-laser kanye neresiphi yokucindezela efanelekile konke kubalulekile.

Imibuzo ebalulekile ye-HDI stackup enezingqimba eziyishumi

• Ingabe i-prepreg ekhethiwe iyatholakala ngesitayela sengilazi kanye nokuqukethwe kwe-resin okukhiqiza ukujiya kwe-dielectric okucindezelwe okudingekayo?
• Ingabe umenzi wezinto uchaze ukunyakaza kobukhulu ngenani eliphakanyisiwe lemishini yokucindezela eyakhiwe?
• Ingabe uhlelo lwe-resin lwe-laser luyabhoboza futhi lususe i-microvia ngendlela ehlanzekile ekujuleni okucacisiwe?
• Ingabe inqubo yokugcwalisa ithusi ingahlangabezana nezidingo zokuhleleka ngaphandle kokudala ithusi elingaphezulu kakhulu?
• Ingabe i-laminate ivunyelwe iphrofayili yokugeleza kabusha kwenhlangano ehlosiwe kanye nanoma yikuphi ukuvezwa kokulungiswa kabusha?
• Kumashaneli anesivinini esikhulu, ingabe okokufaka kwe-Dk, Df kanye ne-copper-roughness kuyatholakala ezakhiweni zangempela - hhayi nje isihloko sedatha sezinga lomndeni?

Imindeni esebenza kahle njenge-Panasonic MEGTRON, i-Isola I-Tera noma i-Tachyon, kanye nezinto ezikhethekile ze-laminate ezilahlekelwa kancane zimboza izidingo ezahlukene zikagesi nezokucubungula. Akufanele zithiwe ziyashintshaniswa ngoba nje amanani azo e-Dk noma e-Df abonakala esondelene. Ukushintsha kungashintsha i-impedance, ukulahlekelwa kokufakwa, ukuziphatha kokulukwa kwengilazi, ukujiya okucindezelwe, impendulo yokubhoboza kanye nokunyakaza kwe-lamination. Ezinye izinto kufanele zilawulwe ngohlu oluvunyiwe noma ukugunyazwa kwamakhasimende okubhaliwe ngemuva kokubalwa kabusha kwe-stackup.

Ukulawulwa kwe-impedance esifundeni se-HDI

Ama-conductor amahle eduze kwamasimu e-microvia azwela kakhulu kuthusi eliqediwe, ukujiya kwe-dielectric, imaski ye-solder, ukuvuleka kwendawo kanye nesimo se-etch. Imodeli ye-impedance kufanele isebenzise i-stackup yangempela ehlongozwayo futhi ifake ingxenye encane yentamo lapho ibaluleke khona ngogesi. Inani lomtapo wolwazi olujwayelekile njenge-"3 mil line ilingana nama-ohms angu-50" alikwazi ukudluliselwa phakathi kwezinhlelo zezinto noma izisindo zethusi.

Iphakheji yokukhiqiza kufanele ihlonze yonke ikilasi ye-impedance ngeleveli, i-geometry, i-reference plane, i-target kanye nokubekezelelana. Umhlinzeki ube esebuyisela ububanzi bomugqa wokukhiqiza kanye nokwakhiwa kwe-dielectric ukuze kuvunywe. Ukuqinisekiswa kwe-TDR kufanele kulandele imibhalo yokuthenga kanye nomklamo wekhuphoni ofanele; inombolo kanye nokubekwa kwamakhuphoni kuyizidingo ezivunyelwene ngazo, hhayi ngokuzenzakalelayo "eyodwa ngengxenye yephaneli" noma "eyodwa ngekota yephaneli." Imininingwane eyengeziwe iyatholakala kumhlahlandlela wobunjiniyela bokulawula i-impedance.

Ama-Microvia awasusi isidingo sokuhlaziywa kokuguquka

I-blind via emfushane ivame ukuba ne-stub engasetshenziswanga kakhulu kune-through-via, kodwa ushintsho luhlanganisa i-pad capacitance, i-antipad discontinuity, i-return-path geometry kanye noshintsho lwe-reference-plane. Iziteshi ezinesivinini esikhulu kufanele zihlolwe njengezixhumanisi eziphelele. Kwezinye izimo i-back-drilled through-via ingcono kune-microvia stack ende; kwezinye, i-shallow microvia iyisisombululo esihlanzekile. Ukukhetha kufanele kuvele ekuhlaziyweni kwesiteshi kanye nokuthembeka, hhayi emthethweni wokuthi i-HDI ihlala ingcono ngogesi.

Ukufaneleka, Ukuhlolwa Kokuthembeka kanye Nokuhlolwa Kokukhiqiza

I-IPC-6016 akufanele ichazwe njengendinganiso yokwamukelwa kwamanje yamabhodi e-HDI. Yakhanselwa, futhi izidingo zokuhambisana ne-HDI ezifanele zadluliselwa ezinhlotsheni zomkhiqizo ezifanele. Kwibhodi le-HDI eliqinile elinezingqimba eziyishumi, incazelo yokusebenza eyinhloko ngokuvamile i-IPC-6012 ekubuyekezweni nasekilasini elishiwo kumadokhumenti okuthenga. Ukwakhiwa kwe-HDI okuguquguqukayo nokuqinile kubhekiswa nge-IPC-6013; amabhodi anemvamisa ephezulu angabiza i-IPC-6018 uma kusebenza. I-IPC-A-600 inikeza incazelo ebonakalayo yezimo zokwamukelwa kodwa ayithathi indawo yencazelo yokusebenza ebusayo.

Kungani ama-microvia ahlanganisiwe edinga okungaphezu kokususwa kwe-microscope okuvamile

Ingxenye ecwebezelayo ihlola ingxenye encane kakhulu yesakhiwo se-a futhi ingase ingabonisi isikhombikubona esibuthakathaka esivuleka kuphela ngemva kokugeleza kabusha okuphindaphindiwe noma ukujikeleza kokushisa. Emikhiqizweni enamazinga amaningi ahlanganisiwe, ukuvezwa okuphezulu kokuhlanganiswa noma izimo zesevisi ezinzima, uhlelo lokufaneleka kufanele luhlanganise ukuhlolwa kwesakhiwo nemoto yokuhlola eqashwe ngogesi. Ikhuphoni eliqondile, ukulungiswa kwangaphambili, inani lemijikelezo, izinga lokushisa kanye nomkhawulo wokwehluleka kufanele kuchazwe yincazelo yekhasimende noma kuvunyelwene ngayo nomenzi.

Amathuluzi awusizo okufaneleka kanye nokwamukelwa

• Ukulingisa ukuhlanganiswa kokugeleza kabusha kwe-Convection: isetshenziselwa ukuveza ibhodi noma ikhuphoni kuphrofayili yokugeleza kabusha echaziwe ngaphambi kokuhlolwa kwesakhiwo noma kukagesi.
• Ukujikeleza kokushisa okubangelwa ugesi we-DC: ifudumeza ikhuphoni yokuhlola ye-daisy-chain ngogesi futhi iqaphe ushintsho lokumelana ngemijikelezo ephindaphindwayo.
• Ukushaqeka kokushisa noma ukujikeleza kwegumbi: isetshenziswa lapho imininingwane yomkhiqizo idinga izinguquko zemvelo ezimele izimo zesevisi.
• Ukuhlaziywa kwe-Microsection: ihlola isimo se-target-pad, ikhwalithi yokugcwalisa, isakhiwo se-plating, ukubhaliswa, ubuqotho be-dielectric kanye nobufakazi bokuhlukana noma ukuqhekeka.
• Ukuhlolwa kwe-AOI kanye nokubhoboza nge-laser: iqinisekisa amaphutha omsebenzi wobuciko, ukulungelelaniswa kwezinhloso kanye ne-geometry yemigodi ezigabeni ezifanele zokukhiqiza.
• Ukuhlolwa kukagesi: iqinisekisa ukuqhubeka kanye nokuhlukaniswa kwebhodi eliqediwe ngokuhambisana nencazelo yokuthenga.
• I-TDR: iqinisekisa amakhuphoni okulawula ukuvimba lapho kuchazwa ukulawula ukuvimba.

Ukufaneleka, ukwamukelwa kwezindawo kanye namarekhodi okuthunyelwa kwempahla kuhlukile

Iziqu zekhono lomhlinzeki zingenziwa njalo ekwakhiweni okumelelayo. Ukuhlolwa kwesihloko sokuqala kungadingeka lapho kwethulwa i-stackup entsha, izinto noma nge-stack. Ukwamukelwa kwe-production lot kungasebenzisa amakhuphoni noma amasampula achazwe yincazelo ebusayo kanye nemibhalo yokuthenga. Amarekhodi okuthunyelwa yimibiko ethunyelwa namabhodi. Lawa mazinga amathathu akufanele ahlukaniswe abe yisicelo sokuthi ibhodi ngalinye noma iphaneli ngalinye lithola ukuhlolwa kokuthembeka.

Izindleko, Abashayeli Besikhathi Sokuhola kanye Nephakheji Yesilinganiso

Izindleko ze-HDI ziqhutshwa yizihibe zenqubo kanye nengozi yokukhiqiza, hhayi yi-overcharge jikelele enamathiselwe egameni lokwakha. Amabhodi amabili afanayo angu-2+6+2 angacaphuna ngendlela ehluke kakhulu uma elinye lisebenzisa ama-microvia angu-100 μm ahlanganisiwe kuphaneli ejwayelekile kanti elinye lisebenzisa ama-stacked via-in-pad, imigqa emihle kakhulu, izinto ezilahlekelwa kancane, ukubhaliswa okuqinile kanye nemibhalo eminingi yokufaneleka.

Izindleko ezinkulu kakhulu kanye nezinhlelo zokushayela

• inani lezinyathelo zokwakheka kanye nezinyathelo zokumbozwa nge-sublamination;
• inani lama-microvia abekwe eceleni uma kuqhathaniswa nenani lama-microvia abekwe eceleni kanye nokuphakama okuphezulu kwe-stack;
• ukugcwaliswa kwethusi, ukuhlelwa kabusha kanye nokucindezelwa okuvumelekile kobuso;
• ububanzi/isikhala esincane somqhubi ngemva kochungechunge oludingekayo lwe-plating;
• ukutholakala kwezinto ezibonakalayo, usayizi wephaneli kanye nomlando wokuzinza nobukhulu;
• ukujiya okuqediwe, isilinganiso sesici esidlula emgodini kanye nobuchwepheshe obuxutshwe;
• amakilasi okuvimbela kanye nezidingo zekhuphoni;
• isigaba somkhiqizo, iziqu zesihloko sokuqala kanye nemibiko edingekayo;
• usayizi webhodi, ukwakheka kwe-array, ukusetshenziswa kwephaneli kanye nesivuno esibikezelwe;
• inani, ukwahlukaniswa kokulethwa kanye nokuthi umzila osheshayo uyatholakala yini ngokobuchwepheshe.

Ngenxa yokuthi lokhu okufakwayo kuyasebenzisana, lesi sihloko asishicileli amaphesenti ahleliwe noma izinsuku zeprototype eziqinisekisiwe. Umhlahlandlela wezindleko ze-PCB onezingqimba eziyi-10 uchaza ukuthi ungaqhathanisa kanjani izingcaphuno ngaphandle kokudideka ngentengo yezinto ezibonakalayo, i-NRE yenqubo, amathuluzi okuhlola kanye ne-logistics.

Amafayela adingekayo ukuze kutholakale isilinganiso se-HDI sobunjiniyela

• Idatha yokwenziwa kwe-Gerber X2, ODB++ noma i-IPC-2581;
• Idatha ye-NC drill/rout enethebula lesendlalelo sokuqala/sokuma lazo zonke izimpumputhe, ezingcwatshwe kanye ne-laser;
• umdwebo wokwenziwa ngobukhulu obuqediwe, ithusi, ukuqeda, ukubekezelelana kwekilasi kanye nobukhulu;
• ukuhlanganiswa okuphakanyisiwe noma imvume yokuthi umenzi wezinto aklame eyodwa;
• ungqimba lohlu lwethebula le-impedance, i-geometry, i-reference plane, i-target kanye nokubekezelelana;
• Idatha ye-BGA noma isithombe se-fanaut samaphakheji aminyene kakhulu;
• imikhawulo yezinto ezibonakalayo kanye nenqubomgomo yokufaka esikhundleni;
• izidingo zokugcwalisa, i-cap kanye ne-planarity;
• izidingo zeziqu, ikhuphoni, ukuhlolwa kanye nombiko;
• ubuningi, ishejuli yokulethwa, ukukhetha kwephaneli/i-array kanye nephrofayili yokuhlanganisa lapho ukuthembeka kuncike ekuvezweni kabusha kokugeleza.

Thumela i-PCB ye-HDI engu-10 Layer ye-DFM kanye ne-Quote

Uhlu Lokuhlola Lokukhishwa Kwe-HDI Ngaphambi Kokwenziwa

Idizayini ye-HDI ilungele ukucashunwa kuphela uma uphawu lokwakheka, imephu kanye nenhloso yokuqondisa ichaza ukwakheka okufanayo ngokomzimba. Iphakheji yokukhulula kufanele ibonise yonke indawo engaboni, efihliwe kanye nedlulayo; khomba ukuthi yimaphi ama-microvia abekwe ndawonye, ​​​​ahleliwe, aweqiwe noma angena ngaphakathi kwephedi; bese usho isimo sokugcwalisa okudingekayo, ukuhlelwa kwepulani kanye nesembozo. Ucwaningo lokuphunyuka kwephakheji kufanele lubonise ukuthi kungani izinga ngalinye lokwakheka lidingeka kunokusebenzisa iphimbo lephakheji njengomthetho wesinqumo kuphela.

• Faka i-subassembly ephakathi, i-buildup order kanye ne-lamination sequence yangempela.
• Qinisekisa ububanzi be-laser-via, ubukhulu be-dielectric, indawo yokubamba, indawo eqondiwe kanye nesilinganiso sesici njenge-geometry eyodwa efanelekile.
• Thola izitaki ze-microvia ezidinga ukufaneleka kokuthembeka okuqondene nesakhiwo.
• Buyisela i-stackup yokukhiqiza kanye ne-impedance geometry ukuze kuvunywe ngaphambi kokuba kukhishwe izinguquko zobuciko.
• Chaza izakhiwo zekhuphoni, imvamisa yesampula, izindlela zokwamukela kanye nemibiko ethunyelwe kumadokhumenti okuthenga.
• Iziqu zenqubo yomhlinzeki ezihlukile, iziqu ze-athikili yokuqala kanye nokwamukelwa kwempahla ejwayelekile; akuzona izinhlelo zokuhlola ezifanayo.

Umphumela othembeke kakhulu ngokuvamile ukwakheka okuyinkimbinkimbi kakhulu okuhlanza iphakheji, okulondoloza izindiza zokubhekisela futhi ohlangabezana nohlelo lokufaneleka komkhiqizo. Ukwengeza elinye izinga lokwakheka kungabuyisa isikhala somzila, kodwa futhi kunezela ukuqongelela kokubhalisa, ukuvezwa kokushisa, imisebenzi yokugcwalisa/yokuhlela kanye nengozi yokukhiqiza.