Ukukhethwa Kwezinto Ze-PCB Eziyi-112G kanye Nokukhiqiza I-PCB Esheshayo

Izinto ze-PCB ezingama-112G

“Izinto ze-PCB ze-112G” ngokuvamile zibhekisela ezinhlelweni ze-laminate ezifanele iziteshi zikagesi ze-112 Gb/s-per-lane ezisetshenziswa kuzixhumanisi ze-chip-to-module, i-chip-to-chip kanye ne-backplane. I-OIF CEI-112G ichaza izigaba eziningana zokufinyelela, ngakho-ke ayikho into eyodwa efanele ibhodi ngalinye le-112G.

I-Highleap Electronics ikhiqiza i-PCB kanye ne-PCBA; asikhiqizi i-laminate. Sisiza amakhasimende ukuthi ahlole izinketho zezinto ezivunyiwe, bese elawula i-stackup, ithusi, ama-via, izixhumi, ukuhlanganiswa kanye nokuhlolwa.

Yikuphi okudingekayo kwi-PCB engu-112G? Khetha ngesabelomali sokufinyelela isiteshi kanye nokulahlekelwa, hhayi ngesilinganiso sedatha kuphela. Iziteshi ezimfushane ze-VSR zingasebenzisa isigaba sokulahlekelwa esihlukile kuneziteshi ezinde ze-backplane. I-Df, ubulukhuni bethusi, ukuluka kwengilazi, ukujiya kwe-dielectric, ngokusebenzisa izingcezu kanye nokuqaliswa kwesixhumi kumele kuhlolwe ndawonye.

Okushiwo Yi-“112G PCB Material” Empeleni

Ishidi ledatha le-laminate linikeza izakhiwo ezinkulu; isiteshi se-112G siwuxhumano olukhiqizwe. Isiteshi esiqediwe sihlanganisa i-trace geometry, iphrofayili yethusi, ama-via, ama-pads, izixhumi, ukuguqulwa kwezinkomba kanye nokuqhekeka kwephakheji.

I-VSR / i-chip-to-module

Ukufinyelela okufushane, kodwa amaphakheji aminyene kanye nokuqaliswa kwezixhumi kwenza ukungaqhubeki kubaluleke kakhulu.

MR / chip-to-chip

Ukuhambisa isikhathi eside kukhulisa ukulahlekelwa kanye nokuzwela kokukhuluma okuphambene.

I-LR / i-backplane

Iziteshi ezinde kanye nezixhumi eziningi zivame ukudinga izakhiwo ezilahlekelwa kakhulu noma usizo lwekhebula.

I-PCB yemojuli ye-Optical

Izimpawu ezimfushane zihlala ndawonye nokuminyana okukhulu, amandla kanye nemikhawulo yemishini.

Lokhu akuyona into eyedwa noma isinqumo se-interface. Ukuziphatha kokugcina kukhiqizwa ukusebenzisana kwama-stubs kanye nokungaqhubeki kwezixhumi nokulahleka kwe-dielectric, kuyilapho ubulukhuni bethusi kanye nokugoba kwengilazi kunquma ukuthi umklamo ofanayo ungaphindaphindwa yini kumaphaneli nasezindaweni zezinto. Yingakho i-Highleap iqala ngamafayela ebhodi esikhundleni semibuzo yomkhiqizo ejwayelekile.

Umthengi akudingeki aqonde kahle yonke imigomo yobuchwepheshe kulesi sigaba. Okubalulekile ukuthi amafayela abonise isekethe ehlosiwe nokuthi ifektri ingakwazi ukubona iziguquguquko zokukhiqiza ezibucayi. I-Highleap ixhumanisa ukubuyekezwa nochwepheshe abafanele futhi ichaza imiphumela maqondana nokusebenziseka, izindleko, isikhathi sokuhola kanye nokwamukelwa.

Izakhiwo Zezinto Ezibalulekile Ku-112G

Property Kungani kubalulekile Iphutha elivamile
Isici sokuqunjelwa Isiza ekunciphiseni i-dielectric Ukuqhathanisa amanani alinganiswa ngezindlela ezahlukene
I-Dk esebenzayo Ilawula ukuvimba kanye nokubambezeleka Ukusebenzisa inombolo yedatha ejwayelekile kuyo yonke into yokwakha
Ubulukhuni bethusi Kwandisa ukulahlekelwa ngumqhubi futhi kungathinta ukubambezeleka Ukwenza imodeli yethusi elibushelelezi ngenkathi u-oda i-foil ejwayelekile
Ukuluka ngengilazi Kungadala ukuhlukahluka kwe-skew kanye ne-local impedance Ukunganaki isitayela sengilazi kanye nokuqondiswa komzila
Okuqukethwe kwe-resin Ishintsha u-Dk, ukujiya nokugcwaliswa okucindezelwe Ukucabanga ukuthi konke ukulungiselela ngesitayela esifanayo sengilazi kuyafana
Ukuthembeka kokushisa Isekela i-lamination enezinga eliphezulu kanye nomhlangano Ukukhetha kuphela nge-Df ephansi

Amanani eshidi ledatha elijwayelekile awanele lapho ukuhlolwa kukagesi okuvamile kungakwazi ukuthola isiteshi esidlula ukubuyekezwa kweshejuli kodwa sehluleka imikhawulo yokufaka nokulahlekelwa noma ukugoba okungalindelekile phakathi kwama-differential pairs. Ukubuyekezwa kumele kusebenzise i-core noma i-prepreg eqondile, iphrofayili yethusi , ubukhulu obuqediwe kanye nomzila. Yilapho ukwesekwa kobunjiniyela komuntu ngamunye kuvimbela umthengi ekuchazeni amadokhumenti amaningi omhlinzeki kuphela.

Amanani e-Dk kanye ne-Df ashicilelwe aqhathaniswa kuphela uma indlela yokuhlola, imvamisa, okuqukethwe kwe-resin kanye nokwakhiwa kwethusi kuqondwa. I-Df ephansi eqanjwe ngegama ayiqinisekisi isiteshi esiqediwe sokulahlekelwa okuphansi uma i-foil ekhethiwe iqinile, i-dielectric ijiyile kunemodeli noma insimu ye-via iveza ukungaqhubeki okukhulu. I-Highleap isebenzisa ukwakhiwa okutholakalayo kanye nokuqagela kwethusi okuqediwe lapho ibuyekeza ukuthi ngabe ikilasi lezinto eziceliwe lifanelekile yini.

Amakilasi Ezinto Ezivamile Zama-PCB angu-112G

Kuye ngokuthi bafinyeleleka kuphi, abaklami bangase bahlole izinhlelo ze-thermoset ezilahlekelwa kancane, ezilahlekelwa kancane kakhulu, ezilahlekelwa kakhulu noma ezilahlekelwa kakhulu. Izibonelo zifaka phakathi imindeni yesivinini esikhulu evela ku-Panasonic, TUC, Isola, ITEQ, Nelco nabanye abahlinzeki. I-Highleap ayiphathi lezi zinhlobo njengezinto ezilingana ngokuzenzakalela.

Ukwakhiwa komkhiqizo kumele kuchaze i-laminate kanye ne-prepreg, isitayela sengilazi, okuqukethwe kwe-resin, i-copper foil kanye nobukhulu. Isibongo somndeni esifana nokuthi “Megtron,” “ThunderClad” noma “low-loss FR-4” asiphelele.

Ukuphindaphinda kuyisilingo esiyinhloko sokukhiqiza. I-prototype ingasebenza ngisho noma iwindi lenqubo libanzi, kodwa ukukhiqizwa komthamo kuveza ukuhlukahluka kwezinto zokwakha, ukusatshalaliswa kwethusi, ukulayishwa kwamaphaneli kanye nokufakwa kweplati. Sibeka amakhuphoni okumelana nokulahlekelwa amele, ukulandeleka kwe-laminate ne-foil okuvunyiwe, ukuhlanganiswa kwe-stackup kanye ne-field-solver kanye ne-back-drill noma isibuyekezo se-HDI ekukhishweni kokukhiqiza ukuze sinikeze ukuqhathanisa okuzinzile phakathi kwezinto zokwakha. Uma i-EM-892K isohlwini olufushane lwezinto zokwakha ezivunyiwe, ukwenziwa kwe-EM-892K kweziteshi zesivinini esiphezulu kufanele kubuyekezwe ngokuqhathanisa nezidingo zangempela ze-stackup kanye nokulahlekelwa kwesiteshi.

Inhloso yokuklama kanye nesinxephezelo sefektri kunabanikazi abahlukene. Ikhasimende lichaza izidingo zikagesi kanye nokuthembeka; I-Highleap isebenzisa ukulungiswa kwe-CAM okuvunyiwe, ukubhoboza, ukubopha kanye nokulungiswa kwe-lamination okudingekayo ukuze kufinyelelwe amanani aqediwe. Noma yiluphi ushintsho oluthinta ukwakheka noma iziqu luphakanyiswa ukuze luvunyelwe esikhundleni sokufihlwa ngaphakathi kokucutshungulwa kwe-CAM.

Imiphumela Yokukhetha Izinto Ngu-Df Alone

  • Ithusi eliqinile lingadala ukulahlekelwa okukhulu kunalokho okusindiswa ukuthuthukiswa kwe-dielectric.
  • Ama-stubs amade angadala ukuzwakala kwemisindo okubusa isiteshi.
  • Ukugoba kwengilazi kunganciphisa umkhawulo wamehlo ngisho noma ukulahlekelwa kokufakwa kwamukelekile.
  • Ubukhulu obucindezelwe obungalawulwa bungashukumisa i-impedance kanye ne-coupling.
  • Amaphutha okuqalisa isixhumi angabangela ukwehluleka kokubuyiselwa kokulahlekelwa.
  • Izinto ezilahlekelwa kakhulu zinganezela izindleko ngaphandle kwenzuzo elinganisekayo eziteshini ezimfushane.

Ukukhiqizwa okuphindaphindiwe kudala enye ingozi: ingxenye yakamuva ingasebenzisa ukwakhiwa okuhlukile okutholakalayo kuyilapho umndeni wezinto eziqanjiwe ungashintshi. I-Highleap iqopha i-stackup evunyiwe, ithusi, izibikezelo zenqubo kanye nendlela yokuhlola ukuze ama-prototypes kanye nokukhiqizwa kuqhathaniswa nesisekelo esifanayo sokukhishwa.

Lezi zingozi kufanele zehlise umzamo odingekayo wokuxhumana nefektri, hhayi ukuyiphakamisa. Uma i-Highleap isithole amafayela e-Gerber noma okuklama, sihlola ukulandeleka kwe-laminate ne-foil okuvunyiwe, ukuhlangana kwe-stackup kanye ne-field-solver, i-back-drill noma i-HDI review kanye namakhuphoni okumelayo okuvimba kanye nokulahlekelwa. Izinqumo kuphela ezithinta kakhulu ukusebenza, ukuthobela imithetho, intengo noma ukulethwa ezibuyiselwa kumakhasimende.

Ukukhethwa kwezinto ze-PCB ze-112G

Isu Lokuqoqwa Kwe-112G kanye Nesu Lokusebenzisa

I-Highleap ibuyekeza ukubekwa kwengqimba yesiginali, ukuqhubeka kokubhekisela, iphrofayili yethusi, ukujiya kwe-dielectric, i-geometry yokwehluka kanye nokuguqulwa kwe-via. Ukubhoboza ngemuva , ama-vias angaboni noma i-via-in-pad kunganciphisa ama-stubs, kodwa inketho ngayinye inemiphumela yokukhiqiza kanye nezindleko.

Ukubhola emuva

Kudinga itafula lokubhoboza elikhishwe, ungqimba oluqondiwe, umkhawulo we-residue-stub kanye nendlela yokuhlola.

I-HDI

Ingafinyeza izindlela zokuphuma futhi isuse izinti ezidlulayo, kodwa i-lamination elandelanayo kanye nama-microvia agcwele andisa ubunzima.

Amakhuphoni

Amakhuphoni e-Impedance, i-insertion-loss noma i-S-parameter kufanele amele i-stackup yangempela yokukhiqiza kanye nethusi.

Ukuphindaphinda kuyisilingo esiyinhloko sokukhiqiza. I-prototype ingasebenza ngisho noma iwindi lenqubo libanzi, kodwa ukukhiqizwa komthamo kuveza ukuhlukahluka kwezinto zokwakha, ukusatshalaliswa kwethusi, ukulayishwa kwamaphaneli kanye nokufakwa kweplati. Sibeka ukulandeleka kwe-laminate ne-foil okuvunyiwe, ukuhlanganiswa kwe-stackup kanye ne-field-solver, ukubuyekezwa kwe-back-drill noma i-HDI kanye namakhuphoni okumelayo okuvimba kanye nokulahlekelwa ekukhishweni kokukhiqiza ukuze kunikezwe ukuqhathanisa okuzinzile phakathi kwezinhlobo.

Indlela eqondile ifanelwe ukunakwa okufanayo nomkhondo oqondisiwe. Ukuqhekeka ngakunye kwe-BGA, ushintsho lwendiza yereferensi, i-stub edlula emgodini kanye nobude obusele be-back-drill kuthinta ukulahlekelwa kokubuya kanye nokuguqulwa kwemodi. Ngakho-ke ukubuyekezwa kwe-stackup kukhomba ama-critical layer pairs, ukuguqulwa kwereferensi kanye ne-geometry ngaphambi kokufakwa kwamaphaneli. Lapho kuphakanyiswa khona i-HDI noma i-back drilling, indlela yokubekezelelana kokukhiqiza kanye nokuhlola ifakiwe ekukhishweni kunokuba ishiywe njengombono womklamo ongakahleleki.

Ukukhiqizwa Nokuhlanganiswa kwe-Highleap 112G PCB

I-Highleap isekela ama-PCB anenani eliphezulu lokulahlekelwa okuphansi, i-HDI, i-lamination elandelanayo, i-via-in-pad, ukubhoboza ngemuva, i-impedance elawulwayo, imigqa emincane , ukwakhiwa kwethusi okuphansi, i-AOI, ukuhlolwa kukagesi kanye nesigaba esinqamulayo. Ukuhlolwa kwe-TDR okungakhethwa, ipharamitha ye-S kanye nokuhlolwa kokulahlekelwa kokufakwa kungafakwa lapho indlela nemikhawulo ichazwa.

Ukuze sihlanganise, sihlinzeka ngokuthola izingxenye, i-SPI, ukubekwa kwe-BGA/LGA, i-AOI, i-X-ray, ukulingana kwengcindezi, umgodi odlulayo kanye nokuhlolwa kokusebenza.

Ukuhlolwa kukhethwa ngephakheji kanye nengozi yokukhubazeka. I-SPI ilawula ukufakwa kokunamathisela, i-AOI ihlola indawo ebonakalayo kanye nezici ze-solder, kanti i-X-ray isetshenziswa lapho amalunga efihliwe khona. Izixhumi ezikhethekile ze-optical, i-RF noma i-mechanical nazo zingadinga ukulungiswa, ukuhlolwa kwedatha noma imiyalelo yokuphatha amakhasimende.

Inqubo yokuhlanganisa iqala ngokwakhiwa kwebhodi elingenalutho. I-Warpage, ibhalansi yethusi, ukuqeda iphedi, ngesimo kanye nobuningi bokushisa kuthinta ukuphrinta, ukubeka kanye nokugeleza kabusha. I-Highleap ibukeza i-PCB kanye nokuhlelwa kwezingxenye ndawonye ukuze ibhodi elihlangabezana nokuhlolwa kwebhodi elingenalutho lingabi yi-PCBA enenzuzo ephansi ngemva kokulayishwa kwezingxenye ezinenani eliphezulu.

Izidingo Zokukhishwa Komkhiqizo Weziteshi ze-112G

  1. Faka iqhwa ohlelweni lwezinto ezibonakalayo kanye nezinye izindlela ezivunyelwe.
  2. Khulula i-stackup enamanani ajwayelekile kanye namanani okubekezelelana.
  3. Thola i-foil yethusi kanye nokuqagela okuqediwe kwethusi.
  4. Nikeza ukuvimba kanye izidingo zokulahlekelwa yisiteshi.
  5. Chaza izakhiwo ze-back-drill noma ze-microvia.
  6. Nikeza amamodeli okuxhuma kanye namaphakheji lapho kudingeka khona ukulungiswa kokuqalisa.
  7. Vumelana ngokwakhiwa kwekhuphoni kanye nokuhlola ukuhambisana ngaphambi kokwenziwa.
  8. Lawula i-warpage yokuhlanganisa, ukugeleza kabusha kanye nokufakwa kwesixhumi.

Ukumbozwa kokuhlolwa kuthinta izindleko kanye neshejuli, ngakho-ke kufanele kube ngokulingana nengozi. Izakhiwo ezibucayi zithola ukuqinisekiswa okuqondile; izici ezizinzile, ezingabalulekile zingathembela ekulawulweni kwenqubo ejwayelekile. Unjiniyela obelwe umsebenzi usiza ukuhlukanisa izivivinyo zokwamukelwa okuphoqelekile kudatha yobunjiniyela ewusizo kanye nokuhlukaniswa kokuzikhethela.

Ukuhlolwa okujwayelekile kukagesi kuqinisekisa ukuvulwa kanye nokufushane, kodwa akuqinisekisi zonke izidingo zokusebenza. Kuye ngomklamo, uhlelo lungasebenzisa amakhuphoni e-impedance, ukuhlolwa kwe-back-drill, i-microsection kanye nokulahlekelwa kokufakwa okungakhethwa noma ukuqinisekiswa kwe-S-parameter. I-Highleap ihlukanisa ukuqinisekiswa kokukhiqiza nokufaneleka komkhiqizo ogcwele ngakho ububanzi bokuhlola obucashuniwe buhambisana nesinqumo okulindeleke ukuthi umphumela usisekele.

Thumela Amafayela Akho Okuklama i-PCB ye-112G—Sizocacisa Okunye

Ukuze uthole isibuyekezo sokuqala, thumela amafayela e-Gerber noma amafayela okuklama e-PCB endawo . Idokhumenti ehlukile ebala zonke izinto, ithusi, ukulahlekelwa kanye nemfuneko ye-via ayidingeki uma lawo manothi esevele ekhona kudatha yokuklama.

Izinqumo ezisheshayo ziphathwa nonjiniyela

Unjiniyela we-Highleap ozinikele uzobuyekeza isakhiwo sesiteshi nethimba lethu lokuqina kwesignali kanye nelokukhiqiza. Sizoqinisekisa isigaba sezinto ezifanele, i-stackup, i-impedance, iphrofayili yethusi, i-HDI noma izidingo ze-back-drill ngokuxhumana okuqondile. Ukuthenga akudingeki kuguqule umklamo ube uhlu lokuhlola lobuchwepheshe ngaphambi kokucela ikhotheshini.

Le ndlela inikeza ikhasimende isinyathelo esilandelayo esisebenzisekayo esikhundleni sohlu lokuhlola olude. Layisha idatha yebhodi kuqala; i-Highleap izobuyekeza ukukhiqizwa, ihlonze inani elincane lezinqumo ezidinga ukuqinisekiswa, futhi iqondise iphrojekthi kusukela ekucashunweni kuya kumodeli kanye nokukhiqizwa okuphindaphindiwe.

Izindleko ze-PCB ze-112G kanye Nokuthuthukiswa Kwezinto Ezibalulekile

Intengo yezinto ezibonakalayo iyingxenye eyodwa kuphela yezindleko eziphelele. Inani lezingqimba, usayizi wephaneli, ithusi eliphansi, i-lamination elandelanayo, ukubhoboza ngemuva, amakhuphoni, isikhathi sokuhlola kanye nesivuno kungaba yizinto ezinkulu ezibangela lokhu. I-Highleap ingaqhathanisa ukwakhiwa ngemva kokuba imingcele yesiteshi kanye neyokufaneleka seyaziwa.

Ngakho-ke amabhodi amabili anosayizi ofanayo kanye nenani lezingqimba angaba namanani ahlukene. Ukuqhathanisa okufanele akusikho izindleko zezinto zokwakha zodwa, kodwa umzila wokukhiqiza, umthwalo wokuhlola, isivuno esilindelekile kanye nenani lomsebenzi wobunjiniyela noma weziqu odingekayo ukuze kukhishwe.

Isikhathi sokulethwa sivame ukulawulwa ukutholakala kwezinto ezibonakalayo, ithusi elikhethekile, ubuncane bomhlinzeki, ukucutshungulwa okulandelanayo noma ukuhlukaniswa kwangaphandle. Unjiniyela ubona umkhawulo wangempela weshejuli futhi uhlola ukuthi ngabe enye indlela evunyelwe ingawususa yini ngaphandle kokushintsha imfuneko yomkhiqizo.

Khetha Isiteshi Esiphelele, Bese Usikhiqiza Ngokuqhubekayo

“Izinto ezingu-112G” azilona ikhambi eliqinisekisiwe. I-Highleap ixhuma i-laminate evunyiwe nethusi, i-stackup, ngezakhiwo, ukukhiqiza, ukuhlanganisa kanye nokuhlola ukuze isiteshi esakhiwe sibonise izibikezelo zomklamo.

Imisebenzi yenkampani nayo isacacile. Abahlinzeki bezinto zokwakha bakhiqiza i-laminate, i-prepreg noma ithusi, kanti abahlinzeki bezingxenye bakhiqiza amadivayisi nezixhumi. I-Highleap ithenga okokufaka okuvunyiwe bese ikuguqula kube ama-PCB aqediwe kanye nama-PCBA anokucubungula okulawulwayo, ukuhlolwa kanye nokuxhumana kwephrojekthi.

Ibhodi eliqediwe kumele likhishwe njengohlelo olulodwa lukagesi, olwemishini nolokukhiqiza. I-Highleap ixhumanisa amafayela amakhasimende namakhuphoni okuvikela kanye nokulahlekelwa amele, ukulandeleka kwe-laminate kanye ne-foil okuvunyiwe, ukuhlangana kwe-stackup kanye ne-field-solver kanye nendlela yokuhlola evunyelwene ngayo. Leyo mibhalo ivumela ukuthi i-prototype ephumelelayo iphindwe lapho ivolumu ikhuphuka noma i-oda libuya kamuva.

Ukuthuthukiswa kwezinto ezibonakalayo akukwazi ukukhokhela ukuqaliswa kwesixhumi, okusele isikhathi eside nge-stub noma indlela yokubuya ebuthakathaka esevele idla umkhawulo wesiteshi. Ngokuphambene nalokho, isiteshi esifushane, esilawulwa kahle singase singadingi i-laminate ebiza kakhulu etholakalayo. Indima ye-Highleap ukugcina izibikezelo zesiteshi ezivunyiwe ekwakhiweni nasekuhlanganisweni, ngenkathi kucaciswa ukuthi yimiphi imikhawulo engeyomklamo wesistimu nokuthi yimiphi engalawulwa yinqubo ye-PCB.

imibuzo ejwayelekile ukubuzwa

Ingabe yonke i-PCB engu-112G idinga i-laminate elahlekelwa kakhulu?

Cha. Isigaba sokulahlekelwa esidingekayo sincike ekufinyeleleni, i-topology, ithusi, izixhumi, ama-via kanye nokulingana kwesistimu.

Ingabe i-Highleap iyayikhiqiza i-laminate?

Cha. Sakha i-PCB kanye ne-PCBA sisebenzisa izinhlelo ze-laminate ezivunyiwe amakhasimende.

Ingabe i-FR-4 ejwayelekile ingasekela i-112G?

Ezinye izakhiwo ezimfushane kakhulu zingase zibe khona, kodwa akunakwenzeka ukuzicabangela. Isiteshi esiphelele kumele siklanywe futhi siqinisekiswe.

Yikuphi okubaluleke kakhulu, i-Df noma i-copper roughness?

Zombili zibalulekile. Umnikelo wazo ohlobene uncike ekuvameni, i-geometry, ithusi kanye nobude besiteshi.

Ingabe i-Highleap ingakwazi ukwenza ukubhoboza emuva kanye ne-HDI?

Yebo, kuncike ku-DFM yephrojekthi ethile kanye nokukhishwa ngezidingo.

Yini okufanele ithunyelwe kuqala ukuze uthole isilinganiso se-112G PCB?

Thumela amafayela e-Gerber noma amafayela okuklama e-PCB. Unjiniyela we-Highleap uzobuyekeza iphrojekthi ngamunye ngamunye futhi axhumanise izinto, i-stackup, i-impedance kanye nemibuzo nethimba lethu lobunjiniyela.

Inothi lokubhekisela lobuchwepheshe: Izakhiwo zezinto ezibonakalayo kanye nezincazelo zesixhumi kumele zihlolwe ngokuqhathanisa nedatha yomkhiqizi wamanje, imininingwane yamakhasimende kanye nezindinganiso zesixhumi ezisebenzayo zokwakha umkhiqizo oqondile. I-Highleap Electronics ingumhlinzeki wokukhiqiza we-PCB kanye nokuhlanganiswa kwe-PCB; izimpawu zokuhweba ze-laminate kanye nezingxenye zingezabakhiqizi bazo.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

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Ungasithola kanjani isilinganiso sama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB