Ukuthi Icwecwe Lethusi kanye Nobuso Baphezulu Kuthinta Kanjani Ukusebenza Kwe-PCB Ye-High-Frequency

Isingeniso

Ekwakhiweni kwe -PCB enemvamisa ephezulu , ukuncishiswa kwesignali kanye nokuqina kwe-impedance kuthonywa kakhulu ubulukhuni bomphezulu we-foil yethusi kanye nohlobo lokuphela komphezulu osetshenziswayo. Njengoba amaza okusebenza enwebeka ngale kwe-5 GHz kuya kububanzi bamagagasi angamamilimitha, ngisho nokwehluka okuncane ezicini zomphezulu womqhubi kuhumusha ekulahlekelweni kokufakwa okulinganiselwe kanye nokuwohloka kokulahlekelwa kokubuya. Ukuqonda ukuthi lezi zinto zithinta kanjani ukusebenza kwemvamisa ephezulu kubalulekile ekufezeni amasekethe anezansi eziphansi, ezinokwethenjelwa okuphezulu kuzinhlelo zokusebenza ezisukela kwingqalasizinda ye-5G kuya ezinhlelweni ze-radar yezimoto. Uma ubuyekeza izinketho zethusi ze-LoPro zamabhodi e-Rogers RF , chaza ukwakhiwa kwethusi okusetshenziswe kumodeli yokulahlekelwa bese uqinisekisa ukuthi kufana nezinto ezi-odwe ukuze kwenziwe.

1. Iqhaza Le-Copper Foil kuma-PCB Amazinga Aphezulu

1.1 Izinhlobo ze-Copper Foil

Ukukhethwa kohlobo lwefoyili yethusi kunquma ngokuyisisekelo izici zokulahlekelwa eziyisisekelo ze-PCB yefrikhwensi ephezulu. Uhlobo ngalunye lwe-foil lunikeza amaphrofayli ahlukile wokugwedla kwendawo kanye nokuhwebelana kokusebenza:

• Electro-deposited yethusi - Ubulukhuni bobuso 4-8 μm, indinganiso yezinhlelo zokusebenza ezijwayelekile ngaphansi kuka-5 GHz.
• Ithusi eligoqiwe - Ukuqina okungaphansi kuka-2 μm, kusetshenzwe ngokuzenzakalelayo ukuze kubushelelezi okuphakeme kumiklamo engaphezu kuka-5 GHz.
• I-foil ehlanjwe kabusha - Isakhiwo sezinyo esiguquliwe ngasohlangothini olubophayo olunendawo yesignali ebushelelezi, ukunamathela okulinganiselwe nokusebenza.
• Ikhopha ephansi kakhulu/Ithusi eliphansi kakhulu - Ukuqina okungu-0.5-1.5 μm, ukukhetha kwe-premium kwamafrikhwensi angaphezu kuka-10 GHz.

1.2 Ukuqina Komhlaba kanye Nendlela Yokulahleka Kwezimpawu

Ubulukhuni bomphezulu buthinta ukusebenza kwe-PCB evame kakhulu ngokusebenzisana kwayo nomphumela wesikhumba, lapho ugesi ugxila eduze kobuso bomqhubi njengoba ubuningi bukhuphuka. Ukujula kwesikhumba kuncipha kube ngaphansi kwama-micrometer angu-0.7 ku-10 GHz ngethusi, kubalwa njengo-√(2/ωμσ). Lapho ubulukhuni bomphezulu busondela noma budlula lokhu kujula, indlela yamanje esebenzayo iyanda kakhulu, okwandisa ukumelana komphezulu kanye nokulahlekelwa kokufakwa. Kuzinhlelo zokusebenza zamagagasi angamamilimitha ezidinga ukuncishiswa okuncane, ithusi eligoqiwe noma eliphansi kakhulu liba yinto ebalulekile kunokuba kube yinto ongayikhetha. Nge- HVLP foil ekwakhiweni nasekuhlanganisweni kwe-PCB , iphrofayili yethusi e-odwe ngaphambilini kumele ihambisane nokuqagela kokulahlekelwa yisignali ngenkathi isasekela izidingo zokubopha nokucubungula okuvunyelwene ngazo.

2. Umthelela we-Surface Finish ekusebenzeni kwe-High-Frequency

2.1 Uhlolojikelele lwe-Common Surface Finishes

Ukwenziwa kwe-PCB ye-high-frequency isebenzisa izinketho ezimbalwa zokuqeda ngaphezulu, ngayinye yethula izici ezihlukile zikagesi:

• ENIG -I-nickel engenawo amandla (3-5 μm) enegolide lokucwiliswa, eliqinile kodwa likazibuthe.
• ENEPIG - Yengeza ungqimba lwe-palladium phakathi kwe-nickel negolide ukuze uthole ukwethembeka okuthuthukisiwe kokubopha izintambo.
• Isiliva Sokucwiliswa - Isendlalelo sesiliva esincanyana ngqo ethusi, esingenazibuthe esinokusebenza okuhle.
• I-Tin yokucwiliswa - Isendlalelo se-Copper-tin intermetallic, esingenazibuthe esinempilo yeshelufu emaphakathi.
• OSP - I-organic coating ingaphansi kuka-0.5 μm ubukhulu, umthelela omncane kagesi kodwa impilo yeshelufu elinganiselwe.

2.2 Umthelela Kubuqotho Besiginali

Izakhiwo zikagesi zokuqedwa okusekelwe ku-nickel ziletha ukulahleka kwesiginali okulinganiselwe ekwakhiweni kwe-PCB okuvamise kakhulu . Izingqimba ze-nickel ezingenagesi zibonisa ukungena okulinganiselwe phakathi kuka-100 no-500 kuye ngokuqukethwe kwe-phosphorus, okudala ukuncishiswa okwengeziwe ngaphezu kwe-2 GHz ngokulahlekelwa okukhulu komphumela wesikhumba. Isivikelo sokucwiliswa kwesiliva kanye nokushiswa kwezinto eziphilayo sigwema lesi sijeziso ngezici ezingezona zikagesi kanye nobukhulu obuncane, okwenza kube ngcono ezindleleni ezibalulekile zesignali ye-RF.

2.3 I-Surface Finish kanye ne-Impedance Control

Ugqinsi kanye nezakhiwo ze-dielectric zokuqedwa komphezulu zithonya ngokuqondile isici semigqa yokudlulisa ye-PCB yamafrikhwensi aphezulu. Igolide lokucwiliswa kwe-nickel engena-electroless lengeza izingqimba zensimbi ne-dielectric kumakhondatha esignali, okudinga isinxephezelo ku-trace geometry ukuze kugcinwe ukuvinjelwa okuqondiwe. Ama-non-magnetic finishes ahlanganiswe nama-foil ethusi abushelelezi aqinisekisa ukufana kwe-impedance ngenkathi kunciphisa izinhlawulo zokulahlekelwa kokufaka.

3. Ukusebenzisana Kwezinto kanye Nokuthuthukiswa Kwedizayini

3.1 Umthelela Ohlanganisiwe Wethusi kanye Nokuqedwa

Ukulahleka okuqongelelekayo ekwakhiweni kwe-PCB okuvame kakhulu kuvela ekuqineni kobuso bethusi kanye nokusebenzisana kokuqeda kobuso. Izilinganiso zibonisa ukuthi ithusi elinobukhulu obuphansi kakhulu eline-organic solderability preservative linikeza ukulahlekelwa okuphansi kokufakwa kune-foil ehlungwe emuva enegolide lokucwiliswa kwe-nickel elingena-electro ngaphezu kwe-10 GHz. Ingqimba ye-nickel ihlanganiswa nobulukhuni bethusi ukudala ukulahlekelwa okungeziwe lapho umnikeli ngamunye eqinisa ukuwohloka kwesiginali. Ekusetshenzisweni kwamagagasi e-millimeter ngaphezu kwe-20 GHz, ithusi elinobukhulu obuphansi kakhulu elihlanganiswe nesiliva lokucwiliswa noma ukuqedwa kwe-OSP kunikeza ubuqotho besignali obuhle kakhulu.

3.2 Amathiphu Okuklama Okusebenzayo

Ukulungiselela okubalulekile kwamaphrojekthi e-PCB emvamisa ephezulu kudinga ukucaciswa okucophelelayo nokukhetha kwamasu:

• Cela idatha enemininingwane yobunzima - Thola kokubili i-Rz (ubude obuphezulu) kanye ne-Ra (isilinganiso esimaphakathi) imininingwane evela kubakhi.
• Gwema i-nickel ezindleleni ze-RF - Cacisa ukuqedwa okungewona kazibuthe weziteshi zesignali ezibalulekile naphezu kokunciphisa ukumelana ne-oxidation.
• Ibhalansi yezindleko eziqhathaniswa nokusebenza - Inhlanganisela yethusi ye-Premium kanye nesiphetho ngokuvamile ingeza izindleko eziphansi ngenkathi iletha ukuthuthukiswa kokulahlekelwa okukhulu.
• Qinisekisa amamodeli we-impedance - I-akhawunti yokuqina kokuqedwa kukulingisa kwe-electromagnetic ukuqinisekisa ukubikezela okunembile kwe-impedance.

4. Izibonelo Zamacala

Idizayini yemojula yerediyo ye-5G enkulukazi ye-MIMO ibonisa izinzuzo zokusebenzisa ngokugcwele izinto. Ngokucacisa ithusi elinephrofayili ephansi kakhulu elinesivikeli se-organic solderability kumanethiwekhi okuphakelayo kwe-antenna ku-28 GHz, idizayini izuze ukuncipha kokulahlekelwa kokufakwa kweyintshi elingu-0.3 uma kuqhathaniswa nethusi elijwayelekile elidiphozithwe ngogesi elinegolide lokucwiliswa kwe-nickel elingenawo ugesi, ukwelula ububanzi bokuxhumana kanye nokunciphisa izidingo zesikhulisi samandla.

Amasistimu erada e-auto millimeter-wave ku-77 GHz adinga ukulinganisa ukusebenza kukagesi nokuthembeka komshini. Idizayini yokukhiqiza esetshenziswa ikhopha egoqiwe ene-electroless nickel electroless palladium immersion gold, lapho ungqimba lwe-palladium olumaphakathi lunikeze ukuhambisana kwe-wire bonding kuyilapho ukuhwaya kwethusi okuncishisiwe kugcinwa ukulahleka kokufakwa okwamukelekayo kokujikeleza kwe-radar ekupheleni ngokuhlolwa okuqinile kokufaneleka kwezimoto.

Isiphetho

Ukusebenza kwemiklamo ye-PCB yemvamisa ephezulu kuncike kakhulu ezicini ezingaphezulu kwe-copper foil kanye nokuqedwa kwendawo esetshenzisiwe. Izindawo zethusi ezimangelengele nezendlalelo zenikeli kazibuthe zombili zifaka isandla ngokulinganiswa ekunciphiseni isignali kumaza we-gigahertz, okunemiphumela ehlanganisayo uma kuhlangene. Onjiniyela bokuklama kufanele bahlole ukukhetha kwezinto ezibonakalayo kusenesikhathi ekuthuthukisweni, ukulinganisa ukusebenza kukagesi ngokumelene nezindleko zokukhiqiza kanye nezidingo zokwethembeka.

I-Highleap Electronics inikeza amakhono aphelele okukhiqiza ama-PCB asebenza njalo :

• Ukukhetha izinto ezilahlekelwe kancane - Ukufinyelela kumafoil ethusi we-VLP/ULP kanye nezindawo ezingezona uzibuthe ezilungiselelwe izinhlelo zokusebenza ze-GHz.
• Ukulawulwa kokunemba kokunemba - Ukuqina kwe-dielectric elawulwayo kanye ne-trace geometry yokuvimbela okungaguquki kwesici kuwo wonke amaphaneli okukhiqiza.
• Izindlela zokwelapha ezisezingeni eliphezulu - Izinketho eziningi zokuqeda kufaka phakathi i-ENIG, i-ENEPIG, isiliva lokucwiliswa kanye ne-OSP enezici zikagesi ezibhaliwe.
• Usekelo lwedizayini egxile ku-RF - Ukubonisana ngobunjiniyela ekukhetheni impahla, ukwenziwa kahle kwezitaki, nokuhlaziywa kwesabelomali esilahlekile.

Xhumana ne-Highleap Electronics ukuze uxoxe ngezidingo zakho ze-PCB ezivame kakhulu futhi usebenzise ubuchwepheshe bethu ekwenzeni ngcono ubuqotho besignali ukuze kusetshenziswe izinhlelo zokusebenza ze-RF namagagasi e-millimeter ezidingakalayo.