Ukukhethwa Kwezinto Ze-PCB Ezingu-224G Zeziteshi Ze-PAM4 Ezingakhiqizwa

Izinto ze-PCB ezingama-224G

Isicelo se-PCB esingu-224G sisebenza kuphela uma isabelo sebhodi sesiteshi sichaziwe. Ukuphunyuka kwephakheji, ukuqaliswa kwesixhumi, iphrofayili yethusi, ukulahleka kwe-dielectric, ngokushintshashintsha kanye nokwehluka kokukhiqiza kudla izingxenye ezahlukene zesabelomali; igama le-laminate lodwa alibonisi ukuthi isixhumanisi sinomkhawulo yini.

Indima ye-Highleap ukuhumusha izibikezelo zesiteshi sekhasimende zibe izidingo zokukhiqiza ezilinganisekayo: i-stackup evunyelwe, ithusi elilawulwayo, imikhawulo ye-impedance, ama-stub target kanye namakhuphoni okuhlola afanele. Ukuthobela i-silicon kusalokhu kungumphumela wezinga lesistimu. I-oda lokuthenga elingenalutho kufanele licacise ubufakazi obungakhiqizwa yifektri kunokucela umndeni wezinto ezibonakalayo ukuthi uqinisekise ipulatifomu ephelele ye-224G.

IphakhejiUkuphunyuka kwe-BGAUmzila we-PCBNgenkambuIsixhumiUmaphakathi womamukeli

Chaza isiteshi se-224G ngaphambi kokukhetha i-Laminate

Iphakheji ewusizo yokuhlelwa kwangaphambilini ikhomba i-transmitter kanye ne-receiver, i-modulation, amamodeli ephakheji, inani lezingxenye ze-PCB, inani lezixhumi, ubude bomzila obuphezulu, ngokushintshashintsha, i-target impedance kanye nokuqagela kokulingana. Iphinde ihlukanise ibhodi le-host kusuka ku-module, i-riser, i-cable assembly noma i-backplane. Ngaphandle kwalolo hlaka, ukuqhathanisa i-laminate kuwukuqagela.

Ikilasi le-224G livame ukuhlotshaniswa nokuthuthukiswa kwe-PAM4 SerDes kanye namapulatifomu okuxhumana noma amakhompyutha esizukulwane esilandelayo. I-PAM4 iphethe ulwazi oluningi ngesimboli ngasinye kune-NRZ kodwa inikeza amathuba amancane okuvuleka kwamehlo aqondile, okwenza umsindo, ukukhuluma okuphambene, ukuzindla kanye nokuphathwa kokulahlekelwa kube nzima kakhulu. Lokho akusho ukuthi yonke imizila engokoqobo kumele isebenzise izinto ezifanayo. Ukuxhumeka okufushane kwephakheji kuya ephaketheni kungaba nesabelomali esihlukile endleleni ende ye-chassis enezixhumi eziningi. Kumabhodi e-MEGTRON 9 ezixhumanisi zekilasi le-224Gbps , ukukhetha i-laminate kumele kuhlolwe ngephrofayili yethusi, i-stackup, ngezinguquko kanye nesabelomali sangempela sokulahlekelwa kwesiteshi.

Umbuzo wesiteshi Kungani ifektri ye-PCB idinga impendulo Okukhiphayo okuvamile
Kusho ukuthini ukuthi “224G” kulo mklamo? Inquma ububanzi bokubonisa kanye nencazelo yokwamukelwa efanele. Incazelo yomzila kanye nereferensi yedokhumenti yesistimu.
Ingakanani indlela eku-PCB? Izikali zokulahlekelwa kwezinto ezibonakalayo ezinobude obuqondisiwe, kuyilapho izinguquko zengeza izinhlawulo ezihlukile. Ubude obukhulu ngokwesendlalelo kanye nesigaba sebhodi.
Zingaki izixhumi kanye nezinkambu ze-via ezikhona? Ukuqalisa kanye nezinti kungabusa isiteshi esifushane. Amamodeli okuxhuma, uhlelo lokubhoboza kanye nethagethi yokubhoboza ngemuva.
Yikuphi ukulahlekelwa kwebhodi okuvunyelwe? Izinto azikwazi ukukhethwa ngokuzibophezela ngaphandle komgomo olinganisekayo. Imaski yokulahlekelwa ukufakwa noma umkhawulo wekhuphoni ovunyelwene ngawo.
Yimuphi umkhawulo wenqubo odingekayo? Ukulingisa okulinganiselwe akwanele ekukhiqizeni ivolumu. I-Tolerance stack kanye nokubuyekezwa kwesimo esibi kakhulu.

Qala ngenqubo yokukhetha izinto ze-PCB ehlelekile nesheshayo . Ukuqhathanisa kufanele kusebenzise idatha yokuklama ethile yokwakha kanye nephrofayili yethusi ehlosiwe. Impahla eshicilelwe elinganiswe kusampula eyodwa ayibufakazi bokuthi yonke ingqikithi kanye ne-prepreg emndenini ofanayo ziziphatha ngendlela efanayo.

Ingabe zonke iziteshi ze-224G zidinga i-laminate elahlekelwa kakhulu?

Cha. Ezinye iziteshi ezimfushane zingase zibe nomkhawulo wokuguquka kunokuba zibe nomkhawulo wokulahlekelwa yi-dielectric. I-laminate elahlekelwa kancane iba yigugu lapho ukulahlekelwa kwebhodi elisatshalalisiwe kudla umkhawulo obalulekile ngemva kokuba i-topology isilungisiwe. Kungenzeka futhi ukuthi amabhodi ahlukene ohlelweni olulodwa asebenzise amazinga ahlukene ezinto zokwakha. Ukukhetha okulungile ukwakhiwa okunengozi ephansi okuhlangabezana nesidingo sesiteshi esiphelele ngokubekezelela ukukhiqizwa, hhayi izinto ezibiza kakhulu ohlwini oluvunyiwe.

Yimuphi umvamisa wokusebenza okufanele usetshenziswe ukuqhathanisa izinto?

Ukuqhathanisa kufanele kulandele imodeli yesiteshi kanye nencazelo esetshenziswa yithimba lesistimu. Unganciphisi isiteshi se-broadband PAM4 sibe yimvamisa eyodwa yedatha engahleliwe. Buyekeza ukulahlekelwa uma kuqhathaniswa nemvamisa, ukwakheka kwe-Dk, ukulahlekelwa kwethusi kanye nokuhambisana kwemodeli phezu kwebhendi efanele. Umdwebo we-PCB kufanele uveze izidingo zebhodi elilinganisekayo kunokuphinda inombolo yokumaketha.

Lapho Isabelomali Sokulahlekelwa yi-224G Sisetshenziswa Khona Ngempela

Isiteshi siyiketanga. Ukuphunyuka kwephakheji, ukuqhekeka kwe-BGA, umqhubi wokulandelela, i-dielectric, ama-via, ukuqaliswa kwesixhumi, izakhiwo zokuxhuma ze-AC kanye nezinguquko zereferensi konke kunegalelo. Ukuguqulwa kwe-Crosstalk kanye nemodi kunganciphisa ukuvulwa kwamehlo okusebenzisekayo ngisho nalapho ukulahlekelwa kokufakwa kubonakala kwamukelekile. Ukwehluka kokukhiqiza kususa yonke iminikelo kumodeli evamile.

Ukwabiwa kokulahlekelwa okusebenzayo kuvimbela i-laminate ekubeni yincazelo elula yazo zonke izinkinga. Uma isixhumi kanye namasimu asebenzisa ingxenye enkulu yesabelomali, ukuthuthukisa i-geometry yawo kungabuyisa imajini eningi kunokushintsha i-resin. Uma indlela ihlala isikhathi eside ngemuva kokulungiswa kwe-topology, ukukhethwa kwezinto kanye nethusi kuba okubaluleke kakhulu.

Iphakheji kanye nokuphunyuka kwe-BGA

Amaphakheji aminyene aphoqa ukugoba kwentamo, ama-via amancane kanye noshintsho lwendiza yokubhekisela. Ukuphunyuka kungase kube kufushane, kodwa ukungaqhubeki kwayo kungadala ukuguqulwa kokubonakaliswa kanye nemodi. I-stackup kufanele ihlanganiswe nensimu ye-BGA pitch kanye ne-pad ngaphambi kokuba inani lezendlalelo liqandiswe. Ama-via ayizimpumputhe noma i-via-in-pad kungasiza kweminye imiklamo, kodwa aneza izinyathelo zenqubo kanye nezidingo zokufaneleka.

Ubulukhuni bethusi kanye ne-geometry eqediwe

Uma imvamisa ephezulu, ugesi ugxilile eduze kobuso bomqhubi. Iphrofayili yethusi, ukwelashwa kokubopha, ububanzi bomkhondo, ukuma kodonga oluseceleni kanye nobukhulu obuqediwe konke kuthinta ukulahleka komqhubi. Ukucacisa ithusi le-VLP noma le-HVLP kungaba usizo, kodwa umkhiqizo kanye nokwelashwa okuqondile kumele kutholakale ekwakhiweni okukhethiwe. Iphrojekthi kufanele ibukeze i-foil yethusi kanye nemiphumela yobuso obunemvamisa ephezulu kunokucabanga ukuthi yonke "ithusi eliphansi" lilingana.

Ngokushintshashintsha kanye nezingcezu ezisele

I-through-via ingakha i-stub ezwakalayo lapho isignali ishintsha izendlalelo ngaphambi kokufika ohlangothini olude. Ukudonsa emuva, ama-vias angaboni noma ukwabiwa kwezendlalelo kunganciphisa ubude obungasetshenziswanga. Indlela ekhethiwe kumele ibhekele ukubekezelelana kokubhoboza, ukubhaliswa kwezendlalelo, i-stub esele kanye nomklamo we-antipad. I-laminate elahlekelwa kakhulu ayikhanseli i-resonant via.

Izixhumi kanye ne-geometry yokuqalisa

Amamodeli esixhumi kufanele afake indawo yonyawo kanye nendlela yokubuyisa, hhayi ingxenye yomthengisi kuphela. Ama-antipad okuqalisa, ama-return vias, ukuguqulwa kwama-pad kanye nokusikwa kwendawo kungabusa. Ifektri ye-PCB ingalawula i-geometry ekhiqiziwe, kodwa umhlinzeki wesixhumi kanye nomklami wesistimu kumele banikeze imodeli kanye nethagethi.

I-oda lokubuyekezwa kwesabelomali sokulahlekelwa

  1. Susa ukungaqhubeki kwe-topology okungagwenywa.
  2. Qinisekisa amamodeli esixhumi kanye nephakheji.
  3. Lawula ngezinti kanye nezindlela zokubuya.
  4. Khetha iphrofayili yethusi kanye ne-stackup.
  5. Hlola ukulahlekelwa kwe-dielectric okusele okusatshalalisiwe.
  6. Khetha izinga lezinto ezibonakalayo elinomkhawulo wokukhiqiza.
Iqoqo lezinto ze-PCB ezingama-224G

Ukuguqula Isabelomali Sokulahlekelwa Sibe Uhlelo Lokuqoqa Nokwakha

Uma ukwabiwa kwesiteshi sekuvunyelwene, idatha yokwenziwa kumele iyilondoloze. I-stackup kufanele ibone ukwakheka okuqondile kwe-core kanye nokwangaphambi kwesikhathi, isikhala se-dielectric esiqediwe, iphrofayili yethusi, isabelo se-signal-layer kanye nezindiza zokubhekisela. Ithebula lokubhoboza kufanele lisho ngohlobo, usayizi oqediwe, uhlangothi lwe-backdrill, ukujula kwethagethi kanye ne-residual stub. Ithebula le-impedance kufanele lihlukanise i-geometry ngayinye ngeleya.

I-Highleap ibuyekeza ukuthi ngabe ukwakhiwa okuhlongozwayo kuyatholakala yini, ukuthi ubukhulu obucindezelwe bungabanjwa yini, ukuthi i-resin ingagcwalisa iphethini yethusi, nokuthi ngabe ukubekezelelana kokubhoboza/ukubhoboza emuva kungakhiqizwa yini. Uma kudingeka ukwakhiwa okunye, kubuyiselwa ukuze kuvunywe ngamakhasimende nge-geometry ye-impedance ebuyekeziwe. Ifektri akufanele ithathe indawo yento noma i-foil yethusi ngoba nje i-Dk eqanjwe ngegama ibukeka ifana.

Ukuluka nokusonta ngengilazi

Ama-pair ahlukene angahlangana nezindawo ezahlukene zengilazi/i-resin, okufaka isandla ekugobeni. I-engeli yomzila, isitayela sengilazi, ukusatshalaliswa kwe-resin kanye ne-geometry yama-pair konke kuthinta umphumela. Ukunciphisa okungcono kakhulu kungokwephrojekthi ethile. Umenzi angaqinisekisa ukwakhiwa kwengilazi okutholakalayo, kuyilapho ithimba lokuklama lilawula umzila kanye nokuzwela kwesiteshi.

Ukulawulwa kwe-impedance kanye nokubekezelelana

Ukubekezelelana okuqinile kwandisa izidingo zenqubo kanye nekhuphoni. Umdwebo kufanele usho ukuthi ukubekezelelana kusebenza yini kukhuphoni, umkhondo womkhiqizo noma kokubili, nokuthi iyiphi indlela yokuhlola eyamukelekayo. Amakhuphoni okuhlola kumele amele ungqimba lokukhiqiza, i-dielectric kanye nethusi. I-Impedance yodwa ayibonisi ukulahlekelwa okuphansi kokufakwa, ngakho-ke iphrojekthi ye-224G ingadinga kokubili i-TDR kanye nekhuphoni yesizinda semvamisa.

Ukuze uthole i-geometry iyonke, sebenzisa i -stackup ye-PCB esheshayo elungele ukukhiqizwa kunohlu lwezingqimba ezinengqondo. Ithusi eliqediwe, ukucindezela kwangaphambili, imaski yokwelula kanye nokuqeda kobuso kufanele kufakwe lapho kuthinta khona imodeli.

Ukuqinisekiswa kwe-Backdrill

Ukujula kwe-backdrill kungaqinisekiswa nge-microsection noma enye indlela evunyelwene ngayo. Inqubo yokwamukela kufanele isho i-stub eseleyo evunyelwe kanye nokuhlukaniswa kusuka kungqimba lokugcina oluxhunyiwe. Ithimba le-CAM le-Highleap liphinde lihlole ukuthi ububanzi be-backdrill bususa i-barrel eboshwe ngaphandle kokwephula ithusi eliseduze. Buyekeza inqubo ezinikele ye-backdrilling ngaphambi kokubeka ithagethi eseleyo engenakwenzeka.

Ukuhlukahluka kokukhiqiza kufanele kube yimodeli

Ububanzi be-etch, ubukhulu be-dielectric, ubukhulu bethusi, i-Dk, indawo yokubhoboza kanye nokujula kwe-backdrill kuyahlukahluka ngaphakathi kwamabanga alawulwayo. Ithimba lesiteshi kufanele lilingise lawo mabanga noma lichaze umkhawulo webhodi owanele. Umdwebo wamehlo ojwayelekile owenziwe nge-geometry efanele awukwazi ukuguqulwa ube isiqinisekiso sefektri. I-Highleap inganikeza idatha yebhodi elilinganisiwe; umnikazi wesistimu uyisebenzisa ekuhlaziyeni okuphelele kwesixhumanisi.

Indlela Yokufanisa Nokucaphuna I-PCB engu-224G

Iphrothokholi engu-224G kufanele iphendule imibuzo ethile. Ingabe ukwakhiwa okukhethiwe kungacindezelwa kube ugqinsi? Ingabe ukungasebenzi kahle kanye nokulahlekelwa kokufakwa kungaphakathi kwemikhawulo yekhuphoni evunyelwene ngayo? Ingabe i-stub esele iyalawulwa? Ingabe ibhodi lihlala lisicaba ngokwanele ukuhlanganiswa? Ingabe amasimu e-BGA kanye nesixhumi angakhiqizwa lapho kukhiqizwa? Iphrothokholi ebonisa kuphela ukuqhubeka kukagesi akuwona ubufakazi obanele bokukhululwa kwevolumu.

Izinto ezinconyiwe zokulethwa

  • ukuhlanganiswa okuvunyiwe kanye nokulandelela izinto/ithusi;
  • imiphumela yekhuphoni ye-impedance ye-geometry ngayinye ebalulekile;
  • ikhuphoni lokulahlekelwa kokufakwa noma i-S-parameter lapho kuchazwe khona;
  • ukubhoboza ngemuva noma ngobufakazi bokuhlukaniswa okuncane;
  • ukujiya okuqediwe, umnsalo/ukujika kanye nombiko wobukhulu obubucayi;
  • ukuhlanganisa isihloko sokuqala kanye nokuhlolwa kokusebenza noma kwesistimu lapho i-PCBA ifakiwe khona.

I-Highleap ingahlinzeka ngama-prototype ebhodi elingenalutho, ukukhiqizwa okuphansi kanye nokuhlanganiswa kwe-turnkey. Kumaphakheji athuthukile, ukubuyekezwa kokuhlanganiswa kufaka phakathi ukwakheka kwephedi le-BGA, i-stencil, ukuzwela komswakama, iphrofayili yokugeleza kabusha, ukuhlolwa kwe-X-ray kanye nemikhawulo yokusebenza kabusha. Izinto okufanele zicatshangelwe ngesivinini esikhulu kanye nobuqotho besignali kufanele zabelwane nethimba lokuhlanganisa lapho ukubekwa kwengxenye, ukufakwa kwesixhumi noma ukuvikela kuthinta khona isiteshi.

Isikhathi sokulethwa sincike ekutholakaleni okuqondile kwe-laminate nethusi, inani lezingqimba, i-lamination elandelanayo, i-backdrill, ukuhlolwa kanye nezingxenye zokuhlanganisa. Amashejuli okujika ngokushesha ayaqinisekiswa ngemuva kokuthi lokho okufakwayo kuhlolwe. Izingcaphuno zingafaka imigomo yokukhokha, izinketho zomhlaba wonke zokuthumela ngesivinini esikhulu noma zokuthutha, ukupakisha kanye nokulandelela ukuthunyelwa. Ngemva kokulethwa, amarekhodi ephrojekthi asekela ukubuyekezwa kokwehluleka noma isinyathelo sokulungisa uma kubikwe inkinga yebhodi noma yokuhlanganisa.

Umklamo wekhuphoni uyingxenye yomklamo we-PCB

Ikhuphoni lokufaka-ukulahlekelwa kufanele limele izinto zokukhiqiza, iphrofayili yethusi, ukwakhiwa kwesendlalelo kanye nokucutshungulwa. Umzila oqondile oqondile obekwe kwisitayela seglasi esihlukile noma esimweni sethusi kungenzeka ungahambisani nesiteshi somkhiqizo. Izinto ezixhunyiwe, ukuqaliswa kwe-probe kanye nezakhiwo zokulinganisa nakho kuthinta idatha elinganisiwe. Ikhasimende kufanele lichaze indlela noma livume ikhuphoni lomenzi ngaphambi kokufakwa kwamaphaneli.

I-Highleap ihlola ukuthi ikhuphoni lifanelana yini nephaneli yokukhiqiza nokuthi lidinga i-geometry yokuqalisa elawulwayo, i-backdrill noma ama-reference via. Indawo yekhuphoni ithinta ukusetshenziswa kwephaneli kanye nezindleko, ngakho-ke kufanele iphathwe njengento ephumelelayo engenziwa esikhundleni sokucabanga kamuva okungeziwe ku-rail.

Ukukhishwa komkhiqizo kudinga isilinganiso sezibalo

I-prototype eseduze nomkhawulo akuyona imiphumela eqinile yokukhiqiza. Ithimba lesistimu kufanele lihlole ukuhlukahluka okulindelekile kobukhulu be-dielectric, i-etch, ithusi, i-Dk kanye nobude be-stub. Inhloso yokwamukela kungadingeka ibe mfushane kunomkhawulo wokugcina wesistimu ukuze ukuhlukahluka kwebhodi, ukuhlanganiswa nezinye izingxenye kugcine umkhawulo. I-Highleap inganikeza ububanzi benqubo kanye nedatha yekhuphoni elilinganisiwe yalokhu kuhlaziywa.

Kuma-oda aphindaphindwayo, ukwakhiwa kwezinto ezivunyiwe kanye nethusi kufanele kuhlale kulawulwa. Uma umhlinzeki eshintsha isitayela sengilazi noma ukutholakala kwefoyili, i-stackup ebuyekeziwe kufanele iklanywe futhi ivunyelwe. Lo mthetho wokushintsha uyingxenye ebalulekile yokuqinisekiswa kwekhwalithi ye-224G.

Ukuthengwa kwezixhumi kanye nokuhlanganiswa kufanele kube seshejulini

Usuku lokujika okusheshayo kwebhodi elingenalutho aluqinisekisi i-prototype ephelele ye-224G. Izixhumi ezinesivinini esikhulu, amaphakheji amakhulu, amasokhethi, izihlangu kanye nezinto zokuhlola zingaba nezikhathi zokuhola ezinde kune-PCB. Uma i-Highleap inikeza ukuhlanganiswa kwe-turnkey, i-BOM ihlolwa ngokuhambisana nokutholakala kwezinto. Ezinye izingxenye azisetshenziswa ngaphandle kwemvume yamakhasimende.

I-Assembly DFM iphinde ibukeze ukuhambisana kwesixhumi, izidingo zokulingana kokucindezela, ukuphuma kwe-BGA, ukwesekwa kokugeleza kabusha kanye nokuhlolwa. Ukuhlolwa kwe-X-ray nokusebenza kungafakwa, kodwa isivivinyo kanye nemigomo yokwamukelwa kudingeka kutholakale. Ibhodi lesivinini esikhulu elingenalo uhlelo lokuhlanganisa nokuhlola olungokoqobo lingafika ngokushesha futhi lihlale lingasetshenziswa.

Indlela yokuqhathanisa okunikezwayo kokukhiqiza kwebhodi le-224G

Qhathanisa i-stackup eqondile, ithusi, izinto, umzila, i-residual stub, ukubekezelelana kwe-impedance, ikhuphoni yokufakwa-ukulahlekelwa, i-microsection kanye ne-assembly scope. Buza ukuthi ikhotheshini ifaka yini izinto ezikhethekile zokuhlola kanye nemibiko. Qinisekisa ukuthi umhlinzeki uphakamisa izinto ezikhona esitokweni noma ucabanga ukuthi ziyatholakala esikhathini esizayo. Intengo eshibhile ingachaza umkhiqizo ohlukile wobuchwepheshe.

Ikhotheshini ye-Highleap ikhomba izibikezelo zokwakha kanye nanoma yiziphi izinto ezidinga ukuqinisekiswa kwamakhasimende. Lokhu kusiza ukuthengwa kwempahla ukuhlola intengo, isikhathi sokuhola kanye nengozi yobuchwepheshe ndawonye, ​​okuwusizo kakhulu kunokubeka amafektri ezingeni ngezindleko zeyunithi eyodwa.

Lokho i-Highleap engakuqinisekisa futhi engenakukuqinisekisa

I-Highleap ingaqinisekisa izidingo zokwenziwa nokuhlanganiswa ezilinganiswayo futhi ezifakiwe kuncazelo yokuthenga evunyiwe, kuye ngokubekezelelana okuvunyelwene ngakho. Ifektri ayikwazi ukuqinisekisa isixhumanisi se-224G esisuka ekugcineni kuya ekugcineni esivela egameni le-laminate kuphela. I-silicon, iphakheji, isixhumi, i-firmware, ukulinganisa, izinga lokushisa kanye nokuhlelwa kwesistimu kuhlala kuyingxenye yokuthobela imithetho.

Lo mngcele awuyona imingcele yesevisi; uvikela ikhasimende esithembisweni esingasekelwa. Okufanelekile okulethwayo yi-PCB kanye ne-PCBA elandelekayo ehambisana ne-stackup evunyiwe, i-geometry, amakhuphoni okuhlola kanye nohlelo lokuhlola.

Izinga lokushisa kanye nesimo sokuhlanganiswa kumele kuhambisane nokubuyekezwa kwesiteshi

Ukulahlekelwa kwezinto ezibonakalayo kanye nomqhubi kuyashintsha ngezimo zokusebenza, futhi ukuziphatha kwesixhumi noma kwephakheji nakho kungashintsha ngokushisa. Uma umkhiqizo kumele usebenze kabanzi, ithimba lesistimu kufanele lichaze ukuthi ikhuphoni le-PCB liyamukelwa yini ekushiseni kwegumbi kuphela noma lisetshenziswa njengokufaka okukodwa kumodeli ebanzi yemvelo. I-Highleap inganikeza ubufakazi bezinga lebhodi ngaphansi kwendlela evunyelwene ngayo, kuyilapho ukufaneleka kwesistimu kuhlala kungumsebenzi ohlukile.

Isiteshi kufanele futhi siklanywe ngesimo saso esihlanganisiwe. Izixhumi ezihlanganisiwe, amaphakheji amakhulu, ama-heatsink kanye nezihlangu zingashintsha i-geometry yokuqalisa noma ukuthamba kwebhodi. Ukukhishwa kokukhiqiza okuqinisekisa ikhuphoni elingenalutho kuphela kungase kuphuthelwe izinkinga ezibangelwa ukuhlanganiswa. Lapho imodyuli ephelele ibalulekile, uhlelo lwesihloko sokuqala kufanele lufake izilinganiso ezihlanganisiwe noma ukuhlolwa kwesistimu.

Uhlelo lokuthola ulwazi oluhleliwe lunciphisa ubungozi beshejuli

Izikhathi zokuhola zezinto ezithuthukisiwe kanye nezixhumi zingase zingabi nasiqiniseko. Uhlelo olusebenzayo lungahlukanisa ukuqinisekiswa kwezinto zobunjiniyela, ikhuphoni yokuhlola ebhodini elingenalutho, iphrothokholi ehlanganisiwe kanye nokukhishwa kokukhiqiza. I-Highleap ingacaphuna isigaba ngasinye futhi ibone ukuthi yiziphi izindleko ezifika kanye. Lokhu kuvumela ukuthenga uku-oda izinto ezifika isikhathi eside ngaphandle kokukhipha ibhodi eligcwele elingaqinisekisiwe.

Ngokukhiqizwa kwezibikezelo, izinto ezivunyiwe kanye nethusi kungagcinwa noma kuhlelwe ngokwesidingo. Isivumelwano sezentengiselwano kufanele sichaze ukuthi izinto ezikhethekile ezingasetshenziswanga, ukubuyekezwa komklamo kanye nezinguquko zezibikezelo ziphathwa kanjani. Lokhu kuyingxenye yokuthenga okulula kwe-PCB ethuthukisiwe: imigomo ecacile ibaluleke kakhulu kunesithembiso esingacacile sesitoko esingenamkhawulo.

Inothi lobunjiniyela: Ukusetshenziswa kanye nezincazelo ze-224G kuyaqhubeka nokuguquka kuzo zonke izindawo zemvelo ezisebenzisanayo. Ikhasimende elilawulayo, umthengisi we-silicon noma idokhumenti yezindinganiso kumele ikhonjwe ku-RFQ; igama elithi “224G” lodwa aliyona incazelo yokwamukelwa.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB