Isidingo se-AI Server PCB ngo-2026

Ihadiwe yeseva ye-AI iyona enamandla amakhulu kakhulu aguqula imboni ye-PCB ngo-2026. Ushintsho aluveli kancane kancane - luwukunyakaza komsebenzi wesinyathelo ngesinyathelo enanini lokuqukethwe kwe-PCB, ibanga lezinto ezibonakalayo, inani lezendlalelo kanye nokuhlushwa kwabaphakeli. Ngokombiko kaMorgan Stanley womhla zingama-22 kuNhlaba 2026 we-BOM we-rack ezayo ye-Vera Rubin VR200 NVL72 ye-NVIDIA, inani lokuqukethwe kwe-PCB nge-rack ngalinye lenyuke ngo-233% isizukulwane-ngo-2020 - lisuka cishe ku-$35,100 ku-GB300 laya cishe ku-$116,700 ku-VR200 . Umbiko ofanayo ubonisa inani lokuqukethwe kwe-MLCC lenyuke ngo-182%, i-substrate ye-ABF inyuke ngo-82%, kanye ne-rack ephelele ye-ASP cishe ku- $7.8 million - cishe kabili kune-rack yamanje ye-GB300.

Lo mhlahlandlela udlula ezinguqukweni zobuchwepheshe kanye nezinto ezibonakalayo ngaphakathi kwepulatifomu yeRubin, uhlelo lomhlinzeki oluyakhayo, kanye nomthelela wokusabalala kokwabiwa kwezinto ze-PCB kubo bonke abanye. Umongo wamanani usekuhlaziyweni kokwenyuka kwentengo ye-PCB , ezomnotho zezinto ezibonakalayo eziyisisekelo kumhlahlandlela wezindleko zezinto ezibonakalayo ze-PCB , ukugxilisa ukuhlinzekwa ekuhlaziyweni kokuntuleka kwezinto ezibonakalayo ze-PCB , kanye nezimpendulo zokuklama nokuthengwa kumhlahlandlela wokunciphisa izindleko ze-PCB.

1. Inombolo Yesihloko: $35,100 → $116,700 nge-Rack ngayinye

Ukuhlukaniswa kwe-BOM kukaMorgan Stanley kwe-rack ye-NVIDIA Vera Rubin VR200 NVL72 engezansi — okwanyatheliswa ngumhlaziyi uHoward Kao ngoMeyi 22, 2026 — kwasungula izinombolo eziphambili zezomnotho ze-PCB zeseva ye-AI ngo-2026. Phakathi kwazo zonke izingxenye ezingezansi, inani lokuqukethwe kwe-PCB libonise ukwanda okukhulu konyaka nonyaka:

Njengoba ihunyushwe ngokwemigomo yemitha-skwele, ama-PCB anezingqimba eziningi ze-elekthronikhi ezijwayelekile ngo-2026 asebenza cishe ku- $204 ngemitha-skwele ngokusho kwedatha yokwehlukaniswa kwemboni nge-Reuters, kuyilapho amabhodi eseva ye-AI ephezulu efinyelela cishe ku- $1,970 ngemitha-skwele - asondele ku- 10 × izinga elijwayelekile . Umehluko uqhutshwa yizinto ezibonakalayo: inani lezingqimba, ibanga le-CCL, iphrofayili ye-copper-foil, ibanga lendwangu yengilazi kanye nokuphela kwendawo konke kusezingeni eliphezulu lezigaba zazo.

Kungani okuqukethwe kwe-AI server PCB kukhuphuka ngo-233% isizukulwane-ngo-isizukulwane->

Ngoba iRubin ihlanganisa imiphumela emibili. Okokuqala, izinhlobo ze-PCB ezikhona ziya ngokuya ziba zinkulu futhi ziyinkimbinkimbi — ibhodi lokubala likaRubin lithuthukisa kusuka ku-PCB ye-HDI enezingqimba ezingu-22 ku-GB300 kuya ebhodini elinezingqimba ezingu-26, kanye nokushintsha kwekhwalithi yezinto ezibonakalayo kusuka ku-M7 kuya ku-M8. Okwesibili, iRubin yethula amamojula amasha e-PCB angekho ku-GB300, kufaka phakathi i-Midplane PCB (amayunithi angu-18 nge-rack ngayinye ku-$1,500 ngayinye) kanye ne-ConnectX module PCB (amayunithi angu-72 nge-rack ngayinye ku-$270 ngayinye). Lezi zinhlobo ezimbili ezintsha zodwa zinikela cishe ku-$46,400 enanini lokuqukethwe kwe-PCB elengeziwe nge-rack ngayinye.

2. Kungani i-Rubin VR200 NVL72 ibiza u-$7.8 Million kwi-ODM

Ukuhlaziywa kukaMorgan Stanley kulinganisela i-rack ephelele ye-Rubin VR200 NVL72 cishe ku- $7.8 million evela ku-ODM , ngamanani aphezulu nakakhulu ngeziteshi ze-OEM ezifana ne-Lenovo, i-Asustek, i-Giga-Byte kanye ne-Dell. Lokhu kucishe kube kabili kune-rack ye-GB300 yamanje ngaphansi kwe-$4 million. Ukwenyuka kusekelwe kabanzi kulo lonke i-BOM:

• Inkumbulo iyisishayeli esikhulu kunazo zonke. Isabelo sememori sisuke ku-5-10% we-GB200 NVL72 BOM saya ku- 25-30% we-VR200 BOMIzindleko zememori eziphelele zenyuke zisuka cishe ku-$370,000 (GB300) zaya cishe ku-$2 million (VR200) ​​— ukwanda okungu-435% okubangelwa kokubili okuqukethwe okuphezulu kwe-HBM kanye nokuphindaphinda kwemakethe yememori eyisisekelo.
• Inani le-GPU silicon dollar likhuphuke ngo-57% — kusukela cishe ku-$2.52 million kuya cishe ku-$3.96 million nge-rack ngayinye — kodwa isabelo se-GPU se-BOM iyonke wawa kusukela cishe ku-65% kuya cishe ku-51% ngoba inkumbulo nezinye izingxenye zakhula ngokushesha.
• Okuqukethwe kwe-PCB kukhuphuke ngo-233% kusukela cishe ku-$35,100 kuya cishe ku-$116,700 nge-rack ngayinye, ngemuva kokubalwa kwezingqimba eziphakeme, amamaki e-CCL aphezulu, kanye namamojula e-PCB amasha ngokuphelele (i-Midplane, i-ConnectX) alethwe yi-Rubin.
• Okuqukethwe kwe-MLCC kukhule ngo-182% kusukela cishe ku-$1,530 kuya cishe ku-$4,320 nge-rack ngayinye. I-rack eyodwa ye-VR200 manje isebenzisa cishe Ama-capacitor e-ceramic angu-600,000 anezingqimba eziningi, ngaphezu kuka-30% ngaphezu kwesibalo se-GB300.
• Inani le-substrate le-ABF likhule ngo-82%, okubonisa indawo enkulu ye-substrate edingekayo kuma-Rubin GPU kanye nengcindezi efanayo yezindleko eqhutshwa yi-T-glass ethinta i-CCL.

3. Ilede Lebanga Le-CCL: M6 → M7 → M8 → M9 Ingilazi Ye-Q → M10

Isizathu sobuchwepheshe sokukhula kwezindleko ze-AI PCB ukunyuka kwezinga le-CCL. Isinyathelo ngasinye sishintsha i-resin chemistry, iphrofayili yethusi-foil kanye nezinga lengilazi-indwangu ngesikhathi esifanayo, siphindaphinda izindleko zezinto esikhundleni sokwengeza kukho. Ukuqhubekela phambili kusuka ku-H100 / GB200 kuya ku-Rubin Ultra kuhlanganisa ama-M-grade amahlanu cishe ezizukulwaneni ezintathu.

Ukwanda kwezindleko kuleli zinga kuyamangalisa. Ngokwemininingwane yemboni: I-M6 CCL isebenza cishe nge-3-5× ejwayelekile ye-FR-4; I-M7 isebenza nge-6-9×; I-M8 isebenza nge-10-15×; I-M9 Q-glass isebenza nge-15-20× . Ibanga le-M10 lesizukulwane esilandelayo elisesikhwameni samanje (Df <0.002) landisa izinga. NgoMashi 13, 2026, umhlaziyi uMing-Chi Kuo waqinisekisa ukuthi i-NVIDIA ibambisene ne -Wus Printed Circuit ukuhlola i-M10 CCL ukuze kutholakale isignali ye-448G+, ngamabhodi okuhlola asebenzisa i-foil yethusi yesizukulwane esilandelayo ye-HVLP5 kanye nendwangu yengilazi ye-Q.

Iyini i-Q-glass futhi kungani ibalulekile ku-AI->

I-Q-glass iyindwangu yefayibha yengilazi eyenziwe ngefayibha ye-quartz ehlanzekile kakhulu (~99.99% SiO₂). Ine-dielectric constant Dk engaba ngu-3.0 kanye ne-dissipation factor Df engaba ngu-0.0007 — zombili ziphansi kakhulu kune-NE-glass kanye ne-T-glass. Ngamazinga edatha angu-224G kanye no-448G, isabelomali sokulahlekelwa kwendlela yesignali yonke sincane kakhulu kangangokuthi ukulahlekelwa okusele okuvela ekungalingani kwengilazi kuba yinto elawulayo. I-Q-glass inciphisa lokhu kulahlekelwa ngokunciphisa i-bulk dielectric constant yokuqinisa ngokwayo. Abahlinzeki be-Q-glass abahamba phambili yiShin -Etsu, Asahi Kasei, Glotech, Feilihua, Taishan Fiberglass kanye neHong Ho.

4. Inani Lezendlalelo Ukwehla kwamandla emali: Kusukela ku-22 kuya ku-26 kuya ku-44 kuya ku-78 Izendlalelo

Inqubekela phambili ekubalweni kwezingqimba ze-PCB kwamabhodi ekhompyutha e-NVIDIA AI iye yashesha ezizukulwaneni ezintathu ezedlule:

• Ibhodi yokubala le-H100: ~Izendlalelo ezingu-22.
• Ibhodi yokubala le-GB300: Izendlalelo ezingu-22-34 kuye ngokuthi zicushwa kanjani.
• Ibhodi yokubala le-Rubin VR200: Izendlalelo ze-26 (ngokusho kokuhlukaniswa kweMorgan Stanley), kuthuthukiswe kusuka ku-GB300's 22-layer HDI.
• I-PCB ephakathi ye-Rubin VR200: ukufinyelela Izendlalelo ze-44 ukuze uthole iplani yokuxhumanisa esezingeni eliphezulu kakhulu erekhini.
• I-Rubin LPX: Cishe Izendlalelo ezingu-52 ku-M9 Q-glass.
• I-Rubin Ultra / Kyber: kulindelwe cishe cishe Izendlalelo ezingu-78+.

Isendlalelo ngasinye esifakwe kwi-PCB cishe sinyusa izindleko zokukhiqiza ngo-20-30% ngoba isendlalelo ngasinye sinezela umongo we-CCL, i-prepreg, umjikelezo we-lamination, ukubhoboza, i-plating kanye nengozi yokubhalisa. Ukuphinda kabili izendlalelo kusuka kwezingu-22 kuya kwezingu-44 kwenza izindleko ezingaphezu kokuphindwe kabili - kuyandisa ngenxa yokubalwa komjikelezo we-lamination ohlanganisayo, ubunzima be-hole-aspect-ratio, kanye nokwakheka kokubekezelela ukubhaliswa. Ngesikhathi umklamo ufinyelela izendlalelo ezingu-78 ku-Q-glass, isinyathelo ngasinye senqubo yokukhiqiza sisemngceleni walokho okusekelwa yimishini yamanje.

5. I-Midplane PCB kanye ne-ConnectX Module — Izinhlobo Ezimbili Ezintsha ze-PCB

URubin wethula izinhlobo ezimbili ze-PCB ezazingekho ku-GB300, futhi ngokwe-BOM kaMorgan Stanley, zodwa zinikela cishe ngo- $46,400 wenani lokuqukethwe kwe-PCB elisha nge-rack ngayinye :

• I-PCB yendiza ephakathi. Amayunithi ayi-18 nge-rack ngayinye ngentengo yamayunithi angaba ngu-$1,500. I-midplane iyi-PCB enkulu exhumanisayo ehlanganisa amabhodi okubala endwangu ye-NVLink ehlanganisiwe kuyo yonke i-rack ye-NVL72. Inani lezingqimba lifinyelela ku-44 nge-dielectric ye-Q-glass, okudinga i-foil yethusi ye-HVLP4 noma ye-HVLP5 ukuze igcine ubuqotho besiteshi se-224G phakathi nesikhathi eside. Abenzi be-substrate be-ABF ne-BT abakwazi ukwenza amabhodi abe makhulu kangaka; lena indawo ye-PCB.
• I-PCB yemojuli ye-ConnectX. Amayunithi angu-72 nge-rack ngayinye cishe ngentengo yamayunithi angu-$270. Imojula ngayinye ye-ConnectX-8 ibekwe njengekhadi lendodakazi ebhodini lokubala, inikeza ama-NIC enethiwekhi yezinga le-rack. I-ConnectX PCB ngokwayo iyibhodi elincane le-HDI elakhiwe ku-M7 noma ku-M8 CCL ene-foil ye-HVLP kanye nokulawula ukuvimba okuqinile.

Uhlobo ngalunye lwalezi zinhlobo ezintsha ze-PCB ludinga ibanga le-CCL eliyi-premium, iphrofayili ye-foil yethusi eliyi-premium, kanye nendwangu yengilazi ekhethekile — zonke izigaba esezinqunyelwe yiSigaba 7 ngezansi. Umphumela ohlangene ukuthi i-NVIDIA Rubin ikhulise kakhulu isidingo samazinga afanayo ezinto ezibonakalayo angavamile njengoba amakhasimende e-5G base-station, i-radar yezimoto, kanye ne-PCB yenethiwekhi ephezulu nawo athembele kuwo.

I-PCB entsha ephakathi incintisana kanjani ngezinto zokwakha nezinye izingxenye zemboni->

Incintisana ngqo. I-midplane isebenzisa indwangu efanayo yengilazi ye-Q enikezwa yi-Nittobo, Shin-Etsu no-Asahi Kasei edingwa yi-PCB yesizukulwane esilandelayo ye-5G millimeter-wave. I-foil yethusi ye-HVLP4/HVLP5 efanayo evela ku-Mitsui Kinzoku edingwa yi-radar namabhodi enethiwekhi asezingeni eliphezulu. I-M8/M9 CCL efanayo evela ku-Doosan, Panasonic, Resonac kanye no-Shengyi. Ukwabiwa kwe-Rubin kwe-NVIDIA kubamba umthamo wezinto eziholayo kuzo zonke izingqimba.

6. Izinto Okucatshangelwayo Ngokuthola Nokukhiqiza i-PCB

Izinhlelo zeseva ye-AI zibeka izidingo eziphakeme kakhulu ekuqineni kwesignali, ukulethwa kwamandla, ukubhaliswa kwezingqimba kanye nokulawulwa kwenqubo. Indlela efanele yokukhiqiza incike ekuqoqweni okuvunyelwe, isabelomali sokulahlekelwa yisiteshi, ithebula le-impedance, ngesakhiwo, ukusatshalaliswa kwethusi, ukuphakanyiswa kwe-BGA kanye nezidingo zokuhlola.

• Qinisekisa ukutholakala kwe-laminate elahlekelwa kancane kanye nemithetho yokushintsha evunyiwe ngaphambi kokukhishwa kokukhiqiza.
• Buyekeza imigomo yokuvimbela okulawulwayo, izidingo zobulukhuni kanye nesu lekhuphoni ngephakheji yokukhiqiza.
• Hlola ukugoba okulandelanayo, ama-via agcwalisiwe, ukubhoboza emuva kanye nokubhaliswa kwenani eliphezulu ngesikhathi se-DFM.
• Hlanganisa izidingo zokwenziwa, ukutholakala kwezingxenye kanye nokuhlanganiswa kwazo uma ibhodi linikezwa njenge-PCBA.

I-Highleap ingabuyekeza iphakheji yokukhiqiza yokukhiqiza i-PCB esheshayo ngaphambi kwekhotheshini, kufaka phakathi i-stackup, idatha ye-impedance, imidwebo kanye nokulindela kokuhlola. Amaphrojekthi anezidingo ezikhethekile zenqubo angahlolwa kokubili ukukhiqizwa kwe-prototype kanye nevolumu.

7. Indlela Isidingo Se-AI Esidonsa Ngayo Ukwabiwa Kwezinto Ezivela Kuwo Wonke Umuntu

Ukusabalala kwesidingo se-AI ngochungechunge lokuhlinzekwa kwezinto ezibonakalayo kuyindaba ebaluleke kakhulu ye-PCB ka-2026 kubathengi abangebona i-AI. Amakhasimende e-Hyperscale AI — akha ama-racks e-Rubin VR200 e-OpenAI, Google, Microsoft, Amazon, Oracle, Meta, xAI kanye nabanye opharetha abakhulu be-data-center — agcine kahle amandla amaningi atholakalayo kubo bonke abakhiqizi bezinto eziphambili:

• Mitsui Kinzoku MicroThin ucwecwe lwethusi — Ama-oda ka-2026 adlula umthamo ofakiwe kumkhiqizi ohamba phambili we-HVLP foil ye-premium.
• Indwangu yengilazi ye-Nittobo T kanye nengilazi ye-Q — ama-oda abuyele emuva ku-Q2 yonyaka olandelayo cishe ku-$100/kg.
• I-Panasonic Megtron 6/7, i-Doosan CCL ephezulu, i-MGC/Resonac CCL — idluliselwe ekuhlinzekweni okusekelwe ekwabiweni.
• I-Topoint / Ithuluzi Le-Union / Ama-micro-drill e-Zhongwu — ukusetshenziswa okungaphezu kuka-90%, ukuphakelwa akukwazi ukuhlangabezana nesidingo.
• I-Atotech / Uyemura plating chemistry — amandla e-ENIG aphezulu kanye nokufakwa kwe-electroplating anikezwe izinhlelo zeseva ye-AI ene-margin ephezulu.

Lokhu kusho ukuthi empeleni noma umthengi ongeyena owe-AI ezimisele ukukhokha amanani alingana no-2024 e-premium CCL noma i-HVLP foil, izinto azitholakali ngempela ngoba abathengi be-AI abaphezulu babeke ama-oda angaphambili athatha indawo yokuqala. Idatha ye-Korea Customs Service — amanani okungenisa e-CCL afinyelela ku- $20,728 ngethani ngoMashi 2026, akhuphuke ngo-74.5% unyaka nonyaka, okokuqala ngqa emlandweni ngaphezu kuka-$20,000/ithani — iyisibonakaliso esisodwa salokhu kulinganiswa kwesabelo.

8. Lokho Abathengi Abangebona Abathengi Be-AI Abakutholayo Manje

Ezimbonini ezingathengi ama-PCB eseva ye-AI kodwa zisebenzisa izinto ezifanayo eziyisisekelo, umjikelezo ka-2026 uveze imiphumela engathandeki esikhathini sokukhokha, amanani kanye nokutholakala kwezinto:

• Ama-OEM emishini yokuxhumana ngocingo kanye neyokuxhumana. Iziteshi zesisekelo ze-5G, amaswishi kanye nama-router kuncike ku-PPE-based mid-loss CCL (isigaba se-Megtron 6) — izinto ezifanayo ezisetshenziswa yimindeni ye-AI. Abaningi babhekene nezikhathi zokuhola zamasonto ayi-14-18 kanye nokwenyuka kwentengo okungu-20-40% ebangeni elifanayo abalithengile ngo-2024.
• Abahlinzeki bengqalasizinda ye-5G. Ukuvezwa kwe-PPE-resin ngqo kusuka emcimbini wokuphakelwa okuphezulu. Eminye imiklamo ihlelwe kabusha okwesikhashana ibe yi-stackups ebanzi noma esezingeni eliphezulu ukuze kugcinwe ukusebenza kwesiteshi ngezinto ezitholakalayo.
• Ama-elekthronikhi ezimoto (ikakhulukazi i-radar engu-77 GHz). Ama-PTFE/ama-hydrocarbon laminates akhethekile (i-laminate ephansi yokulahlekelwa okukhethekile/ikilasi le-laminate ephansi yokulahlekelwa okukhethekile) nawo abekelwe izinhlelo ze-hyperscaler high-frequency. Ukukhiqizwa kwe-radar yezimoto manje kuncike kumazinga afanele e-laminate noma ukwamukela izikhathi ezinde zokuhola.
• Ukulawulwa kwezimboni, amandla kanye nezinto zikagesi zabathengi. I-Standard FR-4 imunca isidingo esisusiwe esivela kubathengi bezinga eliphezulu; izikhathi zokuhola zisukela emavikini ama-2-3 kuya emavikini ayi-6-8. Ngisho nabathengi abavikelwe ngokuphelele ekuvezweni kwezinto zezinga le-AI babona umphumela wokusabalala.
• Ukuzivikela kwezindiza ze-RF / izindiza. Izinto ezikhethekile ze-PTFE ezikhethekile ze-laminate eziphansi zokulahlekelwa okukhethekile azibonakali ngqo kodwa izikhathi zokuhola ziye zanda njengoba i-laminate ekhethekile ene-low loss ekhethekile, i-Taconic ne-Arlon zabela amandla ezinhlelweni ze-hyperscaler eziphezulu.

Yini engenziwa yi-OEM engeyona i-AI ngo-2026->

Impendulo engokoqobo ihlanganisa izinyathelo ezine: (1) fanelekela ibanga lesibili le-CCL ngebhodi ngalinye ukuze kunikezwe umenzi wezinto indlela yokwabiwa; (2) khulisa izibikezelo zibe amasonto ayi-12-26 ukuze umenzi wezinto aqinisekise ukwabiwa kwe-CCL ngokumelene nesidingo sakho; (3) hlola imiklamo yokucacisa ngokweqile — i-M7 icacisiwe lapho i-M6 ifanela khona, i-HVLP icacisiwe lapho i-LP ifanela khona, i-ENIG icacisiwe lapho i-OSP ifanela khona; (4) sebenzisa ama-stackup ahlanganisiwe aphonsa i-CCL ye-premium ezingqimbeni ezingezona ezibalulekile. Lokhu kuhlanganiswe ngokuningiliziwe kumhlahlandlela wokunciphisa izindleko.

9. Imibuzo Evame Ukubuzwa Ngesidingo Se-AI Server PCB

Isidingo seseva ye-AI sikuthinta kanjani ukukhiqizwa kwe-PCB?

Isidingo samabhodi anenani eliphezulu, alawulwayo, angavimbela ukutholakala kwawo kungaqinisa ukutholakala kwama-laminate akhethiwe anokulahlekelwa okuncane, i-copper foil kanye nomthamo wenqubo. Umthelela uyahlukahluka kuye ngezinto ezivunyiwe, ubunzima be-stackup, ubuningi kanye nosuku lokulethwa oludingekayo.

Yiluphi ulwazi oludingekayo ukuze kucashunwe i-PCB yeseva ye-AI ngokunembile?

Nikeza idatha ye-Gerber noma ye-ODB++, i-stackup, ithebula le-impedance, umdwebo wokwenziwa, idatha yokubhoboza, ukujiya okuqediwe, ukuqeda kwendawo, ubuningi, izidingo zokuhlola kanye namafayela okuhlanganisa lapho kudingeka i-PCBA. Idatha ephelele ivumela ukubuyekezwa kobunjiniyela ngaphambi kokuba kwenziwe izinqumo zezinto nezinqubo.

Ingabe amabhodi ayinkimbinkimbi anesivinini esikhulu angakhiwa ngobuningi beprototype kanye nokukhiqiza?

Yebo. Indlela efanele yenqubo iyaqinisekiswa ngesikhathi sokubuyekezwa kobunjiniyela. Ukwakhiwa okuyinkimbinkimbi kungadinga ukuqinisekiswa kwezinto, i-lamination elandelanayo, i-impedance elawulwayo, ngokwelashwa, ukuhlolwa okukhethekile noma ukwakhiwa kokuhlola ngaphambi kokukhiqizwa kwevolumu.

Ithimba lokuklama linganciphisa kanjani ingozi yokuhlinzekwa kwe-PCB ethuthukisiwe?

Cacisa izinketho zezinto ezifanelekile lapho isabelomali sikagesi sivumela khona, khipha i-stackup kusenesikhathi, chaza izilawuli zokushintshana emdwebweni wokukhiqiza futhi uhilele umenzi ngaphambi kokuphothula umzila onobungozi obukhulu noma ngesakhiwo.

I-Highleap kufanele ibukeze nini ibhodi leseva ye-AI?

Ukubuyekezwa kuwusizo kakhulu ngaphambi kokuba umklamo ukhishwe ukuze kukhokhwe, ikakhulukazi uma ibhodi liqukethe iziteshi ezinesivinini esikhulu, umzila wokuphuma we-BGA oqinile, ama-laminate akhethekile, ukubhoboza emuva, izici ze-HDI noma izidingo eziqinile zokulandelela.