Izindleko Zezinto Zokusetshenziswa Kwe-PCB ngo-2026

I-PCB iyinqwaba yezinto ezihlukile, ngayinye eyenziwe ngumkhiqizi ohlukile okhethekile. Indaba yezindleko zango-2026 iwukuthi cishe zonke zazo ziphinde zathengiswa kabusha ngokusemthethweni ngumkhiqizi wazo oyinhloko - i-copper foil, i-copper-clad laminate, indwangu ye-glass fiber, izinhlelo ze-resin, igolide, isiliva, i-palladium, i-tungsten carbide, i-solder mask ink, i-photoresist kanye namakhemikhali enqubo - ngaphakathi kwefasitela lezinyanga eziyisithupha. Lo mhlahlandlela udlula kuzo zonke izinto zokufaka ngokulandelana ngezinombolo zangempela ezivela kubakhiqizi ababeka amanani, kanye nezilinganiso zezindleko ezibonisa ukuthi ngayinye inikela ini kwi-PCB eqediwe.

Umongo wamanani ezingeni lemakethe usekuhlaziyweni kokwenyuka kwentengo ye-PCB , imininingwane yochungechunge lokuhlinzekwa ekuhlaziyweni kokuntuleka kwezinto ze-PCB , isidingo esiqhutshwa yi-AI ekuhlaziyweni kwesidingo se-PCB seseva ye-AI , kanye nezimpendulo zokuklama nokuthengwa kumhlahlandlela wokunciphisa izindleko ze-PCB.

1. Uhlu Oluphelele Lwezinto Ezingaphakathi Kwe-PCB

I-stack yezindleko ngaphakathi kwe-PCB enezingqimba eziningi inezingqimba eziningi kunalokho okushiwo ukuhlukaniswa okuvamile. Ngokwedatha yemboni ye-TrendForce, i-laminate embozwe ngethusi yodwa iyingxenye eyinhloko yebhodi enezingqimba eziningi, futhi ngaphakathi kwe-CCL ngokwayo izindleko zibola cishe njenge- foil yethusi engu-42%, i-resin engu-26%, indwangu yefayibha yengilazi engu-19%, ibhalansi engu-~13% . Kodwa i-CCL ingenye yezinto eziningi ezifakiwe - i-PCB eqediwe idinga nokuqeda ubuso (ngokuvezwa kwayo kwensimbi eyigugu), ama-drill bits, i-solder mask, i-photoresist, i-plating chemistry kanye nezinto ezisetshenziswayo zenqubo.

Izinto zazibiza u-30-50% wezindleko zebhodi elingenalutho kuma-PCB anezingqimba eziningi. Ngo-2026, ngokuphindaphinda ngasikhathi sinye ku-foil yethusi, i-CCL, indwangu yengilazi, igolide kanye ne-tungsten carbide, isabelo sezinto sifinyelele ku- 45-60% kumabhodi athuthukile - izinga eliphakeme kakhulu eminyakeni engaphezu kweshumi. Isigaba ngasinye esingezansi sinendaba yaso yentengo.

2. I-Copper Foil: Ama-42% Aqhuba Konke Okunye

I-foil yethusi iyona efaka kakhulu ngaphakathi kwe-CCL (~42% nge-TrendForce). Ithusi lifakwe ngogesi, ngokuvamile ubukhulu obungu-9-70 μm, elenziwe emigqeni yokukhiqiza ezinikele yiqembu elincane labakhiqizi bomhlaba wonke. Ukwenyuka kwentengo ka-2026 kuvela ngqo kubakhiqizi:

• I-Mitsui Kinzoku (Mitsui Mining & Smelting / 三井金属) amakhasimende azisiwe ku- Mashi 12, 2026 ukuthi yonke imikhiqizo ye-MicroThin copper foil izokhuphuka Isebenza kusukela ngo-12% ngo-Ephreli 2026I-Mitsui iphethe ngaphezu kwama-90% emakethe ye-copper foil yesekethe ye-premium-grade, kufaka phakathi i-HVLP-class foil esetshenziswa kuma-PCB athuthukile kanye nama-IC substrates. NgoFebhuwari 2026, i-Mitsui yethulwa Ifoyili ye-3SAP-Ultra HVLP efinyelela amanani e-Rz ngaphansi kuka-0.5 μm kwe-foil engu-12 μm ubukhulu, eqondiswe kuzinhlelo zokusebenza ze-5G-Advanced kanye ne-AI compute substrate.
• I-Mitsubishi Gas Chemical (MGC / 三菱瓦斯化学) ukwanda okumenyezelwe kwe kuze kufinyelele 30% kuzo zonke izinhlobo zochungechunge lwemikhiqizo kufaka phakathi i-foil yethusi eboshwe nge-resin, i-CCL kanye namashidi okubopha, kusukela ngomhlaka-1 kuMbasa 2026.
• I-Furukawa Electric (古河電気) futhi I-JX Nippon Mining & Metals — bobabili abakhiqizi abakhulu be-HVLP4 — bakhuphule amanani 5-10% ku-Q4 2025 ngokulungiswa okuqhubekayo ngo-2026. Bobabili babekwe kanye noMitsui njengabaholi bomhlaba wonke be-HVLP4.
• I-Iljin Materials (일진머티리얼즈, South Korea) — umhlinzeki omkhulu we-HVLP kanye ne-RTF/VLP — ushintshe amanani ngendlela efanayo.
• I-Circle Foil (eLuxembourg), I-Fukuda Metal Foil kanye ne-Powder, I-Kingboard Chemical (i-foil ejwayelekile ehlanganiswe ngokuqondile), Ukuthuthukiswa kobuchwepheshe obusebenzisana (eTaiwan), Iqembu le-LCY (eTaiwan, eline-HVLP4/HVLP5 ngaphansi kuka-0.4 μm Rz), Futhi I-Jiangxi Copper (eShayina, i-HVLP5) ukugcwalisa isisekelo sokunikezwa komhlaba wonke.

Insimbi engaphansi ihambe kuqala. Ithusi le-LME lifinyelele irekhodi eliphezulu lika- $14,527.50/ithani ngoJanuwari 2026 , ngo-16.9% ngaphezu kokuvalwa kuka-2025, futhi lahlala ngaphezu kuka-$12,900/ithani kuze kube sekuqaleni kwekota yesibili ka-2026. Ngokusho kokuhlaziywa kwemboni, igebe lokuphakelwa kwamandla e-HVLP4 emhlabeni wonke lilinganiselwa kumakhilogremu angu-500,000-600,000 ngenyanga kusukela maphakathi no-2026 . Imakethe ye-MLB (ibhodi le-multilayer) ye-copper foil kulindeleke ukuthi ikhule kusukela cishe kumathani angu-15,000 ngo-2025 kuya kumathani angu-31,000 ngo-2028 kanye namathani angu-54,000 ngo-2030 , futhi ngokuhlaziywa kwemboni ama-oda ka-2026 asevele edlulile umthamo ofakiwe kubakhiqizi abaningana.

Amamaki aphezulu abalulekile ngenxa yomphumela wesikhumba. Emafrikhwensi aphezulu ugesi ugeleza ungqimba oluncane ebusweni bomqhubi, ngakho-ke i-foil erhabaxa yelula indlela yamanje esebenzayo futhi ikhuphule ukulahlekelwa kokumelana. Ukushintsha kusuka ku-foil ejwayelekile ye-ED (Rz ~ 7 μm) kuya ku-HVLP (Rz <2 μm) kuthuthukisa ukulahlekelwa kokufakwa cishe ngo- 5-8% ngaphezu kwe-10 GHz — ku-trace engamasentimitha ayi-10 lokhu kungaba yi-3 dB eqondile kumdwebo wamehlo. I-ASP ye-foil yesekethe ye-MLB ephezulu esetshenziswa kuseva ye-AI kanye nemishini yenethiwekhi isebenza ngaphezu kwe- 3 × ye-ASP ye-foil yethusi yebhethri kanye ne-foil ye-substrate yebhodi eliyinhloko elisetshenziswayo , kanye ne-foil ye-substrate yokupakisha ye-semiconductor enenani elingaphezu kwe- 10 × i-foil yethusi ejwayelekile esetshenziswayo.

I-foil yethusi ifinyelela kanjani ku-PCB quote->

I-foil yethusi igeleza ku-quote ye-PCB nge-CCL — eboshelwe enkabeni ye-dielectric ukuze yakhe ungqimba oluqhubayo lwazo zonke izingqimba ezimbili. Umenzi we-CCL uthenga i-foil ku-Mitsui, Furukawa, JX Nippon, Iljin noma abanye abahlinzeki, wakhe i-laminate, bese eyithengisela umenzi. Ukwenyuka kwe-Mitsui's 12% MicroThin kanye ne-MGC's 30% resin-coated foil kwandisa kokubili ukugeleza ngqo entengweni yokuthenga ye-CCL yomenzi ngaphambi kwanoma yikuphi ukubhoboza, ukuplasta noma ukuqeda.

3. Izinhlelo ze-Resin: i-Epoxy, i-PPE/PPO, i-BT, i-PTFE

I-resin yikhemikhali echaza ubuntu bukagesi nokushisa be-laminate. Ukukhetha i-resin kuhlukanisa i-FR-4 ejwayelekile ne-high-Tg FR-4, kuma-laminate aphakathi nokulahlekelwa, kuma-laminate aphansi nokulahlekelwa, ezintweni ze-RF/microwave. Umndeni ngamunye we-resin unohlu lwawo lwabakhiqizi:

Indaba enkulu kakhulu ye-resin ka-2026 isehlangothini lwe-PPE/PPO. I-PPE inikeza inhlanganisela yokulahlekelwa okuphansi kwe-dielectric, izinga lokushisa eliphakeme lokuguquka kwengilazi kanye nokuqina kobukhulu okudingwa ama-PCB avame kakhulu, futhi akukho okunye ukwakheka kwe-resin okufana nakho ngezindleko ezifanayo. Ukuphazamiseka kokukhiqiza emthonjeni omkhulu we-PPE womhlaba wonke ekuqaleni kuka-Ephreli 2026 kunciphisa kakhulu ukuphakelwa okusebenzayo, kanti ukubuyiselwa kulindeleke ezinyangeni eziyi-6-9. Ngenxa yokuthi abakhiqizi be-PPE abahlukile (u-Asahi Kasei, MGC, Romira) basebenza ngezinga elincane kakhulu, abakwazi ukudonsa igebe ngokushesha.

Ukusabalala kweminye imindeni ye-resin kukhulu. Abathengi be-laminate abasebenzisa i-PPE-mid-loss bashintshe ama-oda baye kuma-laminate e-epoxy ane-Tg ephezulu njengesinye sesikhashana, bemunca amandla e-epoxy avame ukukhonza i-FR-4 ejwayelekile. Izikhathi zokuhola ze-resin ye-epoxy ejwayelekile zisuke cishe emavikini ama-3 kuya kwayi-15. I-Shengquan Group (圣泉) , umhlinzeki omkhulu we-resin ye-epoxy yaseShayina embonini ye-CCL, ibilokhu izuza ngqo kulo mjikelezo njengoba abenzi be-CCL baseShayina bephendukela ekuhlinzekweni kwe-resin yendawo.

Iyini i-resin ye-PPE futhi kungani iyindaba ye-PCB ka-2026->

I-PPE (i-polyphenylene ether), ebizwa nangokuthi i-PPO (i-polyphenylene oxide), iyi-resin ye-thermoplastic esebenza kahle esetshenziswa njengomgogodla wama-laminate e-PCB aphakathi nokulahlekelwa kanye nokulahlekelwa okuncane okuhlanganisa i-Panasonic Megtron 6/7 kanye ne-Isola I-Speed. Kubalulekile kumabhodi asebenzisa i-5G, iseva ye-AI, i-radar yezimoto kanye nethrafikhi yenethiwekhi yesivinini esikhulu. Ukuphazamiseka kokukhiqiza emthonjeni omkhulu we-PPE womhlaba wonke ngo-Ephreli 2026 kunciphisa kakhulu ukunikezwa okusebenzayo, kungekho omunye umkhiqizi ohlukile ngesilinganiso esifanayo. Umphumela ube ukwabiwa kwama-laminate asekelwe ku-PPE kanye nokusabalala kokuqina kulo lonke uchungechunge lokuhlinzekwa kwe-resin.

4. Indwangu Yefayibha Yengilazi: I-E-Glass, I-NE-Glass, I-T-Glass, I-Q-Glass

Indwangu yefayibha yengilazi iwukuqiniswa ngaphakathi kwe-CCL ngayinye. I-E-glass ejwayelekile itholakala kabanzi; amazinga akhethekile adingwa yi-PCB yesivinini esiphezulu kanye ne-AI-server awadingeki. Ukuhlushwa kokunikezwa kukhulu kakhulu — I-Nittobo (Nitto Boseki / 日東紡, Tokyo Stock Exchange 3110) iphethe cishe u-90% wemakethe yomhlaba wonke ye-T-glass kanye no-60-70% we-NE-glass , ngokokuhlaziywa kwemboni ye-TrendForce. I-Nittobo futhi iyinkampani kuphela emhlabeni ekwazi ukukhiqiza i-T-glass yezinga eliphezulu ngokulinganisela.

Ngakho-ke izenzo zentengo zeNittobo zibeke umzila wengxenye yonke yengilazi ethambile:

• Agasti 2025: Ukwenyuka kwentengo cishe ngo-20% kulo lonke umugqa womkhiqizo wefayibha yengilazi.
• April 2026: Ukwanda okwengeziwe cishe ngo-20-30%.
• Ukutshalwa kwezimali kwamandla: Isiqalo cishe I-JPY 15 billion (~$96-102 million) Ukwandiswa kwamandla e-Fukushima 3× kumenyezelwe, kwandiswe kwafinyelela cishe esilinganisweni I-JPY 50 billion phakathi kuka-2026-2027 ukukhiqizwa kweJapan neTaiwan. Izakhiwo ezintsha kulindeleke ukuthi zitholakale ku-inthanethi kusukela ekupheleni kuka-2026, zibe nomthelela ogcwele ngo-2028.
• Ubambiswano lwe-Nan Ya (Nov 2025): I-Nan Ya Plastics (Formosa Plastics Group) izokhiqiza Ama-20% ezindwangu ezikhethekile ze-glass-fiber ezinikezwa yi-Nittobo emakethe yomhlaba wonke ngo-2027I-Nittobo izohlinzeka i-Nan Ya ngentambo yengilazi ehlala isikhathi eside yengilazi yesizukulwane sesibili ye-Nan Ya ephansi ye-Dk NER.
• I-Baotek (5340 TT / 健榮工業): Inkampani engaphansi kweNittobo yaseTaiwan okwamanje ikhiqiza ingilazi ye-NE esezingeni eliphezulu ngentambo yefayibha yengilazi enikezwa yiNittobo, enamandla okushisa angu-500.
• Ingilazi ye-T yesizukulwane esilandelayo (2028): I-Nittobo ihlela ingilazi ye-T ethuthukisiwe enokukhula kwe-coefficient of thermal okuthuthukisiwe cishe ngo-30% (kusukela ku-~2.8 ppm kuya ku-~2.0 ppm).

I-T-glass ikhuphuke yafinyelela cishe ku- $100 ngekhilogramu ngemithombo yemboni, kanti ama-oda abuyele emuva kwikota yesibili yonyaka olandelayo. Abakhiqizi bezindwangu zengilazi baseShayina abasebenzisa ubuchwepheshe be-elekthronikhi nabo bakhuphula amanani — ngokwemibiko yemboni, abenzi bezindwangu baseShayina bakhiphe ukwenyuka kwamanani okune okulandelanayo phakathi kuka-Okthoba noDisemba 2025 kanye noJanuwari noFebhuwari 2026 , kanye nokwenyuka okuhlanganisiwe kuka-2025 okungaphezu kuka-50% kanye nokubikezelwa kokwenyuka kwanyanga zonke okungu-10-15% okuqhubekayo ngo-2026.

Indaba yokuhlinzekwa kwala mabanga ibalulekile ngoba ukusayinda okusheshayo kudinga ingilazi ye-CTE ethambile, ephansi. Ngamazinga edatha angu-56G/112G/224G, iphethini yefayibha elukiwe ngokwayo iletha ukuphambuka kwesignali ("umphumela we-glass-weave") - amasiginali awela ama-fiber bundles abona i-Dk ehlukile esebenzayo kunezimpawu eziwela amaphakethe acebile nge-resin. Izibuko ezikhethekile zixazulula lokhu. Ingilazi ye-Q (eyenziwe ngefayibha ye-quartz emsulwa) iyaqhubeka ngokwehlisa i-dielectric constant ngokwayo, ivumela ukusebenza kwe-Df ~0.0007 okwenziwa yi-M9-class CCL.

5. Ukuqeda Okungaphezulu: Igolide, Isiliva, I-Palladium, Ithini, I-OSP

Ukuqedwa kobuso be-PCB kusekelwe ezinsimbini zangempela eziyigugu. Imakethe yezinsimbi eziyigugu zango-2026 ishintshe kakhulu - igolide elingenalutho lifinyelele phezulu kunawo wonke okungu- $5,595.42/oz ngoJanuwari 29, 2026 , lahweba cishe ngo- $4,327/oz maphakathi noJuni 2026 , futhi likhuphuke kakhulu ngaphezu kuka-$4,000/oz unyaka wonke. Unyaka nonyaka lokhu kungukukhuphuka okungu -56% kusukela ekuqaleni kuka-2024-2025 okungaba ngu-$2,600-$3,300/oz. I-JP Morgan Global Research ibikezela ukuthi igolide lifinyelela ku- $6,000/oz ekupheleni konyaka ka-2026 kanti kungenzeka kube ngu-$6,300/oz ngo-2027.

Ngenxa yokuthi igolide libiza cishe u-70% wezindleko zenqubo ye-ENIG (Electroless Nickel Immersion Gold) , umthelela wezindleko zebhodi elingenalutho uqondile:

• Izindleko zebhodi elingenalutho eliqediwe yi-ENIG zenyukile 5-30% kuye ngendawo yegolide yephaneli, kanye namaphaneli egolide elisindayo ekugcineni okuphezulu.
• Okwengeziwe cishe $40 ngemitha yesikwele emabhodini ajwayelekile anamacala amabili anesembozo segolide esindayo, okubangelwa ingxenye yegolide kuphela yesiphetho.

Abahlinzeki bekhemikhali abahamba phambili ekuqedeni izinto eziyigugu — i-Atotech (MKS Inc.) , i-Rohm kanye ne-Haas Electronic Materials (Dow) , i-Uyemura International , kanye ne -MacDermid Alpha (Element Solutions) — bonke bashintshe amanani ngokuhambisana nemakethe yezinsimbi eziyigugu eyisisekelo.

I-ENEPIG ithole isabelo ngaphezu kwe-ENIG kwezinye izinhlelo zokusebenza ngoba ungqimba lwesithiyo se-palladium luvumela ungqimba oluphezulu lwegolide oluncane, olunciphisa kancane ukuvezwa kwentengo yegolide ngenkathi luthuthukisa ukuthembeka kwe-wire-bond.

I-ENIG ikhuphuke kangakanani ngempela ngo-2026->

Igolide ngokwalo likhuphuke ngo-50-60% uma kuqhathaniswa nesisekelo sango-2024-2025. Ngenxa yokuthi igolide licishe libe ngu-70% wezindleko zenqubo ye-ENIG, izindleko zebhodi elingenalutho eliqediwe nge-ENIG ziphezulu ngo-5-30% kuye ngendawo yegolide yephaneli. Kumabhodi ajwayelekile anezinhlangothi ezimbili anegolide elisindayo, ingxenye yegolide yodwa ingeze cishe u-$40 ngemitha yesikwele ngaphezu kwesisekelo sango-2024. Kumaphaneli anegolide eliningi (iminwe yegolide, indawo enkulu yamaphedi), umthelela ufinyelela ekugcineni kwalolo hlu.

6. Ama-Tungsten Carbide Drill Bits kanye nama-PCB Tooling

Cishe yonke imishini yokubhoboza ye-PCB isebenzisa imishini yokubhoboza i-tungsten-carbide. Imakethe yomhlaba wonke ye-tungsten ifinyelele esimeni sokushintsha kwesakhiwo ngamanani afinyelela cishe amazinga ayisithupha angaphambilini . Abahlaziyi bemboni babikezela ukuthi amanani aphakathi kwe-tungsten carbide ka-2026-2030 aphakathi kuka- $450-$500 ngamakhilogremu ayi-10 - ushintsho lwesakhiwo oluvela emananini angaphambilini kunokuba kube ukwanda kwesikhashana.

Abakhiqizi abakhulu be-PCB drill:

• I-Topoint Technology (尖點科技, Taiwan) imemezele ukwenyuka kwayo kwesibili kwentengo ngo-2026 kwikota yokuqala ka-2026 kuphela, kusukela kuma-drill amhlophe ajwayelekile e-tungsten kuya emikhiqizweni esezingeni eliphezulu. I-Topoint isayine isivumelwano sokubambisana esinobuhlakani ne-Zhen Ding Technology ngoDisemba 2025 sokubhoboza iseva ye-AI kanye ne-IC substrate PCB. NgoMeyi 2026, i-Topoint yaphakamisa I-NT$600 million (~US$19.1 million) ngamabhondi aguqukayo, okuletha abenzi abakhulu be-PCB njengabatshalizimali ababalulekile. Isabelo sokuthengisa esingu-55% ngo-2026 kuma-drill ambozwe nge-coated ephezulu, ukusetshenziswa kwawo sekuvele kungaphezu kuka-90% kodwa kusakwazi ukuhlangabezana ngokugcwele nesidingo.
• Ithuluzi leNyunyana (ユニオンツール, Japan) — umholi wezobuchwepheshe bomhlaba wonke kuma-PCB micro-drills — ulungise amanani ahambisana nezindleko zezinto zokwakha ze-tungsten carbide.
• I-Zhongwu High-Tech (中钨高新, China, 000657.SZ) yethule umshini omusha wokubhoboza omncane ombozwe ngedayimane elincane owenzelwe ngqo Izingxenye ze-Q-glass zebanga le-M9Incwadi yoku-oda ibikwe njengebhukishwe ngokugcwele. Ukwandiswa kwamandla okubhoboza okuncane kwenkampani okungamayunithi ayizigidi eziyi-140 kufinyelele ekukhiqizweni okugcwele ngoMashi 2026, kanye nokwandiswa okwengeziwe kwamabhoboza amancane ayizigidi eziyi-130 okuqhubekayo, kanye namathuluzi okusika amancane amade kakhulu, anokunemba okuphezulu ayizigidi ezingama-63.
• I-DingTai High-Tech (301377.SZ), Amathuluzi e-Wold Diamond (688028.SH), Amathuluzi e-Hengfeng (300488.SZ), i-Huarui Precision, i-Xinrui Shares (688257.SH) — ukwanda kwamandla engeziwe emazingeni aphansi naphakathi emakethe.

Kuma-PCB e-AI server anezingqimba ezingu-44 kanye nezingqimba ezingu-78 anezingqimba ze-Q-glass, izindleko zokusebenzisa i-drill zisebenza amazinga endabuko aphindwe ka-5-8 . I-Q-glass ikakhulukazi inzima futhi ilukhuni kakhulu kune-E-glass ejwayelekile, idinga ama-micro-drill ambozwe nge-nano-diamond abiza ama-multiples avamile futhi anempilo emfushane ewusizo ngomphetho ngamunye. Kula mabhodi athuthukile, izinto zokusebenzisa i-drill ziyingxenye ebalulekile ye-bill yezinto zokwakha kunokuba yinto engemuva kwemvilophu.

Ingabe izingcezu zokubhoboza ziyindleko ye-PCB enengqondo ngempela ngo-2026->

Yebo — ikakhulukazi emabhodini athuthukile. Ebhodini elijwayelekile le-FR-4 elinezingqimba ezingu-4-8, izinto ezisetshenziswayo zokubhoboza ngokuvamile ziyi-2-4% yezindleko zamabhodi angenalutho. Ebhodini elinezingqimba ezingu-22 ezinezingqimba eziphezulu ze-Tg, izinto ezisetshenziswayo zokubhoboza zingaba ngu-5-8%. Ebhodini leseva le-AI le-Q-glass elinezingqimba ezingu-44, izinto ezisetshenziswayo zokubhoboza zisebenzisa amazinga ajwayelekile angu-5-8×, zifinyelela kalula amaphesenti ezinombolo ezimbili zezindleko zamabhodi angenalutho. UTopoint noZhongwu bobabili babika izincwadi zoku-oda ezigcwele futhi basebenzise ukulungiswa kwentengo okuningi ngo-2026.

7. Uyinki we-Solder Mask, i-Photoresist kanye nama-Process Chemical

Izinto zokwakha "ezingemuva" kulula ukuzikhohlwa ngoba zingaphakathi kwekhanda lomenzi. Zonke zishintshe ngendlela enenjongo ngo-2026.

Inki yemaski ye-Solder (i-LPSM, imaski yemaski ye-solder ekwazi ukuthwetshulwa ngoketshezi). Ngokwedatha yomkhakha we-QYResearch, imakethe yenki yemaski yemaski ye-solder yomhlaba wonke ibuswa inani elincane labakhiqizi - i-Taiyo Ink (太陽インキ製造) , i-Rongda Photosensitive Materials , i-Guangxin Materials , kanye ne -Resonac ndawonye babamba cishe u-72% wemakethe yomhlaba wonke kanye ne-Taiyo njengomholi ocacile. Inki yemaski ye-Solder isebenzisa ama-resin epoxy, ama-photoinitiators kanye nemibala - konke okufakwayo kubone ingcindezi yezindleko ngo-2026 - kanti i-Taiyo Ink ibilokhu yandisa amandla okukhiqiza emhlabeni jikelele, kufaka phakathi amamaski e-solder e-inkjet akhethekile ama-PCB athuthukile kanye nama-ink e-dielectric/conductive emakethe yelanga, ukukhanya kanye nezibonisi.

I-photoresist yefilimu eyomile. Isetshenziselwa ukwenza amaphethini ezici zesekethe ngesikhathi sokuthwebula izithombe zengqimba yangaphakathi. Ngokwedatha yemboni ye-QYResearch, abakhiqizi abayisithupha abaphezulu baphethe cishe u-67% wemakethe yomhlaba wonke ye-PCB dry-film photoresist : u-Asahi Kasei (旭化成, kanye nomugqa wefilimu eyomile we-SunFort™ okhiqizwa esitshalweni esikhulu kunazo zonke emhlabeni sokumboza ifilimu eyomile eSuzhou kanye neChangshu), i-Eternal Materials (長興材料), i-Resonac, i-Chang Chun Group (長春集團), i-Kolon Industries (코오롱인더스트리), i-Mitsubishi Paper Mills . Abadlali abengeziwe bafaka i- DuPont, i-Qnity, i-Hunan Chuyuan New Materials kanye ne-Hangzhou First Applied Material . I-Japan ibamba cishe u-55%+ wokukhiqizwa kwefilimu eyomile emhlabeni ; i-Asia-Pacific ibamba cishe u-73% wemakethe yomhlaba.

Amakhemikhali okucubungula kanye ne-chemistry yokubeka. Ukubeka i-PCB, ukuqopha kanye nokulungiswa kwendawo kuncike ekuhlinzekweni okuqhubekayo kwe-sulfuric acid ye-elekthronikhi, i-copper sulfate, i-ferric chloride, i-ammonium persulfate kanye nezinye izinhlobo zamakhemikhali. Abahlinzeki abakhulu bokwenza izinto - i- MacDermid Alpha (Element Solutions), i-Atotech (MKS Inc.), i-Uyemura International, i-Rohm kanye ne-Haas Electronic Materials (Dow) - bakha amakhemikhali okugeza azimele okufaka i-copper plating, i-nickel engena-electro, igolide/isiliva elicwilisiwe kanye nezinqubo ezifanayo. Amanani ashintshe ngezindleko zamakhemikhali okufaka, futhi imakethe ye-sulfuric acid yomhlaba wonke iqinisiwe, okunegalelo ekucindezelweni okuphezulu kwamanani e-chemistry ye-elekthronikhi kuze kube ngu-2026.

8. Intengo Yangempela Yebanga le-CCL kusukela ku-FR-4 kuya ku-M9

Konke okungenhla kugeleza emananini ebanga le-CCL — okuyilokho abakhiqizi abakuthengayo ngempela. Ukuqhubekela phambili kwezindleko phezulu kwelebhu ye-laminate akuqondile: isinyathelo ngasinye sishintsha i-resin chemistry, iphrofayili ye-foil kanye nohlobo lwengilazi ngesikhathi esifanayo, siphindaphinda izindleko kunokuba singeze kukho. Ngokokuhlaziywa kwe-Citi Research, isilinganiso sentengo yokuthengisa ye-CCL sisuke ku-RMB 150-160/ishidi ekupheleni kuka-2025 saya ku-RMB 180-190/ishidi maphakathi no-2026, kanye nesilinganiso sonyaka sika-2026 esibikezelwe ku-RMB 220/ishidi (+76% YoY) kanye nendawo yokuphela konyaka ku-RMB 240/ishidi.

Ngaphakathi kwebanga ngalinye, abakhiqizi abakhulu be-CCL bancintisana ngezindlela ezihlukile kancane. I-Kingboard, i-Shengyi, i-Iteq, i-EMC, i-TUC, i-Nan Ya, i-Doosan, i-Resonac, i-MGC kanye ne-Panasonic ngayinye inemigqa yomkhiqizo emazingeni ahlukahlukene ebanga. Ukukhetha okukhethekile komenzi kuncike ezidingweni zomklamo ze-Dk, Df, Tg, ukushisa kanye nokuthembeka kanye nokutholakala kwezinto.

Yisiphi isisekelo esibiza kakhulu kwi-PCB ngo-2026->

Kumabhodi edijithali, i-M9 Q-glass CCL esetshenziswa kumadizayini e-AI server midplane kanye ne-inference-rack, cishe ku-15-20× standard FR-4. Kumadizayini e-RF kanye namagagasi e-millimeter, ama-laminate e-laminate asekelwe ku-PTFE akhethekile aphansi okulahlekelwa yi- 5-20× FR-4 kuye ngebanga. Phakathi kokuqeda kobuso, i-hard gold electroplated finger plating iyona ebiza kakhulu endaweni ngayinye, kodwa ibanga le-laminate livame ukuba likhulu kakhulu ezintweni zokwakha zamabhodi edijithali.

9. Indlela I-Material Stack Ehlanganisa Ngayo Amanani Ngemitha Eyisikwele

Konke okungenhla kugeleza entengo ngemitha yesikwele amakhasimende ayibona esilinganisweni. Ngokwemibiko yemboni, kucashunwa idatha yokwehliswa kwentengo ye-Victory Giant nge-Reuters, ngo-2026:

• Ama-PCB ajwayelekile anezingqimba eziningi: Cishe $204 ngemitha yesikwele.
• Amabhodi eseva ye-AI ephezulu: Cishe $1,970 ngemitha yesikwele — cishe i-10 × izinga elijwayelekile.

Umehluko we-10× uqhutshwa yizinto ezibonakalayo: inani lezingqimba, ibanga le-CCL, iphrofayili ye-copper-foil, ibanga lendwangu yengilazi, ukuqeda kobuso kanye nokwakhiwa okuphindaphindwe ndawonye. Kwibhodi leseva ye-AI ku-M7+ CCL ene-HVLP4/HVLP5 foil, indwangu yengilazi ye-T, ukuqeda kwe-ENIG noma i-ENEPIG kanye nokwakhiwa kwezingqimba ezingu-22-44, yonke into yokufaka isezingeni eliphezulu lesigaba sayo.

Kungani ukwabiwa kwe-CCL kubaluleke kakhulu njengentengo ngo-2026->

Ngoba emakethe yesabelo-nokwabiwa, intengo engenalo ukwabiwa kwezinto eziqinisekisiwe iwukuqagela. Abenzi be-CCL abahlanganisa i-Kingboard, i-Shengyi, i-MGC, i-Resonac, i-EMC, i-TUC kanye ne-Doosan bonke bathuthele ekuhlinzekweni okusekelwe ekwabiweni ngo-2026, okusho ukuthi ikhasimende ngalinye lithola inani elichaziwe lanyanga zonke kanye nomugqa wama-oda amasha. Umenzi we-PCB ongenalo i-CCL egciniwe akanakuthembisa usuku lokulethwa - futhi ukucaphuna ezintweni ezingavikelekile kuyingozi kokubili ukushelela kwesheduli kanye nokuphindaphinda kwe-post-PO uma izinto kufanele zitholakale khona lapho.

10. Imibuzo Evame Ukubuzwa Ngezindleko Zezinto Zokusetshenziswa Kwe-PCB

Inani lezindleko ze-PCB liyimpahla eluhlaza ngo-2026

Kuma-PCB anezingqimba eziningi ngo-2026, izinto zokusetshenziswa zikhuphukele ku- 45-60% wezindleko zebhodi elingenalutho , zisuka ku-30-50% ngo-2024, ngoba i-copper foil, i-CCL, indwangu yefayibha yengilazi, igolide kanye ne-tungsten carbide konke kukhuphuke kakhulu ngesikhathi esisodwa. Amabhodi eseva ye-AI ku-M7+ CCL avame ukufika engxenyeni engenhla; amabhodi ajwayelekile e-FR-4 asondele ku-35-45%.

Iyini i-CCL futhi kungani ibusa indaba ye-PCB ka-2026

I-CCL (i-laminate embozwe ngethusi) iyi-dielectric eyinhloko ene-foil yethusi eboshiwe eyakha i-PCB ngayinye. Ngokwe-TrendForce, izindleko zayo zihlukaniswa cishe njenge-foil yethusi engu-42%, i-resin engu-26%, indwangu yefayibha yengilazi engu-19%. Njengoba i-Mitsui Kizoku ingu-+12% ku-foil ye-MicroThin, i-MGC ingu-+30% ku-foil embozwe nge-resin, i-Kingboard inyuke kane ngo-2026, i-Iteq ingu-+20-40%, kanye ne-Nittobo ingu-+20-30% kundwangu yengilazi ye-T, zonke izinto ezintathu ezinkulu ze-CCL zikhuphuke ngesikhathi esisodwa.

Kungani i-copper foil ikhuphuke ngo-12-30% ngo-2026

Intengo yethusi ye-LME eyisisekelo ifinyelele ku-$14,527/ton ngoJanuwari 2026 — okuyirekhodi eliphezulu kakhulu. I-Mitsui Kinzoku inyuse i-MicroThin foil ngo-12% kusukela ngo-Ephreli 2026; i-Mitsui Gas Chemical inyuse i-resin-coated foil ngo-30% kusukela ngo-Ephreli 1, 2026. I-Furukawa Electric kanye ne-JX Nippon Mining nazo zilungise ngo-5-10% kusukela ku-Q4 2025. Ama-foil akhethekile e-premium (HVLP, HVLP4, HVLP5) akhuphuke kakhulu ngoba amandla awo ancishisiwe ngokuzimela.

Iyini i-HVLP copper foil futhi ingabe iyakufanelekela izindleko zayo?

I-foil yethusi ye-HVLP (Hyper Very Low Profile) inobulukhuni obungaphansi kuka-2 μm Rz, uma kuqhathaniswa ne-~7-8 μm ye-foil ejwayelekile ye-ED. Ibiza cishe i-foil ejwayelekile engu-2-3× kodwa ithuthukisa ukulahlekelwa kokufakwa ngo-5-8% ngaphezu kwe-10 GHz — ngezinye izikhathi i-3 dB ku-trace engu-10-intshi. Ngokuvamile iyadingeka kusukela ku-25 Gbps+ futhi iyadingeka ku-56 Gbps kanye ne-112 Gbps. I-Mitsui Kinzoku iphethe okungaphezu kuka-90% kokuhlinzekwa kwefoil ye-premium-grade ; I-foil entsha ye-3SAP-Ultra HVLP kaMitsui eyasungulwa ngoFebhuwari 2026 ifinyelela i-Rz ngaphansi kuka-0.5 μm.

Iyini i-resin ye-PPE futhi kungani iyindaba ye-PCB ka-2026

I-PPE (i-polyphenylene ether), ebizwa nangokuthi i-PPO, ingumgogodla we-resin osebenza kahle kakhulu wama-laminate aphakathi nokulahlekelwa kanye nokulahlekelwa okuncane okuhlanganisa i-Panasonic Megtron kanye ne-Isola I-Speed. Ukuphazamiseka kokukhiqiza emthonjeni omkhulu we-PPE womhlaba wonke ngo-Ephreli 2026 kunciphisa kakhulu ukuphakelwa okusebenzayo, kungekho omunye umkhiqizi osezingeni elifanayo. Ukubuyiselwa kulindeleke ezinyangeni eziyi-6-9.

Kungani indwangu ye-T-glass fiber iyindaba yezindleko zika-2026

Ngenxa yokuthi iNittobo iphethe cishe u-90% wokuhlinzekwa kwengilazi ye-T emhlabeni jikelele , inyuse amanani ngo-20% ngo-Agasti 2025 kanye no-20-30% ngo-Ephreli 2026, kanye nokwandiswa kwamandla ayo (3× ngo-2028, utshalomali oluphelele oluyi-~¥50 billion ngo-2026-2027) alukhiqizi umkhiqizo kuze kube sekupheleni kuka-2026. Ingilazi ye-T ikhuphuke yafinyelela cishe ku-$100/kg ngama-oda asele emuva onyakeni olandelayo. Abenzi bezindwangu baseShayina bakhiphe ukwenyuka kwamanani okulandelanayo kane ngo-Okthoba/Disemba 2025 + Jan/Feb 2026, kanye nokwenyuka okuhlanganisiwe kuka-2025 okungaphezu kuka-50%.

Yikuphi okubiza kakhulu kwi-PCB ngo-2026

Kumabhodi edijithali: I-M9 Q-glass CCL esetshenziswa kumiklamo ye-AI server midplane, cishe i-15-20× standard FR-4. Kumagagasi e-RF nama-millimeter: Ama-laminate e-laminate asekelwe ku-PTFE akhethekile aphansi okulahlekelwa yi-laminate , i-5-20× FR-4. Ekuqedeni kwendawo ngeyunithi ngayinye: i-finger plating yegolide eqinile; yize i-laminate ibusa kakhulu kumabhodi edijithali.

I-ENIG ikhuphuke kangakanani ngempela ngo-2026

Igolide ngokwalo lenyuke lisuka cishe ku-$2,600/oz ngo-2024 laya esicongweni esingu-$5,595/oz ngoJanuwari 2026 (+56% YoY). Ngenxa yokuthi igolide licishe libe ngu-70% wezindleko zenqubo ye-ENIG, izindleko ze-ENIG ezingenalutho ziphezulu ngo-5-30% ngo-2026. Kumaphaneli anegolide eliningi, ingxenye yegolide yodwa ingeza cishe u-$40 ngemitha yesikwele ngaphezu kwesisekelo sika-2024.

Ingabe izindleko ze-PCB zibalulekile ngempela?

Yebo — ikakhulukazi emabhodini athuthukile. Amanani e-tungsten carbide azinza ngo-2026 ngo-50%+ ngaphezu kuka-2024, kanti abahlaziyi bemboni babikezela ukuthi isilinganiso sama- $450-$500 ngesilinganiso sama-10 kg kuya ku-2030 . I-Topoint Technology iqalise ukwenyuka kwamanani kabili ku-Q1 2026 kuphela ngokusetshenziswa okungaphezu kwama-90%. I-Zhongwu High-Tech yethule ama-drill e-nano-diamond ebanga le-M9 anenani eliphindaphindwayo lalawo avamile. Kuma-PCB e-Q-glass AI server anezingqimba ezingu-44, izindleko zokusebenzisa ama-drill zisebenzisa amazinga ajwayelekile angu-5-8×.

Ukuthengwa kwempahla kungakunciphisa kanjani ukuguquguquka kwentengo yezinto ezibonakalayo

Ukunyakaza okune kubaluleke kakhulu ngo-2026: (1) thumela isibikezelo esiqhubekayo samaviki angu-12-26 ukuze umenzi akwazi ukubhukha isabelo se-CCL; (2) ufanelekele ibanga lesibili le-CCL ngohlobo lwebhodi; (3) sebenzisa ama-stackup ahlanganisiwe aphonsa izinto ze-premium ezingqimbeni ezingezona ezibalulekile; (4) thuthela emananini anenkomba axhunywe ku-foil yethusi ecacile kanye nefomula yebanga le-CCL. Uma zihlanganisiwe, lezi ziguqula ama-shock entengo eqondile abe ububanzi obulawulwayo.