Ukuhlanganiswa kwe-BGA kanye ne-QFN Ngokuhlolwa kwe-X-Ray Kwamalunga E-Solder Afihliwe
Okuqukethwe
- Kungani i-BGA kanye ne-QFN Assemblies Zidinga Ukulawulwa Kwenqubo Okukhethekile?
- Yimiphi Imininingwane Yomklamo we-PCB Ebuyekezwayo ye-BGA kanye ne-QFN?
- Kukhethwa Kanjani I-Solder Paste kanye ne-Stencil Apertures?
- Izingxenye ze-BGA ne-QFN Zigcinwa Futhi Ziphinde Zigeleze Kanjani?
- Yini Engatholwa Ukuhlolwa Kwe-X-Ray?
- I-BGA kanye ne-QFN Assemblies Zihlolwa Kanjani Ngogesi?
- Yimiphi Imikhawulo Yokusebenza Kabusha ye-BGA kanye ne-QFN?
- Cela Amanani Okuhlanganisa e-BGA kanye ne-QFN
- Imibuzo Yokuhlola i-BGA, QFN kanye ne-X-Ray
Ukuhlanganiswa kwe-BGA ne-QFN ngokuhlolwa kwe-X-ray kuyadingeka ngoba amalunga abalulekile e-solder afihliwe ngaphansi kwengxenye ngemva kokugeleza kabusha. Ukuhlanganiswa okuphumelelayo kuncike ebuhlotsheni obuphakathi kwephakheji eqondile, iphethini yomhlaba we-PCB, ngesakhiwo, idiphozithi ye-solder, isimo somswakama, indawo, ukwesekwa kwebhodi, iphrofayili yokushisa kanye nohlelo lokuhlola. Ukuze kukhiqizwe futhi kuhlolwe i-BGA ngendlela ethambile , uhlelo lokuhlola kufanele luvumelane nomklamo wephedi, inqubo yokunamathisela kanye nenqubo yokwamukela amalunga e-solder afihliwe.
I-Highleap Electronics ibuyekeza i-BGA, i-micro-BGA, i-QFN, i-LGA, i-CSP kanye namadivayisi afanayo aqediwe phansi njengengxenye yokuhlanganiswa okuphelele kwe-PCB. Ukumbozwa kwamandla nokuhlolwa kuqinisekiswa ngemuva kokubuyekeza iphakheji nebhodi. I-X-ray isetshenziselwa ukuphendula imibuzo echaziwe; ayithathi indawo yomklamo ofanele, ukulawula inqubo noma ukuhlolwa kukagesi.
Ukuze uthole ikhotheshini, thumela amafayela e-PCB, i-BOM kanye nobuningi. I-Highleap ingahlonza izingxenye ze-BGA kanye ne-QFN ezivela ku-BOM. Yisho noma yimuphi umbiko we-X-ray odingekayo, izinga lomsebenzi noma umkhawulo wokuthembeka uma kwaziwa; ngaphandle kwalokho uhlelo lokuhlola olusebenzayo lungaphakanyiswa ngesikhathi sokubuyekezwa.
1. Kungani i-BGA kanye ne-QFN Assemblies Zidinga Ukulawulwa Kwenqubo Okukhethekile?
Amajoyinti e-solder e-BGA kanye ne-QFN awakwazi ukuhlolwa ngezindlela ezijwayelekile ezibonakalayo ngemva kokuhlanganiswa. I-Package warpage, ukwakhiwa kwe-via-in-pad, ivolumu ye-solder ye-thermal-pad, ukuvezwa komswakama kanye nokusatshalaliswa kwethusi ebhodini kungadala amaphutha ngisho nalapho ukubekwa kubonakala kulungile. I-Highleap ibuyekeza uhlelo oluphelele lwamajoyinti esikhundleni sokufaneleka umsebenzi nge-ball pitch yodwa.
| Isici sephakheji | Ukukhathazeka okuyinhloko ngokukhiqiza | Ukulawula okuhlobene |
|---|---|---|
| I-BGA ball array | Ukuqondanisa okufihliwe, amabhuloho, ukuvuleka kanye nokusebenzisana kwe-warpage. | Indawo/ngokubuyekezwa, indawo, iphrofayili kanye ne-X-ray. |
| I-Fine-pitch BGA/CSP | Amalunga amancane kanye nesikhala esincishisiwe. | I-stencil/unamathisele, ukwesekwa kwebhodi kanye nokuhlolwa okunekhwalithi ephezulu. |
| Amalunga omjikelezo we-QFN/LGA | Amalunga afihliwe noma abonakala kancane anesimo sokuma esiphansi. | Ukubuyekezwa kwephedi/imaski, ibhalansi yokunamathisela kanye ne-X-ray. |
| Iphedi enkulu yokushisa | I-solder eyengeziwe, i-float yengxenye kanye nephethini engenalutho. | I-aperture ehlukaniswe ngezigaba, iphrofayili kanye nemibandela yokwamukelwa. |
| Ibhodi elincane noma iphakethe elikhulu | Iphakheji kanye ne-PCB warpage ngesikhathi sokugeleza kabusha. | Ukusekelwa kwephaneli, ibhalansi yethusi kanye nendlela yokushisa. |
Amakhasimende angabuyekeza iphakethe le-BGA kanye nokucatshangelwa kokuhlanganiswa kanye nomehluko we-BGA uma kuqhathaniswa ne-QFN , kodwa isinqumo sokukhiqiza se-Highleap sisekelwe enombolweni yengxenye yomkhiqizi kanye nedatha ye-PCB.
2. Yimiphi Imininingwane Yomklamo we-PCB Ebuyekezwayo ye-BGA kanye ne-QFN?
Ubukhulu bendawo, incazelo ye-solder-mask, i-feniut, i-via-in-pad, ibhalansi yethusi, ukuqeda kobuso, ukujiya kwebhodi kanye nokusekelwa kwendawo kuthinta ukwakheka kwe-solder. I-Highleap ihlola ukuthi idatha ye-PCB kanye nomdwebo wephakheji kuyahambisana yini nokuthi iphaneli ingaphrintwa, ibekwe, igelezwe kabusha futhi i-X-ray iphumelele yini.
- Qinisekisa usayizi wephedi, ubudlelwano bephimbo kanye ne-solder-mask.
- Buyekeza i-dog-bone noma i-via-in-pad fanout nokuthi ama-via agcwalisiwe/avaliwe njengoba kudingeka.
- Hlola ukuvulwa kwephedi yokushisa ye-QFN kanye nephethini.
- Buyekeza ukuhlushwa kwethusi lendawo kanye nobunzima bokushisa obulindelekile.
- Qinisekisa ukuthi i-fiducials, ukwesekwa kwebhodi kanye nokuba yisicaba kwephaneli nxazonke kwedivayisi.
- Thola izivikelo, izixhumi noma izingxenye eziseduze ezingase zivimbele ukubuka kwe-X-ray.
Ukubuyekezwa kwe-PCB DFM okugxile kumaphakheji ahlanganisiwe afihliwe kufanele kuhlonze ingozi eqondile yokuklama kanye nesenzo esingaba khona. I-Highleap ayidingi ukuthi umthengi athumele iphakheji yobuchwepheshe ehlukile ngale kwamafayela ebhodi ajwayelekile kanye ne-BOM ngaphandle kokuthi kusebenza ukwethembeka okukhethekile noma isimo sokwamukelwa.
3. Kukhethwa Kanjani I-Solder Paste kanye Nezimbobo Ze-Stencil?
Idiphozithi ye-solder kumele isekele kokubili iphakheji eqediwe phansi kanye nezingxenye ezizungezile. Kuma-thermal pad e-QFN, ukuvulwa okukodwa okukhulu kungabeka i-paste eningi kakhulu futhi kwandise ukuntanta noma ukugoba. Ku-BGA noma i-CSP ene-fine-pitch, ukuqina kwediphozithi kanye nokusekelwa kwebhodi kuba yinto ebalulekile.
| Isicelo | Ukucatshangelwa kwe-stencil | Inhloso |
|---|---|---|
| I-BGA enamabhola ajwayelekile | Ukusekelwa kokudlulisa nokunamathisela okuzinzile. | Ukwakheka okuhlangene okuhambisanayo ngaphandle kwamabhuloho noma ukusonta okunganele. |
| I-Fine-pitch BGA/CSP | Isilinganiso sendawo, ukukhululwa kwembobo kanye nokuqina kokuphrinta. | Nciphisa ukwehluka kwediphozithi ezicini ezincane. |
| Iphedi yokushisa ye-QFN | Ukuvulwa kwefasitela okuhlukaniswe ngezigaba/okunefasitela. | Lawula ivolumu iyonke futhi unikeze izindlela zokukhipha igesi. |
| Ibhodi lephakheji elixubile | Ukuguqulwa kwembobo yendawo noma i-stencil yesinyathelo. | Linganisa izidingo ezincane nezinkulu zomthamo we-solder. |
| Nge-in-pad | Ngesu lokwelapha kanye nokuvula. | Vimbela ukulahleka kwe-solder kanye nokungahambisani kwamalunga. |
I-Highleap ingasebenzisa ukuhlela ukuvuleka kwe-stencil ye-SMT kanye nokuhlolwa kwevolumu yokunamathisela kwamadiphozithi e-BGA ne-QFN lapho ingozi yephakheji kanye nevolumu kuvumela ukulinganiswa. Lezi zilawuli kufanele zifaniswe nebhodi kunokuba zinikezwe njengemigomo yokumaketha.
4. Izingxenye ze-BGA ne-QFN Zigcinwa Futhi Ziphinde Zigeleze Kanjani?
Amaphakheji azwela umswakama angonakaliswa yisitoreji esingalawulwa noma ukuvezwa okushisa okuphindaphindiwe. I-Highleap ibuyekeza isimo sokupakisha, ukuzwela komswakama, isimo sempilo yephansi kanye nanoma yisiphi isidingo sokubhaka okulawulwayo. Izingxenye ezinikezwa amakhasimende kufanele zifike zifakwe emaphaketheni abonakalayo, ahambisana nomshini futhi zinobude obanele bokusetha.
Ukugeleza kabusha kumele kusekele i-paste alloy, imikhawulo yezingxenye, isisindo sokushisa kwebhodi kanye nokuziphatha kwe-warpage. Iphrofayili yokugoqa kabusha elawulwayo ibheka i-ramp, ukucwilisa, isikhathi esingaphezu koketshezi, ukuphakama kanye nokupholisa kunokuthembela enombolweni eyodwa yokushisa kuphela.
- Qinisekisa iphakheji eqondile kanye nesimo somswakama ngaphambi kokusetha.
- Gcina futhi uphathe izingxenye ngaphansi kwezilawuli ezivunyelwene ngazo.
- Phrinta bese uhlola idiphozithi ye-solder njengoba kudingeka.
- Beka usebenzisa idatha yephakheji eqinisekisiwe kanye nokulungiswa kwebhodi.
- Phinda ugeleze ngephrofayili emele kanye nokusekelwa kwephaneli okuzinzile.
- Hlola amayunithi okuqala amele ngaphambi kokukhipha inani eliphelele.
Lapho inhlanganisela yephakheji noma ibhodi inengozi engavamile, i-Highleap ingancoma isivivinyo sokuqala, ukuhlolwa okwengeziwe noma umkhawulo ovunyelwe yikhasimende ngaphambi kokufaka amanani okuphinda ukukhiqiza.
5. Yini Engatholwa Ukuhlolwa Kwe-X-Ray?
Ukuhlanganiswa kwe-PCB okuhlolwe nge-X-ray kungaveza izici ezifihliwe ze-solder ezingabonakali kusukela emaphethelweni engxenye. Kuye ngemishini kanye ne-geometry yephakheji, i-X-ray ingabonisa ukuqondana, amabhuloho e-solder, amalunga angekho noma angajwayelekile, ukuvuleka okuphelele, ukusatshalaliswa kwe-void kanye nokuvumelana kwe-solder-ball. Ayikwazi ngokwayo ukufakazela ukuqhubeka kukagesi, amandla e-metallurgical noma ukuthembeka kwesikhathi eside.
| Umbuzo we-X-ray | Ukubonwa okungenzeka | Ubufakazi obengeziwe obungadingeka |
|---|---|---|
| Ingabe iphakheji iqondile? | Iphethini yebhola/iphedi kanye nezinkomba zesikhundla sephakeji. | Amarekhodi okubekwa kwesihloko sokuqala. |
| Ingabe kukhona amabhuloho afihliwe? | Izindawo ezihlanganisiwe ze-solder phakathi kwamalunga aseduze. | Ukuhlolwa okufushane kukagesi kanye nokubuyekezwa kwenqubo. |
| Ingabe amalunga awatholakali noma awavamile? | Izici ze-solder eziphansi, ezingajwayelekile noma ezingekho. | Ukuhlolwa kukagesi, ukuhlaziywa kwesigaba noma ukwehluleka uma kudingeka. |
| Ingabe ukuvala i-QFN kuyalawulwa? | Indawo engenalutho kanye nokusatshalaliswa okulinganiselwe. | Indlela yokwamukela echazwe yikhasimende kanye nomongo wokushisa/wokuthembeka. |
| Ingabe wonke amalungu athembekile? | I-X-ray ayikwazi ukuphendula lokhu ngqo. | Ukuqinisekiswa kwenqubo, ubufakazi bokuhlola nokuthembeka. |
I-Highleap ingahlinzeka ngezinsizakalo zokuhlola i-PCB X-ray ngokumbozwa okuchazwe kusilinganiso. Ikhasimende kufanele licacise noma iyiphi imfuneko yokwamukelwa ngokusemthethweni; ngaphandle kwalokho i-Highleap ingancoma i-athikili yokuqala, isampula noma ukuhlolwa okubanzi ngokusekelwe engcupheni yephakheji.
6. I-BGA kanye ne-QFN Assemblies Zihlolwa Kanjani Ngogesi?
Ngenxa yokuthi i-X-ray inemikhawulo, ukuhlolwa okufihliwe kufanele kuhlanganiswe nobufakazi bukagesi noma obusebenzayo. I-flying probe noma i-ICT ingase ithole ukuvuleka kanye nokufushane lapho kukhona ukufinyelela kokuhlola. Ukuhlolwa okusebenzayo kuqinisekisa ukuthi ibhodi lisebenza ngamasekethe afanele kanye ne-firmware.
I-SPI, ukuqinisekiswa kwendawo, iphrofayili kanye ne-X-ray.
Ukuqhubeka, ukuhlukaniswa, i-flying probe noma i-ICT ngaphakathi kwesembozo esitholakalayo.
Amandla, ukuxhumana kanye nokusebenza okuqondene nohlelo lokusebenza.
Xhumanisa iyunithi noma inqwaba yezinto zokwakha, inqubo kanye nemiphumela yokuhlola uma kudingeka.
I-Highleap ingahlanganisa ukuhlolwa kokusebenza kwe-PCB kanye nezindlela zokuhlola zikagesi ze-PCB nokuhlanganiswa kwe-BGA/QFN. Izinga lokuhlola kufanele libonise ubungozi bomkhiqizo kanye nomthamo; akuwona wonke amaphrojekthi adinga ukwakheka okuzinikele endaweni yokuqala yeprototype.
Ukuhlolwa kukagesi kufanele kukhethwe ngokuya ngokutholakala okutholakalayo kanye nengozi yomkhiqizo. I-Highleap ingaqala ngokuqhubeka okuyisisekelo noma ukuhlolwa kokusebenza kwesayithi kusenesikhathi bese yethula ukumbozwa okuzinikele kwe-ICT noma okusekelwe kuzinto zokwakha lapho umklamo kanye nenani lokukhiqiza likuvumela.
7. Yimiphi Imikhawulo Yokusebenza Kabusha ye-BGA kanye ne-QFN?
Ukulungiswa kabusha kwe-BGA kanye ne-QFN kwethula omunye umjikelezo wokushisa kanye nokushisa kwendawo engxenyeni kanye ne-PCB. Ngaphambi kokukhiqiza, ikhasimende kanye ne-Highleap kufanele bavumelane ukuthi ukulungiswa kabusha kuvunyelwe yini, ukuthi kuvunyelwe imizamo emingaki, ukuthi yikuphi ukuhlolwa okulandelayo nokuthi ibhodi kumele lenqatshwe nini.
| Isinqumo sokusebenza kabusha | Izinto okufanele zicatshangelwe | Ukulandelela okudingekayo |
|---|---|---|
| Ukulungiswa komphetho wendawo/we-QFN | Ukufinyeleleka okuhlangene kanye nokwamukelwa komsebenzi. | Ukubuyekezwa okubonakalayo noma kwe-X-ray kanye nokuhlolwa kabusha kukagesi. |
| Ukufakwa esikhundleni kwe-QFN | Isimo sephedi, ukuhlanzwa kwephedi yokushisa kanye nokuzwela kwebhodi. | Iphrofayili elawulwayo, i-X-ray kanye nokuhlolwa kabusha kokusebenza okugcwele. |
| Ukufakwa esikhundleni kwe-BGA | Isimo sephakheji, ubuqotho bephedi, i-warpage kanye nomlando wokushisa wangaphambilini. | Inqubo yobuchwepheshe yokulungisa kabusha, i-X-ray kanye nokuhlolwa kabusha kukagesi/okusebenzayo. |
| Ukwehluleka okuphindaphindiwe | Ingozi yokulimala kwephedi noma imbangela yomklamo/inqubo engaxazululiwe. | Yeka ukuphinda usebenze futhi wenze ukulungiswa kobunjiniyela. |
I-Highleap ingabuyekeza ukuvuselelwa kwe-BGA kanye nokufakwa esikhundleni kanye nezingozi ze-BGA solder-joint . Ukuvuselelwa kufanele kubonakale kurekhodi lokukhiqiza lapho ikhasimende lidinga umlando wezinga leyunithi.
8. Cela Amanani Omhlangano we-BGA kanye ne-QFN
Thumela amafayela e-PCB, i-BOM kanye nobuningi. I-Highleap ingahlonza amaphakheji aqediwe phansi bese ibuyisela noma yimiphi imibuzo eqondene nephakheji. Engeza imikhawulo yakho ye-X-ray, yokuhlola noma yokulungisa uma ikhona; ngaphandle kwalokho ikhotheshini ingaphakamisa ububanzi obusebenzayo obuzenzakalelayo.
Impendulo kufanele ichaze ukutholakala kwempahla, ukuqagela kwe-stencil, ukuphathwa komswakama, ukulawulwa kwesihloko sokuqala, ukugeleza kabusha, ukumbozwa kwe-X-ray, imingcele yokuhlola kanye nokusebenza kabusha. Amandla ahlala encike ekwakhiweni kwephakheji kanye nebhodi ngqo.
Sebenzisa ifomu lesilinganiso se-BGA kanye ne-QFN PCB ukuze uqale. I-Highleap ingacaphuna ama-prototypes, i-NPI, i-pilot futhi iphinda ukukhiqizwa ngohlelo olufanayo lokukhiqiza oluqondene nephakheji.
I-Highleap ingacacisa nokuthi izithombe ze-X-ray, imiphumela efingqiwe noma imibiko yokungafani ifakiwe yini. Lokhu kuvimbela ikhasimende ukuthi licabange ukuthi inqubo ye-X-ray ejwayelekile ifaka ngokuzenzakalelayo umbiko osemthethweni wawo wonke amadivayisi.
9. Imibuzo Yokuhlola i-BGA, i-QFN kanye ne-X-Ray
Ingabe i-X-ray iyaqinisekisa ukuthi wonke amalungu e-BGA alungile?
Cha. I-X-ray inikeza ubufakazi obubalulekile obuhlanganisiwe obufihliwe kodwa ayikwazi ukufakazela ngokuqondile ukuqhubeka kukagesi, i-metallurgy noma ukuthembeka kwesikhathi eside. Kufanele kuhlanganiswe nokuhlanganiswa okulawulwayo kanye nokuhlolwa okufanele kukagesi noma kokusebenza.
Ingabe i-X-ray eyi-100% iyadingeka kuyo yonke i-oda le-BGA ne-QFN?
Akunjalo ngaso sonke isikhathi. Ukumbozwa kungaba yinto yokuqala, isampula noma inqwaba egcwele kuye ngephakheji, umklamo, ubungozi bomkhiqizo kanye nesidingo samakhasimende. I-Highleap isho ukumbozwa okuhlongozwayo kusilinganiso.
Ingabe izikhala ze-QFN zingasuswa ngokuphelele?
Ngokuvamile akunjalo. Inhloso ukulawula indawo engenalutho kanye nobubanzi obuhlobene nezidingo zokushisa, zikagesi kanye nokwamukelwa kwamakhasimende. Iphethini ye-stencil, ngokuklama, ukunamathisela kanye nokugeleza kabusha konke kuthinta umphumela.
Ingabe izingxenye ze-BGA ezinikezwa amakhasimende zingahlanganiswa?
Yebo, kuye ngokuthi iphakethe liyini, isimo somswakama, ubuningi, ukupakishwa kanye nomlando wokulungiswa. I-Highleap izobuyekeza izidingo zokwamukela nokuphatha ngaphambi kokuqinisekisa ukwakhiwa.
Luhlanganisani uhlelo lokuhlola i-X-ray lwe-BGA PCB assembly?
Uhlelo lokuhlola i-X-ray lwe-BGA PCB luchaza ukuthi yimaphi amaphakheji namayunithi ahlolwayo, amaphutha noma izilinganiso ezibuyekezwayo, izindlela zokwamukela, amarekhodi emiphumela kanye nokwenyuka lapho kutholakala iphethini engavamile.
Ingabe insizakalo eyodwa yokuhlanganisa i-QFN PCB ingahlinzeka ngezinsizakalo zokunamathisela i-BGA QFN?
Yebo. Insizakalo yokuhlanganisa i-QFN PCB ingahlanganiswa nezinsizakalo zokunamathisela ze-BGA QFN emzileni ofanayo we-SMT. Izilawuli ze-stencil, i-via, umswakama, iphrofayili kanye ne-X-ray eziqondene nephakheji zisadingeka.
Yini okufanele iqinisekiswe ngumkhiqizi we-BGA ngaphambi kwekhotheshini?
Umkhiqizi we-BGA kufanele aqinisekise iphakheji eqondile, indawo yebhodi/ngokwakhiwa, iphaneli, isimo sengxenye, ukumbozwa kokuhlolwa, imikhawulo yokuhlola kanye nokulungiswa kabusha ngaphambi kokufaka amandla kanye nesheduli.
Kuyini ukuhlanganiswa kwezingxenye eziqediwe phansi?
Ukuhlanganiswa kwezingxenye eziqediwe phansi kuhlanganisa amaphakheji amalunga awo ayinhloko angaphansi komzimba, okuhlanganisa i-BGA, i-QFN, i-LGA kanye namadivayisi amaningi e-CSP. Inqubo nokuhlolwa kumele kubhekele ukufinyelela okulinganiselwe kokubona.
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