Umhlahlandlela ophelele we-BGA Substrates

             

Ama-substrates e-BGA (i-ball grid array) abe ubuchwepheshe bokupakisha obuvame kakhulu kumasekethe ahlanganisiwe (ama-IC), ama-ASIC, ama-GPU, nezinye izingxenye eziyinkimbinkimbi. Ngekhono lokwamukela ukuminyana okuphezulu koxhumana nabo endaweni encane, i-BGA inika amandla ukuguqulwa okuncane nokusebenza kwezithuthukisi zezinhlobonhlobo zama-electronics. Kodwa-ke, ukuklama nokukhiqiza ama-substrates e-BGA kudinga ubuchwepheshe obujulile. Lo mhlahlandlela ophelele uhlanganisa konke okudingekayo ukuze kusetshenziswe izinzuzo ze-BGA ngenkathi ugwema izingibe.

Iyini i-BGA Substrate?

A BGA substrate acts as the foundation for BGA packaging, providing mechanical support as well as the electrical interconnects. The substrate consists of an insulating material with conductive traces on or within it that route signals and power between the attached silicon die and the printed circuit board (PCB) on which the Iphakheji ye-BGA is mounted.

Isici esihlukanisayo sawo wonke amaphakheji e-BGA amabhola amancane e-solder ahlotshiswe phansi kwephakheji ngephethini yegridi. Lawa mabhola e-solder axhuma iminonjana ye-substrate kumaphedi okufika afanayo ebusweni be-PCB lapho ingxenye ye-BGA idayiswa ebhodini ngesikhathi somhlangano. Le gridi yebhola inika amandla ukuxhumana okuphezulu kakhulu njengoba amabhola angahlukaniswa eduze.

Ama-substrates e-BGA kumele aklanywe ngokuqondile ukuze afane ne-silicon die kanye nebhodi lesifunda kuyilapho ehlangabezana nezidingo zikagesi, ezishisayo, nezomshini. Ama-laminates, izitsha zobumba, i-silicon, ingilazi, nezinye izinto ezisetshenziswayo ukwenza ama-substrates e-BGA. Idizayini ye-substrate incike ezintweni ezifana nenani loxhumana nabo elidingekayo, isivinini samasignali, izidingo zokulethwa kwamandla, okulindelwe ukuthembeka, kanye nezindleko.

Kungani i-BGA Substrates Ivumela I-Miniaturization

Izinzuzo eziyinhloko ze-BGA zisukela ekhonweni lokufaka ukuxhumana okwengeziwe endaweni encane uma kuqhathaniswa nezindlela zokupakisha ze-IC ezindala. Ngokwesibonelo:

• Amaphakheji okuhola okujikelezayo njengamaphakethe ama-quad flat (QFP) anomkhondo kuphela emaphethelweni, akhawulela ukuminyana kokuxhumana.
• Ama-pin grid arrays (PGA) asebenzisa inqwaba yezikhonkwane ezisuka ngaphansi kwephakheji, kodwa isikhala sephinikhodi esincane sikhulu kunamabhola athengiswayo.
• Izithwali zamachip ezingaholi zinabo oxhumana nabo emaphethelweni noma ngaphansi, kodwa azikwazi ukufanisa ukuminyana kwe-BGA.

Ngokuphambene, i-BGA ingafinyelela ukuminyana okuphezulu kakhulu ngamabhola ku-0.5mm pitch noma ngisho no-0.4mm nangaphansi. Lokhu kunika amandla imisebenzi eminingi kumaphakheji amancane. Umumo oyindilinga okahle wamabhola e-solder nawo uvumela ukuqhelelana ngokusondelana nezikhonkwane.

Izibalo zokuxhumana eziphakeme zinika amandla ukuhlanganiswa kwemisebenzi eyengeziwe njengamaphrosesa amaningi, inkumbulo, izinzwa, okungenantambo, ukuphathwa kwamandla, nezisheshisi ezikhethekile ngaphakathi kwamaphakheji e-BGA aqondiswe ezinhlelweni ezifana ne-5G, AI, ADAS, IoT, nokuningi. I-miniaturization iphinde ihambisane nokuncanyelwayo kwabathengi kuma-electronics ahlangene kakhulu.

Izinto ezisetshenziselwa i-BGA Substrates

Ngenkathi amaphakheji okuqala e-BGA asebenzisa ama-substrates e-ceramic, ama-substrates amasha ezinto eziphilayo manje ahamba phambili ngenxa yezindleko zawo eziphansi kanye nezinzuzo zokumelana nokushaqeka okushisayo, i-warpage encishisiwe, kanye nokuguquguquka. Izinto ezijwayelekile zifaka:

I-BT Substrate – I-Bismaleimide triazine, i-resin ye-thermosetting, evame ukuqiniswa nge-fiber yengilazi kanye ne-foil yethusi. Inikeza ibhalansi yokusebenza kanye nokukhiqiza engabizi kakhulu. Isetshenziswa kabanzi ezinhlelweni zabathengi, zezokuxhumana, zezimboni kanye nezezimoto. Imelana nezinqubo zokusonta ezingenayo i-lead.

I-Polyimide Substrate – Inikeza ukuzinza okuphezulu kokushisa kodwa ngentengo ephezulu kune-BT. Isetshenziswa lapho kudingeka ama-substrate amancane kakhulu. Ivame kakhulu ezinhlelweni zokusebenza zeselula nezinokwethenjelwa okuphezulu.

I-CE Substrate – I-composite epoxy resin eqiniswe nge-glass fiber. Izakhiwo eziphansi zokumunca umswakama. Ivame ukusetshenziswa ezindaweni ezinomswakama ophezulu.

I-Substrate Eguquguqukayo – Amafilimu e-Polyimide angakhiqiza ama-substrate amancane kakhulu, aguquguqukayo ukuze kuthuthukiswe ukumelana nokushaqeka/ukudlidliza. Ivumela imiklamo emincane, emincane.

Ama-Ceramic substrates e-aluminium oxide noma i-aluminium nitride asahamba phambili kwezinye izinhlelo zokusebenza eziphakeme kakhulu ezifana ne-aerospace lapho ukuhanjiswa kwazo okushisayo okuphakeme kuvumela inkokhelo yezindleko. Izithameli ze-Silicon noma zengilazi nazo ziyavela ngamaphakheji we-2.5D/3D aphezulu kakhulu.

Kungani i-Automated BGA Substrate Design Ibalulekile

Ubunkimbinkimbi bokuhambisa amaphethini okuphunyuka ayinkimbinkimbi kanye nokulandelelwa okuvela kumakhulu noma izinkulungwane zabantu oxhumana nabo kudinga umklamo ozenzakalelayo osizwa ikhompuyutha. Isakhiwo se-substrate ye-BGA yesandla asikwazi ukwenzeka.

Izinselelo ezibalulekile zihlanganisa:

Ubuqotho Besignali – Ukuqondanisa amajiyometri okulandelela ukuze kufezwe ukuvimba okulawulwayo nokuqhubekayo kwenethi ngayinye kuyimpoqo, kanye nezindiza ezifanele zokubhekisela ekunciphiseni umsindo. Lokhu kudinga ukulungiswa okuzenzakalelayo.

Ubuqotho Bamandla – Ukwakhiwa ngokubambisana ngokucophelela kwezindiza zamandla kanye nomhlabathi ukuze kusatshalaliswe amandla ngendlela ephumelelayo kudayi we-silicon ngaphandle komsindo omkhulu. Ama-capacitor okususa ama-decoupling nawo kumele abekwe kahle.

Ubuningi – Umzila wokuphunyuka usuka ku-BGA pad array udinga iphethini ehleliwe yama-vias kanye ne-traces kanye nokwabiwa kwezingqimba okulungiselelwe ukugwema ukuminyana nobude.

Ukushisa – I-substrate kumele ivumele ukuqhutshwa okwanele kokushisa kusuka kudayi kuya ku-PCB kanye ne-ambient. Ama-vias okushisa ayasiza.

Ukuthembeka – Imithetho yokuklama yobubanzi/isikhala sokulandelela, ngesakhiwo, ukuma kwephedi, kanye nezinto zokwakha kumele ilinganisele izindleko nokuqina kwesikhathi eside ngaphansi kokujikeleza kokushisa, ukudlidliza, njll.

Amathuluzi e-EDA athuthukisiwe kuphela ahlanganisa ama-algorithms omzila ayinkimbinkimbi, abaphathi bemikhawulo, ukuhlolwa kwemithetho yedizayini, nokulingisa angakwazi ukufeza idizayini ye-substrate ephelele ehlangabezana nezinselele zobuchwepheshe kanye nezidingo zokwenziwa.

Okucatshangelwayo Okubalulekile Kwedizayini Ye-BGA Substrate

Nazi ezinye zezinto ezibaluleke kakhulu abaklami okufanele bazicabangele lapho benza i-substrate ye-BGA:

• Ubuqotho besignali - Ukulandela umkhondo okulawulwayo we-impedance, ireferensi efanele kanye nokuhlukaniswa, ukuncishiswa komsindo, nokugwema ukukhuluma okuphambene kubalulekile kumasignali ahlanzekile, ikakhulukazi ngesivinini esikhulu. Lokhu kunikwe amandla ngomzila we-engeli yesokudla, izindiza eziyinkomba, ukukhetha kwe-dielectric, i-trace geometries, ukulingisa, nokufanisa ubude.
• Ubuqotho bamandla - Idizayini yendiza yamandla ecophelelayo, ama-capacitor aqhafayo, nokulungiselelwa kwe-bump yamandla kuyadingeka ukuze kulethwe amandla azinzile, anomsindo ophansi ku-silicon die. Ukuhlaziywa kokwehla kwe-voltage kufanele kwenziwe.
• Ukuphathwa kwe-Thermal - Idizayini ye-substrate kumele ivumele ukupholisa okusebenzayo nokuguquguqukayo kwefa nge-PCB. I-Thermal vias ngaphansi kwefa ibalulekile. High conductivity materials usizo.
• Ukuthembeka - I-substrate ne-trace materials, imithetho yokuklama, ukumodela, ukuhlolwa kokuhlola, kanye nokulingisa kusiza ukuqinisekisa ukuqina ngaphansi kokuhamba ngamabhayisikili, ukudlidliza, ukushaqeka, umswakama, kanye nezingcindezi zokukhathala ngesikhathi sokuphila komkhiqizo.
• Ukuphunyuka - Amaphethini omzila wokuphunyuka kusukela kuchungechunge lwamabhola aminyene kuya kumjikelezo adinga imigqa ehlukanisiwe ye-vias/ukulandelela okulungiselelwe ukuminyana kwemizila, ukufanisa ubude, kanye nokuba lula. I-HDI ivame ukudingeka.
• Ukwenziwa - Izinqubo ze-DFM kuyo yonke inqubo yokuklama ziqinisekisa ukuthi indawo engaphansi ingakhiwa, ihlanganiswe, ihlolwe, futhi ihlolwe ngendlela ethembekile ngezindleko ezingcono kakhulu.
• Ubuningi - Amaphakheji e-BGA aminyana kakhulu adinga ama-dielectric azacile, imigqa ecolekileyo nezikhala, ama-vias amancane, izendlalelo eziningi, nezinto ezithuthukisiwe ukuze kuhlangatshezwane nokubalwa koxhumano.

I-Ball Pitch kumaPhakheji we-BGA

I-Ball pitch ibanga eliphakathi kwezikhungo zamabhola e-solder aseduze ohlwini lwegridi. I-pitch yehle kancane kancane ukuze inike amandla amaphakheji e-BGA aminyana kakhulu. Ezinye izinkundla zebhola zamanje zifaka:

• 0.8mm - Iphimbo elisetshenziswa kakhulu kumaphakheji we-BGA azwela izindleko, amaphakathi
• 0.65mm - Iphimbo elivamile lokuminyana okuphezulu kwama-IC ayinkimbinkimbi aze afike kusayizi ongu-35x35mm
• 0.5mm - Kubhekwa njengephimbo elihle kakhulu elingafinyeleleka ngokwakhiwa kwe-PCB okuthuthukisiwe
• 0.4mm - Iphimbo eliqine kakhulu elicindezela imikhawulo yamakhono okukhiqiza

Ithrendi ebheke ku-pitch yebhola encane ivumela noma osayizi bephakheji abancane ngenani elinikeziwe lokuxhumanisa noma ukuminyana okuphezulu kumasayizi amaphakheji amakhulu. Kodwa-ke, ukuncipha kuletha izinselele ekulawuleni inqubo yokuhlanganisa, ukuthembeka kokuhlanganyelwa kwe-solder, ubunzima bokusebenza kabusha, kanye nokuzwela ku-warpage ye-PCB. I-pitch enhle kakhulu idinga ukubekezelelana okuqinile.

Izimpawu Ezisemqoka ze-BGA Substrates

                         

Ezinye zezici ezihlukanisayo ze-BGA substrates ezichaza izinzuzo zazo uma ziqhathaniswa nezitayela zephakheji ezindala zihlanganisa:

• Ukuminyana okuphezulu kokuxhumeka - Ikhono lokugxilisa ingqondo phakathi kwama-100 kuya kwangu-1000 oxhumana nabo endaweni encane ivumela ukuhlanganiswa kokusebenza okwengeziwe kanye ne-I/O kusici sefomu elihlangene.
• I-inductance ephansi - Ubude bokuhola obuncane phakathi kwe-silicon die ne-PCB bunikeza ukusebenza kukagesi okuphakeme, ikakhulukazi kumasiginali aphezulu.
• Ukuxhumana okufushane, okuqondile - Ukuxhumana okuqondile okuqondile kuqeda izibopho zocingo ezintekenteke kanye nemikhondo engaphuka. Ukwethembeka kuphakeme.
• Ukuhambisana kwenqubo - Amaphakheji e-BGA angafakwa phezulu njengezinye izingxenye ze-SMT esigabeni somhlangano we-PCB, kuncishiswe izindleko.
• Ukuqhuba okushisayo - Ukuxhumana okuqondile kanye nokuxhumana okufushane kusiza ukushisa ukusakazeka ku-PCB nendawo ezungezile, kunciphisa izindawo ezishisayo.
• Ukuziqondanisa - Ukuqina kwe-solder ye-liquid kuqondanisa amabhola namaphedi afanayo ngesikhathi sokuhlanganiswa kabusha. Ukuzwela okuncane ekunembeni kokubeka.
• Testability - Amaphakheji e-BGA avumela ukuhlolwa okuphelele kwangaphambi komhlangano we-encapsulated die ngaphambi kokufakwa kwebhodi.

I-BGA Substrate Routing Izinselele

Ukulandelela umzila ngaphakathi noma kwezendlalelo ze-BGA substrate kubangela izinselele eziyinkimbinkimbi zedizayini ezihlanganisa:

Ubuqotho Besignali - Ukulawula ukuvimba kokulandelela, ukukhuluma ngokuphambene, kanye nekhwalithi yesignali kudinga amajiyometri afanayo, ukubhekisela okufanele, ukulawulwa kwezicucu, ukufaniswa kwesigaba, kanye nokulingisa.

Ubuqotho Bamandla - Ukulethwa kwamandla okuhlanzekile kuncike ezindleleni zokungenisa umoya eziphansi, ukuhlukanisa okwanele, ukuhlukaniswa kwendiza okufanele, ukuphathwa kokushisa, kanye nokuhlaziywa.

Ubuningi Bomzila – Amaphethini okuphunyuka ahleliwe kumele avumele iziteshi zomzila phakathi kwemigqa eseduze ye-vias/traces ephuma ku-dense matrix array.

Ukukhiqiza - Imithetho yokuklama ngobubanzi bokulandelela, isikhala, izimo, ama-via, nezinto zokwakha kumele ivumelane namakhono okukhiqiza ngenkathi kuthuthukiswa izindleko nokuthembeka.

Ukuphathwa Kokushisa - I-substrate kumele isabalalise ukushisa ngempumelelo kwi-PCB nasendaweni ezungezile ukuze kugwenywe izindawo ezishisayo ngaphansi kwe-dee exinene.

Ukuthembeka - Izinto zokwakha, imithetho yokuklama, izilawuli zokukhiqiza, ukwenza amamodeli, kanye nokuhlola kusiza ukuqinisekisa ukuthi i-substrate izomelana nokucindezeleka phakathi nesikhathi sokuphila komkhiqizo.

Amathuluzi e-EDA athuthukile nonjiniyela abanolwazi babalulekile ukuze kubhekwane nalezi zinselele ezincikene kuyilapho ugwema ukuklama ngokweqile okwengeza izindleko ezingadingekile. Ukuthuthukiswa kwe-substrate kusebenzisana kakhulu nokwenza kahle okuqhubekayo.

I-BGA Substrate Materials Uhlolojikelele

Njengoba kwethulwe ngaphambili, izinto ezisetshenziswa kakhulu ukwenza ama-substrates e-BGA zifaka:

I-Organic Substrates

• I-BT (bismaleimide triazine) – Isetshenziswa kakhulu ngenxa yebhalansi yezindleko/ukusebenza
• I-Polyimide - Ukuzinza okuhle kakhulu kokushisa kodwa izindleko eziphezulu
• I-FR-4 – Impahla ye-PCB eqiniswe ngengilazi yendabuko, ukusebenza okuphansi/izindleko
• I-CE (i-epoxy ehlanganisiwe) - Isetshenziswa ezindaweni ezinomswakama ophezulu
• Ama-substrates aguqukayo - Amafilimu e-Polyimide noma e-LCP anika amandla ama-substrates azacile, aguquguqukayo

I-Ceramic Substrates

• I-aluminium oxide (i-alumina) - Evame kakhulu, i-ceramic ebiza kancane
• I-Aluminium nitride - Ukusebenza okuphezulu okushisayo kwezicelo ezidinga kakhulu
• I-Beryllia - Ubuthi bukhawulela ukusetshenziswa kwe-beryllium oxide ceramic

Amanye ama-Substrates Athuthukile

• Ama-Silicon interposer - Nika amandla ukupakishwa kwe-chip ye-2.5D/3D ngama-TSV
• I-Glass interposer – Izakhiwo ezivikelayo ezilungele ukuminyana okuphezulu

Okokusebenza okuphelele kuncike ezidingweni zohlelo lokusebenza njengemvamisa, amaleveli wamandla, izidingo zokwethenjelwa, izakhiwo ze-dielectric, izindleko zokwenziwa, kanye nemijikelezo yokuphila yomkhiqizo.

Ukukhathazeka Kwenqubo Yomhlangano we-BGA

Ukuze uzuze amajoyinti athembekile ngesikhathi sokuhlanganiswa kwe-SMT kwamaphakheji e-BGA kuma-PCB, kunconywa izinyathelo ezithile zokuphepha:

• Faka ukushisa okwanele ukuze ugeleze kabusha wonke amabhola e-solder ngokuthembekile ngaphandle kokushisisa ngokweqile izingxenye ezibucayi
• Qinisekisa ngisho nokushisisa kuwo wonke umlando we-BGA ukuze ugweme ukugeleza kabusha okungasonta iphakheji
• Sebenzisa unamathisele we-solder ongahlanzekile oklanyelwe ukuhlanganiswa kwe-BGA engenamthofu ukuze ugweme ukufakwa kwezinsalela
• Lawula ngokunembile amaphrofayili okushisa afaka amarampu, ukucwiliswa emanzini, nokupholisa
• Susa ukufakwa kwamatshe ethuneni ngokusebenzisa amadiphozithi afanele, ukugxilisa ingxenye, kanye nokwenza iphrofayela
• Vimbela i-voids ngokusebenzisa amavolumu afanele wokunamathisela afaniswa namavolumu ebhola, imiklamo yokuvula, namandla okubeka
• Hlola kahle izinkomba zokungemanzi kahle, amaphutha ekhanda lomcamelo, ukungafanani, namanye amaphutha
• Qinisekisa izinqubo ngokusebenzisa idizayini yokuhlola (i-DOE) nokuhlola okufana nokuhlaziya amandla e-shear kumasampula amalunga

Ngama-BGA wephimbo elihle, ukuhlangana kudinga ukubekezelelana okuqinile, amasu okuhlola athuthukile, kanye nezilawuli zenqubo ezingaguquguquki kakhulu ukuze kutholwe isivuno esikhulu nokwethembeka.

Ihlola Amalunga e-BGA Solder

Ngokungafani namajoyinti asekelwe kumthofu abonakalayo, ukuxhumana kwe-solder ngaphansi kwe-BGA akukwazi ukuhlolwa ngokubonakalayo. Esikhundleni salokho, imaging X-ray ikhambi elilungile lokuhlola ikhwalithi yangaphakathi ye-solder ehlangene kulandela umhlangano we-BGA.

Amasistimu okuhlola i-X-ray (AXI) akhiqiza izithombe ezinokulungiswa okuphezulu eziveza:

• Ukuqondanisa kwebhola le-solder, ukuphakama kokuma, nokuminyanisa
• Ukuba khona kwama-voids, imifantu, ukumanzisa okunganele, noma amanye amaphutha
• I-solder ball deformation kusuka ekumeni okuhle
• Ukungafani phakathi kwamalunga
• Izinto zangaphandle, ukungcola, noma izinsalela

I-AXI ihlinzeka ngokuhlolwa okugcwele ukuze kuhlonzwe izinkinga zokuhlanganisa ngaphambi kokuthunyelwa kwemikhiqizo kanye nobungozi bokuthembeka obungaba khona besikhathi eside. Amakhono e-3D ahlinzeka ngemininingwane eyengeziwe ngesakhiwo esihlanganyelwe. Uma kutholakala noma yikuphi ukukhubazeka, inqubo ingalungiswa ukuze kuqedwe imbangela.

I-BGA Rework and Repair

Uma ukuhlolwa kwangemva komhlangano noma ukuhlola okulandelayo kuveza amaphutha kumajoyinti e-solder, ukubekwa kwengxenye, noma ukuxhumeka kwezinga lebhodi okuhlotshaniswa nokukhwezwa kwe-BGA, kuyodingeka kusetshenzwe kabusha. Ezinye izinqubo ezihamba phambili zihlanganisa:

• Sebenzisa amasistimu okusebenza kabusha e-BGA akhethekile anama-preheaters, ama-thermocouples, i-vacuum pick-up, nokuqondanisa kokubona
• Khetha ngokukhetha ukushisa okugxilile kuphela engxenyeni enesici ngaphandle kokushisisa ngokweqile izinto eziseduze
• Lawula ngokucophelela irempu ekhuphukayo yokushisa, ukucwiliswa, kanye namazinga okupholisa kuyo yonke inqubo yokuphinda ugeleze
• Sebenzisa unamathisele we-solder noma i-flux eyenzelwe ukusebenza kabusha kwe-BGA ukumanzisa amaphedi ebhodi ngokuthembekile futhi ugweme ukuhlanganisa
• Sebenzisa ubuncane bevolumu yokunamathisela i-solder efaniswa nevolumu yephedi/yebhola ukuze ugweme ukudambisa okweqile
• Hlola ngokubuka ukuqondanisa okufanele ngaphambi kokugeleza kabusha; sebenzisa i-AXI ngemuva kwalokho ukuze uqinisekise ubuqotho obuhlangene
• Susa konke ukuguquguquka okusele ngemuva kokusebenza kabusha usebenzisa izihlanzi ezenzelwe izinsalela eziphansi

Ngama-BGA anephimbo elihle, amathuluzi akhethekile, izinto zokwakha, nezinqubo kubalulekile ekusebenzeni kabusha okuyimpumelelo. Ukuvimbela kuyancomeka ngokuklama okuqinile kwenqubo nokulawula.

Izinzuzo zama-BGA

Nazi ezinye zezinzuzo ezibalulekile ezenze ukupakishwa kwe-BGA kugcwele kuwo wonke ama-electronics:

Ubuningi Obuphezulu - Ikhono lokugxila kakhulu ekuxhumaneni kwe-I/O endaweni encane livumela ukuhlanganiswa kokusebenza okwengeziwe nezici.

Ubuqotho Besignali Esivinini Esiphezulu - Izimpawu ezimfushane phakathi kwedayi nebhodi zinikeza izinzuzo zokusebenza kukagesi, ikakhulukazi kumasignali edijithali asheshayo.

Ukuthembeka - Ukuxhumana okuqondile okuqondile kugwema izibopho zentambo ezibuthakathaka kanye nezintambo ezivame ukuphuka ngenxa yokucindezeleka kokushisa noma komshini.

Ukusebenza Kokushisa - Ukuxhumana okuqondile kwe-die kanye nokuxhumeka okufushane kukhuthaza ukuqhutshwa kokushisa kude ne-silicon eqinile, eshisayo iye kwi-PCB kanye nomoya ozungezile.

Ukuguquguquka Komklamo – Uhlu olubanzi lwezinto zokwakha ezingaphansi komhlaba ezinezakhiwo ezahlukahlukene ze-dielectric lungakhethwa ukuze kuhlangatshezwane nezidingo zobuchwepheshe nezindleko.

Ukuhlolwa - Idayi eyaziwayo ingahlolwa ngokugcwele emaphaketheni e-BGA ngaphambi kokuhlanganiswa kwebhodi ukuze kutholakale isivuno esingcono.

Ukuhambisana Kwenqubo - Amaphakheji e-BGA angafakwa endaweni efana nezinye izingxenye ze-SMT, esebenzisa ukuhlanganiswa kwe-PCB okunomthamo omkhulu.

Imikhawulo ye-BGA Package

Ngaphandle kwezinzuzo ezibalulekile, ama-BGA futhi eza nokulinganiselwa nokuhwebelana:

Ukuhlolwa - Ukungakwazi ukuhlola ngokubona amalunga angaphakathi e-solder kusho ukuthi ukuhlolwa kwe-X-ray kuyadingeka ukuqinisekisa ubuqotho bokuhlanganiswa.

Ubunzima Bokusebenza Kabusha - Ukususa nokufaka esikhundleni ama-BGA ngaphandle kokulimaza amabhodi noma izingxenye eziseduze kudinga amathuluzi namakhono athuthukile.

Ukuzwela kwe-Warpage yeBhodi - Ukucindezeleka kokushisa kungagoba amabhodi ngokwanele ukuphula ukuxhumana namabhola e-solder asontekile kalula ngaphansi kwama-BGA amakhulu.

Izindleko - Ukwenziwa kokuxhumana okuphezulu kanye nezinto zokwakha ezithuthukisiwe kukhulisa izindleko ngaphezu kwezitayela zamaphakheji ezindala ngenani eliphansi lokuxhumana.

Ukuminyana Kwendlela Yesignali – Ama-BGA amaningi kakhulu adinga izendlalelo eziningi zomzila ezixinene kanye namaphethini okuphuma ayinkimbinkimbi anezela izindleko zokwenziwa kwe-PCB.

Ukuxhumeka Kwezinga Lesibili – Kudingeka isigaba esihlukile sokuhlanganiswa ukuze kunamathiselwe idayisi ku-substrate ye-BGA ngaphambi kokufakwa kwebhodi.

Ukucindezeleka Kokushisa - Ukungafani kwe-CTE phakathi kwe-silicon, i-substrate, ibhodi, kanye nama-solder kumele kucatshangelwe ukuze kugwenywe ukwehluleka komjikelezo wokushisa.

I-BGA Substrates vs. LGA

Amaphakheji wegridi yomhlaba (LGA) anikezela ngenye indlela ku-BGA ngokuhwebelana okuhlukile:

Ukususwa – Ama-LGA asebenzisa ama-land pad esikhundleni samabhola e-solder, okuvumela ukufakwa/ukususwa kwezixhumi ze-socket kuma-PCB. Ama-BGA ashintshwa unomphela.

Ukuthembeka – Ama-LGA agwema izindlela zokwehluleka kokukhathala kwe-solder, kodwa ukuxhumana okuningi kwe-socket akuthembekile kangako kune-solder joints ngaphansi kokujikeleza kokushisa.

Ukulungisa - Ama-LGA angasebenzi kahle angasuswa futhi ashintshwe ngaphandle kokususa i-solder noma ukushisa ibhodi. Ama-BGA adinga ukugeleza kabusha.

Ukusula Kokuthintana – Ama-pads e-LGA akhuhla amaphini okuxhumanisa ngesikhathi sokufakwa, asusa i-oxidation kanye nemfucumfucu ukuze kube nokumelana okuphansi kokuthintana. Ama-BGA athembele ekusongeleni kuphela.

Umzila – Ama-LGA adinga ubuningi obukhulu bezimbobo ezifakwe amapulangwe kanye nama-vias eziphini zesokhethi kuyilapho ama-BGA edinga umzila wokuphunyuka ukuze kutholakale umkhondo.

Amaphrofayili – I-LGA iphakeme kune-BGA okungenani ngokuphakama kwesokhethi. I-BGA inikeza iphrofayili ephansi.

Izindleko – Ekukhiqizweni kwevolumu ephezulu, i-BGA ngokuvamile ibiza kancane. I-LGA ingase ithandeke kumavolumu aphakathi.

Ukukhetha okuhle kuncike ezindlekweni ezihlosiwe, okulindelwe umjikelezo wokuphila, izidingo zokusevisa insimu, kanye nezidingo zokusebenza.

Izicelo ze-BGA Kuzo zonke Izimboni

Ukusebenza okuphezulu, usayizi omncane, nokuthembeka kwamaphakheji e-BGA kubone ukutholwa kuzo zonke izinhlobo zezinhlelo zokusebenza:

Consumer Electronics

• Ama-Smartphones, amaphilisi, amalaptop
• Ama-consoles amageyimu, amabhokisi aphezulu
• Amakhamera edijithali, okugqokekayo

Izithuthi

• Amayunithi okulawula injini, i-infotainment
• Amamojula we-ADAS, i-LiDAR
• Izilawuli zomzimba

I-Aerospace ne-Military

• Amabhodi wekhompyutha we-Avionics
• Amasistimu we-radar nezithombe
• Amasistimu wokuqondisa imicibisholo

I-Telecom ne-Networking

• Ukushintsha, amarutha, iziteshi eziyisisekelo
• Amaseva
• Amamojula we-Fiber optics

Medical

• Amasistimu wokucabanga afana ne-MRI, CT, PET scanners
• Abaqaphi besiguli kanye nokuxilongwa
• Ama-implantable njengama-pacemakers

Isiphetho

Njengoba lo mhlahlandlela ubonisile, ama-substrates e-BGA adinga ubunjiniyela obucatshangelwayo kuyo yonke imikhakha eminingi - ugesi, oshisayo, owomshini, isayensi yezinto zokwakha, i-physics, ukukhiqiza, nokuningi.

Lapho eklanywe kahle, ama-substrates e-BGA ahlinzeka ngendlela enokwethenjelwa ephezulu yokuxhumana evumela ukuqhubeka kwentuthuko yezobuchwepheshe. Kodwa zidinga ukumodela ngokucophelela, ukuhlaziya, ukubambelela ezinkambisweni zedizayini ezizwakalayo, kanye nokulawulwa kwenqubo okuqinile ukuze kuzuzwe ikhwalithi yomkhiqizo nezinjongo zokwethembeka.