Ukukhiqizwa Nokuhlanganiswa kwe-Chromebook PCB kwama-Mainboard e-OEM

Ukukhiqizwa kwe-PCB ye-Chromebook mainboard

Okuqukethwe

  1. Kusukela ku-Chromebook PCB Architecture kuya ku-Controlled Production Package
  2. I-Chromebook PCB Yomzila Osheshayo, Izixhumi Zememori Nezibonisi
  3. Ukuhlanganiswa kwe-USB-C, Ukushaja, Okungenantambo kanye Nokugeleza
  4. Ukusatshalaliswa Kwamandla Nobuningi Bokushisa Kumabhodi Amakhulu Ahlanganisiwe
  5. Izidingo Zokwenziwa Kwezingqimba Eziningi, i-HDI kanye ne-Fine-Pitch Lapho Kudingeka Khona
  6. Ukuhlanganiswa kwe-BGA/SMT kanye nokuhlolwa kwama-Chromebook Mainboards
  7. Ukuhlolwa Kokusebenza, i-NPI kanye Nokulawulwa Kokukhiqiza Okuphindaphindiwe
  8. Ukukhetha Umlingani Wokukhiqiza Nokuhlanganisa we-Chromebook PCB

I -Chromebook PCB ivame ukuxoxwa ngayo njengebhodi lomama eliyinhloko eliphethe ukubala, imemori, isitoreji, ukuphathwa kwamandla kanye nemisebenzi eyinhloko ye-I/O yedivayisi ye-ChromeOS. Ihadiwe ye-ChromeOS ikhona kumapulatifomu ahlukene eprosesa kanye nezici zefomu, ngakho-ke umenzi akufanele acabange ukuthi isakhiwo sebhodi elilodwa elihleliwe, inani lezendlalelo noma isethi yezingxenye.

I-Highleap Electronics isekela amabhodi aklanywe ngamakhasimende kusukela kudatha yokukhiqiza ekhishwe ngokuhlanganiswa kwe-PCB, ukutholakala kwezingxenye okuvunyiwe kanye nokuhlolwa okuchazwe ngamakhasimende. Umsebenzi wokukhiqiza ukugcina inhloso kagesi neyemishini yekhasimende ngenkathi kulawulwa amaphakheji aminyene, amanethi asheshayo, ukuguqulwa kwamandla kanye nezinketho ezizwela ukubuyekezwa.

Amabhodi e-interface engeziwe, amabhodi e-USB noma ama-flex interconnect angase abe khona kweminye imiklamo, kodwa ayizinketho zokwakha kunokuba yisici esichazayo se-Chromebook ngayinye. Ngakho-ke lesi sihloko sigxile ebhodini eliyinhloko futhi siphatha izinhlangano zesibili kuphela lapho idatha yomkhiqizo ekhishwe izidinga khona.

1. Kusukela ku-Chromebook PCB Architecture kuya ku-Controlled Production Package

Ibhodi elikhulu livame ukugxila kuphrosesa wohlelo lokusebenza noma ipulatifomu yeprosesa, imemori , isitoreji, ukuxhumana okungenantambo, izixhumanisi zokubonisa, umsindo, izixhumi zekhamera, ukushaja kanye namandla esistimu. Ukuhlukanisa okuqondile kuyahlukahluka ngepulatifomu. I-RFQ ephephile iqala ngokukhishwa okukodwa okulawulwayo kunencazelo ejwayelekile "yebhodi lomama le-Chromebook".

Incazelo yezakhiwo ibalulekile ngoba isitolo sebhodi kanye ne-assembler babona ingxenye yomongo wesistimu kuphela. Ipulatifomu yeprosesa, ubuchwepheshe bememori, i-topology yesitoreji, imisebenzi ye-embedded-controller, inani le-port kanye ne-mechanical envelope konke kungashintsha indlela yokuphuma, ukulandelana kwamandla, ukubekwa kwesixhumi kanye nokufinyelela kokuhlola. Ngakho-ke, iphakheji yokukhiqiza akufanele ibonise kuphela ukubuyekezwa kwe-PCB kodwa futhi ne-BOM variant, izinketho ezifakiwe/ze-DNI, isithombe se-firmware kanye nanoma yimaphi amanothi omhlangano aqondene nepulatifomu adingekayo ukwakha lokho kulungiselelwa okuqondile.

Iphakheji yokukhiqiza

Okufakiwe kwamakhasimende Ukusetshenziswa kokukhiqiza Iphoyinti lokulawula
Umdwebo we-Gerber/ODB++ kanye nowokwenziwa Ichaza idatha yesendlalelo, ama-drill, uhlaka kanye namanothi okuhlanganisa Ungaqageli ukuvimba noma ngesakhiwo kusuka ku-schematic kuphela.
I-BOM kanye nezinye izindlela ezivunyiwe Ichaza izingxenye ezifakiwe kanye nezinhlobo ezahlukene Gcina izingxenye zeprosesa-platform kanye namandla zixhumene nesibuyekezo esikhishwe.
Umdwebo wokukhetha nokubeka nokuhlanganisa Ilawula ukuqondiswa kanye nezinketho ezifakiwe Xazulula izingxabano ze-DNI kanye nezinyathelo ezihlukile ngaphambi kokusetha.
Idatha yemishini Ilawula ubudlelwano besixhumi, i-heatsink kanye ne-chassis Hlola uhlaka lwebhodi, izimbobo zokufaka kanye nokugcinwa kwezingxenye.
Imiyalelo ye-firmware/yokuhlola Ichaza ukuhlolwa kohlelo nokwamukelwa Hlukanisa ukuhlolwa okubonakalayo nokuqinisekiswa kokusebenza.

Umngcele we-DFM

Ukubuyekezwa kwe-PCB DFM kungahlonza imibuzo yokwenziwa, kodwa akufanele kuklanywe kabusha buthule umzila weprosesa, i-topology yememori noma ukwakheka kwamandla. Lokho kuhlala kulawulwa umklamo okhishwe yikhasimende.

Kuzinhlelo ze-OEM, iphuzu lokuguqulwa elisebenzayo liyiphakheji yokukhululwa ekhiqizwe. Ngaphambi kokuba izinto zibekwe, ubunjiniyela kanye nokuthengwa kufanele bakwazi ukuphendula imibuzo emine: ukuthi yikuphi ukuhlanganiswa okukhishwayo, yiziphi izingxenye ezivunyelwe ngempela, yiziphi izilinganiso zomshini ezibalulekile ekufakweni, nokuthi yiziphi imisebenzi okumele iboniswe ngaphambi kokuthunyelwa. Uma lezo zimpendulo zisatshalaliswa kuma-imeyili noma amanothi e-prototype, ukuzihlanganisa ngaphambi kwe-NPI kuvame ukuvimbela ingozi enkulu kunokwengeza ukuhlolwa ngemva kweqiniso.

Iphakheji yokukhiqiza yebhodi elikhulu lekilasi le-Chromebook kufanele ichaze okungaphezu kwe-PCB engenalutho. I-BOM, idatha yokubekwa, umdwebo wokwenziwa, umdwebo wokuhlanganiswa, uhlaka lwemishini, ireferensi ye-firmware kanye nohlelo lokuhlola kudingeka kutholakale ihadiwe efanayo ekhishwe. Izinketho zeprosesa-platform zingashintsha inani lememori, amadivayisi okugcina, amamojula angenantambo, amasethi okuxhuma noma izifunda zamandla ngenkathi uhlaka lwebhodi luhlala lufana. Ngaphandle kokulawula okucacile kwezinketho, ukuthenga nokuhlanganisa kungakha ibhodi elifanele ngokomzimba ngokulungiselelwa okungalungile.

Ngakho-ke ukubuyekezwa kwe-DFM kufanele kuhlukanise inhloso yokuklama nezici ezilawulwa yifektri . Ikhasimende lichaza ukwakheka kukagesi, izinhloso zokuhlanganisa, amakilasi abalulekile e-net, izingxenye ezivunyiwe kanye nemigomo yokwamukelwa. Umenzi uqinisekisa ukuthi izakhiwo zokubhoboza, amasongo e-annular, izimbobo ze-solder-mask, ibhalansi yethusi, ukwakheka kwamaphaneli, isikhala sezingxenye kanye nokufinyelela ekuhlanganisweni kuyakhiqizwa yini. Lo mngcele ubalulekile ngoba umenzi akufanele ashintshe buthule idatha yokuphuma ngesivinini esikhulu, insimu yamandla noma i-connector ukuze nje kube lula ukwenziwa.

  • Hlanganisa yonke i-SKU nesibuyekezo esisodwa se-BOM/CPL/firmware/test kunokuthembela ezincazelweni ze-oda lokuthenga.
  • Thola amanethi okulawula ukuvimba kanye nanoma yisiphi isaphulelo noma isidingo sokubika ephaketheni lokukhiqiza.
  • Nikeza idatha yemishini yama-heat spreaders, ama-shield, izipikha, amakhamera kanye nezimbobo ze-USB-C lapho lokhu kuhlanganiswa kwe-compression.
  • Chaza ezinye izindlela ezivunyelwe amakhasimende ngaphambi kokuba kube nokuntuleka; ama-IC azwela ipulatifomu akufanele athathelwe indawo yinani/iphakheji kuphela.

2. I-Chromebook PCB Enesivinini Esiphezulu Sokuzulazula, Imemori kanye Nezixhumi Zokubonisa

Amabhodi okubala aminyene angaqukatha amabhasi ememori e-DDR, izixhumanisi zesitoreji esisheshayo , i-USB, izixhumi zokubonisa kanye namanye amanethi azwela isikhathi. Ukwakhiwa kumele kulondoloze ukwakhiwa kwe-dielectric okukhishwe, ukuqhubeka kwe-reference-plane, i-geometry yethusi kanye nokusetshenziswa okusetshenziswa yithimba lokuhlelwa.

Ukulawula ukukhiqiza ngesivinini esikhulu kuqala ngokulondoloza izibikezelo ezisetshenziswa ngesikhathi sokuhlelwa. Ibhasi lememori lingase lizwele ekuqhathaniseni ubude, ukugoba, ukuqhubeka kwendiza yokubhekisela kanye nokubala, kuyilapho izixhumanisi zokugcina noma zokubonisa zingase zikhawulelwe yisabelomali sokulahlekelwa noma sokungaguquguquki esihlukile. Lezi akuzona izithiyo ezishintshashintshayo. Umdwebo wokukhiqiza kufanele ukhombe izakhiwo ezilawulwayo kanye ne-target stack-up yomklami ukuze ifektri ikwazi ukubala i-geometry eqediwe kusukela ezimweni zangempela ze-laminate nezethusi esikhundleni sokuphatha wonke ama-differential pair njengomthetho ofanayo.

Lapho kuchazwe khona i-impedance elawulwayo, ukwakheka kufanele kubuyekezwe njengohlelo lwe-stack-up-and-geometry kunokuba kube umsebenzi wobubanzi bokulandelela obujwayelekile. Indlela yokukhiqiza ingahambisana nezidingo zokukhiqiza ze-PCB ezisheshayo kanye nethebula le-impedance lekhasimende.

  • Gcina inkumbulo kanye neminye imizila ethinta isikhathi ixhumene nemithetho yobude bekhasimende, ukugoba kanye ne-topology.
  • Gwema ukuhlukana kwendiza noma ukungaqhubeki kwezindlela zokubuyela emuva ngaphansi kwemizila yesivinini esikhulu.
  • Phatha ukuqhekeka kwesixhumi, ama-vias okuphunyuka e-BGA kanye noshintsho lwezendlalelo njengengxenye yesiteshi.
  • Sebenzisa i-HDI noma ama-microvia kuphela uma izidingo zobuningi kanye nokuphuma zivumelana nazo; aziphoqelekile kuwo wonke ama-PCB e-Chromebook.

I-DFM kufanele futhi ibuyekeze izinguquko kunokuba ibukeze izingxenye ezinde zokulandelela kuphela. Ukuqhekeka kwe-BGA, izifunda eziphansi, ukuqaliswa kwezixhumi, ama-test pad kanye nokuwela kwendiza kungabusa isiteshi ngisho noma umzila oqondile ulawulwa kahle. Lapho kuphakanyiswa khona ushintsho lwe-dielectric, isisindo sethusi noma ngokwakhiwa ukuze kukhiqizwe, umphumela kagesi kufanele ubuyiselwe kumakhasimende ukuze uvunyelwe. Leyo nqubo igcina umhlinzeki endimeni efanele: ukuhumusha umklamo wesivinini esiphezulu ovunyiwe ube ukukhiqizwa okuphindaphindwayo ngaphandle kokushintsha buthule ukuziphatha kwesiteshi sakhe.

Umbuzo obaluleke kakhulu wokukhiqiza ngesivinini esikhulu akulona igama lokumaketha le-interface kodwa i -geometry yesiteshi ekhishwe yithimba lokuklama . Amabhasi e-DDR, izixhumanisi zokugcina, i-USB kanye nezindlela zokubonisa zingaba nezinhloso ezahlukene ze-impedance, imithetho yesikhala, izidingo ze-reference-plane kanye nesabelomali esigobile. Isitolo sebhodi kufanele sithole ulwazi olwanele lokukhiqiza kabusha ukujiya kwe-dielectric, ukujiya kwethusi kanye ne-geometry yokulandelela ngokuqhubekayo; ngaphandle kwalokho ifayela lobuciko elifanayo lingakhiqiza isiteshi sikagesi esihlukile ngemuva kokushintsha kwezinto noma i-stack-up.

Ukushintshashintsha nge-Vy nakho kufanelwe ukubuyekezwa okuqondene nomkhiqizo. Ukuphunyuka kwe-BGA kungaphoqa ukwehla kwentamo noma izinguquko eziningi zezendlalelo, futhi izinguquko ze-reference-plane zingaphazamisa ukubuya kwamandla ngaphandle kokuthi ukuthunga kanye necebo le-plane kwaklanyelwe zona. Ukuze kuqondiswe inkumbulo eningi, i-assembler kumele futhi igcine ukuqondiswa kwephakheji kanye nokulungiselelwa kwememori okufakiwe ngoba ikhwalithi yokuqondisa ayikwazi ukukhokhela idivayisi noma uhlobo lokubeka olungalungile. Ngakho-ke izilawuli zokukhiqiza kanye nokuphathwa kokuhlelwa kwe-assembly kufanele kuphathwe njengohlelo olulodwa kunemisebenzi emibili yomhlinzeki ehlukanisiwe.

Indawo yokudlulisela ubunjiniyela

Ngaphambi kokucaphuna, maka amanethi azwela i-impedance noma i-topology bese ukhomba i-stack-up ekhishwe. Lokho kunikeza ifektri isisekelo esiqinile sokukhetha izinto, ukumodela i-impedance kanye nokuhlela amakhuphoni esikhundleni sokuyicela ukuthi inqume izidingo ezivela esigabeni somkhiqizo.

3. Ukuhlanganiswa kwe-USB-C, Ukushaja, Okungenantambo kanye Nokugeleza

Amadizayini amaningi e-ChromeOS asebenzisa i-USB-C ukuze ahlanganise idatha, imisebenzi yokushaja kanye nokubonisa , kodwa imisebenzi esekelwayo incike ekusetshenzisweni kwepulatifomu kanye nembobo. Ngakho-ke i-USB-C kufanele yenziwe kusukela kusakhiwo sembobo esichaziwe esikhomba isilawuli, indlela yamandla, izidingo ze-mux noma i-redriver, ukuvikelwa kwe-ESD kanye nobuchwepheshe bokuxhuma.

I-USB-C ebhodini elikhulu le-Chromebook iwumsebenzi wesistimu, hhayi nje indawo yokugcina izinto. Kuye ngeplatifomu, imbobo ingabandakanya ukutholwa kwe-CC, ukulawulwa kokulethwa kwamandla e-USB, ukuxubha ngesivinini esikhulu, idatha ye-SuperSpeed, ukuqondisa kokubonisa, ukulawula indlela yokushaja kanye nezingxenye zokuvikela. Isilawuli esifakiwe noma enye i-firmware yesistimu ingahlanganyela ezinqumweni zembobo kanye nokushaja, ngakho-ke ukubuyekezwa kwehadiwe kanye nokucushwa kwe-firmware kudingeka kuhlale kuvumelanisiwe ngesikhathi se-NPI kanye nokwakhiwa okuphindaphindiwe.

Amamojula angenantambo noma amadivayisi angenantambo ahlanganisiwe nawo adinga ukunakwa kwe-BOM evunyiwe, imiyalelo yokugcina i-antenna kanye nesu lokubeka phansi. Ikhamera, umsindo kanye nezinye izixhumi ezisebenzisa ugesi ophansi zingaba bucayi ekubekweni kwezixhumi kanye nokuhanjiswa kwekhebula ngisho noma amazinga azo edatha ephansi kunezixhumi ezisebenzisa ugesi eziyinhloko.

Gwema iphutha elivamile lokuqukethwe

Ungasho ukuthi yonke imbobo ye-Chromebook USB-C inikeza ikhono elifanayo lokushaja, ukubonisa noma idatha. Amapulatifomu e-ChromeOS ayahlukahluka, futhi izidingo ze-schematic plus port ezikhishwe ziwumthombo weqiniso lokukhiqiza.

Izixhumi ezingenantambo nezingaphandle zidala uhlobo oluhlukile lwengozi. Ukuvalwa kwe-antenna, ukumiswa kwemojula, isu lokuvikela kanye nemikhawulo yokuhlala ndawonye kumele kuhambisane nokwakheka kwemishini, kuyilapho izixhumi zekhamera, umsindo kanye nezixhumi ezincane eziguquguqukayo zincike kakhulu ekuqondisweni, ukugcinwa kanye nomzila wekhebula. Ngakho-ke, isibuyekezo sokukhiqiza esiwusizo sihlola isimiso sikagesi kanye nomdwebo wokuvala. Lokhu kuthola ukwehluleka okungaphuthelwa yisibuyekezo se-PCB esihlukile, njengokuvalwa kwe-RF okuvinjiwe yinsimbi noma isixhumi esilungile ngomshini esingafinyeleleki ngemva kokuhlanganiswa kokugcina.

Ukuhlanganiswa kwe-USB-C kuyisibonelo esihle sokuthi kungani isethi yamafayela okukhiqiza kumele ibonise indima yangempela yembobo. I-receptacle ingase ithwale idatha ye-USB, amandla axoxiswane ngawo kanye nethrafikhi ehlobene nokuboniswa kweminye imiklamo, kuyilapho okunye ukusetshenziswa kungaveza isethi encane yesici. Ukukhathazeka ngokukhiqiza ukusetshenziswa okungokoqobo: ukuqhekeka komzila wesivinini esikhulu, isekethe ye-CC/PD lapho ikhona khona, amadivayisi okuvikela, isisekelo segobolondo lesixhumi, izindlela ze-VBUS zamandla aphezulu kanye nokusekelwa komshini. Ukubekwa kwesixhumi kumele futhi kuhambisane nokuvulwa kwe-chassis ukuze ukufakwa kwekhebula okuphindaphindiwe kungalayishi amalunga e-solder noma kuphambukise ibhodi.

Ukuqaliswa okungenantambo kunezela umkhawulo ohlukile. Amamojula e-RF, ama-antenna feed, ama-shield can kanye nezindawo zokugcina zingazwela ekuthululweni kwethusi, ihadiwe yokufaka kanye nezifunda eziseduze ezinesivinini esikhulu noma ezishintshayo. Ushintsho lokwenziwa kwe-PCB olubonakala lungenangozi kunethiwekhi yedijithali lungashintsha indawo ezungezile ye-antenna noma izindlela zokubuya. Ukuze kudluliselwe umkhiqizo, ukugcina ama-antenna, izinyathelo zohlaka lwesivikelo kanye nezingxenye ze-RF ezivunyiwe kufanele zilawulwe ngokubuyekezwa, futhi noma iyiphi enye imojula engenantambo kufanele ibuyekezwe ukuze kutholakale izinyathelo zonyawo, i-firmware, isitifiketi kanye nokuhambisana kwe-antenna kunokuphathwa njengento ethatha indawo ejwayelekile.

I-Highleap Electronics • Ukukhiqiza i-PCB kanye ne-PCBA

Isibuyekezo Sokukhiqiza se-Chromebook Mainboard

Yabelana ngamafayela ebhodi, izidingo ze-BOM kanye nokuhlolwa ukuze uthole isibuyekezo esisebenzayo se-PCB kanye ne-PCBA.

Cela Isilinganiso se-Chromebook PCB → Xoxani Ngokuhlanganisa Ibhodi Elikhulu →

✓ Ukubuyekezwa kwe-DFM kanye ne-DFA ✓ Uhlobo lokuphinda ukukhiqizwa ✓ Ukwenziwa nokuhlanganiswa kwe-PCB

4. Ukusatshalaliswa Kwamandla Nobuningi Bokushisa Kumabhodi Amakhulu Ahlanganisiwe

Ama-rail kagesi eprosesa, inkumbulo kanye ne-interface adala ubuningi bamandla kagesi kanye nokushisa. Umenzi we-PCB kufanele alondoloze i-geometry yethusi, amaphethini okushisa kanye nokuxhumeka kwendiza okuyingxenye yomklamo kagesi nokushisa wekhasimende. Izinguquko zethusi ezenzelwe kuphela ukulula kokukhiqiza zingashintsha ukwehla kwamandla kagesi, ukwabelana kwamandla kagesi noma ukusabalala kokushisa.

Ubuqotho bamandla kufanele bubuyekezwe ngomzila ngesitimela kunokuba bufinyezwe ngokuthi 'ithusi elisindayo elizungeze iprosesa.' Izigaba zokuguqulwa komzila ophezulu zidinga izihibe zamandla ezimfushane, ukusabalala kwethusi okufanele kanye nama-array, kuyilapho imigqa ye-core ye-voltage ephansi ingaba bucayi ekuphepheni kwendiza kanye nokubekwa kokuhlukana. Umenzi we-PCB kumele alondoloze la ma-geometri ngoba ukunciphisa intamo, ukushintsha ngokubala noma ukushintsha ukukhululeka kwendiza kungathinta ukwehla kwamandla kagesi, impendulo yesikhashana kanye nokushisa kwendawo.

Ukulawulwa kokushisa kwezinga lebhodi nakho kuncike ekuvalweni okuqediwe, i-heatsink noma i-spreader, indlela yokuhamba komoya kanye nenqubomgomo yamandla e-firmware. Amasu okuphatha ukushisa kwe-PCB angasekela ingxoxo yokukhiqiza, kodwa i-PCB engenalutho ayikwazi ngokwayo ukuqinisekisa izinga lokushisa lokugcina ledivayisi noma isikhathi sokusebenza kwebhethri.

Ubuqotho bamandla

Gcina izindlela zokuhambisa ezivimbela umoya kancane , ngezakhiwo kanye nezinyathelo ezihlukanisayo ngokwedizayini ekhishwe.

Indlela yokushisa

Buyekeza izindawo ezinkulu zethusi, ama-vias okushisa kanye nezindawo ezivulekile zezingxenye kanye nomdwebo womshini.

Indawo yokushaja

Phatha izixhumi zamandla aphezulu kanye nezingxenye zokuguqula amandla njengezindawo eziyingozi kagesi kanye nezindawo zokuhlanganisa.

Ukuqinisekiswa kokushisa kuncike ngokulinganayo ohlelweni. I-PCB ingasakaza ukushisa ngama-planes nama-vias, kodwa izinga lokushisa lokugcina lincike kuma-heat spreaders, izinto zokusetshenziswa kokushisa, ukuqhutshwa kwe-enclosure, ukuhamba komoya kanye nemikhawulo yamandla e-firmware. Ukuze udlulisele umkhiqizo, chaza ukuthi yiziphi izici zokushisa ezilawulwa umdwebo we-PCB nokuthi yiziphi ezihambisana neziqu zokugcina zesistimu. Lokho kuhlukaniswa kugwema iphutha elivamile lokuthola: ukucela umhlinzeki webhodi ukuthi aqinisekise izinga lokushisa le-enclosure elingaqinisekiswa kuphela ku-Chromebook ehlanganisiwe.

Indawo yokuhlola isibuyekezo sobunjiniyela

Uma ibhodi yakho enkulu ye-Chromebook isuka ku-EVT/DVT iye ku-NPI, thumela i-stack-up ekhishwe, ithebula elilawulwayo, i-BOM, idatha yokubekwa kanye nohlaka lokuhlola ndawonye. Ukubuyekezwa kokukhiqiza okugxile kungadalula izinkinga ze-stack-up, i-BGA, i-USB-C kanye nokulawula okuhlukile ngaphambi kokuba ukuthenga izingxenye kukhiye isakhiwo.

Amabhodi amakhulu ekhompyutha aqukethe izizinda eziningana zamandla ezisebenzisanayo: i-adaptha noma okokufaka kwe-USB-C, ukushaja ibhethri, imisele ehlala ivuliwe, imisele yeprosesa, imisele yememori kanye nezinto ezisetshenziswayo. I-PCB ayinqumi ukwakheka kwamandla, kodwa kumele ikhiqize kabusha ingxenye yethusi, ukuxhumeka kwendiza, ngokubalwa kanye namaphethini omhlaba wezingxenye asetshenziswa yileyo miklamo. Ukwebiwa kwethusi okungakabuyekezwa, ukwehla kwentamo noma ngezinguquko endleleni yamandla aphezulu kungandisa ukumelana noma ukushisa okugxilile ngisho nalapho ibhodi lisaphumelela ukuhlolwa kokuqhubeka.

Ukubuyekezwa kokushisa kufanele kugxile ekuqhubekeni kokugeleza kokushisa . Amaphakheji eprosesa, abalawuli, amadivayisi okushaja kanye nama-inductor anamandla aphezulu angancika ezindizeni zethusi, ama-via e-exposed-pad, izihlangu noma ama-heat spreader omshini. Umhlinzeki we-PCB kufanele aqinisekise ukuthi amaphethini e-thermal-via, ukuvuleka kwe-solder-mask kanye nebhalansi yethusi kuyakhiqizwa ngaphandle kokushintsha indlela ehlosiwe. Ithimba lomkhiqizo, okwamanje, kufanele linikeze imikhawulo yokushisa kanye nezimo zokuhlola ngoba izinga lokushisa lomsebenzisi kanye nokusebenza okuqhubekayo kuncike endaweni evalekile ephelele, inqubomgomo yamandla e-firmware kanye nomsebenzi womsebenzi—hhayi i-PCB yodwa.

Isibuyekezo sangaphambi kokukhiqiza esiwusizo

Uma ibhodi linendawo yokulawula/yokushaja exinene, thumela idatha yokwenziwa kanye nezisindo zethusi ezihlosiwe, ngesakhiwo kanye nemikhawulo yokusabalalisa ukushisa ngomshini. I-Highleap ingabuyekeza ukukhiqizwa ngaphambi kokuba izinto zifakwe, okuwusizo kakhulu kunokuzama ukulungisa inkinga yokushisa noma yokuba yisicaba ngemva kwengxenye yokuqala ehlanganisiwe.

5. Izidingo Zokwenziwa Kwezingqimba Eziningi, i-HDI kanye Ne-Fine-Pitch Lapho Kudingeka Khona

Ibhodi elikhulu le-Chromebook lingasebenzisa ukwakhiwa okuvamile kwezingqimba eziningi noma ukwakhiwa kwe-HDI eningi kuye ngephakheji yeprosesa, indawo yememori, indawo yebhodi kanye nobuningi be-I/O. Akulungile ukunikeza inani lezingqimba elijwayelekile noma ngohlobo lwesigaba.

Isinqumo sokusebenzisa ukwakhiwa okuvamile kwezingqimba eziningi, ama-blind vias, ama-microvias noma i-HDI stack ethuthukisiwe kufanele sivele ezidingweni zobuningi be-routing kanye nokuthembeka. Amaphakheji e-Fine-pitch angase azuze ezakhiweni ze-via-in-pad noma ezilandelanayo, kodwa umjikelezo ngamunye we-lamination owengeziwe kanye nobuchwepheshe be-via wengeza izilawuli zenqubo okumele ziqinisekiswe. Ukubuyekezwa kokwenziwa kufanele kufake i-geometry yokubamba i-pad, i-plating, i-resin fill lapho kuchazwe khona, ukubhaliswa, i-annular-ring margin kanye nanoma iyiphi imfuneko yokuthembeka ehlobene nama-stacked noma ama-stacked microvias.

Kumadizayini adinga ama-microvia , ama-vias angaboni/afihliwe noma i-BGA escape encane, ifektri kufanele ibukeze ibhodi njengenqubo yokukhiqiza ye-HDI. Ukubhaliswa, ukulawulwa kwe-dielectric, ibhalansi yethusi, ukuthembeka kanye nobukhulu obuqediwe kufanele kuxhunywe emdwebweni wokwenziwa kwangempela kuneresiphi ejwayelekile yebhodi le-laptop.

Isimiso esifanayo sisebenza ezintweni zokwakha: ama-laminate ajwayelekile e-FR-4-family angase anele iziteshi eziningi, kuyilapho isabelomali sokulahlekelwa esidinga kakhulu singashukumisa ukukhethwa kwezinto zokwakha. Isinqumo esifanele sivela ekuhlosweni kwesignali-ubuqotho bekhasimende kanye nokuqoqwa, hhayi egameni lomkhiqizo.

Ubukhulu bebhodi kanye nebhalansi yethusi nakho kubalulekile kumabhodi amakhulu aqinile ngoba amaphakheji amakhulu e-BGA kanye nezixhumi ezinde zingaba bucayi ekulweni ne-warpage. Ngakho-ke ukukhethwa kwezinto kufanele kungacabangeli nje ukulahlekelwa okusheshayo kodwa futhi nezidingo ze-Tg/Td, ukuziphatha kwe-z-axis, ukuhambisana kwe-lamination kanye nephrofayili yangempela yokugeleza kabusha. Ikhotheshini yobungcweti kufanele ibonise i-stack-up ekhishwe kanye nezinqubo ezikhethekile ngokwehlukana, okuvumela ukuthengwa ukuthi kubone ukuthi yiziphi izishayeli zezindleko eziyingxenye yomklamo futhi okungenzeka zenziwe lula ekubuyekezweni kwesikhathi esizayo.

I-HDI kufanele ikhethwe ngoba indawo yokuphuma kwephakheji kanye nebhodi iyayidinga, hhayi ngoba "i-Chromebook PCB" icatshangelwa ukuthi isho ama-microvia. Amaprosesa amahle, inkumbulo ehlanganisiwe kanye ne-I/O ejulile kungenza ama-vias angaboni, ama-microvia ahlanganisiwe/ahlanganisiwe noma i-lamination elandelanayo ibe usizo, kodwa amanye amapulatifomu angase akhiqizwe ngokwakhiwa okuvamile kwe-multilayer through-via. Isinqumo esifanele silinganisa ubuningi bomzila, ukuthembeka, inani le-lamination, ikhono lokubhalisa, izindleko kanye nevolumu yokukhiqiza elindelekile.

Ukuze kukhishwe i-HDI, umdwebo wokwenziwa kufanele uchaze ububanzi be-laser-via, ama-capture pad, ukulandelana kokwakheka, ukugcwaliswa kwethusi noma okulindelwe kwe-plating lapho kudingeka khona, kanye nanoma yikuphi ukwelashwa kwe-via-in-pad. Ukuqeda i-pad kanye ne-planarity kubalulekile ngaphansi kwama-BGA amahle ngoba ama-via agcwele angalingani anganciphisa umkhawulo wokuhlangana. Isitolo sebhodi kufanele futhi sibuyekeze ukusatshalaliswa kwethusi kuzo zonke izendlalelo zokwakheka; ithusi lendawo eliminyene eduze kwezindawo ezingenalutho lingenza kube nzima i-plating kanye nokulawula okulinganayo. Lezi yizilawuli zokukhiqiza ezixhunywe ekuqoqweni kwangempela, hhayi izimangalo ezijwayelekile ze-"high-density PCB".

6. Ukuhlanganiswa kwe-BGA/SMT kanye nokuhlolwa kwama-Chromebook Mainboards

Ukuhlanganiswa kwebhodi elikhulu kuvame ukuhlanganisa i-SMT ephihliwe kahle ne-BGA noma amanye amaphakheji aqediwe phansi. Ukuphrinta okunamathelayo okuzinzile, ukunemba kokubekwa, ukuphrinta kabusha kanye nokuqinisekiswa kwengxenye yokuqala kubalulekile ngoba ukuqondiswa okuphindaphindiwe noma iphutha lenketho lingathinta inqwaba ephelele.

I-Chromebook PCBA eningi iyinkinga yokuhlanganisa okuxubile: ama-passive amancane, ama-IC aqediwe phansi, amathini esivikelo, izixhumi kanye nezingxenye ezingaba khona ezimbotsheni noma ezilayishwe ngomshini zingahlala ndawonye ebhodini elilodwa. Ubunjiniyela bezinqubo kufanele buchaze isu le-stencil, ivolumu yokunamathisela, ukulandelana kokubekwa kanye nephrofayili yokushisa ezungeze ingxube yangempela yezingxenye. Amaprosesa abizayo, inkumbulo namadivayisi angahlelwa nawo adinga ukulawulwa kwezingxenye ezingenayo kanye nokuphathwa komswakama okuhambisana nezidingo zephakheji kanye nomhlinzeki.

Indlela yokukhiqiza ingahlanganisa ukuhlanganiswa kwe-BGA PCB ne-AOI ukuze kuhlanganiswe amalunga abonakalayo kanye nokuhlolwa kwe-X-ray lapho amalunga afihliwe edinga ukubuyekezwa okuqondiwe. Indlela yokuhlola kufanele isekelwe ebungozini; i-AOI noma i-X-ray azithathi indawo yokuhlola okusebenzayo kwebhodi lomama elihlanganisiwe.

  • Qinisekisa amadivayisi azwela umswakama futhi abizayo ngaphambi kokukhishwa komugqa.
  • Qinisekisa izihlalo zesixhumi kanye nokuhambisana komshini ngokumelene nemingcele yokuvala.
  • Gcina imikhawulo yokusebenza kabusha kanye nemithetho yokugunyazwa icacile kuma-BGA kanye nezixhumi ze-fine-pitch.
  • Sebenzisa iphakheji eyodwa yokuhlanganisa elawulwa ukubuyekezwa kwe-BOM, i-CPL kanye nemidwebo.

Ukuhlolwa kufanele kubekwe eceleni. I-AOI iwusizo ezimweni ze-polarity, ubukhona kanye nezimo ezibonakalayo ze-solder; i-X-ray ingahlola amalunga akhethiwe afihliwe; ukuhlola kwesihloko sokuqala kuqinisekisa idatha yokubekwa kanye nezinketho; kanye nokuhlolwa kokusebenza kuqinisekisa ukuthi ibhodi elihlanganisiwe liyasebenza, libala futhi lixhumana. Isihluthulelo ukungafaki ngaphezulu kwendlela eyodwa yokuhlola. Ibhodi elibukeka kahle lingasahluleka ngenxa ye-firmware, uhlobo olungalungile lwe-BOM, isiteshi sesivinini esiphezulu esingaphansi noma inkinga yesixhumi/yomshini.

Ibhodi elikhulu eliqinile kufanele lihlanganiswe nohlelo lwenqubo oluqaphela izingozi zezingxenye ezahlukene kakhulu. Ama-passive amancane adinga ukuphrinta nokubekwa okuzinzile; ama-BGA namaphakheji aqediwe phansi adinga ukunamathiswa okulawulwayo, ukugeleza kabusha kanye nokuhlolwa okuhlanganisiwe okufihliwe; izixhumi ezinde nama-socket adinga ukuhambisana nokusekelwa komshini. Ukuqinisekiswa kwesihloko sokuqala kubaluleke kakhulu kumabhodi acebile ngezinketho ngoba imemori engalungile, isilawuli, i-oscillator noma isixhumi singaba nokwenzeka ngogesi kodwa singahambisani ne-firmware noma i-SKU eqondiwe.

Ukuhlolwa kufanele kubekwe ngezingqimba. I-AOI ingathola indawo ebonakalayo eminingi, amaphutha e-polarity kanye ne-solder, kodwa ayikwazi ukuhlola yonke i-BGA joint efihliwe. I-X-ray ingaveza ukugoba okukhulu, amabhuloho, ukuvuleka noma izinkomba zekhanda-emcamelweni kuye ngekhwalithi yephakheji nesithombe, kodwa akukaqinisekisi ukuziphatha okusebenzayo. Ngakho-ke, ukukhishwa komkhiqizo kufanele kuhlanganise izilawuli ezibonakalayo/ze-AOI, i-X-ray eqondisiwe yamaphakheji engozi, ukuhlela lapho kudingeka khona kanye nokuhlolwa okusebenzayo. Imithetho yokulungisa kabusha kufanele kuvunyelwane kusengaphambili ngamaprosesa anenani eliphezulu kanye nenkumbulo ukuze imijikelezo yokushisa ephindaphindwayo ingabi yindlela yokutakula engalawulwa.

Cela Isibuyekezo Sokukhiqiza se-Chromebook PCB

7. Ukuhlolwa Kokusebenza, i-NPI kanye Nokulawulwa Kokukhiqiza Okuphindaphindiwe

Uhlelo lokuhlola ukukhiqiza kufanele luthathwe kuhadiwe kanye ne-firmware yekhasimende. Kuye ngezinto ezitholakalayo kanye nokufinyelela, ukuhlola kungafaka phakathi ukuziphatha kwesitimela samandla, ukuhlela, ukuqalisa noma ukubala, imisebenzi ekhethiwe ye-USB/yokubonisa, ukuhlola okungenantambo, ukuziphatha kokushaja kanye nezinye izixhumi ezichazwe yikhasimende.

I-NPI kufanele iphathwe njengeluphu yokufunda, hhayi i-oda elincane lokukhiqiza ngobuningi. Qopha konke ukuphambuka okutholakale ngesikhathi sokwenziwa, ukusethwa kwe-stencil, ukubekwa, ukugeleza kabusha, ukuhlela, ukulingana komshini kanye nokuhlolwa kokusebenza, bese uvala lezo zinto kuphakheji yokukhiqiza ekhishwe ngaphambi kwe-lot elandelayo. Kwibhodi eliyinhloko lekhompyutha, ukulandeleka kufanele kubophe ukubuyekezwa kwe-PCB, ukubuyekezwa kwe-BOM, inguqulo yedivayisi ehlelwe kanye nohlelo lokuhlola ndawonye ukuze ukwehluleka kamuva kwakhiwe kabusha ngaphandle kokuqagela.

Uhlelo lokukhiqiza lungaxhumanisa ukuhlolwa kokusebenza kwe-PCB nokwakhiwa kwe-prototype kanye ne-NPI . Ukulawula okubalulekile ukulandelelwa: inguqulo ye-firmware, i-BOM variant, ukubuyekezwa kwehadiwe kanye nemikhawulo yokuhlola kufanele kubonise ukucushwa okufanayo ngaphambi kokuba kukhishwe ukwakhiwa ukuze kuphindwe ukukhiqiza.

Inhloso yesibonelo

Ukuqaliswa kweprototype kufanele kubonise okungaphezu kokukwazi ukushintshwa. Kufanele kudalule imibuzo yokuhlanganiswa, izingozi zokuhlanganiswa, amaphutha ahlukahlukene, izidingo zokulungiswa kanye nokungqubuzana kwemishini ngaphambi kokuba kube yizinkinga zokukhiqiza okuphindaphindiwe.

Ukumbozwa kokuhlolwa kokukhiqiza kufanele kuhambisane nalokho ifektri engakuphinda ngokwethembeka. Ukulandelana kwamandla, ukuziphatha okuyisisekelo kokuqalisa, ukusebenza kokushaja/kwe-USB-C, izindlela zokubonisa ezikhethiwe noma ze-USB kanye nokunye ukuhlolwa okuchazwe ngamakhasimende kungaba usizo; ukufaneleka kwepulatifomu egcwele kuwumsebenzi ohlukile. Ukuchaza lowo mngcele kusilinganiso kuthuthukisa ukuguqulwa ngoba ubunjiniyela buyazi ukuthi ubufakazi buzolethwa futhi ukuthengwa kungaqhathanisa abahlinzeki ngobubanzi obufanayo obulinganiswayo kunokuba kuqhathaniswe nezithembiso ezingacacile 'zokuhlola okungu-100%.'

Ukumbozwa kokuhlolwa okusebenzayo kufanele kuthathwe ezindleleni zokwehluleka okungenzeka kanye nokufinyelela okutholakalayo. Ukugeleza kwebhodi eliyinhloko okusebenzayo kungafaka ukumelana noma ukuhlolwa okufushane ngaphambi kokuvula, ukuvuselelwa kwamandla okulinganiselwe kwamanje okulawulwayo, uhlelo lwe-firmware, ukuhlolwa kokuqalisa noma kokubala, ukuqashelwa kwememori/isitoreji kanye nokuqinisekiswa kwesixhumi esikhethiwe. Uma ukuhlolwa okuphelele kwesistimu yokusebenza kungasebenzi kahle emgqeni, isithombe sokuxilonga esakhelwe injongo noma insiza yokuhlola yamakhasimende inganciphisa isikhathi somjikelezo ngenkathi isasebenzisa ihadiwe ebalulekile.

I-NPI yilapho indlela yokuhlola kufanele izinziswe khona. Qopha ukuthi yikuphi ukwehluleka okubanjwe yi-AOI, i-X-ray, uhlelo kanye nokuhlolwa kokusebenza, bese uvala izikhala ngaphambi kokukhiqizwa kwevolumu. Amayunithi egolide, amasethi ekhebula, izinto ezifakiwe, izinguqulo ze-firmware kanye nemikhawulo yokwamukelwa zidinga ukulawula kwazo kokubuyekezwa. Lokhu kuvimbela inkinga evamile yokudlulisa lapho i-PCB ingashintshi khona kodwa isithombe esisha sekhompyutha ephathekayo yokuhlola, i-adaptha, ikhebula noma i-firmware sishintsha umphumela obonakalayo wokupasa/wokwehluleka. Ukukhiqiza okuphindayo kufanele kubuyise ukucushwa kokukhiqiza nokuhlola okuqinisekisiwe, hhayi ukukwakha kabusha kusuka kuma-imeyili.

8. Ukukhetha umlingani wokukhiqiza nokuhlanganisa i-Chromebook PCB

Kuhlelo lwe -Chromebook PCB , iziqu zomhlinzeki kufanele zigxile ezingozini zangempela zebhodi: ukubhaliswa kwezingqimba eziningi, ukuvimbela okulawulwayo, ukuhlanganiswa kwe-BGA okuxineneyo, ukulawula ukubuyekezwa, isiyalo sokuthola kanye nomzila wokuhlola ohambisana nepulatifomu yekhasimende. Ifektri kufanele ikwazi ukusho ukuthi yiziphi izidingo ezilawulwa ngaphakathi nokuthi yiziphi ezidinga izindlela zokwamukelwa kwamakhasimende.

Isiphetho

Ibhodi elikhulu le-Chromebook elithembekile alichazwa ngokubalwa kwezingqimba okuhleliwe noma isakhiwo se-HDI esiyimpoqo. Lichazwa ngokwenziwa ngokwethembeka komklamo wepulatifomu ekhishwe, ukwenziwa kwesivinini esiphezulu okulawulwayo, ukuhlanganiswa okuhlelekile kanye nezindlela zokuhlola ezilinganiswayo.

Ukuhlolwa komhlinzeki kufanele kusekelwe ebufakazini. Buza ukuthi ifektri ilawula kanjani ukubuyekezwa kwe-stack-up, idatha ye-impedance, amapharamitha enqubo ye-BGA, amadivayisi azwela umswakama, izindlela ze-X-ray, ukushintshana kwezingxenye kanye nokucushwa kokuhlola. Kwibhodi yokubala elinobukhulu obuphezulu, ikhono lokwenza i-PCB enezingqimba eziningi liyingxenye eyodwa kuphela yesidingo; umhlanganisi kumele futhi aphathe ama-semiconductor abizayo, amajoyinti afihliwe kanye nezinhlobo ze-SKU ngaphandle kokulahlekelwa ukulandeleka.

Ikhotheshini ewusizo kufanele yenze imingcele yobubanzi ibonakale: ukwenziwa kwebhodi elingenalutho, ukuqagela kwezinto kanye nokuvinjelwa, imodeli yokuthola izingxenye, imisebenzi yokuhlanganisa, ukuhlolwa, uhlelo, ukuhlolwa kokusebenza, izinto ezifakiwe kanye nokubika. Lokho kuvumela ukuthengwa ukuqhathanisa okufana nokufana kunokukhetha ikhotheshini ephansi engafaki izinyathelo ezibalulekile zenqubo. Kuhlelo olusha lwe-Chromebook PCB , ukuthumela idatha yokukhiqiza ekhishwe, i-BOM, i-CPL, ukudweba kokuhlanganisa kanye nokuhlolwa okulindelwe ngesikhathi esifanayo kunikeza i-Highleap umongo owanele wokuhlonza izindleko kanye nezinzuzo ngaphambi kokwakhiwa kokuqala.

Iphuzu lokuguqulwa kwe-RFQ

Ukuze uthole isibuyekezo sokuqala sokukhiqiza, faka i-stack-up, amanothi okulawula ukuvimbela, uhlu lwephakheji ye-BGA, ukubuyekezwa kwe-BOM/CPL, i-firmware noma imfuneko yokuhlela kanye nezixhumi olindele ukuzihlola. I-Highleap ingabe isicaphuna ibhodi kanye ne-PCBA ngokumelene nomzila wokukhiqiza ochaziwe esikhundleni sencazelo yebhodi lomama elijwayelekile.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB