Izixazululo Zokukhiqiza Izixhumi ze-USB-C Ezisezingeni Eliphezulu

I-USB-C ithwala idatha engu-40 Gbps, ihlinzeka ngamandla angu-240 W, futhi ixoxisana ngamaphrothokholi angama-24 ku-pitch engu-0.5 mm — konke kuyashintshashintsha. Ukufaka i-USB-C ku-PCB ngaphandle kokwehluleka kobuqotho besiginali, izinkinga zokulethwa kwamandla, noma izinkinga ze-EMC kudinga imithetho ethile yokwakheka, amasekethe okuvikela, kanye nokubekezelelana kokwenziwa okulo mhlahlandlela okubhala iphinikhodi ngephinikhodi.

Okuqukethwe

1. Imephu Yephini Ye-USB-C: Okudingwa Yiqembu Ngalinye Ku-PCB
2. Umzila Wokwehluka Okusheshayo: Impedance, Ukufanisa Ubude kanye Nesu Lezendlalelo
3. Ukulethwa Kwamandla e-VBUS: Usayizi Wethusi kusukela ku-15 W kuya ku-240 W
4. Ukucushwa kwephinikhodi ye-CC yoMthombo, isinki kanye namachweba anezindima ezimbili
5. Amasekethe Okuvikela: I-ESD, i-EMI kanye Nokuqina Kwemishini
6. Ukwakhiwa Nokuhlanganiswa Kwama-PCB e-USB-C

1. Imephu Yephini Ye-USB-C: Okudingwa Yiqembu Ngalinye Kusuka Ku-PCB

Ukuhlelwa kwamaphini angu-24 okulinganayo (12 ohlangothini ngalunye) kwenza kube lula ukuguqula ama-plug kodwa kuphinda kabili ubukhulu bomzila we-PCB. Womabili amasethi omzila we-TX1/RX1 kanye ne-TX2/RX2 kumele aqondiswe — isilawuli se-USB-C sibona ukuqondiswa kwama-plug ngamaphini e-CC futhi sisebenzise isethi yomzila efanele. Kumadizayini e-USB 2.0 kuphela, i-D+/D− eyodwa kuphela edinga umzila ogcwele; enye ifinyelelwe kuyo kuphedi yokuxhuma.

Iphimbo lephedi elingu-0.5 mm lidinga ukukhiqizwa kwe-PCB okunembile. Isikhala sephedi ukusuka kuphedi kuya kuphedi singu-0.15–0.2 mm kuphela — ngaphansi kwamandla ezinqubo eziningi zokwenziwa kwe-PCB ezijwayelekile. Amandla e-HDI PCB anomkhondo/isikhala esingu-3 mil ayadingeka ukuze kuhlanzeke i-USB-C fanout emiklamweni eminingi ehlanganisiwe.

2. Umzila Wokwehluka Okusheshayo: Impedance, Ukufanisa Ubude kanye Nesu Lezendlalelo

Ku-10 Gbps (USB 3.2 Gen 2), i-differential pair ngayinye iyi-RF transmission line. Imithetho yokwakheka esebenza ku-USB 2.0 iyahluleka ku-SuperSpeed.

Impedance: 90 Ω umehluko, ±5% ye-USB 3.x, ±3% ye-USB4. Ku-FR-4 enobubanzi obungu-4 mil: ~0.18 mm ububanzi bokulandelela, ~0.18 mm igebe. Lawa manani kumele abalwe nge-stackup yangempela yomenzi — ungakopishi amanani avela ezintweni noma ubukhulu obuhlukile.

Ukufanisa ubude: I-Intra-pair (iminonjana emibili ye-pair eyodwa): ≤5 mil ye-USB 3.x, ≤2 mil ye-USB4. Sebenzisa ukulungiswa kwe-serpentine okubushelelezi, hhayi ama-zigzag aqinile — amakhona abukhali adala ama-impedance bumps kumaza amaningi e-GHz.

Isu Lesendlalelo: Amabhangqa e-SuperSpeed ​​​​emigqeni yangaphakathi ehlanganiswe phakathi kwezindiza ze-GND (umugqa westrip) ukuze kuvikelwe kakhulu. Amabhangqa e-USB 2.0 angahamba ezingqimbeni zangaphandle. Izingqimba ezingaphansi kwezingu-6 ze-USB 3.2 Gen 2; Izingqimba ezi-8 ze-USB4. Emabhodini anezingqimba ezine, amabhangqa e-SuperSpeed ​​ahamba ezingqimbeni zangaphandle njenge-microstrip — ayamukeleka kwi-USB 3.0 (5 Gbps) kodwa akunconywa ngaphezu kwalelo jubane.

I-Vias: I-Via ngayinye ku-SuperSpeed ​​​​pair inezela i-inductance engu-~0.2–0.5 nH futhi idale i-stub eyonakalisa umdwebo wamehlo. Qondanisa ukuguquka kwesendlalelo esingu-zero ku-pair ngayinye. Uma ukuguquka kungenakugwenywa, beka i-GND stitching vias ngaphakathi kwe-1 mm bese ucabanga ngokubhoboza emuva okungasetshenziswanga ngama-stubs kumadizayini e-USB4. Kuma-PCB adinga ukubhoboza emuva, bheka umhlahlandlela wethu wobuchwepheshe bokubhoboza emuva.

Ama-capacitor okuxhumanisa e-AC: Imigqa ye-USB 3.x TX idinga ama-caps okuxhumanisa e-AC angu-100 nF (0402 noma 0201). Wabeke ngokulinganayo phakathi kwemigqa emibili yebhangqa ngalinye, eduze kohlangothi lokudlulisela, ngobude obuncane be-stub.

3. Ukulethwa Kwamandla e-VBUS: Usayizi Wethusi kusukela ku-15 W kuya ku-240 W

I-USB-C VBUS ithwala ama-V angu-5 (okuzenzakalelayo), ama-V angu-9, ama-V angu-15, ama-V angu-20 (i-USB PD 3.0, kufika ku-100 W), noma ama-V angu-28 / 36 V / 48 (i-USB PD 3.1 Extended Power Range, kufika ku-240 W). Ithusi le-PCB kumele liphathe ugesi onzima kakhulu ku-voltage exoxiswanayo.

Zonke izikhonkwane ze-VBUS ezine kumele zixhumane ndawonye ku-PCB (kufana ne-GND) — ipulaki iyaguqulwa, ngakho-ke izinhlangothi zombili zinamandla. Kumadizayini angu-100 W+, indiza ye-VBUS ezinikele esendlaleloni sangaphakathi ijwayelekile. I-PCB yethusi esindayo enezingqimba zangaphakathi ezingu-2 oz isekela i-240 W PD ngaphandle kokwenyuka okukhulu kwezinga lokushisa.

Isivikelo: I-OVP (ukuvikelwa kwe-over-voltage) kanye ne-OCP (ukuvikelwa kwe-over-current) ngokuvamile zihlanganiswa nesilawuli se-USB PD IC (TI TPS65987, Cypress CYPD3177, Infineon CYPD6227). Ama-TVS angaphandle ku-VBUS aphatha ama-surge transients adlula ikhono lesilawuli.

4. Ukucushwa kwephinikhodi ye-CC yamachweba omthombo, isinki kanye nezindawo ezimbili

I-CC1 ne-CC2 ziwubuhlakani be-USB-C. Zibona ukufakwa kwekhebula, zinqume ukuqondiswa kwepulagi, zibone indima yomthombo/isinki, futhi zixoxisane nge-voltage ye-PD kanye nogesi. Ukucushwa kwe-PCB kuncike endimeni yedivayisi:

Isinki (amandla okwamukela idivayisi): Iphini ngayinye ye-CC idonswa ku-GND ngokusebenzisa i-resistor engu-5.1 kΩ Rd. Izimpawu "Ngiyidivayisi, nginike amandla." Kumasinki anekhono le-PD, isilawuli se-PD esisebenzayo sithatha indawo yama-resistor futhi sisingatha ukuxoxisana kwemiyalezo ye-PD nge-BMC encoding kulayini we-CC.

Umthombo (idivayisi enikeza amandla): Iphini ngalinye le-CC lidonswa ku-VCONN noma ku-3.3 V nge-resistor ye-Rp. Inani le-Rp likhangisa ikhono lamanje: 56 kΩ = i-USB ezenzakalelayo (500 mA), 22 kΩ = 1.5 A, 10 kΩ = 3 A. Kwimithombo ye-PD, isilawuli esisebenzayo sithatha indawo ye-Rp futhi sixoxisane ngezinkontileka ze-voltage/current.

I-Dual-Role Port (DRP): Ishintshana phakathi kwe-Rp ne-Rd, iskena umlingani. Isilawuli se-PD siphatha umshini wesimo se-DRP, i-Try.SRC/Try.SNK logic, kanye ne-PR_Swap (ukushintshana kwendima yamandla). I-DRP isetshenziswa kuma-laptop, kuma-USB-C hubs, kanye nasezikhungweni zokufaka amandla ezingakhipha futhi zicwilise amandla.

Ukuhlelwa kwe-PCB: gcina ama-CC traces ngaphansi kwama-50 mm ukuze unciphise amandla. Engeza ukuxhuma okungu-0.1 µF ku-GND eduze kwesixhumi. Ama-CC traces asuka kuma-SuperSpeed ​​​​differential pairs — isignali ye-BMC ku-CC ingahlanganiswa nemizila yesivinini esikhulu uma isikhala singanele.

Kumikhiqizo esebenzisa i-DisplayPort noma i-Thunderbolt Alt Mode, amaphini e-sideband e-SBU1/SBU2 axhuma kusilawuli se-Alt Mode. Lawa adinga ukuvikelwa kwe-ESD kodwa awekho ukuvimba okulawulwayo.

5. Amasekethe Okuvikela: ESD, EMI kanye Nokuqina Kwemishini

I-oda lokubekwa kokuvikelwa kwe-ESD (isixhumi → ihabhu IC):

1. Ama-TVS diode arrays ku-SuperSpeed ​​TX/RX — ≤0.3 pF (TI TPD4S214, Diodes Inc DT1452-02)
2. I-TVS ku-D+/D− — ≤3 pF (TI TPD4S012, Nexperia PESD5V0U4BF)
3. I-TVS ku-VBUS — iqondiswa kabili, ikalwe nge-voltage ye-PD (i-Bourns CDSOT23-SM712)
4. I-TVS ku-CC kanye ne-SBU — ngokuvamile ihlanganiswe kusilawuli se-PD

Zonke izingxenye ze-ESD ezingaphakathi kuka-1.5 mm ukusuka kuma-connector pin. Lona umthetho ongenakuxoxiswana ngawo — idivayisi yokuvikela isebenza kuphela uma ibamba i-pulse ye-ESD ngaphambi kokuba ifike ku-controller IC.

Ukunciphisa i-EMI: Ukuchoboza kwemodi evamile kuma-pair e-SuperSpeed ​​(i-Murata DLW32SH ye-USB 3.0, i-TDK ACT45B ye-USB 2.0). Isivikelo sokuxhuma siboshwe ku-chassis GND ngokusebenzisa ama-via amaningi okuthunga ngaphakathi kwama-2 mm ama-shell pads. Emikhiqizweni eqondiswe ezindinganisweni ze-EMC zezokwelapha, zezimoto, noma zezempi, kusetshenziswa amasu okuklama i-PCB avame kakhulu okuhlanganisa izindiza zokuvikela kanye nama-via okulawula ukuvinjelwa.

Ukuthembeka kwemishini: I-USB-C ilinganiselwe imijikelezo yokufaka engu-10,000. Izixhumi ezifakwa ngaphezulu ezinezimbobo ezibamba imigodi (uhlobo oluvame kakhulu) zinikeza amandla anele emishini. Izixhumi ze-SMT ezimsulwa zibuthakathaka — ziyamukeleka emikhiqizweni engashukumi, aziphatheki. Izixhumi ezifakwa phakathi (ezifakwe emaphethelweni ebhodi) zifanelana namadivayisi amancane kakhulu kodwa zidinga ukuqondisa kwe-CNC ngokunemba kohlaka lwebhodi.

6. Ukwakhiwa Nokuhlanganiswa Kwama-PCB e-USB-C

Ama-PCB e-USB-C adinga ukubekezelelana kokwenziwa okuqinile kunamabhodi ajwayelekile. Qinisekisa lawa makhono nomkhiqizi wakho ngaphambi kokuphothula umklamo:

I-Trace/isikhala: okungenani ama-mil angu-3 / ama-mil angu-3 ezifundeni ze-USB-C fanout. Ama-mil angu-5 / ama-mil angu-5 ajwayelekile awanele kuma-contact pad angu-0.5 mm.

Ukulawulwa kwe-Impedance: ±5% ku-90 Ω differential ye-USB 3.x; ±3% ye-USB4. Kudinga ukulingiswa kwe-field-solver ku-stackup yokukhiqiza yangempela kanye nokuqinisekiswa kwekhuphoni ye-TDR ku-batch ngayinye. Ukwenziwa okulawulwa yi-Impedance e-Highleap kusekela lokhu kubekezelelana ku-FR-4 kanye nama-laminate aphansi.

Ukuphela kobuso: I-ENIG (igolide elingena-electro nickel/i-immersion elingena-electron) iyindlela ejwayelekile yokubopha amaphedi e-USB-C — ubuso obuyisicaba buhlinzeka ngokufakwa kwe-solder paste okuhlala njalo ku-dense pad array. Ukuphela kobuso be-ENIG obunobukhulu begolide obulawulwayo kuqinisekisa ukunamatheliswa okuthembekile kwesixhumi phakathi nesikhathi somkhiqizo.

Ukuhlanganiswa: Isixhumi se-USB-C sinama-signal pad angu-24 kanye nama-shield/mounting pad angu-4 ku-pitch engu-0.5 mm. Ukwakheka kwe-stencil aperture ye-solder paste kubalulekile — i-over-deposit ibangela amabhuloho; i-less-deposit izimbangela ziyavuleka. Abahlanganyeli be-Assembly abanolwazi lokukhiqiza i-USB-C basebenzisa ukunciphisa i-stencil aperture ethile (ngokuvamile okungu-80–90% wendawo ye-pad) okuqinisekiswe emabhodini okuhlola ngaphambi kokukhiqizwa.

I-Highleap Electronics yakha ama-USB-C PCB kusukela ezingqimbeni ezine kuya kweziyi-12 anekhono le-HDI. Thumela umklamo wakho we-USB-C PCB ukuze uthole isilinganiso.

Okuhlobene: Umhlahlandlela wokuklama we-USB hub PCB · Ukukhetha umenzi we-USB hub PCB · Imikhiqizo ye-USB converter · Umhlahlandlela we-USB port expander