I-Hard Drive PCB: Umsebenzi, Izindlela Zokwehluleka, kanye Nokukhiqiza

I-PCB yedrayivu eqinile iyibhodi eluhlaza eboshwe ngaphansi kwe-HDD engu-3.5″ noma engu-2.5″. Iqhuba injini, ibeke amakhanda, iphathe isiteshi sokufunda, futhi ikhuluma ne-host nge-SATA - futhi ngenxa yokuthi ingxenye yayo ilinganiswe ngendlela ekhethekile kuleyo drayivu eyodwa, awukwazi ukulungisa idrayivu efile ngokuyibopha ebhodini elivela kumodeli efanayo. Lo mhlahlandlela uchaza kahle ukuthi ibhodi lenzani, ukuthi kungani ukushintshana okuqondile kuvame ukwehluleka, izici zokukhiqiza ezenza la mabhodi abe nzima, nokuthi i-Highleap Electronics yakha kanjani ama-PCB nama-assemblies ebanga lokugcina.

1. Yini eyenziwa yi-PCB ku-hard drive?

I-PCB eku-hard drive iyibhodi le-elekthronikhi le-drive, futhi yenza imisebenzi emine: ijikeleza ama-plate nge-spindle motor engenamabhulashi, ihambisa ama-read/write heads nge-voice-coil actuator, ilungisa izimpawu ezincane ze-analog ezivela kuma-heads nge-preamp kanye ne-read channel, futhi iphatha i-interface ye-SATA (noma i-SAS) kanye ne-cache kwikhompyutha ephethe. Ngamafuphi, ama-platers agcina ama-bits kodwa i-PCB yiyona eguqula lawo ma-bits abe yidiski esebenzayo uhlelo lokusebenza olungayibona.

Ngokwemvelo, ibhodi le-HDD lesimanje liphethe uhlelo oluyinhloko olusebenzisa i-chip (isilawuli, esihlanganisa isilawuli se-hard disk, i-microprocessor, kanye nesiteshi sokufunda), i-chip ye-DRAM cache, i-IC yomshayeli wemoto eshintsha amaza aphezulu ku-spindle kanye ne-actuator, kanye ne-flash encane noma i-ROM holding firmware encane. Okubaluleke kakhulu, idatha ethile yokulinganisa kanye ne-adaptive - amapharamitha alungisa ibhodi ukuze lihambisane nezici eziqondile zamagnetic zamakhanda nama-plates ayo - ahlala kuleyo flash nakumlawuli. Leyo mininingwane yisona sizathu esenza isigaba esilandelayo sibaluleke kangaka.

2. Ungashintsha i-PCB ye-hard drive ukuze uthole idatha?

Cha — ukushintshanisa i-PCB kusuka kudrayivu yomnikelo efana nemodeli efanayo ngokuvamile ngeke kubuyise idatha yakho, futhi kungenza izinto zibe zimbi kakhulu. Amadrayivu anamuhla agcina ukulinganiswa okuguquguqukayo kwedrayivu ethile (ngokuvamile okubizwa ngokuthi “ama-adaptives”) ku-flash chip e-serial ebhodini nangaphakathi kwesilawuli, futhi lawa manani ahambisana namakhanda nama-platter aleyo drayivu eyodwa. Ibhodi yomnikelo ine-adaptives engalungile, ngakho-ke ngisho ne-PCB efanayo ngokomzimba izohluleka ukufunda ama-platter ngendlela efanele, futhi ukuxhuma nomshayeli wemoto ongahambisani kungacindezela amakhanda.

Uma ukuzama ukushintsha ibhodi ngochwepheshe, umkhuba ojwayelekile ukudlulisela i-ROM/flash chip yedrayivu yokuqala ebhodini labanikeli ukuze ama-adaptive afanele ahambe nayo - umsebenzi wokulungisa kabusha obucayi, hhayi ukushintshana kwe-plug-and-play. Ngemininingwane ebalulekile, indlela ephephile ilebhu yokubuyisa idatha ekhethekile kunokuba kube ukuhlola. Uma intshisekelo yakho esikhundleni salokho kuyi-trace eyonakele noma i-pad ephakanyisiwe ebhodini olilungisayo, leyo yinkinga ehlukile exazululwa amasu okulungisa ama-trace e-PCB ngokucophelela , futhi ukwakha kabusha ibhodi le-multilayer elingabhalisiwe kuyisizinda sobunjiniyela be-PCB reverse be-multilayer . Noma ngabe yikuphi, isifundo ukuthi ibhodi le-HDD lixhunywe ngokuqinile kudrayivu yalo futhi akuyona ingxenye ejwayelekile.

3. Yini eyenza kube nzima ukukhiqizwa kwe-HDD PCB

Ama-PCB e-hard drive afuna ukukhiqiza ngoba ahlanganisa ukusayina kwe-SATA okusheshayo, iziphetho zangaphambili ze-analog ezibucayi, i-motor drive enamandla kagesi, kanye nezilawuli ze-BGA eziqondile ebhodini elincane, elivame ukuba nezingqimba eziningi. Ngayinye yalezo zidonsela umklamo kumakhono okukhiqiza ahlukile, futhi ibhodi lezinga lokugcina kufanele liwanelise wonke ngesikhathi esisodwa:

• Umzila wejubane eliphezulu olawulwayo ovimbelayo. I-SATA isebenza njengama-differential pairs ngama-multi-gigabit rates, ngakho-ke ama-differential traces adinga i-impedance echaziwe ebekwe yi-stackup — umsebenzi oncike ku-tight izidingo zokuvimbela okulawulwayo kuhlangatshezwana nokuqanjwa.
• I-stackup yezingqimba eziningi. Ukuhlukanisa imisinga yemoto enomsindo kusuka kumasignali athambile e-preamp kanye ne-interface yesivinini esikhulu ngokuvamile kudinga I-PCB ye-multilayer ngezindiza zomhlabathi nezamandla ezizinikele.
• Ukuhlanganiswa kwe-BGA okune-pitch encane. Isilawuli i-SoC ngokuvamile siyi-BGA encane, engabekwa futhi ihlolwe ngokuthembekile kuphela ngomugqa we-SMT ochwepheshe kanye ne-X-ray.
• Ukuphela kobuso okuthembekile kokuxhumana. Oxhumana nabo bomphetho nama-connector pad badinga ukuqeda okuqinile nokuyisicaba, yingakho inqubo efana ENIG isiphetho esiphezulu kuvamile ezindaweni zokugcina izinto kanye nakumabhodi abathengi.

Lezi zici ezifanayo zibonakala kuma -PCB esimanje e-consumer-electronics , lapho amabhodi amancane, anesivinini esikhulu, anesignali exubile eyinto evamile kunokuba kube yinto engavamile.

4. Kungani ama-PCB e-hard drive ehluleka (nokuthi angaklanywa kanjani ngokumelene nawo)

Ama-PCB e-hard drive avame ukwehluleka ngenxa yokucindezeleka kukagesi ngokweqile — ukuqhuma kwamandla noma i-TVS diode ehlulekile ekhipha i-IC yomshayeli wemoto — kanye nokukhathala kokushisa okuqhekeka ama-solder joints eminyakeni eminingi yokujikeleza kokushisa. Umshayeli wemoto uyisisulu esivamile ngoba ushintsha amaza amakhulu futhi usebenza kakhulu, ngakho-ke ukuqhuma noma i-marginal solder joint lapho yikho okubulala ama-drive amaningi isikhathi eside ngaphambi kokuba ama-plate aguge.

Ukuklama ngokumelene nalezo zindlela zokwehluleka kumayelana kakhulu nokuphathwa kwamandla okuqinile kanye nokuhlanganiswa komsindo. Indlela yamandla ehlanzekile enokuvikelwa kwesikhashana okufanele ivimbela ukukhuphuka komoya ukuthi kungafiki kumshayeli; ukukhululeka okwanele kwethusi kanye nokushisa ngaphansi kwama-IC ashisayo kunciphisa ukuguquguquka kokushisa; kanye namajoyinti e-solder asezingeni eliphezulu - aqinisekisiwe kunokuba kucatshangelwe - amelana nokukhathala kokushisa. Lawo maphuzu amabili okugcina ayizinqumo zokukhiqiza kanye nalezo zokuklama, yingakho ukubamba iphethini ye-marginal footprint noma iphethini ye-thermal-pad ekubuyekezweni kokwenziwa kwangaphambi kokwakhiwa kukhokha kahle ngaphambi komthamo. Ngemva kokuhlanganiswa, i-AOI kanye ne-X-ray ziqinisekisa ukuthi amajoyinti anquma ukuthembeka kwesikhathi eside aqinile.

5. I-SATA, i-SAS, kanye nezidingo zokuqina kwesignali zamabhodi okugcina

Izixhumi zesitoreji ezifana ne-SATA ne-SAS zisebenza njengama-differential pair asheshayo, futhi ukuhlangabezana nobuqotho besignali yazo kuyingxenye eyodwa edinga kakhulu yokwakheka kwebhodi lesitoreji. I-SATA isebenza ngamanani edatha e-multi-gigabit ngaphezu kwe-differential pair eyodwa ngesiqondiso ngasinye, kuyilapho i-SAS iphakamisa amazinga aphezulu futhi ivame kuma-drive ebhizinisi - futhi kulawo majubane, i-trace geometry, hhayi nje i-schematic, inquma ukuthi isixhumanisi siyasebenza yini.

Imikhakha emithathu yokwakheka inquma impumelelo. I-differential pair kumele ibambe i-impedance echaziwe (ngokuvamile i-100 ohm differential) ebekwe ububanzi be-trace, isikhala, kanye nobukhulu be-dielectric, yingakho ibhodi lingenakwakhiwa ngaphandle kwe-stackup ehleliwe. Imizila emibili ye-pair ngayinye kumele ihambisane nobude ukuze izimpawu zifike ndawonye, ​​​​njengoba i-skew phakathi kwazo yonakalisa isignali ye-differential. Futhi ama-high-speed pair kumele abhekiselwe endizeni yomhlaba eqhubekayo futhi aqondiswe kude nemisinga ye-motor-drive enomsindo, okuyisizathu esisebenzayo sokuthi la mabhodi abe yi-multilayer. Ukufeza umgomo we-impedance kuncike kumenzi ophethe i-geometry echaziwe, umongo wanoma yikuphi ukwakhiwa kwe-controlled-impedance ; ukuphutha kubonakala njengamaphutha esixhumanisi noma i-drive evumelana nesivinini esisheshayo. Lezi zithiyo ezifanayo zibusa ezinye izixhumi ezisheshayo, ngakho-ke i-discipline idlulisela ngqo kunoma yimuphi umklamo we-multilayer high-speed.

6. Indlela i-Highleap eyakha ngayo ama-PCB nama-PCBA ebanga lokugcina izinto

I-Highleap ikhiqiza amabhodi ebanga lokugcina ngokuhlanganisa ukwenziwa kwezingqimba eziningi ezilawulwayo ezivimbela ukuvimba kanye ne-fine-pitch, i-X-ray-verified assembly — ingxube eqondile ibhodi le-HDD eliyidingayo. Ngokukhiqizwa kwe -PCB yezingqimba eziningi , i-stackup yakhelwe ukubamba i-SATA differential impedance ngenkathi ihlukanisa umsindo we-motor-drive kumasignali e-analog azwelayo, kanye nokuqedwa kwendawo okuhlala isikhathi eside kwezindawo zokuxhuma kanye nezindawo zokuxhumana.

Ngasohlangothini lokuhlanganisa, ukuhlanganiswa kwe-turnkey kuhlanganisa ukutholakala kwezingxenye ezivela eziteshini ezigunyaziwe, ukubekwa kwe-BGA okuqondile, kanye nokuhlolwa kwe-AOI kanye ne-X-ray ukuze kuhlolwe amalunga abalawuli afihliwe, hhayi ukuqagelwa. Ukuze uthole isitoreji esisha noma umklamo wedivayisi yedatha, ukuqinisekisa ukwakhiwa nge- prototype PCB esheshayo ngaphambi kokukala kugwema ukuthwala inkinga yokwakheka ibe yivolumu. Uma ucela isilinganiso, yabelana ngenani lezingqimba, imigomo ye-impedance yama-pair asheshayo, iphakheji yokulawula, kanye nokulindela kwakho kokuhlola ukuze isilinganiso sibonise ibhodi langempela.

7. Imibuzo Evame Ukubuzwa Nge-PCB Ye-Hard Drive

Ikuphi i-PCB ku-hard drive?

Ifakwe ngaphansi kwedrayivu, ngokuvamile ibanjwe ngezikulufo ezimbalwa, uhlangothi lwengxenye lubheke ngaphakathi lubheke endaweni yokukhipha. Uyayisusa ngokuvula lezo zikulufo bese uvula isihlalo sesixhumi esincane esisixhumanisa ne-motor kanye ne-head assembly.

Ingabe ama-SSD ane-PCB efana nama-hard drive?

Yebo, kodwa kuhlukile. I-SSD empeleni iyi-PCB egcwele isilawuli, i-DRAM, kanye nama-flash chip e-NAND futhi ayinazo izingxenye ezihambayo, ngakho-ke ibhodi layo alinawo i-spindle noma i-actuator drive — yize isathembele ekuqondisweni kwesivinini esiphezulu kwe-controlled-impedance ukuze isebenzise i-interface yayo.

Ngingayithola kanjani i-PCB yomnikelo ehambisanayo ye-hard drive?

Ibhodi labanikeli akumele lifane nemodeli yedrayivu kuphela kodwa ngokuvamile ibhodi elibukeziwe kanye nenombolo yekhodi yebhodi ephrintiwe ku-PCB. Ngisho nalapho i-ROM noma i-flash chip yebhodi yokuqala ngokuvamile kufanele ithuthelwe kumnikeli, ngoba idatha yokulinganisa ihlukile kudrayivu yakho.

Ingabe i-PCB ye-hard drive ingalungiswa esikhundleni sokushintshwa?

Ngezinye izikhathi — ingxenye eshile njenge-TVS diode noma i-trace eyonakele ingalungiswa uchwepheshe, okuvame ukuba kuphephile kune-donor swap ngoba igcina ama-electronics okuqala alinganisiwe edrayivu. Umonakalo we-trace kanye ne-pad ungalungiswa; isilawuli esihlulekile ngokuvamile asilungiswa.

Iyini i-chip ku-PCB ye-hard drive egcina i-firmware?

Kuyi-chip encane ye-serial flash noma ye-ROM ephethe ingxenye ye-firmware yedrayivu kanye nokulinganiswa kwayo okuguquguqukayo. Ngenxa yokuthi lezo zi-adaptive zihambisana nedrayivu ethile, le chip iyingxenye yokudluliselwa kochwepheshe bokubuyisa idatha lapho befaka ibhodi labanikeli.

Kungani i idrayivu yangaphandle yangaphandle PCB have a USB-to-SATA chip?

Ama-drive angaphandle naphathekayo engeza i-chip yebhuloho eguqula isikhombimsebenzisi se-SATA sedrayivu sibe yi-USB. Uma idrayivu enjalo yehluleka, ibhuloho ngezinye izikhathi lingadlulwa ngokuxhuma idrayivu engenalutho ngqo nge-SATA, okuyisinyathelo esivamile sokutakula.