Iyini i-Multilayer PCB: ukukhiqiza nokuklama

Ngokungafani nama-PCB anezingqimba ezimbili noma ezinezingqimba ezimbili, ama-PCB anezingqimba eziningi aqukethe izingqimba ezintathu noma ezifika ku-60 zethusi, ezihlukaniswe ngezinto zokuvikela bese zihlanganiswa ndawonye ngaphansi kokushisa nokucindezelwa. Lezi zingqimba ezengeziwe zivumela imiklamo yesekethe eyinkimbinkimbi futhi ebanzi, evumela inani elikhulu lezingxenye ebhodini elincane. Leli khono libalulekile kuma-elekthronikhi anamuhla, lapho amadivayisi eba mancane khona kodwa abe namandla kakhulu. Ukuvela kwama-PCB anezingqimba eziningi kuqhutshwa yisidingo semikhiqizo ye-elekthronikhi esebenza kahle, ethembekile, nencane. Nge- RO4450T bondply yamabhodi e-RF anezingqimba eziningi , ubukhulu be-bonding-layer kumele bubuyekezwe ku-stackup eqediwe kunokuphathwa njengegama lokuthenga kuphela.

Ukwakhiwa Kwezingqimba Ezivamile

• Izendlalelo ezingu-4-6 - ubunzima obuphansi kuya kokulinganisela
• Izendlalelo ezingu-8-10 - amabhodi edijithali ayinkimbinkimbi
• 12-16 izendlalelo - i-RF ethuthukisiwe kanye nokucubungula idatha
• 20+ izendlalelo - ukuxhumana okuminyene kakhulu
• Izendlalelo ezingu-60+ - ubuchwepheshe be-HDI obusezingeni eliphezulu

Inqubo Yokukhiqiza yama-PCB amaningi

1. Ukwakhiwa Kwesendlalelo Sangaphakathi

Iphethini ye-Photolithographic isetshenziswa kuma-laminates agqoke ithusi ukuze kuchazwe ukulandelana kwesifunda, okulandelwa ukucisha ithusi elingafuneki, ukwengeza okuhlosiwe kokubhaliswa kongqimba kanye nezimbobo zamathuluzi, ukuhlolwa kukagesi kokulandela umkhondo, nokulungiswa kwendawo yokucwenga.

2. Lamination Lamination

Izendlalelo eziningi ziboshelwe kusetshenziswa umshini wokunyathelisa we-sheet lamination, ngohlelo lwe-stackup of cores, prepregs, copper, kanye nama-dielectrics, aphulukiswe ngaphansi kwezinga lokushisa nokucindezela ukwenza i-laminate eqinile.

3. Drill Imigodi

Ukubhola okunembayo okuphezulu kudala ithuluzi kanye nezimbobo ezinokubhaliswa okunembile kwesendlalelo ngasinye.

4. Imbobo Plating

I-electroless copper plating elandelwa yi-electrolytic copper plating yakhela ithusi ezingqimbeni zangaphakathi nezimbobo ezibhoboziwe.

5. Ukwenziwa Kwezendlalelo Zangaphandle

Ukusetshenziswa kwemaski yokusoda ewuketshezi ethwebula izithombe , ukuphrinta izimpawu zokuhlonza, ukufota kanye nokuqopha isekethe yangaphandle, kanye nokuhambisa iphaneli kuma-PCB ngamanye.

6. Ukuhlola Nokuqinisekisa Ikhwalithi

Kubandakanya ukuhlola okuzenzakalelayo kokubona, ukuhlola ukuxhumeka kwenetha, i-impedance, amandla kagesi aphezulu, nokuhlolwa kokusebenza, kanye nokulawula ikhwalithi yobukhulu.

Ukucatshangelwa kwe-Multilayer PCB Design

Inombolo Yezendlalelo:

Ukunquma inani lezendlalelo kuyisinyathelo sokuqala ekwakhiweni kwe-PCB ye-multilayer. Isibalo sesendlalelo, esingaba sezendlalelo ezine kuye kweziyishumi noma ngaphezulu, sincike ebunkingeni bomklamo, isibalo sezingxenye, kanye nezidingo zokusebenza kukagesi.

Ukubekwa Kwengxenye

Besebenzisa isofthiwe yesakhiwo se-PCB, abaklami bahlela izingxenye futhi bachaze ukuxhumana kukagesi. Ukuhlelwa kufanele kuthuthukise umzila wesignali, kunciphise ukuphazamiseka, futhi kuqinisekise ukunqanyulwa kokushisa.

Umzila Wesiginali

Umzila kagesi uhlanganisa ukucacisa ububanzi, isikhala, kanye nokwabiwa kwesendlalelo sokuxhunywa, kugxilwe ebuqotho besignali, ukunciphisa inkulumo-mpikiswano, nokuvimbela ukubonakaliswa kwesignali.

Ukucatshangelwa kwe-Layer Stacking:

Izendlalelo kufanele zipakishwe ngezinombolo ezilinganayo ezikhethwayo, futhi zonke izingqimba zesignali kufanele zibe seduze nendiza yaphansi ngangokunokwenzeka. Ukuqondiswa kwezintambo kungqimba olufanayo lwesignali kufanele kuhambisane. Ukukhethwa kwenombolo yezendlalelo nakho kuncike ohlotsheni lwesiginali abadinga ukuyidlulisela, ihlukaniswe njengemvamisa ephezulu, imvamisa ephansi, umhlabathi, noma amandla.

Ukuhlelwa kwengxenye kanye nesixhumi esibonakalayo:

Ngokufanelekile, izingxenye kufanele zibekwe ohlangothini olulodwa, futhi isikhundla nokuma kwezingxenye zesixhumi esibonakalayo kufanele kuhlelwe ngokufanele. Izingxenye ezixhumene kakhulu nogesi zibekwe kahle kakhulu.

I-Gerber File Generation:

Uma umzila kagesi usuchaziwe, kukhiqizwa amafayela e-Gerber, aqukethe ulwazi mayelana nokupakishwa kongqimba, ukuxhunywa kukagesi, ukubekwa kwengxenye, nolunye ulwazi lokuklama.

Ukukhiqiza:

Umkhiqizi usebenzisa amafayela e-Gerber ukuze akhe ama-photomasks, abese esetshenziselwa ukwakha izendlalelo ze-PCB ngazinye. Lezi zendlalelo zenziwe nge-laminated ukuze zakhe i-PCB ye-multilayer PCB.

Ukucatshangelwa Kobuqotho Besiginali ye-Multilayer PCB

Isitaki Sesendlalelo: Ukuhlela kahle isitaki sesendlalelo kubalulekile. Izendlalelo zesignali nephansi kufanele zihlanganiswe eduze ukuze kuncishiswe i-impedance kanye nokuboniswa kwesignali.

I-Trace Routing: Imikhondo kufanele ihanjiswe ukuze kugwenywe ukuphazamiseka kwe-crosstalk kanye ne-electromagnetic interference (EMI). Ukugcina izindlela zesignali zimfushane futhi ziqondile kuthuthukisa ubuqotho besignali.

Ukulawulwa Kokuvinjelwa : Ukugcina ukuvinjelwa okuqhubekayo ku-PCB kuvimbela ukuphambuka kwesignali kanye nokubonakaliswa kwayo.

Ama-Decoupling Capacitor: Lezi zibalulekile ekulawuleni ubuqotho bamandla kanye nokunciphisa umsindo ezindizeni zikagesi.

Ngedizayini: Idizayini nokubekwa kwemizila yesignali ye-vias futhi kufanele ithuthukiswe ukuze kugcinwe ubuqotho besignali.

Izindleko zokucatshangelwa kwe-Multilayer PCB

Ukuba yinkimbinkimbi nokubala Kwezingqimba: Izendlalelo eziningi nobunkimbinkimbi ekwakhiweni kwandisa izindleko zokukhiqiza.

Izinto Ezisetshenziswayo: Izinto ezisezingeni eliphezulu noma ezikhethekile zinganyusa izindleko zizonke.

Amasu Okukhiqiza: Izindlela zokukhiqiza ezithuthukile zemiklamo eyinkimbinkimbi nazo zingangeza ezindlekweni.

Usayizi we-PCB: Ama-PCB amakhulu adinga izinto zokwakha ezengeziwe nokucubungula, okwandisa izindleko.

Ubuningi: Ukwenziwa kokukhiqiza okukhudlwana kunganciphisa izindleko ngeyunithi ngayinye ngenxa yesilinganiso somnotho.