Umhlahlandlela Ophelele Wokusekela Ukukhiqiza i-PCB Ejwayelekile Ephezulu

Usekelo lokukhiqiza i-PCB oluvame kakhulu

Umfanekiso 1. I-PCB Enemvamisa Ephakeme

Okuqukethwe

  1. Isikhathi Sokusebenzisa Usekelo Lokukhiqiza - nokuthi Kwenzekani Uma Ungakwenzi
  2. Ukusekelwa Kobunjiniyela Be-Stackup: Ukuvumelanisa Imodeli Yakho Yokulingisa Neqiniso Lokukhiqiza
  3. I-DFM Ekhethekile ye-HF: Lokho Ukubuyekezwa Okujwayelekile kwe-DFM Okuphuthelwa Yizibhedlela Eziphezulu Zemvamisa
  4. Ushintsho Lohlobo Oluvela Ekukhiqizeni: Igebe Lokusekela Elibulala Amashejuli
  5. Ukuhlanganiswa Kokwakhiwa Nokuhlanganiswa Kwamabhodi E-HF
  6. Izimo Zangempela Lapho Ukusekelwa Kokukhiqiza Kuvimbele Ukuhluleka Kwephrojekthi
  7. Imodeli Yokusekela Ukukhiqiza ye-Highleap

Ithimba lobunjiniyela laklama ibhodi le-antenna ye-array enezigaba ezingama-24 GHz. Ukulingisa kwabikezela ukulahlekelwa kokufakwa okungu-0.6 dB/intshi kunethiwekhi yokuphakelayo. Iphrothokholi yokuqala yalinganisa okungu-1.1 dB/intshi — cishe kabili ukulahlekelwa okwakubikezelwe. Imbangela eyinhloko: ukulingisa kwasebenzisa i-Dk ejwayelekile = 3.48 ye-laminate ekhethekile yokulahlekelwa okuphansi enethusi elibushelelezi; ibhodi elenziwe lalinoDk yangempela = 3.53 kuleyo ndawo yokukhiqiza enethusi elijwayelekile le-ED (Rz = 6 µm). Ububanzi bokulandelela babulungile, i-impedance yayingaphakathi kokubekezelelana, kodwa isabelomali sokulahlekelwa sasingekho ngoba imodeli yokulingisa ayizange ibonise iqiniso lokukhiqiza. Ukusekelwa kokukhiqiza kwe-PCB okuvame kakhulu kukhona ukuvimbela lolu hlobo lokwehluleka — ngokunikeza idatha, impendulo, kanye nokubambisana kobunjiniyela okuvala igebe phakathi kwenhloso yokuklama kanye nomphumela owenziwe. Lesi sihloko sichaza ukuthi ukwesekwa kokukhiqiza kuhlanganisa ini kumaphrojekthi e-PCB avame kakhulu nokuthi kufanele kusetshenziswe nini.

Thola Isilinganiso Esisheshayo

1. Nini Ukufaka Isicelo Sokusekela Ukukhiqiza — nokuthi Kwenzekani Uma Ungakwenzi

1.1 Iphuzu Elifanele Lokuzibandakanya: Incazelo Yokuqoqwa Kwezinqwaba

Isikhathi esibaluleke kakhulu sokuxoxisana nethimba lobunjiniyela bomkhiqizi yingesikhathi sokuchazwa kwe-stackup — ngaphambi kokuthi uqondise umkhondo owodwa. Kulesi sigaba, umenzi angenza lokhu:

  • Qinisekisa ukutholakala kwezinto ezibonakalayo ekujiyeni okuthile kanye nokucushwa kwethusi okudingayo
  • Nikeza amanani alinganisiwe e-Dk/Df avela ezindaweni zabo zokukhiqiza zakamuva (hhayi amagama eshidi ledatha)
  • Qinisekisa ukuthi ububanzi bakho bokulandelela obuphakanyisiwe bufinyelela ukuvimba okuqondiwe enkambisweni yabo (usebenzisa izici zabo ze-etch kanye nobukhulu bangempela be-dielectric)
  • Maka izinkinga zokubopha i-hybrid stackup ngaphambi kokuthi unikeze isabelo sesendlalelo
  • Ncoma uhlobo lwe-copper foil olufanele imvamisa yokusebenza kwakho

Uma ulinda kuze kube yilapho i-Gerber ithumela ukuze ixhumane nomkhiqizi, zonke lezi zinto ziba yi-oda lokushintsha — ezidinga ukuguqulwa kwesakhiwo, ukulingisa kabusha, kanye nokulibaziseka kweshejuli.

1.2 Izindleko Zokuthembisana Sekwephuzile

Indawo Yokuzibandakanya Izinkinga Ezijwayelekile Ezitholiwe Umthelela Weshejuli I-Cost Impact
Ngesikhathi sencazelo ye-stackup Ukushintshaniswa kwezinto, ukulungiswa kobubanzi bokulandelela Akukho — izinguquko ezenziwe ngaphambi kokuhlelwa Akukho zindleko ezengeziwe
Ngesikhathi sokuhlelwa (ngaphambi kwe-Gerber) Ukulungiswa kwejiyometri, ngokushintsha kwesikhala Izinsuku ezingu-1-3 zokushintsha ingxenye yendlela Isikhathi sobunjiniyela bokuhlela
Ekuthunyelweni kweGerber (DFM) Izinguquko ze-stackup, ukubambezeleka kokuthola izinto ezibonakalayo Izinsuku ezi-5–15 zokuklama kabusha + ukuphindaphinda kwe-DFM Izindleko eziphelele zokuphinda ujikeleze ($5K–$20K)
Ngemva kokuthi i-prototype yehlulekile ukuhlolwa Ukuhlaziywa kwembangela eyinhloko, ukwakhiwa kabusha okuphelele Amaviki angu-3-8 okulungisa iphutha + ukuphinda kwenziwe kabusha $10K–$50K+ (amabhodi + isikhathi sobunjiniyela)

Ukuzibandakanya kusenesikhathi kumahhala. Ukuzibandakanya sekwephuzile kuyabiza.

2. Ukusekelwa Kobunjiniyela Be-Stackup: Ukuvumelanisa Imodeli Yakho Yokulingisa Neqiniso Lokukhiqiza

2.1 Amanani e-Dk/Df alinganisiwe vs. Datasheet

I-laminate ekhethekile ephansi yokulahlekelwa ishicilela i-Dk = 3.48 ±0.05 ye-laminate ekhethekile ephansi yokulahlekelwa ku-10 GHz. Lolo hlu lwe-±0.05 lusho ukuthi izindawo zokukhiqiza zangempela zingalinganisa noma yikuphi kusuka ku-3.43 kuya ku-3.53. Ku-microstrip engu-50Ω, lolu hlu lwe-Dk lubangela ukushintshashintsha kwe-impedance okungaba ngu-±1.5Ω - okungu-3% wethagethi. Uma ukubekezelela kwakho kwe-impedance kungu-±5%, lolu shintsho olulodwa ludla ngaphezu kwengxenye yesabelomali sakho sokubekezelela ngaphambi kokuba kufakwe noma yikuphi ukushintshashintsha kokukhiqiza.

Usekelo lokukhiqiza lubhekana nalokhu ngokuhlinzeka:

  • I-Dkt ethize yelothi: I-dielectric constant elinganisiwe kusukela ku-substrate lot yangempela ezosetshenziselwa amabhodi akho
  • Isilinganiso sokukhiqiza uDkt: Inani elimaphakathi le-Dk kuzo zonke izindawo eziningi zokukhiqiza zakamuva, liwusizo kakhulu ekuhleleni ukukhiqiza okuqhubekayo
  • Idatha ye-Df: Isici sangempela sokushabalalisa sokulingisa ukulahlekelwa, ikakhulukazi kuzinhlelo zokusebenza ezibhajethiwe zokulahlekelwa

2.2 Idatha ye-Etch Factor yokwenza ngcono ububanzi be-Trace

I-field solver yakho ibala i-impedance ngokusekelwe kububanzi be-trace obucacisile. Umenzi wenza i-trace ngokuqopha ithusi, akhiqize ubukhulu obuncane kanye ne-bottom ebanzi kunomsebenzi wobuciko. Idatha ye-etch factor yomenzi ikutshela ngqo ukuthi kufanele usebenzise isinxephezelo esingakanani - noma ngokunenzuzo, i-field solver yomenzi ifaka i-etch factor yayo ukuze income ububanzi be-artwork trace obukhiqiza i-target impedance yakho.

Isibonelo: Ufuna i-50Ω ku-laminate ekhethekile ephansi yokulahlekelwa, i-core engu-0.508 mm, ithusi elingu-1 oz. Ukulingisa kwakho kuncoma ububanzi be-trace obungu-0.305 mm usebenzisa i-geometry engunxande kanye ne-Dk = 3.48. I-field solver yomenzi, esebenzisa i-geometry ye-trapezoidal ene-etch factor yayo elinganisiwe kanye ne-Dk = 3.52 kusuka ku-current lot, incoma ububanzi bomsebenzi wobuciko obungu-0.318 mm. Umehluko ongu-0.013 mm uhumusha ku-2.2Ω impedance shift — ngokusobala ibalulekile ekubekezeleleni okungu-±5%.

2.3 Isiqondiso Sokubopha I-Hybrid Stackup

Akuzona zonke izinto ezikhethekile ezilungiselelwe i-laminate/FR4 hybrid ezikhiqizwa ngokulinganayo. Ithimba lobunjiniyela lomkhiqizi lingaqinisekisa:

  • Yimaphi amalungiselelo okubopha abawaqinisekisile ngenhlanganisela yakho yezinto ezibonakalayo
  • I-Dk yesendlalelo sokubopha (okumelwe ifakwe ku- imodeli ye-stackup)
  • Kuyadingeka yini ukuthi ukukalwa kobuciko obuhambisana ne-CTE kudingeke yini ukuze kubalwe izendlalelo zakho kanye nokuhlanganiswa kwezinto ezibonakalayo?
  • Ukunemba okuphezulu kokubhaliswa okufinyelelekayo kokwakhiwa kwe-hybrid

3. I-HF-Specific DFM: Lokho Ukubuyekezwa Okujwayelekile kwe-DFM Okuphuthelwa Yizibhedlela Eziphezulu Zemvamisa

3.1 I-DFM ejwayelekile vs. i-HF DFM

Ukubuyekezwa okujwayelekile kwe-DFM kuhlola ububanzi/isikhala esincane sokulandelela, indandatho ejikelezayo, ukuvuleka kokubhoboza kuya ethusini, uhlaka lwebhodi, kanye nokufakwa kwamaphaneli. Lokhu kubamba ukwephulwa kwe-geometry ngokumelene nemithetho yokukhiqiza ejwayelekile. Ukusekelwa kokukhiqiza okuvame kakhulu kunezela ukubuyekezwa okubucayi okungaphuthelwa nhlobo yi-DFM ejwayelekile:

  • Imaski ye-Solder kuma-RF traces: I-DFM ejwayelekile ayifaki uphawu lwe-solder mask emboza imigqa yokudlulisela — ngoba kumabhodi e-FR4 akunandaba. Kumabhodi e-HF angaphezu kwe-6 GHz, i-solder mask kuma-traces e-RF inezela ukulahleka okungu-0.1–0.3 dB/intshi futhi ishintsha i-impedance engu-2–5Ω. I-HF DFM imaka lokhu futhi incoma izindawo zokukhipha i-solder mask ezikhethiwe.
  • Ukususwa kwe-trace-to-board-edge ku-PTFE: Ubuncane obujwayelekile bungu-0.25 mm. Ama-substrate e-PTFE akhipha ama-chip amaningi ngesikhathi sokuhambisa, okudinga ubuncane obungu-0.5–0.75 mm. I-HF DFM ibamba lokhu ngaphambi kokuba umonakalo womphetho ubhubhise imikhondo ebalulekile ye-impedance eduze komngcele webhodi.
  • Ngokuhlolwa komthelela we-stub: I-DFM ejwayelekile ayihloli ngama-stubs ngoba awathinti amabhodi e-FR4 kuma-frequency ajwayelekile. I-HF DFM ikhomba ama-vias lapho ubude be-stub budlula khona u-λ/10 kuma-frequency akho okusebenza futhi incoma ukubhoboza emuva ngama-depth target athile.
  • Ukuqinisekiswa kwesikhala ngokusebenzisa i-ground: I-DFM ejwayelekile ayihloli ukuthi ngabe umhlabathi odlula ngocingo oluzungeze i-CPW noma izakhiwo ze-stripline uyahlangabezana yini nesidingo sesikhala esingu-λ/10 sokucindezelwa kwemodi.
  • Ibhalansi yethusi nezinto ezixubile ze-CTE: I-DFM ejwayelekile ihlola ibhalansi yethusi eyisisekelo; i-HF DFM ihlola ibhalansi yethusi icabangela izici ezahlukene ze-CTE ze-laminate ekhethekile ene-low-loss uma kuqhathaniswa nezendlalelo ze-FR4, ezithinta i-warpage ngendlela ehlukile kune-stackups efanayo.
  • Ukushisa ngokusebenzisa ukusebenziseka ku-PTFE: Ama-substrate e-PTFE anemikhawulo ephansi ngesilinganiso se-aspect kune-FR4 ngenxa yemikhawulo ye-plasma desmear. I-HF DFM ikhombisa ukushisa ngama-array adlula isilinganiso se-aspect esingafinyeleleka.

3.2 Umphumela we-DFM ongasetshenziswa

I-HF DFM ewusizo ayigcini nje ngokumaka izinkinga - inikeza izixazululo. Entweni ngayinye ephawulwe, ithimba lobunjiniyela lomkhiqizi kufanele licacise: ukuguqulwa okuqondile okudingekayo, umthelela wokusebenza uma ukuguqulwa kungenziwanga, nokuthi ukuguqulwa kudinga ukuvunyelwa kwamakhasimende noma kuwela ngaphansi kokulungiswa kwe-DFM okugunyazwe kusengaphambili.

I-PCB Yomhlaba Wonke Yobumba

Umfanekiso 2. Usekelo Lokukhiqiza lwe-PCB Ejwayelekile Ephezulu

4. Ushintsho Lohlobo Oluvela Ekukhiqizeni: Igebe Lokusekela Elibulala Amashejuli

4.1 I-Prototype Isebenzile — Ukukhiqiza Akusebenzi

Ukuqaliswa kwephrothokholi yamabhodi angu-5-10 kuvame ukuphumelela ngoba umenzi ukhetha amaphaneli ngesandla, anikeze opharetha abanolwazi, futhi asebenza emgqeni olayishiwe kancane. Amanani okukhiqiza — amabhodi angu-100, 500, noma angu-1,000+ — agcizelela inqubo ngendlela ehlukile. Ukucindezela kwe-lamination kusebenza ngomthamo, imigqa ye-etch isebenza njalo, futhi ukuhlukahluka kwephaneli kuya kwephaneli kuyanda. Ngaphandle kokusekelwa okufanele kokushintsha, indawo yokukhiqiza iletha izici ezihlukile zokungavimbeli kanye nokulahlekelwa kunephrothokholi eqinisekisiwe.

4.2 Okubandakanya Ukusekelwa Kokuguquka

  • Idokhumenti yepharamitha yenqubo yesihloko sokuqala: Izinga lokushisa/ingcindezi/indawo yokuhlala, ukuhlushwa okucacile kanye nesivinini somugqa, isilinganiso samandla/isikhathi/igesi eplasma — wonke amapharamitha akhiqize i-prototype ephumelelayo, aqoshwe ukuze kukhiqizwe kahle ngesikhathi sokukhiqiza.
  • Ukusungulwa kwe-SPC: Imikhawulo yokulawula inqubo yezibalo isethwe kusetshenziswa idatha ye-prototype kanye neyangaphambi kokukhiqiza. Ukuvinjelwa okulinganiswe kuwo wonke amaphaneli okukhiqiza kudwetshwa ngokumelene nemikhawulo yokulawula. Ukuzulazula kuyatholwa futhi kulungiswe ngaphambi kokuba amabhodi athunyelwe ngaphandle kwe-spec.
  • Ukuqinisekiswa kwamandla enqubo: Ukuhlaziywa kwe-Cpk kuwo wonke amaphaneli okuqala okukhiqiza ayi-10-20 ukuqinisekisa ukuthi inqubo igxile futhi iyakwazi ukukhiqiza ngobuningi — hhayi nje esikalini se-prototype
  • Imigomo yokwamukelwa kwelothi: Izindlela zokupasa/zokwehluleka ezibhalwe phansi ezidlula ubuncane be-IPC ukuze zifake izilinganiso ezithile ze-HF (ukubekezelelana kwe-impedance, umkhawulo wokulahlekelwa kokufakwa, ukufana kobubanzi bokulandelela)

4.3 Ukugcina Amathuluzi Nomsebenzi Wobuciko

Kuma-oda okukhiqiza aphindaphindwayo, umenzi ugcina wonke amathuluzi: amathuluzi esithombe, izinhlelo zokubhoboza, ubuciko bokunxephezela i-etch, amaphrofayili e-lamination, kanye nemiklamo yekhuphoni ye-impedance . Ukuqaliswa kokukhiqiza okulandelayo kuqala kusukela kumapharamitha aqinisekisiwe kunokuphinda kuthuthukiswe kusukela ekuqaleni. Lokhu kususa izindleko ze-NRE kanye nesikhathi sokusetha ubunjiniyela ku-oda ngalinye eliphindaphindwayo.

5. Ukuhlanganiswa Kokwakhiwa Nokuhlanganiswa Kwamabhodi E-HF

5.1 Kungani Lokhu Kuhlanganisa Kubalulekile

Amabhodi amaningi anemvamisa ephezulu azohlanganiswa nezingxenye. Inqubo yokuhlanganisa ithinta ibhodi ngendlela ehlukile kunethinta i-FR4 ejwayelekile:

  • I-PTFE warpage ngesikhathi sokugeleza kabusha: Ama-substrate e-PTFE anokuqina okuphansi kune-FR4. Ngesikhathi sokugoqa kabusha, izindawo ezingasekelwa zingase zigobe ngale kwemingcele ye-IPC, okubangela ukuthunjwa kwamatshe ezingxenyeni ezincane ezingasebenzi kanye namajoyinti avulekile kumaphakheji e-BGA/QFN.
  • Ukuzwela kwe-thermal: Amabhodi e-hybrid e-laminate akhethekile ane-low loss anezinto ezixubile ze-CTE asabela kuma-gradient okushisa okugeleza kabusha ngendlela ehlukile kune-FR4 efanayo. Ithimba lokukhiqiza lingacacisa izinga lokushisa eliphakeme kakhulu lokugeleza kabusha futhi lincome izindawo zokusekela i-pallet noma izinto zokwakha.
  • Ukuhambisana kokuqeda kobuso: The isiphetho sendawo okukhethiwe ngesikhathi sokwenziwa (i-ENIG, isiliva lokucwilisa, i-OSP) kunquma i-chemistry yokunamathisela i-solder kanye nephrofayili yokugeleza kabusha. Lesi sinqumo kufanele sihlanganiswe phakathi kokwenziwa nokuhlanganiswa — hhayi ukwenziwa ngokwahlukene.

5.2 Inzuzo Yokukhiqiza Ehlanganisiwe

Uma ukwenziwa kanye nokuhlanganiswa kwe-SMT kwenzeka ngaphansi kophahla olulodwa, ithimba lokukhiqiza lixhumana ngqo nemiyalelo yokuphathwa kwe-substrate ethile emgqeni wokuhlanganisa. Amabhodi angenalutho adluliselwa ekuhlanganisweni ngaphandle kokupakisha, ukuthunyelwa, kanye nokuhlolwa kabusha — kususa izinsuku ezingu-2-5 zokuthutha phakathi kwabathengisi kanye nengozi yokulimala kokuphathwa kwezimpawu ze-RF eziveziwe. Lapho uhlola umhlinzeki webhodi lesifunda le-TMM , cela ubufakazi bokulandelela izinto, ukulawula inqubo kanye namarekhodi okuhlola ahambisana nokwakhiwa kwebhodi okuhlongozwayo.

Kumabhodi e-HF anemaski ekhethiwe ye-solder (ama-RF traces aveziwe), ukuphathwa kwezikhungo ezahlukene kuletha ukungcola kanye nengozi ye-oxidation. Ukudluliselwa kwezikhungo ezifanayo ezimweni ezilawulwayo kulondoloza ikhwalithi yobuso bethusi okuncike kuyo ukusebenza kwe-RF yakho.

I-PCB Yomhlaba Wonke Yobumba

Umfanekiso 3. Usekelo Lokukhiqiza lwe-PCB Ejwayelekile Ephezulu

6. Izimo Zangempela Lapho Ukusekelwa Kokukhiqiza Kuvimbele Ukuhluleka Kwephrojekthi

6.1 Isimo: I-5G Antenna Array — Ukufakwa Kwezinto Kulondolozwe Amaviki Ama-4

Ikhasimende lichaze i-Isola Astra MT77 ngebhodi le-antenna elingu-28 GHz. Ngesikhathi sokubuyekezwa kobunjiniyela be-oda langaphambilini, ithimba le-Highleap lithole ukuthi i-MT77 yayingekho esitokweni futhi yayidinga isikhathi sokulethwa samasonto ama-4. Isikhathi sokugcina sekhasimende sasingamaviki ama-3. Ukuhlaziywa kobunjiniyela kubonise ukuthi i-foil yethusi ephansi ye-laminate ekhethekile (Dk = 3.48, Df = 0.0031) ihlangabezane nezidingo zikagesi ze-prototype engaphansi kwe-array - futhi yayitholakala esitokweni. Ikhasimende livumile ukufakwa esikhundleni, lathola amabhodi e-prototype ezinsukwini eziyi-8, laqinisekisa iphethini ye-antenna, futhi kamuva lashintshela ku-MT77 ukuze likhiqizwe uma impahla ifika. Ngaphandle kwesincomo senye yezinto ezisebenzayo, iphrojekthi ngabe imile inyanga yonke. Ekukhiqizweni kwebhodi le-prototype le-TMM , ukutholakala kwezinto kusenesikhathi kanye nokubuyekezwa kwe-DFM kusiza ukunquma ukuthi yiziphi izilinganiso kanye nokuhlolwa kwe-RF okumele kuqinisekiswe ngaphambi kokwakhiwa okuphindaphindiwe.

6.2 Isimo: I-Radar engu-77 GHz — Ukukhethwa kwe-Copper Foil Kuvinjelwe Ukuphendula

Ikhasimende lithumele amafayela e-Gerber ebhodi le-radar yezimoto elingu-77 GHz elichaza “ithusi eli-1 oz” ngaphandle kokucacisa uhlobo lwe-foil. Umkhuba ojwayelekile emafektri amaningi kungaba ukusebenzisa ithusi elijwayelekile le-ED. Ithimba lobunjiniyela be-HF le-Highleap libike ukuthi i-foil ejwayelekile ye-ED (Rz = 6 µm) izokwengeza cishe ukulahlekelwa komqhubi okungu-0.4 dB/intshi ku-77 GHz uma kuqhathaniswa ne-foil ye-HVLP (Rz = 1.0 µm). Ubude benethiwekhi yokuphakelayo iyonke babungu-30 mm - okuhunyushwa kube ukulahlekelwa okwengeziwe okungu-0.5 dB okwakuzocindezela ukuzwela kwe-receiver ye-radar ngaphansi kwencazelo. Ikhasimende lavuma ithusi le-HVLP ngaphambi kokwenziwa. Iphrothokholi yasebenza ekwakheni kokuqala.

6.3 Isimo: Imojuli ye-Wi-Fi 6E — Ukuthuthukiswa Kwephaneli Izindleko Ezincishisiwe 18%

Ibhodi le-module le-Wi-Fi 6E lekhasimende lalinobukhulu obungu-12×15 mm. Ukufakwa kwamaphaneli kokuqala kwabeka amabhodi angu-80 ngephaneli ngayinye enezitimela ezijwayelekile kanye nomzila wamathebhu. Ukusekelwa kokukhiqiza kunconywe ukunciphisa ububanzi besitimela ngo-2 mm nokushintshela ekuhlukaniseni kwe-V-score, kufaka amabhodi angu-96 ngephaneli ngayinye - ukuthuthukiswa okungu-20% ekusetshenzisweni kwephaneli. Ku-oda lokukhiqiza lamayunithi angu-5,000 elinezendlalelo zangaphandle ze-laminate ezikhethekile eziphansi, lokhu konge u-$0.35 ngebhodi ngayinye - okulinganiselwa ku-$1,750 nge-oda, okwanele ukukhokha izindleko ze-NRE ngokuphelele.

7. Imodeli Yokusekela Ukukhiqiza ye-Highleap

I-Highleap Electronics inikeza ukwesekwa kokukhiqiza kwezinga lobunjiniyela njengengxenye ejwayelekile yawo wonke ama-oda e-PCB avame kakhulu — hhayi njengesengezo esikhokhelwayo:

  • Ukubonisana nge-Stackup: Ukuhlaziywa kwe-field solver kusetshenziswa i-Dk/Df eqinisekisiwe yokukhiqiza kanye nezinto ze-etch; ububanzi be-trace obunconywayo bubuyiselwe zingakapheli amahora angama-24 kusukela ekuthunyelwe kwe-stackup
  • Isiqondiso esibalulekile: Ukutholakala kwesitoko kuqinisekisiwe esigabeni sokubuza; izincomo ze-substrate ezihlukile ngokuqhathaniswa kokusebenza okulinganiselwe lapho izinto ezicacisiwe zingatholakali
  • I-DFM eqondene ne-HF: Isibuyekezo esihlanganisa zonke izinto eziseSigabeni 3 ngenhla — imaski yokwemboza ku-RF traces, i-PTFE edge clearance, ngokuhlolwa kwe-stub, umhlabathi ngobuningi, ibhalansi yethusi, kanye nokushisa ngokwenzeka
  • Imibhalo yesibonelo: Iphakheji yedatha yesihloko sokuqala ephelele ehlanganisa umbiko we-impedance TDR, izithombe zesigaba esiphambene, izitifiketi zezinto ezibonakalayo, kanye nemingcele yenqubo yokuguqulwa kokukhiqiza
  • Ushintsho ekukhiqizweni: Ukusethwa kwe-SPC, ukuhlaziywa kwe-Cpk, ukusungulwa kwezindlela zokwamukelwa kwenqwaba, kanye nokugcinwa kwamathuluzi ukuze kulandelwe uku-oda okuphindaphindiwe okungenamthungo
  • Ukuhlanganiswa kokuhlanganiswa: Ukukhiqiza-kuya-ukudluliselwa kwenhlangano ngamaphrofayili okugeleza kabusha kwe-substrate ethile, izincomo ze-fixture, kanye nokuqinisekiswa kokuhambisana kokuqedwa kwendawo/ukunamathisela kwe-solder

Xoxa ngephrojekthi yakho ye-HF PCB

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Masikwenzele ukuhlaziya kwe-DFM/DFA futhi sibuyele kuwe ngombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunikeze isaphulelo:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB