Ukukhiqiza Uhlobo Lwe-TMM PCB

I-prototype ye-TMM PCB kufanele yakhiwe ukuqinisekisa ingxenye ethile yomklamo we-RF ngaphambi kokuba ukukhiqizwa kuqandwe. I-prototype ingase ifakazele ukuhlanganiswa kwezinto, i-geometry ye-antenna, i-impedance, impendulo yesihlungi, ukulingana kwenhlangano noma isici esinzima semishini. I -prototype ye-Rogers TMM PCB iyibhodi lesekethe elakhiwe kuqala noma elakhiwe ngobunjiniyela elisetshenziselwa ukuqinisekisa i-RF, i-microwave, i-antenna, ukusebenza kokushisa noma kokukhiqiza ngaphambi kokukhiqizwa okugcwele. Kumadizayini e-TMM, i-prototype akuyona nje isampula yemishini. Kuyisivivinyo sokuqala sangempela sobukhulu be-dielectric, i-geometry eqoshiwe, i-impedance elawulwayo, ukulahlekelwa kokufakwa, i-antenna resonance, ukuqaliswa kwesixhumi, ngokushintshashintsha, ukuqeda kobuso kanye nokuziphatha kwenhlangano. Lapho i-prototype isebenzisa izici ezincane ze-Dk, ukuqinisekiswa kwenqubo ye-TMM10 kufanele kusebenzise i-geometry yangempela ekhishwe kanye nenqubo yokwamukelwa.

Ukuze uthole isilinganiso sephrothokholi yeRogers TMM, abathengi nonjiniyela kufanele bachaze inhloso yephrothokholi, amafayela, ukuqoqa, ukulinganisa kanye nezidingo zokudlulisa umkhiqizo ngaphambi kokuba kuqale ukukhiqiza. Ukuze uthole abashayeli bezindleko zezentengiselwano, bheka umhlahlandlela wamanani we-TMM PCB . Ukuze uthole inqubo yokukhiqiza, bheka umhlahlandlela wokukhiqiza we-TMM PCB.

Iphrothokholi ye-TMM kufanele iqinisekise ukuthi ukwakhiwa kwe-RF okukhishwe kungakhiqizwa futhi kulinganiswe ngaphambi kokuba amathuluzi okukhiqiza amiswe. Ukuhamba komsebenzi kwephrothokholi kuxhumanisa ukulawulwa kwe-stackup, ubukhulu obubalulekile kanye nokuqinisekiswa kwe-RF nedatha edingekayo yokudluliselwa kokukhiqiza.

Inhloso Yokukhiqiza Yesibonelo Se-Rogers TMM PCB

Iyini inhloso yesibonelo se-Rogers TMM PCB?

Inhloso ukunciphisa ubungozi ngaphambi kokukhiqizwa. Ukulingisa kungabikezela ukuvinjelwa, ukulahleka, impendulo yesihlungi noma ukufaniswa kwe-antenna, kodwa ibhodi elenziwe kuphela elibonisa umphumela wento yangempela, ukujiya kwe-dielectric, ukuqeda kwethusi, ukubekezelelana kwe-etch, i-launch geometry kanye nokuhlanganiswa. I-prototype iguqula ukucabanga kube idatha elinganisiwe. Bamba izidingo ze-stackup ezivunyiwe, amathuluzi kanye nokuhlolwa ngesikhathi sokwakha kokuqala ukuze i-oda eliphindaphindwayo lisebenzise incazelo efanayo yokukhiqiza ekhishwe. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa.

Kungani ukwenza i-prototyping kubaluleke kakhulu ku-TMM kunakuma-PCB avamile?

Ama-PCB amaningi ajwayelekile angadlula ngokusebenza noma ngabe izakhiwo ze-dielectric ziyahlukahluka. Amabhodi e-TMM avame ukusetshenziswa ngoba i-dielectric kanye ne-copper geometry ziyingxenye yesekethe ye-RF. Uma i-antenna ye-patch ishintshiwe, isihlungi sivaliwe noma ukuqaliswa kunokulahlekelwa okungalungile kokubuya, ukuhlolwa kokuqhubeka ngeke kubambe inkinga. I-prototype ivumela izinguquko zobunjiniyela kuyilapho inani kanye nokuzinikela kwezinto kusekuncane.

Yini okufanele iboniswe yisibonelo?

Kufanele kubonise izidingo eziyingozi kakhulu: ukuvimba okulawulwayo, ukulahlekelwa kokufakwa, imvamisa yokuzwakala, i-bandwidth, ukulahlekelwa kokubuya, ukufaniswa kwesigaba, ngokuthembeka, ukuziphatha kokushisa, inqubo yokuhlanganisa noma ukukhiqizwa kwe-hybrid stackup. I-prototype engenawo umgomo wokulinganisa ingachitha isikhathi. Ngaphambi koku-oda, chaza ukuthi yini ezokwamukelwa noma ezoshintshwa ngokusekelwe kumphumela.

Uma Kudingeka Imodeli Ye-Rogers TMM PCB

Kunini lapho umklamo omusha kufanele uqanjwe khona ngempela?

Iphrothokholi lapho ibhodi isebenzisa ibanga elisha le-TMM, i-stackup entsha, isici esisha se-antenna, i-topology entsha yesihlungi, ukuqaliswa okusha kwesixhumi, isabelomali sokulahlekelwa okuncane, isakhiwo esincane se-DK ephezulu, ukwakhiwa kwe-hybrid TMM/FR4 noma inqubo entsha yokuhlanganisa. Iphrothokholi lapho umphumela we-RF ungenakuqinisekiswa kusukela ekwakhiweni kwangaphambilini. Iphrothokholi lapho ukwehluleka kokukhiqiza kungabiza kakhulu.

Kunini lapho kungase kungadingeki khona i-prototype?

Iphrothokholi ezinikele ingase ingadingeki ekubuyekezweni okuncane komklamo wokukhiqiza olinganiswe ngaphambilini, ebangeni elifanayo le-TMM, i-stackup efanayo, ukuqeda okufanayo kanye ne-geometry efanayo ye-RF. Kuleso simo, ukusebenzisa into yokuqala encane noma i-pilot kungase kwanele. Uma kukhona i-geometry elawulwayo-impedance, ubukhulu be-antenna, i-resonator yesihlungi, ukuqeda noma izinto ezishintshayo, ukuqinisekiswa kwephrothokholi kufanele kucatshangelwe kabusha.

Ingabe i-prototype kufanele isebenzise i-stackup yokukhiqiza eqondile?

Yebo noma nini lapho umphumela uncike ekuziphatheni kwe-RF. I-stackup elula yokufaka esikhundleni ingaba usizo ekuhlolweni kokuqala kwemishini, kodwa ngeke iqinisekise ukungasebenzi kahle, ukulahleka, ukuzwakala kwe-antenna noma impendulo yesihlungi. Uma ukukhiqizwa kuzosebenzisa i-stackup ehlanganisiwe, i-prototype kufanele isebenzise i-stackup efanayo ehlanganisiwe ngaphandle kokuthi ithimba lobunjiniyela lihlukanise ngamabomu ukuqinisekiswa kwezinto nokuqinisekiswa komkhiqizo.

Ukuhlela Izibonelo Zebhodi Le-Rogers TMM RF kanye Ne-Microwave

Kufanele ihlelwe kanjani i-prototype ngaphambi koku-oda?

Qala ngokufaka ohlwini izinto ezingaziwa. Ingabe ukukhetha ingozi ye-Dk, ukubekezelelana kwe-etch, ukuqaliswa kwesixhumi, ukulungiswa kwe-antenna, ukulahlekelwa kokufakwa, ngokushintsha, ukuziphatha kokushisa noma ukuhlanganiswa? Bese uklama i-prototype ukuze uphendule leyo mibuzo. Engeza amakhuphoni okuhlola uma kudingeka. Shiya izici zokulungisa lapho kufaneleka khona. Khiya ukuphela kwendawo, iphrofayili yethusi kanye ne-stackup uma kuthinta umphumela olinganisiwe.

Ingabe amakhuphoni okuhlola kufanele afakwe?

Kumadizayini alawulwayo kanye nalawo azwela ukulahlekelwa, yebo. Ikhuphoni le-TDR liqinisekisa i-impedance. Ikhuphoni elide lomugqa wokudlulisela lisiza ukuhlola ukulahlekelwa kokufakwa. Ikhuphoni le-microsection lisiza ukuhlola i-plating kanye nokuthembeka. Ikhuphoni yokulungisa i-antenna noma i-element eyisipele ingasiza ekuqhathaniseni izinguquko zejometri. Amakhuphoni abiza imali kodwa avame ukonga i-respin yebhodi.

Zingaki izingcezu zeprototype okufanele zi-odwe?

Inani kufanele lihlanganise ukuhlanganiswa, ukuhlolwa, ukuhlolwa okubhubhisayo kanye namayunithi okusekelayo. Ibhodi elilodwa alivamile ngokwanele ukuthuthukiswa kwe-RF ngoba ibhodi elilodwa lingadliwa ngokuvivinywa kokuhlanganiswa, elilodwa ngokulinganisa, elinye ngokuguqulwa kanye nelinye ngokuhlaziywa kwe-microsection noma ukwehluleka. Inani elifanele lincike ohlelweni lokuhlola, izidingo zokuhlanganiswa, izidingo zokuhlolwa okubhubhisayo kanye nesabelomali.

Amafayela kanye nedatha ye-Stackup yesilinganiso se-Rogers TMM Prototype

Yimaphi amafayela adingekayo?

• Idatha yomklamo we-Gerber, ODB++ noma i-IPC-2581.
• Amafayela okubhoboza e-NC kanye netafula lokubhoboza.
• Umdwebo wokwenziwa ngokubuyekezwa.
• Ukufakwa kwezingqimba kanye nokufakwa kwezinto ezibonakalayo.
• Ithebula le-impedance elilawulwayo kanye nokubekezelelana.
• Izidingo zokuqeda ubuso kanye nemaski yokusongelwa.
• Ubukhulu obubalulekile bezimpawu ze-RF, i-microwave noma i-antenna.
• Izidingo zokuhlola kanye nemidwebo yamakhuphoni uma ikhona.

Yiluphi ulwazi lwe-stackup olubaluleke kakhulu?

Izinga le-TMM, ukujiya kwe-dielectric, isisindo sethusi, izindiza zokubhekisela, ukujiya kwebhodi eliqediwe kanye nokuphela kwendawo kubalulekile. Uma umklamo ulingisiwe, thumela izibikezelo ze-stackup ezilingisiwe. Umenzi angabe esehlola ukuthi i-stackup yokukhiqiza ehlongozwayo iyahambisana yini nomodeli. Uma kungenjalo, i-prototype ingaqinisekisa into engalungile.

Yini okufanele imakwe njengebalulekile?

Maka ububanzi be-trace ye-RF, izikhala ze-GCPW, ubukhulu be-antenna ye-patch, izikhala zokuxhuma, ubude be-resonator, ama-launch pad, nge-pitch yocingo, izindawo zokuvula phansi, izikhala kanye nezici zebhodi eliseduze nezakhiwo ezikhipha imisebe. Lezi yizici okungafanele zishintshwe ngesikhathi se-CAM ngaphandle kwemvume.

Ububanzi bezinto ezibonakalayo: Lesi sihloko sikhuluma ngokwenziwa kwe-PCB yesibonelo lapho umklamo ucacisa i-TMM laminate. Qinisekisa ibanga elivunyiwe, ukwakhiwa kanye nemibhalo yezinto ezibonakalayo ku-RFQ.

Izinketho Zokwakha Imodeli Ye-Rogers TMM

Iyiphi inketho yesibonelo ewusizo esheshayo?

Kwezindlela eziningi ze-RF nama-antenna, i-prototype ye-TMM enezinhlangothi ezimbili iyindlela ewusizo esheshayo ngoba iqinisekisa i-laminate, i-geometry yethusi, ukuqeda kanye nokusethwa kokulinganisa ngobunzima obuncane be-lamination. Lokhu kusebenza lapho umklamo wokukhiqiza nawo ulula noma lapho i-prototype iqinisekisa ngamabomu isakhiwo esisodwa se-RF.

Kunini lapho kudingeka khona i-prototype enezingqimba eziningi noma i-hybrid?

Sebenzisa i-prototype enezingqimba eziningi noma i-hybrid lapho ukusebenza komkhiqizo kuncike emigqeni efihliwe, izindiza zangaphakathi, ngokushintshashintsha, ukujiya kwe-lamination, ukuvikela noma ukusebenzisana phakathi kwezingqimba ze-RF nezingezona ze-RF. Uma ukukhiqizwa kuzosebenzisa ukwakhiwa kwe-TMM/FR4 hybrid, isampula elula ye-all-TMM ingase ingabonisi izinkinga ze-warpage, ukubhaliswa noma zokuguquka.

Ingabe ukuhlanganiswa kufanele kufakwe ku-oda lesibonelo?

Ukuhlanganiswa kufanele kufakwe lapho ukubekwa kwengxenye, ukusongelwa kokuqaliswa kwesixhumi, ukusekelwa komhlaba, isikhombimsebenzisi sokushisa noma ukulungiswa kwenethiwekhi yokufanisa kuthinta umphumela we-RF. Ukulinganiswa kwe-PCB okungenalutho kanye nokulinganiswa kwebhodi elihlanganisiwe kuphendula imibuzo ehlukene. Kuma-amplifiers wamandla, ama-LNA kanye nama-antenna anezingxenye ezifanayo, ukulinganiswa okuhlanganisiwe kuvame ukuba umphumela onenjongo.

Ukuhlolwa kwe-RF, i-Microwave kanye ne-Antenna kwama-Rogers TMM Prototypes

Yini okufanele ihlolwe kumodeli we-RF?

Hlola ukuvimba okulawulwayo, ukulahlekelwa kokufakwa, ukulahlekelwa kokubuya, ukuqaliswa kwesixhumi, ngokuguqulwa kanye nanoma yiziphi izindlela ezibalulekile ze-RF. Qhathanisa imiphumela yekhuphoni nezilinganiso zomkhiqizo. Uma ikhuphoni lidlula kodwa umkhiqizo wehluleka, inkinga kungenzeka ukuthi iwukwakheka noma i-geometry yokuguquka kunokuba ikhwalithi ye-laminate.

Yini okufanele ihlolwe kumodeli we-microwave?

Linganisa amapharamitha e-S ezihlungi, ama-couplers, ama-divider, ama-amplifier noma ama-transitions. Buyekeza ukulahlekelwa kokufakwa, ukulahlekelwa kokubuya, i-bandwidth, ukuhlukaniswa, ukuxhuma, ibhalansi yesigaba kanye nokuzuza uma izingxenye ezisebenzayo zihlanganisiwe. Uma isihlungi se-microwave sishintshiwe, hlola ubukhulu obuqoshwe kanye nokuqagela kwe-dielectric ngaphambi kokushintsha izinto. Izihloko ezinemininingwane ze-microwave zimbozwe kumhlahlandlela we-Rogers TMM microwave PCB.

Yini okufanele ihlolwe kumodeli we-antenna?

Kala ukulahlekelwa kokubuya, i-VSWR, imvamisa ye-resonant, i-bandwidth, inzuzo, ukusebenza kahle, iphethini yemisebe kanye ne-polarization. Kuma-array, kala ukuhambisana kwezakhi kanye nesigaba sokuphakelayo nenethiwekhi. Izinto ezithile ze-antenna kanye nemininingwane yokulungisa imbozwe kumhlahlandlela we-PCB we-antenna ye-Rogers TMM.

Indlela Yokuchaza Imiphumela Yokuhlolwa Kwesibonelo SeRogers TMM

Lisho ukuthini iphutha le-impedance ngokuvamile?

Iphutha le-impedance livame ukukhomba ububanzi bokulandelela, ukujiya kwe-dielectric, ukujiya kwethusi, ukucabanga kwe-Dk, imaski ye-solder, uhlobo lomugqa noma i-fixture yokulinganisa. Qhathanisa ikhuphoni le-TDR ne-product net. Uma kokubili kuvaliwe, inkinga kungenzeka ukuthi i-stackup noma i-etch. Uma kuphela i-product net ivaliwe, inkinga kungenzeka ukuthi i-layout discontinuity noma i-probability.

Kusho ukuthini ukushintshashintsha kwe-antenna noma imvamisa yesihlungi?

Ukushintsha kwemvamisa kungavela ku-Dk yangempela, ubude obuqoshwe, ukujiya kwe-dielectric, imaski ye-solder, ukuqeda, ukulayisha okuvalekile noma izimuncagazi zokuhlanganisa. Linganisa ubukhulu obubalulekile ngaphambi kokushintsha umklamo. Uma ubukhulu bebhodi buhambisana nomdwebo kodwa imvamisa ishintshiwe, buyekeza imodeli noma izibikezelo zezinto ezibonakalayo. Uma ubukhulu bungahambisani, lungisa isinxephezelo sokwenziwa.

Kusho ukuthini ukulahlekelwa kokufakwa ngokweqile?

Ukulahlekelwa ngokweqile kungavela ekulahlekelweni yi-dielectric, ukuba lukhuni kwe-conductor, ukuqeda kobuso, imigqa emincane, ukuqaliswa okubi, umzila omude, ngokushintsha noma ngemisebe. Ikhuphoni lisiza ukuhlukanisa ukulahleka kwezinto/kokuqeda ekulahlekelweni kokuhlelwa komkhiqizo. Ngaphandle kwekhuphoni, amaqembu avame ukusola i-laminate lapho ukuqaliswa noma ukuqeda kuyinkinga yangempela.

Ukusuka ku-Rogers TMM Prototype kuya ku-Production

Izinguquko ze-prototype kufanele zilawulwe kanjani?

Lonke ushintsho lokulungisa kufanele luguqulwe lube idatha ekhishwe: ama-Gerber abuyekeziwe, i-stackup ebuyekeziwe, isiphetho esishintshiwe, indawo entsha yokuxhuma, eguqulwe ngocingo noma inothi lokukhiqiza elibuyekeziwe. Ungathembeli kuma-imeyili noma kumanothi ebhentshi. Ukukhiqiza kufanele kwakhiwe kusukela ekubuyekezweni okulinganisiwe nokuvunyiwe.

Yini okufanele ingashintshi kusukela kumodeli kuya ekukhiqizweni?

Gcina izinga le-TMM, ukujiya kwe-dielectric, iphrofayili yethusi, ukuqeda kobuso, i-stackup, umthetho wemaski we-solder kanye ne-geometry ebalulekile kungashintshiwe ngaphandle kokuthi ithimba lobunjiniyela livuma ushintsho olulawulwayo. Ukwehliswa kwezindleko zokukhiqiza akufanele kushintshe buthule iziguquguquki ze-RF eziqinisekiswe yi-prototype.

Ukuhlolwa kwesihloko sokuqala kufanele kusetshenziswe kanjani?

Ukuhlolwa kwesihloko sokuqala kuqinisekisa ukuthi ukukhiqizwa kufana nomodeli ofanelekayo. Kungafaka phakathi ikhuphoni ye-impedance, umbiko wobukhulu, i-microsection, ukuhlolwa kokuqeda kanye nokulinganiswa kwe-RF okukhethiwe. Ngemikhiqizo enokwethenjelwa kakhulu, idatha yesihloko sokuqala iba yisisekelo seziza zesikhathi esizayo.

Uhlu Lokuhlola lwe-RFQ lwe-Rogers TMM Prototype

Yini okufanele ithunyelwe ukuze kutholakale ikhotheshini yesibonelo?

• Amafayela okuklama kanye nomdwebo wokwenziwa.
• Izinga eliqondile le-TMM, ubukhulu be-dielectric kanye ne-stackup.
• Inhloso yesibonelo kanye nomphumela obalulekile we-RF.
• Izidingo ze-impedance elawulwayo kanye nekhuphoni.
• Ukuqeda ubuso kanye nemithetho yemaski yokusongelwa.
• Ubuningi, isikhathi esifunekayo sokuhola kanye nesidingo sokuhlanganiswa.
• Uhlelo lokulinganisa noma idatha yokuhlola elindelekile.
• Noma yimuphi umgomo wokukhiqiza okumele umelelwe yi-prototype.

Uma uhlobo lweprototype selulungele ukubuyekezwa kwezentengiselwano, ikhasi lomkhiqizi we-Rogers TMM PCB lichaza ukuthi ikhono lokukhiqiza kanye nokulawulwa kwekhwalithi kufanele kuhlolwe kanjani.

Izigaba Zesibonelo seRogers TMM: I-EVT, i-DVT kanye Nokukhiqizwa Kwangaphambi Kokukhiqiza

Yini okufanele i-prototype yobunjiniyela bokuqala iqinisekise?

Imodeli yokuqala yobunjiniyela kufanele iqinisekise umqondo we-RF ongaqinisekile: usayizi we-antenna, i-topology yesihlungi, umqondo wokuqalisa, ukuguquka kwe-impedance, ibanga lezinto ezibonakalayo noma isabelomali sokulahlekelwa. Kungafaka izakhiwo zokuhlola ezengeziwe, amathebhu okulungisa noma izinyathelo ezihlukile. Umgomo ukufunda, hhayi ukusebenza kahle kokukhiqiza okuphelele. Kodwa-ke, i-stackup kufanele isasebenza uma umphumela we-RF olinganisiwe ubalulekile.

Yini okufanele iboniswe yisibonelo sokuqinisekiswa komklamo?

Imodeli yokuqinisekisa umklamo kufanele isondele kakhulu kumkhiqizo ohlosiwe. Kufanele isebenzise izinga lokukhiqiza le-TMM, i-stackup, ithusi, i-finish, umthetho wemaski we-solder kanye nesu lokuxhuma. Kufanele iqinisekise ukusebenza ngaphezu kwebanga lokusebenza elilindelekile futhi iqinisekise ukuthi umklamo ungahlanganiswa. Izinguquko ngemuva kwalesi sigaba kufanele zilawulwe ngoba zingadinga ukuqinisekiswa kabusha.

Yini okufanele iboniswe ngaphambi kokukhiqiza?

Ukusebenza kwangaphambi kokukhiqiza kufakazela ukuphindeka. Kuhlola ukuthi umhlinzeki angakha yini amabhodi noma amaphaneli amaningi ane-impedance ehambisanayo, ubukhulu, ukuqeda kanye nedatha yokuhlola. Kuhlola futhi ukupakishwa, ukugeleza kokuhlanganiswa, imibhalo kanye nokuhlolwa okungenayo. Kumaphrojekthi ezimboni e-B2B, lesi sigaba sivame ukuba lapho ukuthenga kanye nobunjiniyela kuhambisana khona ngaphambi kokukhishwa kwevolumu.

Okuthunyelwe Okufanayo Kwe-Rogers TMM PCB Engineering Review

Yiziphi izinto okufanele zilethwe kanye ne-RF prototype engathi sína?

Iphrothokholi ye-RF engathi sína kufanele ifake okungaphezu kwamabhodi aqediwe. Kuye ngesidingo, okutholakalayo okuwusizo kufaka phakathi i-stackup evunyiwe, i-callout yezinto ezibonakalayo, ukulinganiswa kwekhuphoni ye-impedance, umbiko we-microsection, irekhodi lokugcina lokuhlola, umbiko wobukhulu obulawulwayo, isitifiketi sezinto ezibonakalayo kanye namanothi kunoma yikuphi ukuphambuka kokukhiqiza. Lawa marekhodi asiza ubunjiniyela ukuhumusha imiphumela yokuhlolwa. Uma iphrothokholi yehluleka ukuhlolwa kwe-RF kodwa kungekho idatha yobukhulu noma ye-stackup, ukuxazulula izinkinga kuba umsebenzi wokuqagela.

Kufanele zilawulwe kanjani iziguquguquko ze-prototype assembly?

Ukushiselana kwesixhumanisi, ukuqondiswa kwengxenye, iphrofayili yokugeleza kabusha, ivolumu yokushiselana, ukuhlanza kanye nokulungisa kabusha konke kungathinta imiphumela ye-RF. Ukuqaliswa kwesixhumi okulinganiswe ngemva kokushiselana ngesandla kungase kubukeke kuhlukile kulokho okuhlanganiswe ngenqubo elawulwayo. Izingxenye ezifanayo zingashintsha uma kusetshenziswa ama-parasites ephaketheni angalungile. Uma iphrothokholi ihlanganisa ukuhlanganiswa, bhala phansi indlela yokuhlanganisa bese uyigcina ihambisana lapho uqhathanisa imiphumela yokuhlolwa.

Yini okufanele ishintshwe ngemva kokwehluleka kwephrothokholi?

Shintsha imbangela, hhayi uphawu. Uma i-resonance iphezulu ngoba i-patch imfushane kakhulu, lungisa i-geometry. Uma ukulahlekelwa kuphezulu ngoba i-ENIG isetshenziswe kulayini omude we-microwave, buyekeza ukuqeda. Uma i-impedance ivaliwe ngoba ububanzi bomugqa okhiqiziwe buhlukile kumodeli, lungisa isinxephezelo se-etch noma i-stackup. Uma ukulahlekelwa kokubuyiselwa kukubi kuphela esixhumini, buyekeza ukuqaliswa esikhundleni sokushintsha i-laminate yonke. Inqubo yokulungisa iphutha ehlelekile ivimbela ukuphindaphinda okungadingekile.

Imibuzo Yokukhiqiza Iphrothokholi ye-TMM

Kuthatha isikhathi esingakanani i-prototype ye-Rogers TMM PCB?

Isikhathi sokulethwa sincike ekutholakaleni kwezinto zokwakha, ubunzima beqoqo, ukuqeda, ukuhlolwa kanye nobuningi. Ishejuli ethembekile idinga amafayela okukhiqiza kanye nohlu lwezinto zokwakha.

Ingabe kufanele ngisebenzise i-prototype enokuphela okufana nokwemikhiqizo?

Yebo uma ukulahlekelwa kwe-RF noma ukuziphatha kokuhlanganiswa kubalulekile. Ukushintsha ukuphela phakathi kweprototype kanye nokukhiqiza kungashintsha ukulahlekelwa kokufakwa okulinganisiwe kanye nokushintshwa.

Ingabe uhlobo lwe-Rogers TMM lungaya ngqo ekukhiqizweni?

Kuphela ngemva kokuba imiphumela elinganisiwe idluliselwe kumafayela okukhiqiza alawulwayo futhi umhlinzeki eqinisekisa izidingo zezinto, i-stackup, ukuqeda kanye nokuhlolwa. Ukuze uthole ikhotheshini yeprototype, faka inani, ibanga eliqondile le-TMM, ubukhulu bebhodi, i-stackup, ukuqeda, izidingo zokuhlolwa kwe-RF kanye nesikhathi esiqondiwe. Sho ukuthi yiziphi izilinganiso noma imiphumela kagesi enquma ukwamukelwa kweprototype.