Ukwenziwa kwe-TMM10 PCB

Ukwenziwa kwe-PCB ye-TMM10 kuyindlela ethile yenqubo yokwakha i-thermoset ye-Dk ephezulu. Inhloso ebalulekile yokukhiqiza i-geometry eqediwe ngemva kwe-lamination kanye ne-etch, ikakhulukazi lapho izakhiwo ze-RF ezihlangene zincike ezinguqukweni ezincane zobukhulu. Ukwenziwa kwe-PCB ye- Rogers TMM10 kusetshenziswa lapho ibhodi le-microwave lidinga i-laminate ye-ceramic ye-Dk 9.2 thermoset ye-geometry ye-RF ehlangene. I-TMM10 ine-process Dr 9.20 +/- 0.230 kanye ne-dissipation factor 0.0022 ku-10 GHz. Kuyasiza ekunciphiseni usayizi wesekethe wezihlungi, ama-antenna e-patch, ama-couplers, nama-resonator, kodwa ukwakheka kwe-Dk ephezulu kushiya isikhala esincane sokushintshashintsha kwe-etch, i-drill, i-routing, kanye ne-solder mask.

Okuqukethwe

1. Uma i-TMM10 iyi-PCB Material efanele
2. I-TMM10 Idinga Ukulawulwa Okuncane Kwejiyometri, Hhayi Ukucutshungulwa Kwe-RF PCB Okujwayelekile
3. Izakhiwo Zezinto Ezithinta Ukukhiqizwa
4. Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna
5. Izilawuli Zenqubo Yokukhiqiza
6. Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

Ububanzi bezinto ezibonakalayo: I-Highleap Electronics ingumkhiqizi we-PCB kanye nomhlanganisi wesakhiwo esichazwe lapha. URogers kanye namagama ebanga elibhekiselwe kuwo akhomba izinto ezicacisiwe futhi akuyona incazelo yokukhiqiza izinto ze-Highleap.

Uma i-TMM10 iyi-PCB Material efanele

I-TMM10 isetshenziswa lapho umklamo we-microwave udinga izinto ze-thermoset ze-Dk eziphezulu zezakhiwo ze-RF ezihlanganisiwe. Ifanela izihlungi ezincane, ama-antenna, ama-resonator, ama-couplers, imigqa yokulibazisa, kanye namamojula e-RF lapho i-Dk 9.2 isiza ukunciphisa usayizi wesekethe ngenkathi igwema ezinye izinselele zokucubungula ezihlobene nama-laminate e-PTFE.

Umbuzo obalulekile ukuthi ingabe i-geometry ehlanganisiwe ingakhiqizwa ngokuphindaphindiwe. Ithusi eliqediwe, isinxephezelo se-etch, i-solder mask clearance, ukubekezelelana komphetho oqondisiwe, i-geometry yokuqalisa isixhumi, kanye namarekhodi okuhlola kufanele kuchazwe kusenesikhathi ngoba izici ezincane ze-TMM10 zingathinta ngqo impendulo yemvamisa.

I-TMM10 Idinga Ukulawulwa Okuncane Kwejiyometri, Hhayi Ukucutshungulwa Kwe-RF PCB Okujwayelekile

Inani le-TMM10 ukuthi linikeza i-dielectric constant ephezulu ezintweni ze-microwave ezicutshungulwayo ze-thermoset. Ingozi iwukuthi i-high-Dk miniaturization ingenza ama-trace, izikhala, kanye nezici ze-resonator zibe zincane ngokwanele kangangokuthi i-etch compensation kanye nokubhaliswa kwemaski ye-solder kube yiziguquguquki zokusebenza. Ngakho-ke i-TMM10 kufanele icashunwe njengengxenye ye-RF ye-compact-geometry, hhayi njenge- PCB ye-microwave ejwayelekile.

Ukugxila kokuqukethwe okubaluleke kakhulu ukulawula i-geometry kusukela kumodeli ye-RF kuya kuthusi eliqediwe. I-Highleap ihlola osayizi besici se-RF ngaphambi kokwamukela i-stackup, bese ibuyekeza isisindo sethusi, i-final trace target, ukubekezelelana komzila, i-connector launch geometry, i-solder mask clearance, kanye nohlelo lokuhlola. Uma isici sesihlungi, i-coupler, noma i-antenna sibaluleke kakhulu emvamisa, umdwebo kufanele uphawule leyo ndawo ukuze i-CAM, i-etching, i-test, kanye ne-outgoing review zonke ziqonde ukubaluleka kwayo. Umdwebo wokubekezelela kufanele ubonise ukuzwela kukagesi kwesihlungi se -TMM10 kanye ne-resonator build , ikakhulukazi izikhala ezincane kanye nobubanzi be-conductor obuqoshwe.

Ukuze kukhiqizwe okuphindaphindiwe, ifomethi yephaneli evunyiwe, isinxephezelo se-etch, indlela yekhuphoni, kanye namanothi okuhlola kufanele kugcinwe kuzinzile. Ibhetshi yakamuva eyenziwe ngesisindo sethusi esihlukile, isinxephezelo sephaneli esihlukile, noma indlela ehlukile yekhuphoni ingadlula ukuhlolwa okuvamile kukagesi kodwa ishintshe impendulo yemvamisa yezakhiwo ze-RF ezihlangene.

• Phatha izici ezincane ze-RF njenge-geometry elawulwayo, hhayi njengobuciko bethusi obujwayelekile.
• Isinxephezelo sethusi ne-etch esiqediwe sokukhiya ukuze amasekethe amancane e-TMM10 ahlale ephindaphindeka.
• Sebenzisa amakhuphoni noma amarekhodi okuhlola okuvunyelwene ngawo uma umkhiqizo udinga ukuhambisana kwe-RF yeqembu ngalinye.

Izakhiwo ze-TMM10 Ezithinta I-Geometry ye-RF Eqediwe

Isibuyekezo se-DFM kanye ne-Stackup Ngaphambi Kokucaphuna

Isilinganiso esithembekile siqala ngesethi ephelele ye-Gerber, amafayela okubhoboza, uhlu lwe-net, uhlaka lwebhodi, umdwebo we-stackup, i-callout yezinto zokwakha, isisindo sethusi, ukuqeda kobuso, amanothi emaski e-solder, ama-impedance target, kanye nanoma yiziphi izidingo zokuhlanganisa. I-Highleap ihlola ukuthi umklamo ungenziwa ngokuphindaphindiwe yini ngaphambi kokuqala kwamathuluzi.

Izilawuli Zenqubo Yokukhiqiza

Indlela yenqubo kufanele ikhethwe ngaphambi kokuba izinto zikhishwe ukuze zikhiqizwe. Izilawuli ezijwayelekile zifaka phakathi ukuqinisekiswa kwezinto, ukuhlolwa kwengqimba yangaphakathi, ukubuyekezwa kwe-lamination, ikhwalithi yokubhoboza, ukulungiswa kwemigodi, i-copper plating, ukubhaliswa kwemaski ye-solder, ukuqeda ubuso, ukunemba komzila, ukuhlolwa kukagesi, kanye nokuhlolwa kokugcina. I-Highleap ibuyekeza ukubhoboza, i-lamination, ukubhaliswa kanye nencazelo yethusi ngokumelene ne-TMM10 stackup ekhishwe. Uhlelo lwenqubo kufanele lugcine izilawuli eziqinile zezici ezibalulekile ze-RF kunokusebenzisa ukubekezelelana okufanayo kuzo zonke izilinganiso emdwebweni. Amanani empahla eqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa. Ngaphambi kwama-oda aphindaphindwayo, ukuqinisekiswa kwebhodi lokuhlola le-TMM kungasungula ubufakazi bokuhlola obudingekayo ukuze kuvunyelwe indlela yokukhiqiza.

Ngokwakhiwa kwe-TMM10 okuphindaphindiwe, gcina i-stackup evunyiwe, ithagethi yethusi, ifomethi yephaneli, isinxephezelo se-etch, indlela yekhuphoni kanye nemigomo yokuhlola izinzile. Ushintsho lwenqubo kamuva kufanele luhlolwe ngokumelene nomphumela we-RF ofanelekile kunokwamukelwa okujwayelekile kwe-PCB kuphela.

Iphakheji ye-RFQ kanye namarekhodi okukhiqiza

I-TMM10 ifanelekela izihlungi ezihlangene, ama-antenna e-patch, ama-couplers, ama-resonator aphezulu e-Dk, imigqa yokulibaziseka, amamojula e-RF e-aerospace, kanye namasekethe e-microwave lapho usayizi webhodi kanye nokuzinza kobukhulu kubalulekile khona.

Thumela idatha ye-Gerber, idatha yokubhoboza, i-stackup, ubukhulu be-TMM10, isisindo sethusi, ama-impedance target, ukuqeda, amarekhodi okuhlola, ubuningi, ishejuli yokulethwa, kanye namafayela e-PCBA uma kudingeka ukuhlanganiswa.

Kwezakhiwo ze-TMM10, ubufakazi obuwusizo buhlanganisa ukuhlolwa kwesici se-RF esiqediwe, ukuhlolwa kwe-impedance lapho kuchazwe khona, izingxenye ezincane, amarekhodi ezinto kanye nokulinganiswa kwesihloko sokuqala. Uma isekethe ibucayi kakhulu, irekhodi lokuhlola kufanele likhombe ubukhulu obulawulwa ngesikhathi sokwenziwa. Ukuze uthole ikhotheshini, nikeza ibanga le-TMM10, ukujiya okuqediwe, ithusi, izici ze-RF ezincane, amakilasi emigodi kanye nobuningi. Lokhu kunikeza umenzi ulwazi olwanele lokuhlela amathuluzi nokuhlola.