Isevisi Yokuqinisekisa Umkhiqizi kanye Nezinto Ezibalulekile ze-ITEQ IT-170GRA1TC PCB
I-Highleap Electronics ibuyekeza izicelo ze-ITEQ IT-170GRA1TC zama-PCB eseva, isitoreji, i-router, iswishi, kanye nokuxhumana. Ngaphambi kokucaphuna, siqinisekisa ukuthi isijobelelo esithi “TC” sisho ukuthini, ukwakhiwa kwe-laminate/prepreg ngqo, ithusi, ubufakazi bemvelo, kanye nokuhlinzekwa. Ngemva kokuvunyelwa, singahlela ukwenziwa kwezingqimba eziningi, impedance elawulwayo, ukubhoboza ngemuva, ukuhlanganiswa okungenalo i-lead, ukuhlolwa, kanye nokuhlolwa.
Ububanzi Bokukhiqiza be-PCB Esheshayo Yohlobo lwe-IT-170GRA1
Uma izinto eziqondile ze-ITEQ seziqinisekisiwe, i-Highleap ingasekela amabhodi anezingqimba eziningi ezisheshayo nge-BGA breakout eqondile, i-impedance elawulwayo , ukubhoboza emuva , i-lamination elandelanayo, kanye nezakhiwo zokuxhuma eziyinkimbinkimbi. Imiklamo edinga ukuxhumana kwe-layer yanoma yiluphi uhlobo ibuyekezwa njengohlelo oluphelele lwe-microvia hierarchy, i-stackup, i-reliability target, kanye ne-okulindelekile yield; ayikhawulelwe esibonelweni esijwayelekile esingu-1+N+1 kuya ku-3+N+3.
Okubalulekile: I-Highleap isekela amasampula, ukwakheka kweziqu, kanye nokukhiqizwa komthamo. Ukuze uthole izidingo ezingavamile zobuningi, ukulahlekelwa, noma ukuthembeka, ithimba lobunjiniyela liqinisekisa umzila okhiqizwayo kanye nohlelo lokuhlola ngaphambi kokuba i-oda likhishwe.
Ukulingana okuhle kakhulu
I-High-Tg, engenayo i-halogen, iseva eqaphela i-CAF, isitoreji, i-router, iswishi, izimboni, kanye nezendlalelo eziningi zokuxhumana.
Ingozi enkulu
Ukuphatha isijobelelo esingaqinisekiswanga njengobufakazi besigaba sokulahlekelwa, ukwelashwa ngethusi, isimo se-UL, noma ukuhambisana nemvelo.
Isikali se-Highleap
Ukuqinisekiswa kwezinto ezibonakalayo, ukuhlanganiswa, ukuvimba, ukubuyekezwa kwe-CAF/inqubo, i-vias/back drill, i-PCBA engenalo i-lead, ukulandeleka, ukuhlolwa, kanye nokuhlolwa.
Okokufaka kwesilinganiso
Idokhumenti eqondile ye-TDS/umthombo, izidingo zemvelo/ze-UL, ukwakhiwa, ithusi, i-stackup, i-SI, ama-via, ubuningi, i-PCBA, kanye nedatha yokuhlola.
Okokuqala Qinisekisa ukuthi kusho ukuthini ukuthi “IT-170GRA1TC”
I-matrix yezinto zomphakathi ze-ITEQ ikhomba umndeni we-IT-170GRA1 njengento ene -Tg ephezulu , engenayo i-halogen, engamelani ne-CAF, futhi elahlekelwa kancane phakathi. Isijobelelo "se-TC" esiqondile akufanele siphathwe njengebanga elihlukile eliqinisekisiwe ngaphandle kokuthi ikhasimende noma umhlinzeki ahlinzeke ngemibhalo elawulwayo eyichazayo. Kungabhekisela ekwakhiweni kwesifunda, ukuphathwa kwethusi, ikhodi yokusabalalisa, ukuqokwa kwekhasimende, noma esinye isici sokuthenga.
Iphrojekthi ifanelana kahle ngemva kokuqinisekiswa
- amaseva, isitoreji, ama-router, amaswishi, kanye ne-elekthronikhi yokuxhumana;
- imikhiqizo edinga i-Tg ephezulu, ubufakazi obungenayo i-halogen, kanye nokubekwa okumelana ne-CAF;
- iziteshi lapho i-FR-4 ejwayelekile ingaphansi kodwa inezinto ezilahlekelwa kakhulu akudingeki;
- izingqimba eziningi ezingenalo umthofu ezidinga ukulandelelwa kwezinto ezilawulwayo.
Yima ucacise ukuthi nini
- okuwukuphela kwento edingekayo “IT-170GRA1TC” engenalo idokhumenti yomthombo;
- iphrojekthi ithatha ukuthi isijobelelo siqinisekisa ithusi, ukulahlekelwa, i-UL, noma isimo semvelo;
- umklamo udinga ukusebenza okuphansi kakhulu okulahlekelwayo okungasekelwa yidatha eqinisekisiwe;
- ikhasimende ngeke livume ukwakhiwa kwe-laminate/prepreg ngqo.
Impendulo efanele yezentengiselwano ye-Highleap ukuqinisekisa ubunikazi ngaphambi kokuthenga izinto noma ukusebenza okuthembisayo. Ukusungula ishidi ledatha lesijobelelo esingaqinisekile kungadala ukwehluleka kokuthenga nokuthobela imithetho.
Ububanzi Bokukhiqiza be-Highleap Ngemva Kokuqinisekiswa Kwezinto Ezibalulekile
Uma ubunikazi bezinto zokwakha kanye nokwakhiwa sekuvunyiwe, i-Highleap ingabuyekeza izingqimba eziningi eziqinile ukuze ithole ama-prototype, amavolumu aphansi, kanye nokwakhiwa kokukhiqiza. Izinsizakalo zingafaka ubunjiniyela be-stackup, i-impedance elawulwayo, ukubhoboza ngemuva, ama-vias angaboni/angcwatshwe, ukubuyekezwa kwenqubo egxile ku-CAF, ukuhlanganiswa okungenalo i-lead, i-BGA X-ray, imisebenzi yokungena emgodini/ukucindezela, ukuhlanza, ukumboza, kanye nokuhlolwa kokusebenza okuchazwe amakhasimende.
| Scope | Isibuyekezo se-Highleap | Ukugunyazwa kwekhasimende |
|---|---|---|
| Ubunikazi bezinto ezibonakalayo | Incazelo eqondile ye-ITEQ TDS, "i-TC", ukwakhiwa kwe-laminate/prepreg, ithusi, i-UL/IPC, izimemezelo zemvelo, ukuphakelwa kanye nokulandeleka. | Vuma ibanga elibhalwe phansi kanye nanoma yiliphi elinye eliphakanyisiwe. |
| Ukuqina kwe-stackup kanye ne-signal | Izitayela zengilazi, okuqukethwe kwe-resin, ukujiya okucindezelwe, iphrofayili yethusi, i-impedance, i-loss target, ngama-stubs, i-back drill, kanye namakhuphoni. | Vuma i-geometry kanye nesisekelo sokuhlolwa. |
| I-CAF kanye nokuthembeka | Isikhala, ikhwalithi yemigodi, ukususwa kwenhlabathi, ukucwebezela, ukuhlanzeka, umswakama, ukucindezeleka kwamandla kagesi, kanye namakhuphoni amele. | Chaza indawo yomkhiqizo, isigaba sekhwalithi, kanye nobufakazi bokuthembeka. |
| Umhlangano ongenalo i-lead | Ukulawulwa komswakama, inani lokugeleza kabusha/iphrofayili, ukucindezeleka kwe-BGA/isixhumi, i-warpage, i-X-ray, ukuhlanza, kanye nokugqoka. | Nikeza i-BOM, umdwebo wokuhlanganisa, imikhawulo yephrofayili, kanye nohlelo lokwamukela. |
| Ukulandelela | Indawo yezinto ezibonakalayo, umhambi, ukuhlolwa, ukuphambuka, i-CoC, kanye namarekhodi okuthunyelwa. | Cacisa izimfuneko zokubhala amagama esitifiketi kanye nokugcinwa kwaso. |
Ikhasi akufanele lisho ikhono lezinombolo elibanzi. Izinto ezine-Tg ephezulu zingasetshenziswa emabhodini alula noma ayinkimbinkimbi kakhulu; ukwenzeka kwangempela kuncike ekubalweni kwezingqimba, ukujiya, ubukhulu, imigodi, ithusi, ukubekezelelana, kanye nokuhlolwa.
I-Tg ephezulu, i-Halogen-Free, i-CAF, kanye nokulahlekelwa yizidingo ezihlukile
Lawa malebula avame ukuhlanganiswa ndawonye kuma-RFQ, kodwa aphendula imibuzo ehlukene.
High Tg
Kubonisa ukuziphatha kokuguquka kokushisa ngaphansi kwendlela yokuhlola eshiwo. Isekela ukubopha okudingakalayo kanye nokuhlanganiswa okungenalo umthofu , kodwa ayiqinisekisi ngokuthembeka ngemva kwanoma yimiphi imijikelezo eminingi yokugeleza kabusha.
I-halogen-free
Ibhekana nemikhawulo ecacisiwe ye-chlorine ne-bromine uma isekelwa yisimemezelo sezinto eziqondile. Akufani nokuhambisana ne-RoHS, futhi i-PCBA eqediwe ingadinga ukuqinisekiswa okuhlukile kwemaski yokusoda, izingxenye, amalebula, izinamathiselo, kanye nokugqoka.
Ukumelana ne-CAF
Ichaza indawo yezinto ezisetshenziswayo ngokumelene nokukhula kwe-filament ye-anodic eqhubayo. Ukuthembeka kwangempela kwensimu nakho kuncike ekusikeni isikhala, ikhwalithi yembobo nodonga, isikhombimsebenzisi se-resin/ingilazi, ukuhlanzeka, umswakama, i-voltage, izinga lokushisa, kanye nesikhathi.
Ukulahlekelwa okuphansi-phakathi
Ingathuthukisa i-margin yesiteshi esinejubane eliphezulu uma iqhathaniswa ne-commodity FR-4, kodwa akufanele imakethwe njengokulahlekelwa okuphansi kakhulu ngaphandle kwedatha yokwakhiwa kanye nendlela eqondile. Inani le-matrix yomphakathi elimele elivela esihlokweni somthombo licishe libe yi-Dk 3.80 kanye ne-Df 0.009 kokuqukethwe kwe-resin okungu-50%; akufanele ikopishwe ngokungaboni kumodeli ye-impedance noma yokulahlekelwa kwesijobelelo esingaqinisekisiwe.
Ukuhlela Okuhlanganisiwe Kwama-PCB Eseva Nokuxhumana
Izinto kufanele zikhethwe ngokumelene nesidingo sangempela sesiteshi kanye nesendawo ezungezile. Isilawuli seseva esinemizila emifushane singadinga ukuthembeka kokushisa kanye ne-CAF ngaphezu kokulahlekelwa okuphezulu. Iswishi noma ipulatifomu yokugcina enemizila emide ingadinga ukulahleka okuncane, ukubhoboza ngemuva, kanye nephrofayili yethusi elawulwayo.
Nikeza lezi zinto zokufaka umklamo
- isikhombikubona, izinga ledatha, isikhathi sokukhuphuka, ubude bomzila obuphezulu, inani lezixhumi, kanye ne-topology;
- ukuvinjelwa kanye nokubekezelelana, ukulahleka kokufakwa noma inhloso yomkhawulo wamehlo, kanye nemvamisa yokuhlola;
- ukwakhiwa kwe-core/preg, isitayela sengilazi, okuqukethwe kwe-resin, iphrofayili yethusi, kanye nobukhulu obuqediwe;
- ngesakhiwo, itafula lokubhoboza ngemuva, umkhawulo we-residual-stub, amasimu okulingana nokucindezela, kanye nokuqhekeka kwe-BGA;
- indawo yokusebenza, isikhala se-voltage, umswakama, ukujikeleza kokushisa, kanye nesidingo se-CAF;
- imijikelezo yokuhlanganisa engenalo umthofu, ukwesekwa kwamabhodi, izinki zokushisa, izinti zokuqinisa, kanye nomkhawulo we-warpage.
I-Highleap ingaphakamisa i-stackup isebenzisa izakhiwo ezitholakalayo, kodwa ikhasimende akufanele lidinge ubukhulu obungatholakali ngenkathi livimbela zonke izakhiwo ezilinganayo. Inqubomgomo ehlukile evunyelwe inciphisa ingozi yokuphakelwa ngaphandle kokuvumela ukushintshwa okungalawulwa.
Ukulawulwa Kokukhiqiza Nokuhlanganisa
- Ukuqinisekiswa okungenayo: qinisekisa ubunikazi obuqondile bezinto ezibonakalayo, indawo, ithusi, ukwakhiwa, imibhalo yezemvelo, kanye nendawo yokugcina.
- Ukufakwa kanye nokufakwa kwe-lamination: ibhalansi yethusi, ukugcwaliswa kwe-resin, ukulingana, imijikelezo yokucindezela, ukujiya, ukubhaliswa, kanye ne-warpage.
- Ukubhoboza nokususa inhlabathi: ikhwalithi yokulawula ukubhoboza, ukususwa kwe-resin, isilinganiso sesici, indandatho ye-annular, kanye nezixhumi ezithinta i-CAF.
- Ukufakwa kwethusi: qinisekisa ukujiya kwembobo nodonga, amasimu okulingana ngokucindezela, ngokugcwaliswa, ukukhula kwethusi elingaphezulu, kanye nezingxenye ezincane.
- Ukuthwebula izithombe/ukuqopha kanye nokuvimba: buyisela ithusi langempela bese uhlola izici ezilawulwayo namakhuphoni.
- Umhlangano ongenalo i-lead: phatha umswakama, iphrofayili yokugeleza kabusha kanye nokubala, ukucindezeleka kwe-BGA/isixhumi, i-AOI/X-ray, ukuhlanza, kanye nokugqoka.
- Ukukhishwa kokugcina: ukuhlolwa kukagesi kwesixhumanisi, impedance, i-microsections, ubufakazi bezemvelo, izinto ezibonakalayo, i-CoC, kanye nokuphambuka.
Ukumelana ne-CAF akufakazelwa umusho wedatha. Umklamo webhodi kanye nenqubo kumele kugweme izindonga zemigodi ezonakele, ukungcola, isikhala esinganele, ukuvezwa komswakama, kanye nokucindezeleka kukagesi okungalawuleki.
Izindleko kanye Nezinto Ezithinta Isikhathi Sokuhola
| Driver | Kungani ishintsha ikhotheshini | Isenzo esidingekayo |
|---|---|---|
| Ukuqinisekiswa kwesijobelelo kanye nemibhalo | Ukucaciswa komhlinzeki, izitifiketi ezikhethekile, ubufakazi be-UL/IPC, kanye nokuvunyelwa kwamakhasimende kwengeza isikhathi sobunjiniyela kanye nokuthengwa kwempahla. | Thumela idokhumenti yomthombo echaza “i-TC.” |
| Ukwakhiwa kwezinto zokwakha kanye nokuhlinzekwa kwazo | Ingilazi ethile, okuqukethwe kwe-resin, ithusi, ukujiya, i-MOQ, kanye nesifunda kuthinta intengo kanye nokutholakala. | Vuma ezinye izindlela ezingathengwa ngokulawula ushintsho. |
| Ukubalwa kwezingqimba kanye nokubhoboza nge-/back | Kudingeka izinto ezengeziwe, imijikelezo yokucindezela, ukubhoboza, ukufaka amaplanga, ukulawula ukujula, kanye nokuhlola. | Sebenzisa ukwakheka okulula kakhulu okuhlangabezana nomzila kanye ne-SI. |
| Ukuhlolwa kwe-CAF/ukuthembeka | Amakhuphoni, ukuchayeka emvelweni, ukuhlolwa kwe-IST noma kwamakhasimende kunezela amasampula, imishini, kanye nokubika. | Chaza uhlelo lwesampula kanye nemigomo yokuphasa/ukwehluleka. |
| Ubufakazi bomkhiqizo oqediwe ongenawo i-halogen | Kungadingeka izimemezelo zemaski yokusoda, uyinki, izingxenye, izinamathiseli, nezinto zokuhlanganisa, hhayi i-laminate kuphela. | Sho ukuthi le mfuneko iyasebenza yini ezintweni ze-PCB noma kwi-PCBA ephelele. |
| Ubunkimbinkimbi bomhlangano | Ama-BGA amakhulu, ukulingana kwe-press-fit, ukumboza, ukuhlanza, ukuhlela, kanye nokuhlolwa kokusebenza kungabusa izindleko eziphelele. | Thumela amafayela e-PCBA kanye ne-RFQ yokuqala. |
I-Highleap iqinisekisa isikhathi sokukhokha ngemuva kokuba ubunikazi bezinto buvaliwe. Intengo esheshayo esekelwe esijobelelweni esingaqinisekisiwe akuyona ikhotheshini eqinile.
Iphakheji Yokuqinisekisa I-RFQ kanye Nezinto Ezibalulekile
Thumela isimemo sezinto zamakhasimende ezilawulwayo, umhlinzeki we-TDS ochaza “IT-170GRA1TC,” izidingo zemvelo kanye ne-UL/IPC, ezinye izindlela ezivunyelwe, ukwakhiwa kwe-laminate/prepreg, ithusi, i-stackup, i-impedance kanye ne-loss target, ithebula le-via/back-drill, ubukhulu, ukujiya kanye nemikhawulo ye-warpage, izidingo zephaneli, ubuningi, isibikezelo, i-delivery target, kanye nohlelo lokuhlola.
Ku-PCBA, faka i-BOM, ezinye izindlela ezivunyiwe, i-centroid, imidwebo, imininingwane ye-BGA/press-fit, imikhawulo yokugeleza kabusha, ukuhlanza, ukumboza, ukuhlela, ukuhlolwa kokusebenza, kanye nokulandelela okudingekayo.
Uma isijobelelo singenakuqinisekiswa, i-Highleap kufanele ibuyisele isicelo sokucacisa noma isakhiwo esihlongozwayo esivezwe ngokucacile ukuze sivunywe. Akufanele siguqule ukungaqiniseki kube isimangalo esingamanga.
Izinsiza ezihlobene: Izidingo ze-PCB ezingenayo i-halogen , izinto ze-PCB ezingamelana ne-CAF , kanye nokukhethwa kwezinto ezisheshayo.
Imibuzo Evame Ukubuzwa Yezentengiselwano
Ingabe i-IT-170GRA1TC iyafana ne-IT-170GRA1?
Umndeni we-IT-170GRA1 oyisisekelo ubonakala esidlangalaleni, kodwa isijobelelo "se-TC" esiqondile kufanele siqinisekiswe nge-ITEQ yamanje noma imibhalo elawulwa amakhasimende ngaphambi kokucaphuna nokukhiqizwa.
Ingabe i-Highleap ingakhiqiza futhi ihlanganise lokhu?
Ngemva kokuqinisekiswa kwezinto ezibonakalayo, amaphrojekthi afanele anezingqimba eziningi angabuyekezwa ukuze kutholakale ukwenziwa, ukulawulwa kwe-impedance, ukubhoboza i-vias/back, ukuthola izingxenye, ukuhlanganiswa, ukuhlolwa, kanye nokuhlolwa kokusebenza.
Ingabe iyinto elahlekelwa kakhulu?
Kufanele kuphathwe njengesigaba sokulahlekelwa okuphansi okuphakathi ngaphandle kokuthi ishidi ledatha elivunyiwe kanye nendlela yokuhlola isekela esinye isimangalo. Iziteshi ezinde noma ezidinga kakhulu zingadinga umndeni wezinto ezibonakalayo ohlukile.
Ingabe ukungabi ne-halogen kusho ukuthi kuyahambisana ne-RoHS?
Cha. Ziyizidingo ezihlukile. Okungenawo ama-halogen kulawula okuqukethwe kwe-halogen okucacisiwe; i-RoHS ivimbela izinto eziyingozi ezisohlwini. I-PCB noma i-PCBA eqediwe ingadinga ubufakazi bamasethi amaningi ezinto.
Yini edingekayo ngentengo eqinile?
Nikeza incazelo eqondile yezinto ezibonakalayo, i-stackup, ithusi, i-impedance/ukulahlekelwa, ngezakhiwo, ubukhulu, ubuningi, isibikezelo, ukulethwa, iphakheji yokuhlanganisa, amadokhumenti ezemvelo, kanye nohlelo lokuhlola.
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Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:
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- Gerber, ODB++, noma .pcb, spec.
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- Ubuningi
- Isikhathi sokushintsha
Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.
