Ukuthuthukiswa Kokuklama kwe-PCB Vias ebholiwe nge-Laser kanye nezindleko

Ama-PCB microvias okubhoboza nge-laser akuyona indlela yokuthuthukisa umkhiqizo oyikhethayo ukuze uthole udumo — iyisisombululo esithile sezinkinga ezithile zomzila, futhi ukuyikhetha ngaphandle kokuqonda imithetho yokuklama ehambisana nayo kuholela ezicaphunweni ezibuya ngo-40% ngaphezulu kunokulindelekile, amafulegi e-DFM abambezela i-prototype yakho, kanye nokwehluleka kwensimu okulandelela emuva kuma-vias agcwele izikhala aphumelele ukuhlolwa kwefektri. Lo mhlahlandlela ubhalelwe abaklami be-PCB kanye nonjiniyela behadiwe asebevele bazi ukuthi iyini i-microvia futhi badinga imithetho yokuklama esebenzisekayo, izindleko, amaqiniso okusebenza kwe-CAM, kanye nezindlela zokwehluleka — hhayi isiqalo se-laser physics.

Thola Isibuyekezo Samahhala se-HDI DFM

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1) Kunini Lapho Umklamo Wakho We-PCB Udinga Ukubhobozwa Nge-Laser?

1.1 Izinkinga Ezintathu Zokubhoboza Nge-Laser Ezixazululwa Yizinkinga Ezintathu Zokubhoboza Nge-Laser

Qinisekisa ukuthi iyiphi kulezi zinkinga ezintathu umklamo wakho onazo ngempela ngaphambi kokuzibophezela ekwakheni i-HDI:

Inkinga 1 — Indlela yokuphuma ye-BGA ivinjwe ngokwejiyometri yizimbobo zokungena. I-BGA engu-0.50mm-pitch inesikhala esiphakathi nendawo esingu-0.50mm. I-mechanical through-hole via idinga ububanzi bephedi engu-0.60mm (i-drill engu-0.30mm + indandatho engu-0.15mm ohlangothini ngalunye). Lokho kukhulu kune-pitch — awukwazi ukufaka i-through-hole via ngokoqobo emgqeni ngamunye we-BGA. I-microvia engu-0.15mm ene-land pad engu-0.30mm iyakuxazulula lokhu. E-pitch engu-0.40mm ngisho ne-0.15mm iba lukhuni, futhi i-0.10mm iyadingeka.

Inkinga 2 — Ubuqotho besiginali ngaphezu kuka-5–10 GHz budinga ama-via angenazinti. Imbobo yokungena ngomshini ethwala isiginali kusuka ku-L1 kuya ku-L4 ebhodini elinezingqimba ezingu-16 ishiya i-stub yethusi engasetshenziswanga (L5–L16) ezwakala kumaza aphezulu. Ukubhoboza emuva kususa iningi layo, kodwa ubude be-stub obusele busadala ukubonakaliswa okungaphezu kuka-10 GHz. I-blind via ebhobozwe nge-laser ayina-stub ngokwakhiwa. Kumalayini e-SerDes, i-DDR5, noma i-RF engaphezu kuka-5 GHz kumabhodi anezingqimba eziningi, ama-blind via angaba yimfuneko yobuqotho besiginali, hhayi inketho yobuningi.

Inkinga 3 — Indawo yebhodi kumele inciphe kodwa ukusebenza kwayo akukwazi. Amabhodi aminyene ngezinye izikhathi ahamba kahle ku-multilayer ejwayelekile kodwa adinga indawo engaphezulu ngo-20% kunalokho okuvumelayo ebiyelweni. Isakhiwo se-HDI esinobuningi be-microvia-in-pad singabuyisa leso sikhala. Ibhodi le-HDI libiza kakhulu nge-inch yesikwele kodwa izindleko eziphelele zingase zehle uma ukunciphisa indawo kukhulu ngokwanele.

1.2 Lapho Ukubhoboza Nge-Laser Kuyisinqumo Esingalungile

• Uhlobo lwesibonelo kuphela noma amayunithi angaphansi kwama-50: Isikhathi sokuhola se-HDI siyizinsuku ezingu-8-14 uma kuqhathaniswa no-5-7 we-multilayer ejwayelekile. Ukuze kuqinisekiswe ukusebenza, ukwakheka okujwayelekile kukufikisa lapho ngokushesha.
• Ibhodi elihamba kahle elinezimbobo zokungena: I-BGA engamabhola angu-64 engu-0.50mm enendawo yebhodi engavinjelwe ivame ukuphuma nge-vias ye-dog-bone kanye nokwakhiwa okujwayelekile okunezingqimba eziyisithupha — ngesigamu sezindleko zokwakhiwa kwe-HDI.
• Imiklamo lapho inzuzo yobuningi inganciphisi khona iphrimiyamu yezindleko: Amanye amadizayini e-HDI anezela u-50-80% ezindlekweni zebhodi elingenalutho ukuze kuzuzwe izinzuzo zomzila ezingatholakala ngokungeza izendlalelo ezimbili ezijwayelekile esikhundleni salokho.

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2) Imithetho Yokuklama i-Microvia: Izinombolo Eziqondile Ezilawula Izindleko Nenzuzo

2.1 Nge-Diameter — Okujwayelekile Kukhulu Ngaphandle kokuthi I-Pitch Iphoqa Ngaphandle kwalokho

Iningi labaklami likhetha ama-microvia angu-0.10mm ngoba imiklamo yereferensi ye-HDI ibonisa u-0.10mm. Lelo yiphutha — u-0.10mm ubuncane obuqhutshwa yimingcele yephimbo, hhayi okuzenzakalelayo. I-0.10mm ngayinye esetshenzisiwe lapho i-0.15mm izosebenza khona ikhokha iphrimiyamu yezindleko zokubhoboza (cishe u-1.6 × izindleko zokubhoboza ze-0.15mm via) ngaphandle kwenzuzo yokuqondisa.

Umthetho wokukhetha ububanzi:

• 0.10mm: Kuphela lapho iphimbo le-BGA ≤ 0.40mm liyiphoqa khona, noma lapho indawo yomhlaba engaphakathi ilinganiselwe kakhulu
• 0.125mm: Indawo ephakathi nendawo ewusizo ye-pitch fanout engu-0.40–0.45mm lapho isikhala sivumela khona
• 0.15mm: Okuzenzakalelayo kwazo zonke ezinye izindlela ze-HDI — isivuno esingcono, izindleko zokubhoboza eziphansi, ukugoba kwethusi okulula

2.2 Usayizi Wephedi Yomhlaba — Inombolo Evame Ukungalungi Kakhulu

I-land pad ezungeze i-blind via kumele ifake imithombo emibili yamaphutha: ukunemba kwesikhundla se-laser (±25µm) kanye nokubhaliswa kwe-lamination (±50–70µm kuye ngenani lomjikelezo wokwakha). Lokhu kuhlanganiswa ngokungeziwe esimweni esibi kakhulu.

Ukubeka ama-pad okungenani kudala umklamo ongabekezeleli lutho. Ama-pad anconywa ukukhiqizwa anezela umkhawulo ongu-0.06–0.07mm osinda ekushintsheni okuvamile kwenqubo. Indawo yethusi eyengeziwe ayibizi lutho ekukhiqizweni.

2.3 Isisindo se-Copper Foil Ezingqimbeni Ezihlanganisiwe

Izendlalelo zokwakheka kwe-HDI kumele zisebenzise i-foil yethusi engu-½ oz (17µm) — hhayi i-1 oz. Ekubholeni kwe-CO₂, ifasitela lethusi (imaski ehambisanayo) liqoshwa ngamakhemikhali ngaphambi kokubhoboza nge-laser. Ngethusi elingu-1 oz, i-etch engaphansi kwe-etch ishintsha ukubhoboza okuncane okusebenzayo ngobubanzi kusuka ku-0.10mm kuya ku-0.12–0.13mm. Ngethusi elingu-½ oz, i-0.10mm ingafinyeleleka ngokuthembekile. Cacisa "ithusi elingu-½ oz kuzo zonke izendlalelo zokwakheka kwe-HDI" kumanothi akho okukhiqiza. Abaklami abaningi bakopisha ama-stack-up angewona ama-HDI acacisa i-1 oz kuyo yonke indawo futhi abaqapheli umthelela.

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3) Isilinganiso Sokubukeka: Iphutha Elilodwa Elibiza Kakhulu Ekwakhiweni Kwe-HDI

3.1 Kungani Isilinganiso Sokubukeka Silawula Ukuthembeka — Hhayi Ukuzidela Nje

Isilinganiso se-Microvia aspect = ukujiya kwe-dielectric ÷ ngokusebenzisa ububanzi. Njengoba lesi silinganiso sikhuphuka ngaphezu kuka-0.8:1, i-copper plating chemistry iba nobunzima obandayo bokufinyelela phansi kwe-via. Umphumela uba yithusi elincane edolweni le-via — lapho ukucindezeleka kokushisa kugxila khona ngesikhathi sokujikeleza kokushisa. Imodi yokwehluleka ayivuli ngokushesha. Kuyindlela edlula ukuhlolwa kwefektri, idlula ukuhlolwa okungenayo, futhi yehluleke ngemva kwemijikelezo yokushisa engu-200–400 ensimini.

3.2 Izindleko Nokuthembeka Ngokwesilinganiso Sokubukeka

Indlela abaklami abadala ngayo ngengozi izilinganiso ezimbi zesici: ukukopisha i-stack-up lapho i-dielectric eyakhiwayo yayingu-75µm, kodwa umenzi wefektri ushintsha uhlobo lwe-prepreg olujiyile kancane — 100µm esikhundleni sika-75µm. Isilinganiso se-aspect esingu-0.10mm esifanayo sigxuma kusuka ku-0.75:1 kuya ku-1.0:1. Njalo chaza ubukhulu be-dielectric obulungisiwe (isb., “1080 prepreg, cured 60µm ±5µm”), hhayi inombolo yesitayela se-prepreg kuphela.

3.3 Isixazululo: Khetha Ukulungiselela Okufanele

• I-prepreg engu-1080 ngokuqukethwe kwe-resin okungu-65–70%: Iphola kufika ku-55–65µm — ilungele u-0.10mm nge (isilinganiso sobuso 0.55–0.65:1)
• I-1080 prepreg ku-55% resin: Ukwelapha kufike ku-70–80µm — kuyamukeleka ku-0.10mm (0.70–0.80:1)
• 2116 ukulungiselela: Ukwelapha kufike ku-110–130µm — ungasebenzisi njenge-dielectric ehlanganisiwe yodwa ye-vias engu-0.10mm

Ukwephulwa okuningi kwe-DFM kwesilinganiso se-aspect-ratio kubangelwa abaklami abacacisa i-2116 prepreg ekwakheni ngoba kwakuyinto ezenzakalelayo ethuluzini labo lokufaka i-stack-up. Ukushintshela ku-1080 prepreg kubiza okufanayo futhi kulungisa inkinga ngokuphelele.

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4) Imithetho ye-Via-in-Pad kanye nokwehluleka kokuhlanganiswa akekho okuxwayisayo ngakho

4.1 Uma Kudingeka i-Via-in-Pad vs. Uma Kudingeka Ongakukhetha

I-Via-in-pad ibeka i -microvia ngqo ngaphakathi kwe-BGA noma i-QFN land pad kunokuba ibe eceleni kwayo. Iyadingeka uma i-BGA pitch ingu-0.40mm noma ngaphansi futhi kungekho mzila wokuqondisa okhona phakathi kwama-pads ukuze kuphume okuvamile. AYIDINGI ngokuzenzakalelayo kuwo wonke amabhodi e-HDI — ama-BGA amaningi angu-0.50mm-pitch aphuma nama-vias angaboni abekwe phakathi kwama-pads, hhayi ngaphakathi kwawo. I-Via-in-pad yengeza izindleko ngokugcwaliswa kwethusi kanye nokuhlelwa kabusha. Ungakucacisi ngaphandle kokuqinisekisa ukuthi i-routing iyakudinga ngempela.

4.2 Kungani I-Via-in-Pad Engagcwalisiwe Ibulala Isivuno Sokuhlanganiswa

I-open via-in-pad ifaka i-solder paste emgodini ngesikhathi sokugeleza kabusha. I-solder ayibuyi - imanzisa izindonga zembobo bese ihlala ngaphakathi. Umphumela uba yi-BGA joint elambile nge-solder: i-solder esele eyanele ukuze iqhubeke ekushiseni kwegumbi, kodwa amandla anele omshini okusinda ekudlidlizeni noma ekujikelezeni kokushisa. Le ndlela yokwehluleka idlula njalo ukuhlolwa kukagesi kanye ne-X-ray ekushiseni kwegumbi, futhi ivele kuphela ekubuyeni kwensimu noma ekuhlolweni kokuphila okusheshayo.

4.3 Imininingwane Yokugcwalisa Ithusi — Okumele Kube Kumanothi Akho E-Fab

Cacisa zonke lezi zinto ezine ngokucacile noma umenzi uzosebenzisa okuzenzakalelayo okungenzeka ukuthi akulona iqiniso:

• Izindawo ezisebenzisa i-Via-in-pad: Bhala uhlu ngomklami wereferensi, igama eliphelele, noma isimemo kumdwebo wokwenziwa — hhayi “zonke i-vias ngaphansi kwama-BGA” (okungaqondakali kakhulu)
• Indlela yokugcwalisa: “Ukugcwaliswa nge-electroplated yethusi” — hhayi “ukugcwaliswa nge-” (kungasho ukugcwaliswa kwe-resin, okunganele ukuphonswa kahle)
• Ukuhlela: “I-CMP ehlelwe ngohlelo, ukuvela okungu-≤15µm ngaphezu kwethusi elizungezile” kwephimbo elingu-0.40mm; okungu-≤25µm kwamukelekile kwephimbo elingu-0.50mm
• Imininingwane engenalutho: “≤10% indawo engenalutho enqamula ingxenye ngayinye ye-IPC-6012D” — cela i-≤8% kunoma yisiphi isicelo esinesidingo sokushisa esingu->500-cycle

4.4 Ukuvulwa Kwe-Stencil Kumelwe Kuncishiswe Ezindaweni Ezisebenzisa I-Via-in-Pad

I-protrusion egcwele (ngisho noma i-≤15µm) ithatha ivolumu ye-solder paste. I-solder paste stencil aperture kuma-BGA pads e-via-in-pad kufanele ibe ngu-80–90% wendawo ye-nominal pad ukuze ivumelane. Unjiniyela wakho wokuhlanganisa udinga uhlu lwendawo ye-via-in-pad ukuze aklame i-stencil aperture ngendlela efanele - lolu lwazi aluhambi ngokuzenzakalelayo lusuka kumanothi e-PCB fab luye eqenjini lokuhlanganisa.

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5) I-CO₂ vs I-UV Laser: Yikuphi Okudingwa Yi-Stack-Up Yakho

5.1 Ukuthembela Kwezinto Ezibonakalayo

I-laser ye-CO₂ (10.6µm infrared) isusa i-resin ye-dielectric kodwa ikhipha ithusi — idinga ifasitela lethusi eliqoshwe kusengaphambili (imaski ehambisanayo) ngaphambi kokubhoboza i-dielectric engezansi. I-laser ye-UV (355nm) isusa ithusi ngqo futhi ibhoboza ithusi kanye ne-dielectric ekusebenzeni okukodwa.

Umphumela womklamo: Uma i-PCB stack-up yakho evame kakhulu isebenzisa ama-laminate akhethekile aphansi noma asekelwe ku-PTFE ezingqimbeni zokwakheka, qinisekisa ukuthi umenzi wakho unekhono le-laser ye-UV ngaphambi kokuqedela i-stack-up. Abakhi abane-laser ye-CO₂ kuphela bazokwenqaba i-oda noma bashintshe i-dielectric ehlukile yokwakha.

5.2 Amaphaneli e-CO₂ + UV ahlanganisiwe

Eminye imiklamo ixuba izendlalelo zangaphakathi ze-FR4 ezijwayelekile ne-laminate ekhethekile ephansi yokulahlekelwa noma ama-patches ezinto ezivame kakhulu zezingxenye ze-RF. Uma i-dielectric yokwakha i-HDI endaweni ye-RF ingeyona i-FR4, umenzi udinga izindlela zokubhoboza eziqondene nendawo: i-UV ezindaweni ezikhethekile ze-laminate eziphansi yokulahlekelwa okukhethekile, i-CO₂ kwenye indawo. Lokhu kungenzeka kodwa kudinga ukubizwa kwemingcele yendawo ecacile emdwebweni wokwenziwa. Amanothi angacacile afana nokuthi “i-laminate patch ekhethekile ephansi yokulahlekelwa okukhethekile endaweni ye-RF” aphoqa unjiniyela we-CAM ukuthi aqagele — futhi bazosebenzisa izilungiselelo ezilondolozayo ezifanele kakhulu kunoma iyiphi indawo.

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6) Indlela Onjiniyela be-CAM Abacubungula Ngayo Amafayela Akho Okubhoboza Nge-Laser — nokuthi Yini Ebasizayo

6.1 Izinto Ezine Ezikwenziwa Yi-CAM Engineering Ngamafayela Akho E-HDI

Ukuqonda ukuhamba komsebenzi kwe-CAM kukuvumela ukuthi ulungiselele amafayela aqala ukukhiqizwa ngqo esikhundleni sokubangela umjikelezo wokubuyekezwa wamahora angu-24-48:

Isinyathelo 1 — Ukuqinisekiswa kwe-stack-up. Unjiniyela we-CAM uhlola ukuthi ukuqina kwe-dielectric okucacisiwe kukhiqiza amanani afanele e-impedance FUTHI kusekela izilinganiso ze-via aspect ekwakhiweni. Uma ucacise inombolo yesitayela kuphela (hhayi ukujiya okulungisiwe), unjiniyela we-CAM usebenzisa uhlobo oluzenzakalelayo lwefektri lwaleso sitayela — olungahluka kulokho ithuluzi lakho le-EDA elikucabangayo ekubalweni kwe-impedance.

Isinyathelo 2 — Ukukhipha i-blind nge-layer pair. Uhlelo lokubhoboza nge-laser lwakhiwe ngokukhipha ngezimo ezivela ku-layer eyodwa kodwa hhayi okuphambene nalokho. Uma umklamo wakho une-blind vias exhumanisa izendlalelo ezingezona eziseduze (iphutha elivame kakhulu lokuklama i-HDI), yilapho okutholakala khona — ngemva kokulinda usuku lonke ukuze uthole isilinganiso.

Isinyathelo 3 — Imephu yesinxephezelo sokubhalisa. Ubuningi bethusi obungalingani kuzo zonke izendlalelo zangaphakathi kubangela ukwanda kwephaneli engalingani ngesikhathi sokulamina, okususa izikhundla zethusi zangempela kusuka kuma-coordinates e-CAD. I-CAM ibala imephu yokuphambuka kwephaneli lonke bese ilungisa kusengaphambili izikhundla zokubhoboza nge-laser ukuze ibuyisele. Izendlalelo zangaphakathi ezinokusatshalaliswa kwethusi okungalingani kakhulu (isikhungo esingu-80%, imiphetho engu-20%) zenza lo modeli unganembile, okwandisa iphutha lesikhundla.

Isinyathelo 4 — Ukwenziwa kwefasitela lemaski elihlelekile. Ngokubhoboza i-CO₂, i-CAM ikhiqiza amafasitela e-copper etch azungeze i-blind ngayinye ngendawo — ububanzi befasitela = ububanzi + 50–75µm ohlangothini ngalunye. Uma umklamo wakho wephedi yangaphandle ungashiyi ithusi elanele kuzungeze la mafasitela, i-CAM izobonisa i-geometry emarginal.

6.2 Okufanele Ukufake Kumafayela Akho Ukuze Ugweme Ukuya Nokubuyela Emuva

• Ubukhulu be-dielectric obulungisiwe ngesendlalelo ngasinye, hhayi isitayela sokulungiselela kuphela: “1080 prepreg, ephilisiwe engu-60µm ±5µm” — hhayi “1080.” Lokhu kukhiya ukubalwa kwesilinganiso sesici kanye ne-impedance ngasikhathi sinye.
• Amapheya angaboni ngesendlalelo achazwe ngokucacile: “Izimbobo ezingaboni Ungqimba 1 → Ungqimba 2 (bobabili ubuso)” kumanothi okwenziwa. Onjiniyela be-CAM babone ukubhangqa okwanele kwezingqimba okuchazwe ngokungalungile kangangokuthi ukubiza okucacile kugwema isicelo sokubuyekezwa.
• Izindawo ezitholakala nge-Via-in-pad zikhonjwe: Bhala uhlu ngokwe-refdes, igama elifanele, noma i-PDF ephawuliwe. Ngaphandle kwalokhu, i-CAM isebenzisa inqubo yayo ejwayelekile yokugcwalisa — okungaba yi-resin plug, hhayi i-copper fill.
• Inothi lebhalansi yethusi lezendlalelo ezingavamile: Uma ungqimba luncane ngamabomu (30% ithusi ngezizathu zokungangeni), luphawule ngokucacile ukuze unjiniyela we-CAM angalubeki uphawu njengephutha lokuklama okungenzeka.

6.3 Yini Ebangela Ukubambezeleka Okukhulu Kokubuyekezwa

• Ifayela eliyimpumputhe nge-drill alihlukanisi ukuthi yiziphi izi-via ezima kusiphi isendlalelo — I-CAM kumele yakhiwe kabusha kusukela ku-geometry ehambisanayo
• I-Stack-up icacisa i-prepreg ngesitayela kuphela — umenzi wezinto kumele aqinisekise ukuthi yiluphi uhlobo olugciniwe nokuthi luyahlangabezana yini nesilinganiso sesici
• Ama-Via-in-pad nama-via ajwayelekile angaboni kahle awahlukanisiwe — umenzi akakwazi ukunquma izidingo zenqubo yokugcwalisa
• I-Impedance spec ibhekisela kungqimba yendiza engekho ku-stack-up ethunyelwe

Akukho neyodwa yalezi ezidinga ushintsho lomklamo. Zidinga amadokhumenti athatha imizuzu engama-30 futhi onge amahora angama-48.

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7) Izici Zezindleko Zokubhoboza Nge-Laser: Yini Eqhuba Isilinganiso Sakho Se-HDI Sikhuphuke Noma Sihle

7.1 Izinto Ezinhlanu Ezishintsha Intengo

Okuguquguqukayo 1 — Ngokubala. Isikhathi somshini we-laser siyisithiyo se-HDI. Ama-vias ayizimpumputhe angu-6,000 ngama-drill ephaneli angu-3× amade kuno-2,000. Ukulungiswa komklamo — kusetshenziswa imigodi egqitshwe ukuze kufakwe esikhundleni se-blind ehlanganisiwe ngamaketanga, ukwabelana ngama-vias phakathi kwama-pair esignali aseduze — kunciphisa ngokubala kanye nezindleko ngqo.

Okuguquguqukayo 2 — Ngokusebenzisa ububanzi kanye nenani lamashothi. I-0.10mm nge idinga amashothi e-laser angu-6-10 (iphethini yokuhlela kabusha). I-0.15mm nge idinga amashothi angu-3-5. Ephanelini elinama-vias angu-3,000, ukushintsha lawo angadingi i-0.10mm kuya ku-0.15mm kusindisa cishe u-30-40% wesikhathi somshini we-laser. Ukunciphisa izindleko kwangempela nokulinganisekayo.

Okuguquguqukayo 3 — Inani lemijikelezo ye-lamination. Umjikelezo ngamunye unezela izinsuku ezingu-2-3 kanye nezindleko ezilinganayo. Uhlobo I (imijikelezo emi-2) → Uhlobo II (imijikelezo emi-3) → Uhlobo III (imijikelezo emi-4+) ngamunye unezela cishe u-25-35% ngomjikelezo ngamunye owengeziwe.

Okuguquguqukayo 4 — Isidingo sokugcwalisa ithusi. Ukugcwaliswa kwe-electroplating yethusi kwama-vias ahlanganisiwe kunezela amahora angu-18-30 ngomjikelezo ngamunye wokugcwalisa. Uma ama-vias ahleliwe (≥0.20mm offset evundlile phakathi kwama-pair aseduze) esebenza emzileni wakho, ukususa isidingo sokugcwalisa konga u-20-35% wezindleko ze-HDI ngesendlalelo ngasinye.

Uhlobo lwe-Variable 5 — Uhlobo lwe-Laser. I-CO₂ iyindleko ejwayelekile. I-UV laser (edingekayo kuma-dielectric angewona ama-FR4) ingeza u-15–25%. Bhajetha lokhu uma i-stack-up yakho isebenzisa ama-laminate akhethekile aphansi noma asekelwe ku-PTFE ezingqimbeni ezihlanganisiwe.

7.2 Inkomba Yezindleko Ngohlobo Lokwakha

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8) Amaphutha Okuklama angu-8 Atholakala Ekubuyekezweni kwe-DFM

Lokhu kuvela kaningi ekubuyekezweni kwe-HDI DFM. Konke kungalungiswa ngaphambi kokwenziwa — akukho okudinga ukuhlelwa kabusha okugcwele.

1. Impumputhe ngokuxhumanisa izendlalelo ezingezona eziseduze. I-blind via esuka ku-L1 iye ku-L3 ekwakheni uhlobo I ayikhiqizwa — i-laser iyama kuthusi lokuqala elihlangana nalo (L2). Ukulungiswa: ama-blind via amabili alandelanayo ngokusebenzisa ukucushwa okuhleliwe noma okuhlanganisiwe.
2. Isilinganiso se-aspect esingaphezu kuka-0.8:1 ngenxa yokulungiswa okungalungile. Ngokuvamile kubangelwa ukucacisa i-2116 prepreg (ivuvukala ibe yi-110–130µm) ene-vias engu-0.10mm. Lungisa: shintsha i-buildup prepreg ibe yi-1080-style ku-60–70µm curved thickness.
3. Ithusi elingu-1 oz ezingqimbeni ezakhelwe i-HDI. Yehlisa ikhwalithi yefasitela lemaski elinobunjalo futhi inyusa ubuncane obusebenzayo ngobubanzi obungu-0.12–0.13mm. Lungisa: chaza ithusi elingu-½ oz (17µm) ezingqimbeni eziqongelelwe kumanothi okwenziwa.
4. Ama-land pad asayizi omncane kakhulu ngaphandle komkhawulo. Noma yikuphi ukuhlukahluka kokubhalisa kubangela ukuqhekeka. Lungisa: sebenzisa amanani anconywe ekukhiqizweni kuSigaba 2.2.
5. I-Via-in-pad ayibonakali kumanothi okwenziwa. I-Fabricator isebenzisa ipulaki ejwayelekile ye-resin kuzo zonke izimbobo ezingaboni; izindawo ezisebenzisa i-in-pad zithola inqubo engalungile. Lungisa: bhala izindawo ezisebenzisa i-in-pad ngokucacile ngokugcwaliswa kwethusi kanye nokuhlelwa kwe-CMP okucacisiwe.
6. Ama-vias ahlanganisiwe lapho i-staggered izosebenza khona. Ukwengeza izindleko zokugcwalisa ithusi kanye namahora angaphezu kwangu-30 okucubungula ngokungadingekile. Lungisa: hlola ukuthi ingabe i-offset evundlile engu-0.20mm phakathi kwama-pair ingafezeka yini — uma kunjalo, shintshela ku-staggered.
7. Ubukhulu be-dielectric abucacisiwe, isitayela sokulungiselela kuphela. I-Fabricator isebenzisa uhlobo lwayo lwesitoko samanje, olungahluka ku-75µm olucatshangwa yithuluzi lakho le-EDA. Lungisa: chaza ubukhulu be-dielectric obulungisiwe ngesendlalelo ngasinye ngokubekezelelana.
8. Ukungalingani kobuningi bethusi okudala ingozi yokukhukhuleka kokubhaliswa. Izendlalelo zangaphakathi ezinethusi elingaphansi kwama-25% engxenyeni eyodwa zibangela ukunwetshwa kwephaneli elingalingani kanye nokuqongelela kwamaphutha okubhalisa kuyo yonke imijikelezo ye-lamination. Lungisa: engeza ukugcwaliswa kwethusi okuchanyuselwe ezindaweni ezingenalutho — akudingeki ukuthi kuxhunywe kunoma iyiphi inethi.

8.1 Ingqalasizinda Yokubhoboza Nge-Laser yaseHighleap

I-Highleap Electronics inikeza ikhono eliphelele lokukhiqiza i-HDI:

• I-CO₂ laser: Izinhlelo eziyi-6, okungenani u-0.10mm, 400–600 nge/min, inqubo yemaski eguquguqukayo ye-FR4 kanye nawo wonke ama-laminate ahambisana ne-FR4
• I-UV laser: Izinhlelo ezimbili, okungenani u-0.075mm, i-ablation eqondile yethusi — i-laminate ekhethekile ephansi yokulahlekelwa, i-PTFE, ehambisana ne-polyimide
• Ukugcwaliswa kwethusi: Ukugcwaliswa kwethusi okufakwe ngogesi nge-CMP kuya ku-≤15µm protrusion; i-void spec ≤8% (idlula i-IPC-6012D Class 3 ≤10%)
• Izinhlobo zokwakha: Uhlobo I kuya kuhlobo III, i-anylayer HDI kuze kufike ezingqimbeni ezine zokwakheka kobuso ngobuso, i-rigid-flex HDI hybrid
• Isibuyekezo se-DFM: Isilinganiso ngasinye se-HDI sihlanganisa ukuhlolwa kwesilinganiso sesici, ukuqinisekiswa kwe-layer pair, kanye nokubuyekezwa kwe-copper fill callout zingakapheli amahora angu-24 — ngezincomo ezithile zokulungisa, hhayi amafulegi okwenqatshwa

Thumela Amafayela Akho E-HDI Ukuze Abuyekezwe Futhi Acashunwe yi-DFM