Ukukhiqizwa kwe-PCB ye-Optical Transceiver eShayina

I-Highleap Electronics inikeza ukukhiqizwa kwe-PCB ye-transceiver ye-optical eShayina kubaphakeli be-module ye-OEM kanye nabakhiqizi be-elekthronikhi abadinga ukwenziwa kwezingqimba eziningi okulawulwayo, amabhodi e-HDI aqinile kanye nokukhiqizwa okuphindaphindwayo kwama-PCB e-transceiver e-optical achazwe ngamakhasimende. Insizakalo yethu yebhodi elingenalutho ihlanganisa ukubuyekezwa kobunjiniyela be-CAM/DFM, ukuthengwa kwezinto ezivunyiwe, i-lamination yezingqimba eziningi, ukuthwebula izithombe zemigqa emihle, ukubhoboza kanye nokufaka iplati, ukuqeda indawo, ukuhlolwa kukagesi kanye nokuhlolwa kokukhiqiza okuvunyelwene ngakho.

Ukukhiqiza i-PCB ye-optical-transceiver akuyona nje indaba yokuhlangabezana nenani lezingqimba. Ibhodi lingadinga ukujiya okuncane okuqediwe, izinto ezilahlekelwa kancane, i-impedance elawulwayo, ama-via amancane, oxhumana nabo abakhethiwe begolide eliqinile, ama-solder pad amahle kanye nohlaka oluqondiswe kahle ngendlela efanayo. I-Highleap ihlola lezi zidingo ndawonye ngaphambi kokwamukela umzila wokukhiqiza. Amakhasimende athola ikhotheshini ngokusekelwe ezicini ezicacisiwe kanye nobubanzi bokuhlola, kunokuba kucatshangelwe ukuthi yonke "i-PCB enesivinini esikhulu" isebenzisa inqubo efanayo.

Sisekela ama-oda e-prototype, ukwakhiwa kokuhlola kanye nokukhiqizwa okuphindaphindiwe. Thumela i-stackup ekhishwe, idatha yokukhiqiza, umdwebo, amanothi ezinto zokwakha kanye nokuqeda, ubuningi kanye nosuku oluceliwe ukuze amaqembu ethu obunjiniyela nawokukhiqiza akwazi ukuhlola ibhodi langempela.

Ukubuyekezwa Kobunjiniyela Ngaphambi Kokukhiqizwa Kwe-PCB Ye-Optical Transceiver

I-Highleap iqala ukukhiqizwa kwe-transceiver ye-optical engenalutho ngesibuyekezo sobunjiniyela esilawulwayo sephakheji yomklamo ekhishwe. Ubuciko be-CAM, idatha yokubhoboza, ishejuli yezinto ezibonakalayo, ngemephu, i-stackup, uhlaka lwebhodi, izidingo zokuqeda ubuso kanye nemigomo yokwamukelwa kumele ichaze ibhodi elifanayo. Isilinganiso esisekelwe kuphela enanini lezendlalelo, usayizi webhodi kanye nobukhulu obuncane obumbalwa asikwazi ukunquma ukuthi isakhiwo sangempela silungele ukwenziwa okuzinzile.

Ukubuyekezwa kobunjiniyela kuhlukanisa nezici ezivame ukumbozwa yinqubo yokukhiqiza ekhethiwe kulabo abadinga ukusebenza okukhethekile noma okuhlukile. Inhloso ukugwema ukuthola ukuthintana okuqinile, i-BGA egcwele futhi enesivalo nge-hybrid laminate noma ukubekezelelana okuqinile ngokungavamile kuphela ngemva kokuba i-oda lokuthenga selamukelwe. Amadokhumenti angaba khona aphikisanayo acaciswa ngaphambi kokuba kuqedwe umzila wokukhiqiza kanye nemigomo yezentengiselwano.

Ukuhlolwa Okubalulekile Kokukhishwa kwe-CAM kanye ne-DFM

• Ukulungiswa kokubuyekezwa kwamafayela: Izendlalelo ze-Gerber noma ze-ODB++, ama-drill e-NC, izikhala, izindlela zokuhamba, amanothi okukhiqiza kanye nokubuyekezwa komdwebo kuyahlolwa ukuthi kuyafana yini. Ukuphela kokuxhumana okuboniswe kuphela emdwebweni womshini noma ngesakhiwo esingekho kumephu yokubhoboza kungabangela iphutha elikhulu lokucubungula. Ulwazi oluphikisanayo lubuyiselwa kumnikazi womklamo kunokuba luxazululwe ngombono wokukhiqiza ongaqoshiwe.

• Ukuqinisekiswa kwezinto zokwakha kanye nokuhlanganiswa kwazo: Ibanga le-laminate, ukwakhiwa kwe-dielectric, isisindo sethusi ngesendlalelo, ubukhulu bebhodi lokugcina kanye nezinye izindlela ezivunyiwe ziyahlolwa ndawonye. Izinto ezithile ezilahlekelwa kancane noma ezihlanganisiwe zingadinga izimo zokucindezela ezizinikele noma isikhathi sokuthola. Imiyalelo ejwayelekile "yokusebenzisa i-FR-4 yesivinini esikhulu" ayifani nesisekelo sezinto ezifanelekile, ikakhulukazi esiteshini samakhasimende esiqinisekiswe ngaphambilini.

• Inhlanganisela yezici zokukhiqiza: Umkhondo/isikhala esincane, indandatho ehlanganisiwe, ububanzi bokubhoboza, isikhala sethusi esisuka embobeni siye kokungaxhunyiwe, ukujiya kwethusi kanye nokubhaliswa kuhlolwa njengenhlanganisela. Umkhondo noma usayizi wethuluzi omncane kakhulu wesitolo awubufakazi bokuthi wonke umklamo ungakhiwa ngokwezomnotho ngaleyo mingcele. Uma umkhawulo wenqubo umncane, okuhlukile kanye nanoma iyiphi enye indlela ehlongozwayo kubhaliwe ukuze kubuyekezwe amakhasimende.

• Izincazelo ze-Via-treatment kanye ne-HDI: Ukuxhumana okungaboni nokufihliwe kudinga imephu yokuxhumeka kwesendlalelo kanye nohlelo olufanele lwe-lamination. Uma kukhona i-via-in-pad, imidwebo kumele icacise ukuthi ukugcwalisa, ukuhlelwa kwe-planarization kanye ne-copper cap kuyadingeka yini; ukuxhuma okuvamile kwe-solder-mask akukwazi ukuthathwa njengokulingana ngaphansi kwe-solderable pad ethambile. Le misebenzi ithinta intengo, ukuhlolwa kanye nesikhathi sokuhola ngakho-ke kufanele kube sekhotheshini yokuqala.

• Ubukhulu bokuthintana obubalulekile kanye nobemishini: Indawo yokuthintana komphetho, ukuqeda, ubukhulu obufakwe ipuleti lapho kuchazwe khona, ukujiya, uhlaka kanye nobukhulu obufanele imodyuli kubuyekezwa ngokuqhathanisa nemidwebo ekhishwe yikhasimende. Amaphedi e-ENIG kanye nokuxhumana okugqokwa okuqinile okukhethiwe kunezidingo ezahlukene zokwenziwa. Indlela yokuhlola eyamukelekayo kanye nanoma yiziphi izinkomba zesixhumi ezilawulwayo zisungulwa ngaphambi kokukhiqizwa.

• Izimfuneko zokwamukelwa nokulethwa: Ukuhlolwa kukagesi, ukuqinisekiswa kwe-impedance, izingxenye ezincane, ukulandeleka kwezinto, amarekhodi anobukhulu kanye nanoma yimuphi umbiko wokuthembeka ochazwe yikhasimende akuvunyelwana ngobubanzi, indlela kanye nokusampula. Isitatimende esijwayelekile "sokuhlola okungu-100%" noma ifayela le-CAM elivunyiwe alithathi indawo yobufakazi bokwamukelwa obudingekayo. Ukuzibophezela kwesikhathi sokukhiqiza kufanele kuqale kusukela eqophelweni lokukhishwa okuvunyelwene ngalo ngokucacile.

Xazulula Okuhlukile Kobunjiniyela Ngaphambi Kokusebenzisa Amathuluzi

Ukubuyekezwa kwe -Highleap's PCB DFM kungabona lezo zikhala ngaphambi kokuba kuqale ukwenziwa. Umphumela uyiphakheji yokukhiqiza echaziwe, okuhlukile kobuchwepheshe okuqinisekisiwe kanye ne-RFQ ngokusekelwe kumklamo wangempela. Imvume yamakhasimende iyatholakala nganoma yiluphi ushintsho oluthinta ubuciko bethusi, ukuvimba, ukusebenza kwezinto, ukulingana kwesixhumi noma ukuthembeka; isivuno esithuthukisiwe sefektri akusona isizathu sokushintsha izidingo zomkhiqizo okhishwe buthule.

Ukuthengwa Kwezinto Ezinelahleko Eziphansi kanye Nokushiswa Kwezingqimba Eziningi

I-Highleap ikhiqiza ama-PCB e-optical-transceiver esebenzisa uhlelo lwe-laminate oluqinile oluvunyiwe, olunezinga lesivinini esikhulu/lokulahlekelwa okuphansi kanye nokuhlelwa kwe-hybrid okuhlolwe ngokwedizayini. Umndeni we-laminate ochazwe yikhasimende, uhlobo lwe-copper foil, inhlanganisela ye-core/prepreg kanye nobukhulu bokugcina be-dielectric kulawula ukuthi sisungula kanjani indlela yezinto kanye nomzila we-lamination. Ukukhetha izinto akushintshwa kalula ngebanga le-FR-4 elishibhile uma kuyingxenye yokwakhiwa kukagesi okuvunyiwe.

Izinto ezikhethekile zingadinga isitoreji esihlukile, ukuphathwa, imijikelezo yokucindezela kanye nezimo zokubopha ezivela ezakhiweni ezivamile. Ukuxuba izinhlelo ze-dielectric kunezela olunye ungqimba lokubuyekezwa kwenqubo: izinto kumele zihambisane nohlelo lokubopha olukhethiwe kanye nokuziphatha okudingekayo kokushisa/komshini. I-Highleap ihlola ukutholakala kokuthengwa kanye nochungechunge lokwakha oluhlongozwayo ngaphambi kokuqinisekisa ishejuli yokulethwa, ikakhulukazi lapho ikhasimende lidinga i-laminate eqanjwe igama noma lingavumeli ukushintshwa.

Ukusatshalaliswa kwethusi kanye nokwakhiwa kwezingqimba nakho kuyahlolwa ukuze kutholakale ukubhaliswa kanye nokuzinza kobukhulu. Amabhodi e-transceiver amancane angaba bucayi ekuphathweni kwamaphaneli kanye nokubekezelelana kobukhulu. Amaphethini angaphakathi aminyene angadala izinselele zokuqopha kanye nokubopha uma kuhlanganiswa nezinsimbi zethusi ezikhethekile. Lokhu kuxazululwa ngamathuluzi okukhiqiza kanye nokuhlela inqubo, hhayi ngokuthembisa ukuthi zonke izici zizokhiqizwa ngokuzenzakalelayo ngomkhawulo wamandla azo ahlukile.

Lapho kucacisiwe khona ukuthi i-impedance iyasebenza, i-stackup kanye ne-geometry yomqhubi oqediwe kuphathwa njengemfuneko ehlanganisiwe. Amakhuphoni avunyiwe, ukubekezelelana kokulinganisa kanye nobubanzi bokubika kuqinisekiswa kumadokhumenti okukhiqiza. Izinsiza zokukhiqiza izinto ze-PCB ze-Highleap ezisheshayo zinikeza isizinda esihlobene ngezinto zokwakha kanye nezinketho zokwakha.

Ukulawula Ukwakhiwa Kwezingqimba Kusukela Enkingeni Yezinto Ezibonakalayo Kuya Ekubunjweni Kwezingqimba

I-stackup evunyiwe iqhuba ukuthengwa kwezinto, ukulungiswa kwezingqimba zangaphakathi kanye ne-lamination. Kuzinhlelo ze-transceiver ezisebenzisa ama-laminate aphansi noma ama-hybrid, i-Highleap ihlola amazinga e-laminate kanye ne-bondply, ubukhulu obukhona be-core/prepreg, uhlobo lwe-copper foil kanye nokuhambisana kwezinto nenqubo eceliwe. Izingqimba zangaphakathi ziyakhiwa futhi zihlolwe ngaphambi kwe-lamination; uma sezifakiwe, amaphutha amaningi omugqa kanye nesikhala kunzima ukuwabuyisela. I-stackup elawulwayo ifaka phakathi isikhala se-dielectric esidingekayo, izinsimbi zethusi eziqediwe, ubukhulu bokugcina kanye nezibonelelo zokubhalisa, hhayi nje igama lomkhiqizo le-laminate.

I-hybrid stack ingahlanganisa izinto ezinezici ezahlukene zokushisa nezobukhulu. Ngakho-ke, amapharamitha e-lamination kanye nokuhambisana kwezinto kudinga ukuqinisekiswa kwephrojekthi ethile. Uma ibanga eliceliwe lingatholakali, kufanele kufakwe okunye esikhundleni esiphakanyisiwe ngokumelene nezidingo zikagesi nezokuthembeka ezivunyiwe ngaphambi kokuba noma yiliphi i-oda lishintshwe. I-Highleap ayiphathi i-dielectric ejwayelekile ebiza kancane njengokushintsha okuzenzakalelayo kokwakhiwa kwesiteshi sesivinini esiphezulu esifanelekayo kumakhasimende.

Yiziphi Izinguquko Phakathi Kohlobo Lwesibonelo Nokukhiqizwa Kwe-Lamination

Iphrothokholi ingakhiqizwa ngezinto zephaneli ezitholakala kalula noma isivumelwano esithile se-stackup esivunyelwe ukuhlolwa. Ukukhiqiza okuphindaphindiwe kudinga ukunikezwa okuzinzile kanye nokwakhiwa okubhalisiwe okuphindaphindwayo. Sibuyekeza amafomethi ephaneli, ukubhaliswa kwezingqimba, imibhalo yeqoqo lezinto lapho kuchazwe khona kanye nemikhawulo yamakhasimende kwezinye izinto. Uma umkhiqizo udinga imibiko ye-impedance noma ukujiya, indlela yokuhlola ifakwa ohlelweni lokwakha. Ukuqinisekiswa kokufakwa nokulahlekelwa okunikezelwe kuchazwe ngokwehlukile; umphumela we-impedance awusona isiqinisekiso esiphelele sokusebenza kwemojuli nohlelo.

Izinqubo Zokuqopha Ezinhle, Ukubhoboza Okwenziwa Ngomshini kanye Ne-HDI

Ukukhiqiza ama-PCB e-transceiver e-optical aqinile kusho ukulawula okungaphezu kwesihloko esincane sokulandelela kanye nekhono lokubhoboza. Amaphethini ethusi amahle kakhulu, amaningi ngezakhiwo kanye nezikhala zangaphakathi ezincane angavela ebhodini elincane elifanayo. Umthelela wawo ohlangene ekuthwebuleni izithombe, ekuqopheni, ekubhobozeni, ekucwebezelweni, ekucwebezelweni nasekuhlolweni kunquma ukukhiqizwa kwangempela, isivuno kanye nendlela efanele yokukhiqiza.

I-Highleap ihlola umqhubi oqediwe kanye nejiyometri yembobo ehlosiwe ngokuqhathanisa nesisindo sethusi, ukujiya kwebhodi, ukubhaliswa kwesendlalelo kanye nohlelo lwezinto ezicacisiwe. Isici esingakhiqizwa ngesikhathi sokuhlolwa okukhethekile akuyona ngempela into ezenzakalelayo engcono kakhulu yokukhiqizwa kwevolumu okuphindaphindiwe. Ukubuyekezwa kobunjiniyela kugxile ekufezeni ukwakhiwa kukagesi nokwemishini okukhishwe ngamakhasimende ngemingcele yenqubo ephindaphindwayo kanye nenqubo ecacile yokukhetha.

Izilawuli Zokwenziwa Okubalulekile zama-PCB e-Fine-Line kanye ne-HDI Transceiver

• Isinxephezelo somsebenzi wobuciko kanye nephrofayili yokulandelela: Ububanzi bokulandelela kanye nesikhala kubukezwa kuqhathaniswa ne-base foil, ithusi lokugcina, isu lokufaka iplati kanye nenqubo ekhethiwe yokuqopha. Umzila omncane we-2/2 mil ungadinga ukulawulwa okuqinile kanye nokuhlolwa okwengeziwe, ikakhulukazi ezintweni ezikhethekile. Ifektri akufanele ikhulise ngokungenasizathu inethi elawulwa yi-impedance; lapho ukwakheka okungadingi kakhulu kungenzeka, kuphakanyiswa kumakhasimende ngaphambi kokukhishwa kwedatha.

• Usayizi wethuluzi lokubhoboza uma kuqhathaniswa nemigodi eqediwe: Ububanzi bokubhoboza obusebenza ngomshini, ubukhulu bemigodi eqediwe, ukuguguleka kwamathuluzi, ukujiya kwebhodi kanye nenani lokubhoboza kucatshangelwa ndawonye. Ithuluzi elingu-0.20 mm lingase lisebenzeke kodwa lihambe kancane futhi lingathetheleli kangako kunethuluzi elikhulu esakhiweni esithile. I-drill engu-0.30 mm inganciphisa ingcindezi yokukhiqiza kuphela uma osayizi bephedi, isikhala sikagesi kanye nezidingo zokubhoboza zikuvumela; izinguquko ezinjalo azikaze zenzeke ngokuzenzakalelayo.

• Ukubhaliswa kwembobo kuya kuthusi kanye nesendlalelo: Imbobo ingafinyelela ububanzi bayo obujwayelekile kodwa ibe sengozini yokulahlekelwa yinkomba yangaphakathi eseduze uma ukubhoboza kanye nokubekezelelana kokubhaliswa kwesendlalelo kusebenzisa umkhawulo otholakalayo. I-CAM ihlola ukuvuleka kwethusi okungasebenzi, amasongo ahlanganisiwe, isikhala phakathi kwembobo nembobo kanye nobukhulu obuphakanyisiwe bokuqedwa. Izikhala zangaphakathi eziqinile zingadinga ukuvuleka okubuyekeziwe noma ushintsho lobuciko oluvunyiwe kunokuba kube uhlelo lokubhoboza oluhlukile.

• Ukwenziwa kwensimbi embobeni edlulayo kanye nokuhlolwa: Ukuqina kwe- Desmear, ukufakwa kanye nobuqotho bethusi obumboziwe kubalulekile ekuqhubekeni kukagesi okunezingqimba eziningi kanye nokuthembeka kwesikhathi eside. Inqubo eyamukelekayo kanye nohlelo lokuhlola lukhethwa ukwakhiwa kwebhodi langempela kanye ne-geometry yembobo. Ukuhlolwa kokuqhubeka/ukuhlukaniswa kwebhodi eliqediwe akukwazi ukusungula ikhwalithi yodonga olumboziwe; izingxenye eziphambene noma ubufakazi obengeziwe kufanele bufakwe lapho kuchazwe yikhasimende.

• Ukulandelana kwe-HDI, ama-microvia kanye ne-via-in-pad: I-microvia ngayinye noma uxhumano olufihliwe luboshelwe ku-layer pair yayo kanye nesigaba se-lamination. Izakhiwo ezihlanganisiwe, ama-resin-filled kanye nama-capped vias, kanye nemigodi ebholiwe emuva yizici ezahlukene ezinemisebenzi ehlukene yokukhiqiza. Ku-BGA egoqekayo nge-in-pad, izidingo zokuba flat kanye ne-capping ziyaqinisekiswa ngokuhlanganiswa; i-solder-mask tenting ayiphathwa njengento ethatha indawo ye-planar pad ehlanganisiwe.

• Ukugcinwa kwesici esiphakathi: Ukuhlolwa kwesendlalelo sangaphakathi kungabamba amaphutha okuthwebula izithombe ngaphambi kokulamina; izilawuli ezilandelayo zibhekana nokubhoboza, ukucwebezela, ukujikeleza kwesendlalelo sangaphandle kanye nobukhulu bokugcina. Uma kutholakala isici, indawo ihlolwa ngokuhambisana nezindlela zokwamukela ezivunyelwene ngazo kanye namarekhodi enqubo athintekile—hhayi nje ukuthi ukuhlolwa kokugcina kukagesi kuyamukeleka. Ikhasimende kumele livume noma yikuphi ukukhishwa ngaphandle kwencazelo ekhishwe.

Ukuvumelanisa Ubunzima Bokukhiqiza Nokukhiqiza Ubuningi

Izinketho zenqubo ezinemininingwane zichazwe ngaphansi kokukhiqizwa kwe-HDI PCB . Umbuzo ofanele wokukhiqiza we-oda le-transceiver ye-optical ukuthi ingabe i-stackup ehlanganisiwe, i-geometry yethusi kanye nomklamo we-via kungagcinwa ngokuqhubekayo yini enanini elidingekayo kanye nezinga lokuhlola. Lokhu kunikeza ikhotheshini ethembeke kakhulu kunokuphatha ukuboniswa kwesici selabhoratri njengesiqinisekiso sokukhiqiza esihlanganisiwe.

Ukufakwa Kwezingcezu Ezikhethiwe, Iminwe Yegolide kanye Nejiyometri Yebhodi Eliqediwe

Amabhodi amaningi e-transceiver axhunywayo athembele ku-geometry yokuxhumana kwegolide eqediwe okumele ihambisane nesixhumi se-host. I-Highleap ikhiqizwa ngokuvumelana nezidingo zokuxhumana ezichazwe yikhasimende kanye nohlaka, okuhlanganisa izici zokubopha ezikhethiwe, i-edge-bevel noma ubukhulu bebhodi eliqinile lapho kungenzeka khona. Ukuphela kokuxhumana kumele kuchazwe ngokunembile: I-ENIG kuma-component soldering pads ayihlangabezani ngokuzenzakalelayo nencazelo yokuxhumana okugugile kwegolide.

Imfuneko yokubeka i-plating kufanele iveze indawo ehlosiwe yegolide eliqinile, ubukhulu be-nickel/igolide lapho kuchazwe khona, imingcele yokufihla kanye nanoma yikuphi ukucushwa okukhethekile kokuxhumana. Uhlelo lwenqubo luphinde lubhekele ubudlelwano phakathi kokubeka i-plating, ukuqondisa ibhodi kanye nokubeka i-beveling. Oxhumana nabo ababekwe i-plating onqenqemeni lokufaka bangadinga ukulawula okwengeziwe kunalokho okushiwo yinto ejwayelekile yomugqa wokuphela kwendawo; imininingwane engekho iyimbangela evamile yokucaphuna kabusha ngemva kokubuyekezwa kwe-CAM.

Ezinye izici zokunemba zingafaka phakathi amaphrofayili ebhodi elincane, imiphetho egobile lapho kuchazwe khona, ukuvuleka okuqondiswe khona kanye nobukhulu obulawulwa kahle obuzungeze isixhumi noma isikhombimsebenzisi sendlu. I-Highleap ibuyekeza lokhu ngomdwebo wokubhekisela komshini kanye nowokwenziwa. Ibhodi elisebenza kahle ngogesi kodwa elingafaneleki endaweni ebiyelwe liwumkhiqizo ongahambisani, ngakho-ke ubukhulu obubalulekile kanye nezidingo zokulinganisa ziyaqinisekiswa ngaphambi kokwenziwa okuphindaphindiwe.

Ukukhethwa kokuqedwa kwendawo nakho kuthinta ukuhlanganiswa kwe-SMT okulandelayo. Ama-pad akhethekile noma izici zokushisa zingadinga ukukhetha kokuqeda kanye nokwelashwa okufanele kuhlolwe ngenqubo yokuhlanganisa. Lapho i-Highleap inikeza kokubili ukwenziwa kanye nokuhlanganiswa, le mininingwane yokudluliselwa ihlanganiswa kuzo zonke izikophu ezimbili, kanye nensizakalo yokuhlanganisa i-PCB ye-transceiver ehlukile etholakalayo kuma-oda ebhodi elinabantu abaningi.

Izinqubo Ezihlukile Zama-SMT Pads kanye Neminwe Yokuxhumana

Amabhodi e-transceiver e-optical avame ukuhlanganisa ama-solderable pad athambile ane-pitch kanye nokuxhumana kokufaka okunomphetho wekhadi. Elokuqala lingadinga i-ENIG noma okunye ukuqeda okuvunyelwe; elesibili lingadinga igolide eliqinile elikhethiwe, ungqimba lwe-nickel kanye nobukhulu obuthile bokuxhumana. I-Highleap ibuyekeza indawo eqondile yokubeka, imaski yokukhipha, i-edge bevel, i-conductor-to-edge clearance kanye nendlela yokuhlola. Umdwebo othi nje "i-gold plating" awukwazi ukuhlukanisa lezi zidingo futhi ungabangela ukucaphuna kabusha ngemva kokubuyekezwa kwe-CAM.

Ukuqondisa Amabhodi Amancane Ngaphandle Kokulahlekelwa Ukunemba Kwe-Interface

Uhlaka lwemojuli oluncane lungaba nozwelo ekuqondisweni kwemishini, ukwesekwa kwephaneli kanye nokwehluka kobukhulu. Ibhodi eliqediwe lingadinga umphetho wokufakwa olawulwayo kanye nokuba yisicaba kwendawo ngaphansi kwezingxenye noma izici zokuhlangana. I-Highleap ihlola imingcele yamathuluzi, ama-data e-outline, ubukhulu bebhodi kanye nezidingo zokulinganisa ngaphambi kokukhishwa kwephaneli. I-contact plating ekhethiwe ingase ibeke imingcele eyengeziwe endleleni iphaneli ecutshungulwa ngayo, ngakho-ke ukuqeda kanye nohlaka kufanele kubuyekezwe ndawonye kunokuba kube yizinto ezihlukene.

Ukuhlolwa, Izihloko Zokuqala kanye Nokulawulwa Kwenqubo Yokukhiqiza

Inqubo yokukhiqiza ye-Highleap ingafaka i-AOI yangaphakathi kanye neyokugcina, ukuqinisekiswa kwembobo efakwe ipulasitiki, ukuhlolwa kukagesi kwebhodi eliqediwe, ukuhlolwa okubucayi kanye nezilawuli ezengeziwe ezichazwe ngamakhasimende. Uhlelo lokwamukela ukukhiqizwa kwebhodi le-optical-transceiver lungadinga namakhuphoni e-impedance, amarekhodi e-microsection, ukulandeleka kwezinto, imibiko yobukhulu noma izilinganiso zokufaka ipulasitiki ezikhethiwe. Lokhu kumele kuchazwe yimidwebo evunyiwe kanye nesivumelwano sekhwalithi; asisho ukuthi iphakheji eyodwa yokuhlola ejwayelekile ihlanganisa zonke izidingo ze-optical-module ezingaba khona.

Umphumela wekhuphoni le-impedance awufani nokufaneleka okuphelele kokulahlekelwa yisiteshi, futhi ukuhlolwa kwe-E kwebhodi elingenalutho akubonisi ukusebenza kahle kokukhanya. Lezo zivivinyo zichazwa ezingeni lomkhiqizo elihlukile. Inani lamarekhodi okukhiqiza ukuthi abonisa ukuthi i-Highleap yakha ibhodi yini ngezakhiwo ezichazwe kuleyo ndawo yokukhiqiza.

Ukuze kuqinisekiswe i-prototype, sithola ukuthi yiziphi izici ezidinga ubufakazi besihloko sokuqala nokuthi yiziphi ezingalandela ukuhlolwa okuvamile kwe-lot. Kuma-oda aphindaphindwayo, izinguquko ezihilela i-laminate, i-foil, i-via process, i-surface finish noma amathuluzi abalulekile kufanele zibuyekezwe ngokuqhathanisa nokucushwa kokukhiqiza okuvunyelwe ngamakhasimende. Izinsiza zethu zokuhlola ugesi ze-PCB zixoxa ngengxenye eyodwa yaleyo nqubo yokwamukelwa kwebhodi elingenalutho.

Ukuqinisekiswa Okunezingqimba Kunokuhlolwa Kokugcina Okukodwa

Ikhwalithi yokukhiqiza iqala ngaphambi kokuhlolwa kokugcina kwe-E. Kuye ngobubanzi bomsebenzi obamukelekayo, i-AOI yengqimba yangaphakathi ihlola umsebenzi wobuciko, izilawuli zokubhoboza kanye ne-plating zibhekana nobuqotho bembobo ehlanganisiwe, ukuhlolwa okubonakalayo nobukhulu kuqinisekisa uhlaka lwebhodi kanye nokuqeda, kanti ukuhlolwa kukagesi kubhekana nokuqhubeka/ukuhlukaniswa. Amakhuphoni okuvinjelwa, izigaba eziphambeneyo, izilinganiso zobukhulu kanye nokuqinisekiswa kwe-plating kwenziwa ngokwemigomo e-odiwe yikhasimende. Isethi yokuqinisekisa ikhethwa ukuze ifane nengozi yangempela: uhlelo lokuxhumana olune-card-edge ludinga ubufakazi obuhlukile ebhodini lesignali elijwayelekile elingaxhunywa.

Izenzo Zokulungisa Nokuhambisana Kwezindawo

Iphrothokholi edlula ukuhlolwa okusebenzayo ayanele ukuvumela izinguquko ezingamenyezelwanga ku-laminate, iphrofayili yethusi, ngokucubungula noma ukubopha okukhethiwe kuma-batches akamuva. I-Highleap isebenzisa izilawuli zokubuyekezwa kanye nokucaciswa ukuze iqhathanise ama-oda aphindaphindwayo nesisekelo esikhishwe. Uma ukubekezelelana noma inqubo ekhethekile kungacaci, inkinga iphakanyiswa ngaphambi kokukhiqiza; lapho ukuhlolwa kukhomba isici esingahambisani, ukuhlelwa kulandela imigomo yokwamukelwa okuvunyelwene ngayo kanye nanoma yisiphi isidingo sokuvunyelwa kwamakhasimende. Lokhu kudala izinqumo ezingalandelelwa esikhundleni sokuthumela buthule isakhiwo esithatha indawo.

Izilinganiso Zokwenziwa Kwe-PCB Ye-Transceiver Ye-Optical kanye Nama-oda Okukhiqiza

Ukuze ucele isilinganiso sokukhiqiza, nikeza idatha ye-Gerber noma ye-ODB++ elawulwayo, idatha ye-NC drill kanye ne-rout, i-layer stackup, izidingo ze-laminate grade kanye ne-dielectric, ukujiya kwebhodi eliqediwe, izinsimbi zethusi, amanothi e-impedance, ubukhulu bomshini kanye nencazelo yokuphela kwendawo. Thola ama-via acwebezelwe noma abholwe nge-laser, noma yimiphi imikhawulo ye-backdrill noma ye-via-stub, ukugcwalisa/ukuvala nge-via-in-pad, igolide eliqinile elikhethiwe, i-edge bevel nezinye izici ezikhethekile. Sho amakhefu enani, ivolumu yonyaka elindelekile, imibiko yokuhlola kanye nomgomo wokulethwa odingekayo.

Uchungechunge lwe-RFQ olulungele ukukhiqizwa

1. Thumela umsebenzi wobuciko ophelele okhishwe, amafayela okubhoboza, i-stackup, amazinga ezinto kanye nomdwebo wokuqeda ukuxhumana.
2. Khomba izinto zenqubo ekhethekile ezidinga ukuvunyelwa kobunjiniyela kanye nanoma yibuphi ubufakazi bokuhlolwa obuyimpoqo.
3. Cela ukubuyekezwa okubhaliwe kwezinto ezihlukile ngaphambi kokwamukela izindleko zokugcina kanye nesikhathi sokuhola sokukhiqiza.
4. Khipha uhlelo lokubuyekezwa oluvunyiwe kanye nohlelo lobuningi ukuze kutholakale isisekelo sokukhiqiza.

I-Highleap ibuyekeza izidingo ngaphambi kokuqinisekisa umzila wokukhiqiza, ukutholakala kwezinto, okuhlukile kobuchwepheshe, intengo yeyunithi kanye neshejuli. Isilinganiso singaba yisabelomali kuyilapho idatha yobunjiniyela ingaphelele; isilinganiso sokukhiqiza esivunyiwe sibonisa imininingwane yokugcina yokukhiqiza. Uma isici esiyimpoqo sidlula iwindi lenqubo eqinisekisiwe, sixoxa ngenye indlela evunyiwe ngobuchwepheshe noma sithole inkinga ngaphambi kokuzibophezela ku-oda.

I-Highleap inikeza ukwenziwa kwe-PCB engenalutho njengobubanzi bokukhiqiza obuchaziwe. Amaphrojekthi adinga ukuthengwa kwezingxenye, ukubekwa kwe-SMT noma ukuhlolwa kwezinga lebhodi angacashunwa ngokwehlukana njengokuhlanganiswa kwe-PCB ye-transceiver ye-optical , kuyilapho ukuhlinzekwa kwethu kwe-PCB ye-transceiver eyenziwe ngokwezifiso kuhlanganisa nezidingo ze-module-form-factor kanye ne-connector-interface. Thumela amafayela akho okukhiqiza ku-Highleap Electronics ukuze uthole ikhotheshini ebuyekezwe ubunjiniyela kanye nohlelo lokukhiqiza.

Indlela Intengo Yokukhiqiza Eyakhiwa Ngayo

Isilinganiso sebhodi elingenalutho sibheka ukusetshenziswa kwezinto zokwakha kanye nephaneli, inani lezinqubo zengqimba yangaphakathi, ubunzima bokubhoboza kanye nokufaka amaplati, imikhawulo emigqeni emincane, ukuqedwa okukhethekile, ukuqinisekiswa okuhleliwe kanye nobuningi. Izinyathelo ezengeziwe zokwakha, ama-via agcwalisiwe, ukubhoboza okujulile okulawulwayo noma igolide eliqinile elikhethiwe kungashintsha kokubili intengo kanye nomthamo. Izicelo zokujika ngokushesha kumele zihlolwe ngokuhambisana nokulandelana kwenqubo yangempela; ukwelapha, ukubopha kanye nokufaka amaplati akukwazi ukufinyezwa njalo ngaphandle kokushintsha iphrofayili yengozi.

Faka noma yimiphi imibhalo yokuhlola edingekayo ku-RFQ yokuqala. Isicelo semibiko yokuvinjelwa, ukulandelelwa kwezinto noma ubukhulu bokuxhumana obubalulekile ngemva kokufakwa kwe-oda kungase kwethule izilinganiso ezengeziwe kanye nezinguquko zokuhlela. I-Highleap ingahlukanisa ukwenziwa okujwayelekile, izinqubo ezikhethekile ezibuyekezwe ubunjiniyela kanye nanoma yikuphi ukuhlolwa okucashunwe ngokwehlukana ukuze ukuthenga kuqhathanise ububanzi bangempela obamukelekayo.