Inqubo Yokukhiqiza i-PCB: Kusukela Kumklamo we-PCB kanye Nobunjiniyela be-CAM kuya Ekukhiqizeni Nokuhlanganisa

isifinyezo-senqubo-yokukhiqiza ye-pcb

Umfanekiso 1. Ukubuka Konke Kwenqubo Yokukhiqiza ye-PCB

Inqubo yokukhiqiza i-PCB ayiqali lapho iphaneli embozwe ngethusi ifika emgqeni wezithombe. Embonini ye-PCB yobungcweti, ukukhiqiza kuqala lapho idatha yomklami iguqulwa ibe idatha yokukhiqiza elawulwayo. Lokho kuguqulwa kungumthwalo wemfanelo wobunjiniyela be-CAM.

Umklami we-PCB uchaza inhloso kagesi, imikhawulo yemishini, izinhloso ze-stackup kanye ne-interface yezingxenye. Unjiniyela we-CAM uguqula leyo nhloso ibe yimisebenzi yobuciko ekhiqizwayo, izinhlelo zokubhoboza kanye nezinhlelo zokuqondisa, idatha yephaneli, izinkomba zokuhlola, amakhuphoni e-impedance kanye nemiyalelo yenqubo. Lezo ziphumo zibe sezikhishwa nge-ERP yefektri noma uhlelo lokufundisa lokukhiqiza ukuze wonke umnyango wokukhiqiza usebenze kusukela encazelweni eyodwa elawulwayo.

Lo mhlahlandlela uchaza inqubo ephelele yokukhiqiza i-PCB kusukela kulokho kudluliselwa kobunjiniyela ngokulungiselela izinto, ukucubungula okungaphakathi, i-lamination, ukubhoboza, i-plating, i-outer-layer imaging, i-solder mask, i-surface finish, i-profiling, ukuhlolwa kukagesi kanye nokuhlolwa kokugcina. Uchaza nokuthi yini abaklami be-PCB okufanele bayiqonde nge-CAM ukuze amabhodi abo adlule ekubuyekezweni kobunjiniyela ngemibuzo embalwa, ukuvumelana okuncane kanye nendlela ezinzile yokukhiqiza.

Umqondo oyinhloko: Umklamo we-PCB kanye nobunjiniyela be-CAM akuwona umhlaba ohlukile. Umklamo omuhle we-PCB unciphisa ukungenelela okungadingekile kwe-CAM; ubunjiniyela be-CAM obuqeqeshwe kahle buvikela inhloso yomklamo ngenkathi buvumelanisa idatha ne-physics yokukhiqiza yangempela. Umphumela omuhle kakhulu wokukhiqiza uvela ekuphatheni lokhu okubili njengochungechunge olulodwa lobunjiniyela.

 

Inqubo Yokukhiqiza ye-PCB Ihlanganisani Ngempela?

Inqubo yokukhiqiza ibhodi lesifunda eliphrintiwe ukuguqulwa okulawulwayo kwedatha yokuklama ye-PCB ibe ibhodi elingokoqobo elihlangabezana nezidingo zikagesi, zobukhulu, zezinto kanye nokuthembeka. Ihlanganisa okungaphezu nje kokuthwebula izithombe nokuqopha. Inqubo yokulungiselela ukukhiqiza ivame ukuba nezendlalelo ezine zobunjiniyela ezixhunyiwe:

Isendlalelo sobunjiniyela Umthwalo wemfanelo oyinhloko Okukhiphayo okuvamile
PCB design Ichaza ukuxhumana kwesekethe, umzila, indawo, izixhumi zomshini, ama-stackup target kanye nemikhawulo yokuklama. Idatha ye-Gerber/ODB++/IPC-2581, amafayela okubhoboza e-NC, umdwebo wokwenziwa, i-stackup, uhlu lwe-net kanye namanothi okuklama.
Ubunjiniyela be-CAM kanye ne-DFM Ihlola ukukhiqizwa, ixazulule ukungaqondakali kwedatha, isebenzise isinxephezelo senqubo esivunyiwe futhi idale idatha elungele ukukhiqizwa. Ubuciko bokukhiqiza, izinhlelo zokuprakthiza/zokuqondisa, idatha yephaneli, izinkomba ze-AOI, idatha yokuhlola, amakhuphoni nemibuzo yobunjiniyela uma kudingeka.
Ubunjiniyela bokukhiqiza / i-ERP-MI Ichaza indlela yenqubo, izinto zokwakha, imishini, imiyalelo ekhethekile, ukuhlolwa kanye nezindawo zokuhlola zokwamukelwa. Umhambi noma i-MI, ukulandelana kwesikhungo somsebenzi, izibalo zezinto ezibonakalayo, amanothi enqubo ekhethekile kanye nezimfuneko zokuhlola.
Ukwenziwa nokuqinisekiswa Yakha, iqede futhi ihlole i-PCB engenalutho ngokomzimba. Amabhodi angenalutho akhishwe alungele ukuthunyelwa noma ukuhlanganiswa kwe-PCB.

Lo mehluko ubalulekile ngoba izincazelo eziningi zendlela ama-PCB enziwa ngayo ziqala “ngokuphrinta ungqimba lwangaphakathi.” Embonini ye-PCB yezimboni, iphaneli akufanele ifinyelele leso sinyathelo kuze kube yilapho i-CAM isiqinisekisile ukuthi ungqimba ngalunye lusho ukuthini, ukuthi umklamo ungakhiqizwa yini, ukuthi iyiphi indlela yokukhiqiza esebenzayo nokuthi iyiphi isethi yedatha ekhokhelwayo isikhungo ngasinye somsebenzi okumele siyisebenzise.

Inqubo Yokukhiqiza i-PCB Ngokubuka Nje

Ukukhishwa komklamo we-PCB → ukuthathwa kwedatha → Ukulungiswa kwe-CAM → Ukubuyekezwa kwe-DFM kanye nekhono → imibuzo yobunjiniyela uma kudingeka → Ukubuyekezwa kwe-stackup kanye ne-impedance → Isinxephezelo se-CAM → Ukufakwa kwamaphaneli kanye namathuluzi → Incazelo yenqubo ye-ERP/MI → ukulungiswa kwezinto → Ukuthwebula izithombe zesendlalelo sangaphakathi → Ukuthwebula izithombe zesendlalelo sangaphakathi → I-AOI yesendlalelo sangaphakathi → Ukufakwa kwe-layup kanye ne-lamination → Ukubhoboza / ukubhoboza nge-laser → Ukufakwa kwensimbi ye-desmear kanye nembobo → Ukuthwebula izithombe zesendlalelo sangaphandle → Ukufakwa kwe-copper kanye ne-etching → I-AOI yesendlalelo sangaphandle → imaski ye-solder → inganekwane → ukuqeda kobuso → ukuphrofayilisha / ukuhambisa / ukufaka ama-V-scoring → ukuhlolwa kukagesi kanye nokuhlolwa kobukhulu → ukuhlolwa kokugcina kanye nokupakisha → ukuhlanganiswa kwe-PCB okungakhethwa.

Indlela eqondile iyashintsha ngokubalwa kwezingqimba, ngesakhiwo, isisindo sethusi, uhlelo lwezinto ezibonakalayo, ukuqeda ubuso kanye nezidingo ezikhethekile zemishini. Ibhodi le-FR-4 elinezingqimba ezimbili lingadlula imisebenzi eminingana yezingqimba eziningi, kuyilapho ibhodi le-HDI lingaphinda imijikelezo ye-lamination kanye ne-laser-drilling izikhathi eziningana.

Kungani Ubunjiniyela be-CAM Buyibhuloho Phakathi Kokuklama Nokukhiqiza kwe-PCB

I-PCB CAD ichaza lokho umkhiqizo okumele ukwenze ngogesi nangomshini. Imishini yokukhiqiza idinga izinga elihlukile lolwazi: i-geometry yomqhubi okhokhelwayo, izincazelo zethuluzi lokubhoboza, izixhumanisi zamaphaneli, i-polarity yenqubo, idatha yokuthwebula izithombe, amakhuphoni, izici zamathuluzi, izindlela zomzila, ulwazi lokufaka amaphuzu, izinkomba zokuhlola kanye namanothi aqondene nenqubo. Ubunjiniyela be-CAM bakha leso sendlalelo sokuhumusha.

Ngenxa yalesi sizathu, i-CAM akufanele iphathwe njengokuhlolwa kwe-Gerber ngomzuzu wokugcina. Ukubuyekezwa kwe-CAM okunekhono kubuza ukuthi umklamo ungasinda yini endleleni ephelele yokukhiqiza. Isibonelo, i-via ingaba semthethweni emithethweni yokuklama ye-CAD kodwa isenayo imajini enganele yendandatho ye-annular ngemva kokubekezelelana kokubhoboza kanye nemvume yokubhalisa kucatshangelwa. I-trace ingahlangabezana nobubanzi obujwayelekile ekwakhiweni kodwa idinga isinxephezelo se-etch ngokusekelwe esisindweni sethusi kanye nenqubo ekhethiwe yokuthwebula/yokuqopha. I-slot esebenzayo ngomshini ingadinga inqubo ehlukile ngoba i-plated, ayijwayelekile, ilawulwa ngokujula noma itholakala emaphethelweni ebhodi.

Unjiniyela we-CAM kumele avikele inhloso kagesi yomklami ngenkathi eguqula ubukhulu bomklamo obujwayelekile bube ubukhulu bokukhiqiza. Yingakho ifektri enhle ihlukanisa isinxephezelo senqubo nokuguqulwa komklamo . Isinxephezelo sokukhiqiza sihloselwe ukufeza ubukhulu obuqediwe bekhasimende ngemuva kokuqopha, ukucwebezela, ukuncibilikisa noma ukukhanda. Ushintsho oluthinta ukuxhumana, usayizi wembobo oqediwe, i-geometry yokulawula ukuvinjelwa, incazelo yohlaka noma enye imfuneko yokusebenza kufanele luphathwe njengombuzo wobunjiniyela, hhayi ukuhlelwa kabusha buthule.

Isigaba 1: Iphakheji Yedatha Yokukhiqiza kanye Nenhloso Yokuklama

Ikhwalithi yenqubo yokukhiqiza i-PCB ithonywa kakhulu yikhwalithi yephakheji yokukhishwa. I-CAM ingalungisa izinkinga zokufometha, kodwa ayikwazi ukuqagela ngokuphephile inhloso yokuklama engekho. Iphakheji yokukhishwa enamandla kakhulu iqukethe idatha efundeka ngomshini kanye nencazelo emfushane yokwenziwa.

Idatha noma imfuneko Kungani i-CAM iyidinga Ukungacaci okuvamile okufanele kugwenywe
Izendlalelo zethusi, imaski ehlanganisiwe kanye nezendlalelo zenganekwane Isungula isithombe sokwakha esihlosiwe sohlangothi ngalunye kanye nesendlalelo sangaphakathi. Amagama ezingqimba angacacile, ulwazi olungekho lwe-polarity, izingqimba eziphindaphindwayo noma eziphelelwe yisikhathi.
Amafayela okubhoboza e-NC kanye netafula lokubhoboza Ihlukanisa i-PTH, i-NPTH, i-microvia kanye nezidingo ezikhethekile zokubhoboza bese ihlela imigodi eqediwe kumathuluzi okukhiqiza. Ukusebenzisa uphawu olufanayo lwezimbobo ezifakwe ipulasitiki kanye nezingenapulasitiki noma ububanzi bokuxuba obuqediwe kanye nobubanzi bamathuluzi.
Uhlaka lwebhodi kanye nesendlalelo somzila Ichaza ubukhulu obuqediwe, iziqephu zangaphakathi, izikhala kanye nezici zephrofayili. Uhlaka luphindwe kabili ezingqimbeni eziningana, ama-contour avulekile, ubukhulu obuphikisanayo noma i-geometry yesikhala esingacacile.
Umdwebo wokwenziwa Ikhuluma ngobukhulu, ukubekezelelana, ukuqeda, ithusi, amanothi omshini kanye nezinqubo ezikhethekile. Amanothi aphikisana nedatha ye-Gerber/drill noma amanothi akopishiwe ajwayelekile angasebenzi ebhodini.
Isitaki sesendlalelo se-PCB Ichaza izisindo zethusi, ukwakhiwa kwe-dielectric, ukujiya okuqediwe kanye nokwakheka kwe-controlled-impedance. Ubukhulu be-dielectric obujwayelekile ngaphandle kokusho ukuthi umenzi angazilungisa yini izinto zokwakha.
Ithebula le-impedance elilawulwayo Ixhumanisa ithagethi ngayinye ye-impedance nesendlalelo, i-trace geometry, i-reference plan kanye nokubekezelelana. Ukucacisa ithagethi kodwa hhayi ukuhlonza amanethi noma i-geometry efanele.
Idatha ye-netlist ye-IPC noma yomklamo ohlakaniphile Isekela ukuqhathaniswa kokuxhumeka futhi inciphisa amathuba okuthi ukungaqondakali kwesithombe kube yiphutha likagesi. I-Netlist yenziwe kusukela ekubuyekezweni komklamo okuhlukile.
Ukuqeda okungaphezulu kanye nokuqeda okukhethiwe Inquma ukuhanjiswa kwenqubo futhi ithinta ukushintshwa kwe-soldering, i-planarity, ukuguguleka kokuxhumana kanye nokuhambisana kokuhlanganiswa. Ukubiza i-ENIG emhlabeni jikelele ngenkathi ulindele iminwe eqinile ngaphandle kokukhetha izindawo ezikhethiwe.
Izidingo ezikhethekile zemishini Ivumela i-CAM ukuthi ichaze isinki esiphikisayo, ibhobo eliphikisayo, ukuqondisa okujulile okulawulwayo, izici zokubopha, i-edge plating noma i-press-fit. Ukunikeza kuphela ukuma komdwebo okungenawo ububanzi bokugcina, ukujula/ubukhulu obusele kanye nokubekezelelana.

I-Gerber isalokhu ivamile, kuyilapho i-ODB++ kanye ne-IPC-2581 zingaphatha ulwazi oluhlelekile kakhulu uma bobabili abaklami kanye nomenzi bezisekela. Kungakhathaliseki ukuthi zinjani ifomethi, ukulawula ukubuyekeza kubalulekile. Idatha yethusi, yokubhoboza, yokudweba, yokuqongelela kanye ne-netlist kufanele konke kuchaze ukubuyekezwa okufanayo.

Cela Isilinganiso Sokukhiqiza se-PCB

Isigaba 2: Ukulungiswa Kwedatha ye-CAM kanye Nokubuyekezwa kwe-DFM

2.1 Ukulungiswa kwedatha: ukwakha kabusha incazelo yebhodi eyodwa ethembekile

Umsebenzi wokuqala we-CAM ukwenza idatha ihambisane ngaphakathi. Amayunithi, izixhumanisi, umsuka, ukuhleleka kwezendlalelo, isimo sesibuko, i-polarity, izincazelo ze-aperture, amafomethi okubhoboza kanye ne-geometry yephrofayili kuyahlolwa ngaphambi kokuthi noma yikuphi ukuhlela kokukhiqiza kuqale. Unjiniyela we-CAM uphinde athole idatha engasetshenziswanga, izendlalelo eziphindaphindwayo kanye nezici okungenzeka ukuthi zithunyelwe ngokuhlukile ezinhlelweni ezahlukene ze-CAD.

Yilapho iphakheji yokukhishwa ehlakaniphile isindisa khona isikhathi. Uma unjiniyela we-CAM engacaci kahle ukuthi angakuchaza kanjani, kulapho ingozi encane yokuthi isikhathi sobunjiniyela sichithwa khona ukuhlukanisa isici esihlosiwe kulokho okwenziwa ngaphandle.

2.2 Ukuhlolwa kokuxhumana kanye nobudlelwano bezendlalelo

I-CAM iqhathanisa umklamo kuzo zonke izendlalelo zethusi, idatha yokubhoboza, kanye nohlu lwamakhasimende olutholakalayo. Inhloso akukhona nje ukuthola izimbobo ezisobala noma ama-short. Futhi ukuqinisekisa ubudlelwano phakathi kwe-pad-to-hole, ngezakhiwo, ukuxhumana kwendiza, ama-antipad, i-thermal reliefs kanye nobudlelwano obuhlosiwe phakathi kwe-copper nezici zemishini.

2.3 Ububanzi bomugqa, isikhala kanye nokubuyekezwa kwesisindo sethusi

Ububanzi kanye nesikhala esincane somqhubi wekhompiyutha akukwazi ukuhlolwa ngokuzimela kobukhulu bethusi kanye nendlela yenqubo. Njengoba ithusi liba nzima kakhulu, ukugoba kuba nzima kakhulu futhi ukugoba okuseceleni kunomthelela omkhulu ku-geometry eqediwe. Ngakho-ke i-CAM ibukeza umugqa/isikhala esincane kanye nethusi eliyisisekelo, ithusi eliqediwe nokuthi ngabe lesi sici sihlukanisiwe noma sitholakala ensimini yethusi ebanzi.

Abaklami kufanele bagweme ukuphatha imikhawulo yamandla okukhiqiza i-PCB njengenombolo evamile esebenza kuzo zonke isisindo sethusi kanye nesendlalelo ngasinye. Umklamo okhiqizwa kakhulu usebenzisa amandla okukhiqiza ajwayelekile okwakhiwa okukhethiwe futhi ugcina i-geometry eyeqile kuphela lapho ubuningi besekethe bukwenza kudingeke khona.

2.4 Indandatho ehlanganisiwe, ukubekezelela ukubhoboza kanye nokususwa kwembobo kuya ethusini

Imbobo eqediwe efakwe ipulasitiki ayilingani nosayizi webholi yokukhiqiza. Ifektri kumele ibhekele ukufakwa kwethusi odongeni lwembobo, ukubekezelela ukubhoboza kanye nokushintshashintsha kwenqubo. Ngakho-ke i-CAM ihlola i- pad kanye ne-annular-ring geometry ngemuva kokusetshenziswa kwebholi yokukhiqiza kanye nezibonelelo zokubhalisa.

Isimiso esifanayo sisebenza esikhala phakathi kwembobo nomqhubi. Ukulinganisa kwe-CAD okwenziwe ngomgodi oqediwe kungase kungameleli ingozi yokukhiqiza. I-CAM ihlola umgodi wokukhiqiza, isinxephezelo sawo kanye nethusi okumele lisale ngemva kokubhoboza, ukubopha kanye nokubhalisa. Lokhu kubaluleke kakhulu emiklamo emide enezingqimba eziningi, imigodi yokucindezela kanye nemiklamo eseduze nekhono elincane kakhulu lendandatho ye-annular yefektri.

2.5 PTH, NPTH, izikhala kanye nezimbobo ezingajwayelekile

Okufakwe imigodi ngemigodi kanye nemigodi engafakwanga ipulasitiki kufanele kucace kahle ephaketheni lokuklama. I-CAM ingasebenzisa izigaba ezahlukene zokubhoboza, imithetho yesinxephezelo noma ukulandelana kwenqubo yezici ze-PTH kanye ne-NPTH. Izikhala ezifakwe ipulasitiki kanye nokuvuleka okungajwayelekile okufakwe ipulasitiki kudinga ukubuyekezwa okwengeziwe ngoba ukukhiqizwa kwazo kuncike ku-geometry, ukufinyelela kwamathuluzi, umzila wokufaka ipulasitiki, indandatho ye-annular kanye nethusi eliseduze.

Izici ezikhethekile ezifana nemigodi eboshwe nge-castella, i-edge plating kanye ne-half-holes eboshwe nge-plated kumele zikhonjwe ngokucacile. Zithinta ukwakheka kwephaneli kanye ne-profiling ngoba isici kumele sihlale sisekelwe ngomshini kuze kube sezingeni lokukhiqiza elifanele.

2.6 Ukukhiqizwa kwemaski yesolder

I-CAM yenza ukuhlolwa kwe-DFM kwe-solder-mask ngokumelene ne-geometry yephedi, ububanzi bedamu, ukubekezelelana kokubhaliswa, ngezidingo zokwelashwa kanye nokuhlanganiswa. Ukuvulwa kwe-solder-mask okubonakala kwamukelekile ku-CAD kungaba yinkinga lapho kuhlangana izikhala ezimbili eziseduze, lapho idamu elincane le-mask lingenakubanjwa ngokuthembekile noma lapho i-via ivezwa ngokungahlosile endaweni ethengiswayo.

Abaklami kufanele basho okuhlosiwe ngokwelashwa lapho kubalulekile: okuvulekile, okunamatende, okuxhunyiwe, okugcwele i-resin kanye nokuvalwe, noma esinye isakhiwo esilawulwayo. I-CAM akufanele inqume ukuthi kukhona yini ukuthembeka okuphezulu ngokwelashwa kusukela nje ekutheni kukhona yini ukuvulwa okukhona kungqimba yemaski ye-solder.

2.7 Ukubuyekezwa kwenganekwane kanye nokumaka izingxenye

Umbhalo wesikrini se-silk uyahlolwa ukuthi uyafundeka yini nokuthi awushayisani nama-pads avele obala, amaphuzu okuhlola, iminwe yegolide nezinye izindawo lapho uyinki ungavunyelwe khona. I-CAM ingase isuse inganekwane engabalulekile kuma-pads ngaphansi komthetho wokukhiqiza okuvunyelwene ngawo, kodwa ukumaka okubalulekile kokuhlanganisa kufanele kwakhiwe ngokuvuleka okwanele kunokuba kuncike ekusikeni okuzenzakalelayo.

2.8 Unqenqema lwebhodi, i-V-score kanye nokususwa komzila

Izingxenye, ithusi, ama-via kanye nezici ezifakwe ipulasitiki eduze komphetho webhodi kumele zihlolwe ngendlela yokususa amaphaneli ehlosiwe. Ukufaka ama-V, ukuhambisa amathebhu, izimbobo zesitembu kanye nokuhambisa i-CNC kudala izimo ezahlukene zemishini. I-CAM kumele futhi yazi ukuthi umphetho webhodi uhloselwe ukuba yi-dielectric engenalutho, i-plated, i-castelled noma ingxenye yesistimu yokuxhuma/yokuxhumana.

2.9 Iminwe yegolide kanye nokuqedwa kwendawo exubile

Iminwe ekhethiwe yegolide eqinile ayiyona nje "enye i-PCB surface finish ." Ingadinga ukuxhumeka okuzinikele kwe-plating kanye nochungechunge oluthile lwenqubo ngaphambi kokuba lokho kuxhumeka kwesikhashana kususwe ngesikhathi sokucubungula. Uma umklamo uhlanganisa iminwe yegolide ne-ENIG, i-OSP, i-immersion tin, i-immersion silver noma i-HASL kulo lonke ibhodi, i-CAM kumele ichaze izindawo ezikhethiwe kanye ne-oda lokukhiqiza ngendlela efanele.

Uma umkhiqizo ungavumeli ukuxhumeka kwesikhashana kwe-plating, lowo mkhawulo kufanele ukhulunywe kusenesikhathi ngoba ungashintsha inqubo enconywayo. Lokhu kusebenza futhi ezidingweni ze-chamfer, ukubekezelelana kobude beminwe kanye nanoma yikuphi ukwakheka "komunwe omude/omfushane".

2.10 Ibhalansi yethusi kanye nethusi elisele

Onjiniyela be-CAM babheka nokuthi ingakanani ithusi elisele kungqimba ngayinye nokuthi ithusi lisakazwa kanjani kulo lonke iphaneli. Esinye isilinganiso sobunjiniyela esiwusizo isilinganiso sethusi esisele:

Residual copper ratio = copper pattern area ÷ unit board area × 100%

Lokhu kubalulekile ngoba i-lamination iyinqubo yokugeleza kwe-resin. Ubuningi bethusi obuhlukene kakhulu ezingqimbeni eziseduze bungashintsha isidingo se-resin, ukujiya kwe-dielectric yendawo kanye nebhalansi yemishini. Amabhodi ethusi aqinile akhulisa umphumela. Umklamo onezindawo ezinkulu ezingenathusi eduze kwethusi elisindayo ungadinga izinguquko zokuhlanganisa, amasu okulinganisa ithusi noma izilawuli ezengeziwe zenqubo.

Kumklami we-PCB, isifundo silula: ibhalansi yethusi akuyona nje inkinga yobuhle. Ithinta ukukhiqizwa, ukulawulwa kobukhulu bebhodi, ingozi ye-warpage kanye, kwezinye izakhiwo, ukuziphatha kwe-dielectric ezungeze izakhiwo ze-impedance.

2.11 I-impedance elawulwayo kanye nezinto ezisetshenziswa kakhulu

I-impedance elawulwayo kumele ibuyekezwe njengohlelo lwe-stackup kunenombolo yobubanzi bokulandelela. I-CAM kanye nobunjiniyela bezinqubo bucabangela ukujiya kwe-dielectric, ukujiya kwethusi, i-geometry yomqhubi oqediwe, ubudlelwano be-reference-plane kanye nohlelo lwangempela lwezinto. Kumiklamo ye-RF kanye ne-microwave esebenzisa izinto ezifana ne- Rogers , i-Taconic, i-Arlon noma ezinye izinto eziphansi zokulahlekelwa, ukucubungula izinto ezithile kungathinta nokubhoboza, ukulungiswa kwendawo, i-lamination kanye nokuziphatha kobukhulu.

Ukukhishwa komklamo okuphephile kakhulu kunikeza ukuvimba okuqondiwe, ukubekezelelana kanye ne-geometry kagesi, kuyilapho kuvumela umenzi ukuthi aphakamise i-stackup elawulwayo lapho kufanele khona. I-geometry yokugcina yokukhiqiza kufanele iqinisekiswe ngaphambi kokwenziwa kunokuba kucatshangwe ukuthi ububanzi be-CAD nominal trace buzohlala bungashintshi.

Isigaba 3: Isinxephezelo se-CAM, Ukuhlanganiswa Kwamaphaneli kanye Nedatha Yokukhiqiza

Ngemva kokuthi izinkinga ze-DFM sezixazululiwe, i-CAM iguqula idatha yokuklama eqanjiwe ibe idatha yokukhiqiza. Lokhu kuhlelwa kuyizinqubo zokulawula ngamabomu, hhayi izinguquko ezingahleliwe kusekethe.

3.1 Isinxephezelo sokuqopha nokudweba izithombe

Ithusi lisuswa eceleni kanye naphezulu ngesikhathi sokusika. Kuye ngesisindo sethusi kanye nenqubo, unjiniyela we-CAM angase abuyisele izici zomqhubi ukuze umugqa oqediwe kanye nobukhulu bephedi bufike endaweni eqondiwe ngemva kokuthwebula izithombe, ukucwebezela kanye nokusika. Isu lokubuyisela lingahluka phakathi kwezingqimba zangaphakathi nezangaphandle ngoba imizila yazo yenqubo iyahluka.

3.2 Isinxephezelo sokubhoboza nokufaka amaplanga

Ngezici ze-PTH, i-drill yokukhiqiza ikhethwa ukuze imbobo eqediwe ihlangabezane nezidingo zekhasimende ngemuva kokwenziwa kwensimbi ngodonga lwembobo. Izici ze-NPTH ziphathwa ngokwehlukana ngoba azihloselwe ukuthola ukwakheka okufanayo kwethusi. I-CAM iphinde ihlanganise amathuluzi okubhoboza ngempumelelo ngenkathi ivikela ukubekezelelana okukhethekile nezici ezilawulwayo.

3.3 I-Solder-mask kanye nokwenza ngcono i-legend

Izimbobo zokukhiqiza zilungiswa ngokwenqubo ye-solder-mask kanye nekhono lokubhalisa. I-CAM ihlola amadamu amancane, ubudlelwano be-mask-to-pad, ithusi eliveziwe kanye nezimbobo ezingahlosiwe. Inganekwane ingasuswa ezindaweni ezithengiswayo ngokwemithetho evunyelwe, kuyilapho izimpawu ezibalulekile kufanele zihlale lapho umdwebo uzidinga khona.

3.4 Ukuhlelwa kwamaphaneli

I-PCB yekhasimende ngalinye ivame ukwenziwa kuphaneli yokusebenza enkulu. I-CAM ikhetha ukuqondiswa, ubuningi be-array, isikhala, ama-rails, imigodi yamathuluzi, ama-fiducial, amakhuphoni, indlela yokuqhekeka kanye nesu lokuhambisa ngokusekelwe ekusebenzeni kahle kokukhiqiza kanye nezidingo zokuhlanganisa ezingezansi. Ukufakwa kwamaphaneli kungathinta ukusetshenziswa kwezinto, ukusatshalaliswa kwe-plating, ukuqina kwebhodi, ukusebenziseka kwe-V-score kanye nokuphathwa okuzenzakalelayo.

Uma ikhasimende lihlinzeka nge-assembly array, i-CAM kufanele igcine inhloso yokuhlanganisa futhi iqinisekise ukuthi i-array nayo iyahambisana nokukhiqiza. Lapho ifektri idala iphaneli, izidingo zokuhlanganisa kufanele zisacatshangelwe uma amabhodi ezothuthela ngqo ekukhiqizweni kwe-SMT.

3.5 Amakhuphoni, izici zokusebenzisa amathuluzi kanye nezingezona ezomkhiqizo

Iphaneli yokusebenza ingafaka amakhuphoni e-impedance, imigomo yokubhalisa, amakhuphoni okuhlola, izici zokulawula inqubo kanye namathuluzi. Lawa angaphandle kwesekethe esiqediwe kodwa ayingxenye yokulawula ukukhiqiza. Ukubekwa kwawo kufanele kwakhiwe ukuze amele izimo zokukhiqiza ezifanele ngaphandle kokuphazamisa umkhiqizo noma ukususwa kwamaphaneli.

3.6 Lokho i-CAM okungafanele ikushintshe buthule

I-CAM akufanele isebenzise ukulula kokukhiqiza njengesizathu sokushintsha umklamo kagesi wekhasimende. Izinguquko kusayizi wembobo oqediwe, uhlaka lwebhodi, i-geometry ye-impedance ngaphandle kwemodeli yesinxephezelo esivunyelwene ngayo, ukuxhumana, ukuvuleka kwethusi okushintsha ukusebenza, noma izici zokusebenza kwemishini kufanele kubangele umbuzo wobunjiniyela. Umzila wokuvuma olawulwayo uyingxenye yenqubo yokukhiqiza ye-PCB ethembekile.

Isigaba 4: Ukukhishwa Kwenqubo Yobunjiniyela Be-Stackup kanye ne-ERP/MI

Uma idatha ye-CAM isikhiqizwa, ifektri kumele ichaze ukuthi ibhodi lizokwakhiwa kanjani ngempela. Yilapho ukwakheka kwe-stackup , ukukhethwa kwezinto kanye nokuhlelwa kwenqubo kuba yimiyalelo yokukhiqiza esemthethweni.

4.1 Ubukhulu bebhodi eliqediwe buwumphumela we-stackup

Ubukhulu obuqediwe abuyona nje ingqikithi yamanani ayisisekelo ekhathalogi kanye nokulungiselela. Ubunjiniyela kumele bucabangele ukusatshalaliswa kwethusi, ukugeleza kwe-resin, ukwakheka kwethusi kanye nomnikelo wobukhulu bezinto zokumboza kanye nokuqedwa lapho kufanele khona. Imodeli yomqondo ewusizo yile:

Designed board thickness ≈ core thickness + dielectric thickness after lamination + copper-layer contributions + applicable surface/coating contributions

Kumabhodi anezingqimba eziningi, ukujiya kwe-dielectric okusebenzayo ngemva kokucindezela kuncike ohlelweni lokulungiselela kanye nephethini yethusi elizungezile. Lesi esinye isizathu sokuthi isilinganiso sethusi esisele sibaluleke ngesikhathi sokubuyekezwa kwe-stackup.

4.2 Ukwakhiwa kwezingqimba nezinto ezikhethekile

Ama-standard FR-4, ama-high-Tg FR-4, ama-laminate aphansi, izinto ze-RF ezisekelwe ku-PTFE, izinto ze-metal-core kanye nokwakhiwa okuqinile akuhlanganyeli iresiphi eyodwa yokubopha okujwayelekile. I-CAM kanye nobunjiniyela bezinqubo kumele kuhambisane nezidingo zokusebenza kwekhasimende nezinto eziqinisekisiwe kanye nomzila wenqubo. Ukwakhiwa kwe-hybrid okunemvamisa ephezulu kudinga ukunakwa okukhethekile ngoba izinto ezingafani zingaba nokuziphatha okuhlukile kokugeleza, ubukhulu kanye nokulungiselela ubuso.

4.3 Umhambi we-ERP/MI uguqula izinqumo ze-CAM zibe yimiyalelo yasefektri

Umhambi we-ERP noma we-MI wefektri kufanele achaze isethi yezinto ezibonakalayo, izidingo zethusi, indlela yokuthwebula izithombe, ukulandelana kwe-lamination, izinhlelo zokubhoboza, umzila wokufaka i-plating, izidingo ze-solder-mask kanye ne-legend, ukuqeda ubuso, imiyalelo ye-routing/V-score, imisebenzi ekhethekile yemishini, izindawo zokuhlola kanye nezidingo zokuhlola kagesi.

Imisebenzi ekhethekile kumele ibe sobala. Isibonelo, isikhala sokujula okulawulwayo noma isinki esiphikisayo kufanele sibe nesihlonzi sohlelo esifanele kanye nobubanzi/ijiyometri edingekayo kanye nokujula noma ukujiya okusele kanye nokubekezelelana. Inqubo ekhethiwe yomunwe wegolide kufanele isho ukuqeda okukhethwayo okudingekayo kanye nokulandelana komzila. I-blind/engcwatshwe nge-build kufanele ichaze ukuthi yimuphi umjikelezo we-lamination odala isakhiwo ngasinye nge-structure.

Leli yiphuzu elisebenzayo lapho ubunjiniyela be-CAM buba yindlela yokukhiqiza. Uma umhambi wokukhiqiza engacacile, abaqhubi bezokuhamba baphoqeleka ukuhumusha inhloso ngokuzimela. Inqubo enhle iqeda lokho kungaqondakali ngaphambi kokuba kukhishwe inqwaba.

Isigaba 5: Inqubo Yokukhiqiza i-PCB Isinyathelo Ngesinyathelo

Ngemva kokuvunyelwa kwe-CAM nokukhishwa kwe-MI, ukwenziwa ngokomzimba kuyaqala. Uchungechunge olulandelayo luchaza inqubo evamile yokwenziwa kwe-PCB engaphansi kwezingqimba eziningi. Indlela eqondile iyahlukahluka ngomklamo.

Isinyathelo 1: Ukulungiswa kwezinto kanye nokusikwa kwamaphaneli

Ama-cores ambozwe ngethusi, i-copper foil kanye ne-prepreg kukhethwa ngokuya nge-stackup evunyiwe. Ubunikazi bezinto ezibonakalayo, isisindo sethusi, ukujiya kanye nokulandeleka kwenqwaba kuyaqinisekiswa ngaphambi kokuba amaphaneli asikwe ngosayizi osebenzayo. Ama-laminate avame kakhulu futhi akhethekile angadinga ukugcinwa okukhethekile, ukuphathwa noma ukulungiswa kwendawo.

Isinyathelo 2: Ukuthwebula izithombe ezingaphakathi

Umsebenzi wobuciko be-CAM ongqimbeni olungaphakathi udluliselwa ku-photoresist kusetshenziswa i-laser direct imaging noma enye indlela yokuthwebula evunyelwe. Ama-target okubhalisa akhelwe kudatha ye-CAM asiza ukulawula ukuhambisana kwengqimba. Umgomo ukudala iphethini yokumelana ezovikela ithusi elihloselwe ukuhlala ngemva kokuqoshwa.

Isinyathelo 3: Ukuqopha ngaphakathi kwesendlalelo futhi umelane nokukhumula

Ithusi elingavikelwe lisuswa ngamakhemikhali, okukhiqiza iphethini yomqhubi wangaphakathi. I-resist iyasuswa bese iphaneli ihlanzwa. Amapharamitha okusika ayalawulwa ukuze i-geometry yomqhubi oqediwe ifane nethagethi ye-CAM ekhokhelwayo kunokuba nje kube nobukhulu obujwayelekile be-CAD yokuqala.

Isinyathelo 4: I-AOI yengqimba yangaphakathi

Ukuhlolwa okuzenzakalelayo kwe-optical kuqhathanisa ungqimba oluqoshwe nereferensi ye-CAM. Ukuvula, ama-shorts, ama-nick, ama-protrusion kanye nezinye iziphambeko zomqhubi kungatholakala ngaphambi kwe-lamination, lapho ungqimba lusafinyeleleka. Le ndawo yokuhlola ivimbela isici esaziwayo sengqimba yangaphakathi ukuthi singafihlwa unomphela ngaphakathi kwebhodi elinezingqimba eziningi.

Isinyathelo 5: Ukwelashwa kwebhondi, ukubekwa phansi kanye nokubhaliswa kwezendlalelo

Ama-core angaphakathi alungiselelwa ukubopha futhi ahlanganiswe nge-prepreg kanye ne-copper foil ngokuya ngokulandelana okuvunyelwe. Ukuqondiswa kwesendlalelo kanye nokuhleleka kulawulwa ngokucophelela. Kumabhodi anezingqimba eziningi, i-layoup yilapho i-stackup kagesi iba khona isakhiwo esibonakalayo.

Isinyathelo 6: Ukuhlanza

Inqwaba icindezelwa ngaphansi komjikelezo wokushisa nokucindezela olawulwayo. I-prepreg resin iyageleza, igcwalisa izikhala ezizungeze ithusi futhi iqine ukuze ibophe izendlalelo. Amapharamitha okucindezela kumele afane nohlelo lwezinto zokwakha kanye nokwakhiwa. Ubuningi bethusi, ukujiya kwe-dielectric kanye ne-geometry yethusi esindayo konke kuthinta ukugeleza kwe-resin kanye nokuziphatha kobukhulu bokugcina.

Isinyathelo 7: Ukuqinisekiswa kokubhaliswa kanye nokubhoboza

Ngemva kokufaka i-lamination, ukubhaliswa kungaqinisekiswa kusetshenziswa i-X-ray noma ezinye izindlela zokulinganisa ngaphambi kokubhoboza ngomshini. Ukubhoboza nge-CNC kudala imigodi ye-PTH, izingxenye kanye namathuluzi ngokuya ngohlelo lokubhoboza olukhokhelwayo. Ukubhoboza nge-laser kusetshenziselwa ama-microvia ezakhiweni ze-HDI. Izinhlelo ezikhethekile zingasetshenziswa kuma-countersink, ama-counterbore kanye nezici ezilawulwayo zokujula.

Isinyathelo 8: Ukulungiswa kwe-Desmear kanye nodonga lwemigodi

Ukubhoboza ngomshini kuveza i-dielectric futhi kungashiya i-resin smear ezindaweni zethusi zangaphakathi. I-Desmear kanye ne-hole conditioning kulungisa udonga lwembobo ukuze i-metallization elandelayo yakhe uxhumano oluthembekile lukagesi ezingqimbeni zethusi zangaphakathi.

Isinyathelo 9: Ukwenziwa kwensimbi yethusi engenagesi kanye nemigodi edlulayo

Ingqimba yethusi elincane elihambisa umoya libekwa odongeni lwembobo engahambisa umoya, okudala imbewu yokwakha ithusi elenziwe nge-electrolytic kamuva. Lesi sinyathelo siguqula imbobo ebholiwe ibe yisakhiwo esingaxhumanisa izendlalelo ngogesi ngemva kokufakwa kweplati.

Isinyathelo 10: Ukuthwebula izithombe zesendlalelo sangaphandle

Iphethini yengqimba yangaphandle ekhokhelwayo ifakwa esithombeni kuphaneli. Kuye ngendlela yokukhiqiza ekhethiwe, ifektri ingasebenzisa i-pattern plating noma olunye uchungechunge olufanelekile. I-CAM polarity kanye nokukhethwa kwenqubo kumele kufane nendlela ehlosiwe ye-plating kanye ne-etching.

Isinyathelo 11: Ukufakwa kwethusi kanye nokugqwala okungaphandle

Ithusi lakhiwa lapho kudingeka khona ukuze kufezwe izidingo zomqhubi kanye nodonga lwemigodi. Uhlelo lwensimbi oluvikelayo/oluvikelayo lwesikhashana luyacutshungulwa ukuze ithusi eliyisisekelo elingafuneki likwazi ukuqoshwa. Umphumela uba iphethini yomqhubi wangaphandle oqediwe.

Isinyathelo 12: I-AOI yengqimba yangaphandle

Ithusi langaphandle eliqediwe lihlolwa ngokubhekisele ku-CAM. Imiklamo emincane, ukuqhekeka kwe-BGA okuminyene kanye nokushintsha kwethusi elisindayo kudinga ukuthwebula izithombe okuzinzile kanye nokuqopha ngoba amaphutha kuleli qophelo athinta ngqo ukuxhumana okuqediwe.

Isinyathelo 13: Ukufaka imaski yesolder, ukuvezwa kwayo kanye nokwelashwa kwayo

Imaski yokusoda ekwazi ukuthathwa isithombe iyasetshenziswa, ithathwe kudatha yemaski yokusoda ye-CAM, yathuthukiswa futhi yaqiniswa. Imaski ivikela ithusi ekushisweni nasekulawulweni lapho i-solder ivunyelwe khona ngesikhathi sokuhlanganiswa. Ukubhaliswa kwe-CAM kanye nomklamo wokuvula kubalulekile eduze kwama-fine-pitch pads, ama-via kanye nezindawo zezingxenye eziseduze.

Isinyathelo 14: Inganekwane / isikrini sesilika

Izinkomba zokubhekisela, izimpawu ze-polarity, ama-logo, amakhodi osuku kanye nezinye izimpawu ezivunyiwe ziyanyatheliswa noma zithathwe ngezithombe zedijithali. Inganekwane kumele ihlale ifundeka ngaphandle kokungcolisa izindawo ezishintshwayo noma ezithintanayo.

Isinyathelo 15: Ukuqeda umphezulu

Ithusi eliveziwe lithola isiphetho esichaziwe. Izinketho ezivamile zifaka phakathi i-ENIG, i-ENEPIG, i-OSP, i-HASL engenalo i-lead, isiliva lokucwilisa, ithini lokucwilisa kanye negolide eliqinile elikhethiwe. Isiphetho esifanele sincike enkambisweni yokuhlanganisa, iphimbo lengxenye, izidingo zokuthintana, okulindelwe kwisitoreji, ukusebenza kwe-RF kanye nezindleko.

Ukuqeda okuxubile kudinga ukulandelana okuchaziwe. Iminwe yegolide, isibonelo, ingasebenzisa igolide eliqinile elikhethiwe kuyilapho lonke ibhodi lithola okunye ukuqeda okusongelwayo. I-CAM ne-MI kumele zihlukanise ngokucacile lezo zindawo.

Isinyathelo 16: Ukufaka iphrofayili, ukuhambisa, ukufaka amaphuzu angu-V kanye nomsebenzi okhethekile womshini

Ukuqondisa i-CNC, ukufaka ama-V noma ukubhoboza kuhlukanisa i-geometry yomkhiqizo nephaneli yokukhiqiza. Izikhala, izici zomphetho, ama-chamfer, ama-castellations kanye nemisebenzi yokujula elawulwayo kuqedwa ngokwedatha yemishini kanye nomzila wenqubo. Ukulandelana kubalulekile lapho isici kufanele sihlale sisekelwa ngesikhathi sokufaka i-plating noma omunye umsebenzi wangaphambilini.

Isinyathelo 17: Ukuhlolwa kukagesi kanye nokuqinisekiswa kwe-impedance

Ukuhlolwa kukagesi kwe-PCB kuqinisekisa ukuqhubeka kanye nokuhlukaniswa ngokumelene nedatha ye-netlist evunyiwe noma yokuhlolwa. Amakhuphoni okuvimbela okulawulwayo akalwa uma kudingeka. Inhloso ukuqinisekisa ukuthi inqubo yokukhiqiza ebonakalayo ilondoloze inethiwekhi kagesi echazwe umklamo.

Isinyathelo 18: Ukuhlolwa kwekhwalithi okunobukhulu, okubonakalayo kanye nokugcina

Ukuhlolwa kokugcina kuqinisekisa ubukhulu obubalulekile, izimbobo, iphrofayili, izimpawu, imaski yokusoda, ukuqeda, umsebenzi wobuciko kanye nezinye izidingo eziqondene nekhasimende. Ukuhlolwa okwengeziwe noma ukuhlukaniswa okuncane kungasetshenziswa ukuqinisekisa inqubo, izidingo zokufaneleka noma zokuthembeka okuphezulu.

Isinyathelo 19: Ukuhlanza, ukupakisha nokukhulula

Amabhodi avunyiwe ayahlanzwa, avikelwe ekuphathweni nasekulinyazweni kwemvelo, abhalwe ukuthi alandeleke kahle futhi apakishwe ngokwezidingo zokuqeda kanye nezidingo zamakhasimende. Kuleli qophelo inqubo yokukhiqiza i-PCB engenamabhodi isiqediwe.

ukugeleza kwenqubo-yokukhiqiza ye-pcb

Umfanekiso 2. Ukugeleza Kwenqubo Yokukhiqiza ye-PCB

Amagatsha Enqubo Yokukhiqiza Ekhethekile ye-PCB

Ukugeleza okuyisisekelo okungenhla kuwuhlaka. Amabhodi athuthukile aneza izihibe zenqubo noma izilawuli ezikhethekile okumele zixazululwe ngesikhathi se-CAM kunokuba zitholakale phansi esitolo.

I-HDI kanye ne-lamination elandelanayo

Ukukhiqizwa kwe-HDI PCB kungasebenzisa ama-microvia angaboni, ama-via agqitshwe, ama-microvia ahlanganisiwe noma ahlanganisiwe kanye nezakhiwo ze-via-in-pad. Lezi zakhiwo zingadinga imijikelezo ephindaphindwayo yokudalwa kwebhodi elincane, i-lamination, ukubhoboza nge-laser, i-metallization kanye ne-imaging. Unjiniyela we-CAM kumele aqondise i-via ngayinye esigabeni esifanele se-lamination futhi aqinisekise ukuthi i-stackup ingakhiqizwa ngokomzimba ngokulandelana okuhlosiwe. Amandla okukhiqiza e-HDI PCB e-Highleap ahloselwe imiklamo edinga lolu hlobo lwesakhiwo sokuxhumana esilawulwayo.

Ukukhiqizwa kwe-PCB yethusi elinzima

Ukukhiqizwa kwe-PCB yethusi esindayo kushintsha ukuqoshwa komqhubi, ukucwebezela, ukugcwaliswa kwe-resin kanye nokuziphatha kwe-lamination. Umehluko omkhulu ekuxineni kwethusi kunzima kakhulu ukuwucindezela ngokulinganayo, futhi izikhala ezincane ziba nzima ukuzigcina njengoba ukujiya kwethusi kukhuphuka. Ngakho-ke abaklami kufanele baxoxe ngezidingo zamanje, isisindo sethusi kanye ne-geometry encane ndawonye esikhundleni sokuzikhetha ngokuzimela.

Ukukhiqizwa kwe-RF kanye ne-PCB evame kakhulu

Ukukhiqizwa kwe-PCB okuvame ukusetshenziswa kakhulu kuvame ukusebenzisa i-Rogers, i-Taconic, i-Arlon noma ezinye izinto ezikhethekile, ngezinye izikhathi kuma-stackups e-hybrid ane-FR-4. Ukubhoboza okuqondene nezinto ezithile, ukulungiswa kwendawo kanye ne-lamination kumele kucatshangelwe, futhi i-geometry ye-impedance kufanele iqedwe ngokumelene ne-stack yangempela yokukhiqiza. Ngenxa yalesi sizathu, ukubuyekezwa kwe-CAM/DFM kufanele kwenzeke ngaphambi kokuba ukwakheka kwe-RF exinene kuqandwe ngokuphelele.

Ukukhiqizwa kwe-PCB eqinile-flex

Ukwenziwa kwe-PCB okuqinile kwengeza izinto eziguquguqukayo, i-coverlay, i-selective bonding kanye ne-mechanical transition zones. Unjiniyela we-CAM kumele aqinisekise imingcele eqinile kuya eguquguqukayo, izifunda ezigobile, i-copper geometry, ukuvuleka kwe-coverlay, izidingo ze-stiffener kanye nokulandelana kwe-routing. Lezi zici zishintsha kokubili incazelo yengqimba kanye nokugeleza kokukhiqiza kwe-mechanical.

Izici zokujula okulawulwayo, isinki esiphikisayo kanye nebhoreyi eliphikisayo

Izici ezikhethekile ezilawulwa ukujula kufanele zichazwe yi-geometry eqediwe, indawo, ukubekezelelana kanye nesidingo sokujula esicacile. Umdwebo obonisa kuphela uphawu lwesithombe akwanele ohlelweni lwe-CNC oluthembekile. Lapho ikhasimende licacisa ukujiya kwezinto ezisele esikhundleni sokujula okusikiwe, inothi lokukhiqiza kufanele lisho ngokucacile ukuthi i-CAM kanye nomshini wokugaya zisebenzisa ireferensi efanayo.

Izikhala ezenziwe ngensimbi, ama-castellations kanye ne-edge plating

Lezi zici zihlanganisa i-electrical plating kanye ne-mechanical profile yokugcina. I-CAM kumele inqume ukuthi isici sibholwa nini noma siqhutshwa nini, ukuthi sihlala kanjani sinamathele ngesikhathi sokufakwa kwe-plating kanye nokuthi unqenqema oluqediwe luvezwa kanjani. Indawo yazo ingathinta futhi ukwakheka kwamaphaneli kanye nokwakheka okuqhekekile.

Lokho Abaklami be-PCB Okufanele Bakwazi Ukuze Benze Ubunjiniyela be-CAM Busheshe Futhi Buphephe

Umklami akudingeki abe ngumsebenzisi we-CAM. Kodwa-ke, ukuqonda izinqumo zokukhiqiza okumele zenziwe yi-CAM kusiza umklami ukuthi adale idatha efinyelela ekukhiqizweni ngemibuzo embalwa yobunjiniyela.

Isinqumo sokuklama i-PCB Lokho unjiniyela we-CAM okumele akuhlole Umkhuba ongcono wokuklama/ukukhulula
Umkhondo omncane kanye nesikhala Isisindo sethusi, ukuziphatha kokuqopha, izici ezihlukanisiwe vs ezixineneyo kanye nekhono lenqubo yasefektri. Sebenzisa ikhono elijwayelekile lenqubo lapho kungenzeka khona; gcina i-geometry encane yezindawo eziminyene ngempela.
Ngephedi kanye nendandatho ejikelezayo Ukubhola kokukhiqiza, isabelo sokubhoboza, ukubekezelela ukubhoboza kanye nokubhaliswa kwezingqimba. Yakha ngesilinganiso sokukhiqiza, ikakhulukazi ezingqimbeni zangaphakathi kanye nezimbobo ezinesilinganiso esiphezulu.
Ukususwa kwembobo kuya kuthusi Usayizi wangempela wokubhoboza umkhiqizo kanye nokubekezelelana kwesimo, hhayi nje kuphela umgodi oqediwe ojwayelekile. Linganisa izindawo ezivulekile usebenzisa izibikezelo zokukhiqiza ezingokoqobo bese ucindezela ifulegi ukuze ulingane kahle noma izimbobo ezibalulekile.
I-PTH kanye ne-NPTH Isinxephezelo esihlukile kanye nomzila wenqubo. Zihlukanise ngokucacile kudatha yokubhoboza kanye namanothi okukhiqiza.
Izikhala kanye nezimbobo ezingajwayelekile Isimo esifakwe ipulasitiki/esingafakwanga ipulasitiki, ukusebenza kwethuluzi, indandatho ehlanganisiwe kanye nokulandelana kwenqubo. Ubukhulu buqedile ububanzi/ubude besikhala bese usho ukuthi kufanele yini sibekwe ipulasitiki.
Amadamu e-solder-mask kanye nokwelashwa Ukubekezelela ukubhaliswa, ububanzi bedamu elikhiqizwayo nokuthi ama-vias avuliwe, afakwe amatende, axhunyiwe noma agcwele. Cacisa ukusebenza ngokwelashwa ngqo; ungathembeli ekuvulekeni kwe-Gerber ngengozi.
Ama-pads e-silkscreen ngaphezulu Ukukhishwa kweyinki kanye nokusika okuzenzakalelayo. Gcina inganekwane ebalulekile yokuhlanganiswa kude nama-pads ethusi abonakalayo kanye nama-solderable pads.
I-V-score / umzila Kusukela ethusi kuya emaphethelweni, ukuhlukaniswa kwezingxenye, ukujiya kwebhodi, ukuqondiswa kwesilinganiso kanye nokuqina kwe-array. Chaza indlela yokususa amaphaneli ehlosiwe futhi uvikele izingxenye ezibuthakathaka/ezisindayo eduze kwemigqa yokuqhekeka.
Iminwe yegolide Ukuqeda okukhethiwe, uxhumano lwe-plating, i-chamfer kanye nokulandelana kwenqubo. Chaza indawo eqinile, i-geometry yeminwe kanye ne-chamfer; chaza imikhawulo yokuxhumeka kwesikhashana kwe-plating.
Impedance elawulwayo Uhlelo lwe-dielectric lwangempela, ithusi eliqediwe, isinxephezelo sokulandelela kanye nendiza yokubhekisela. Nikeza ukubekezela/ukuqondisa futhi uthole amanethi; vumela ukwenziwa ngcono kwe-stackup lapho kungenzeka khona.
Ithusi elinzima Isici sokusika, isikhala, ukugcwaliswa kwe-resin kanye nebhalansi yethusi. Khulisa umkhawulo wejiyometri futhi ugweme umehluko omkhulu ongalawuleki wobuningi bethusi.
Izinto ezivame kakhulu Ukutholakala kwezinto, ukujiya, ukubhoboza, ukubopha kanye nokuziphatha kobukhulu. Khiya umndeni/imininingwane yezinto eziqondile kuphela uma kudingeka ngogesi; kungenjalo vumela okulinganayo okuvunyelwe ngesivumelwano.
Umshini wokusebenza olawulwayo I-geometry yamathuluzi, indawo yokubhekisela, ukujula/ubukhulu obusele kanye nokubekezelelana. Nikeza umdwebo onesilinganiso esiphelele kanye nencazelo eyodwa yokujula engaguquki.
Ukujiya kwebhodi I-dielectric ecindezelwe, ukwakheka kwethusi, ukumbozwa kanye nokubekezelelana kwe-stackup. Ubukhulu kanye nokubekezelelana okuqediwe; vumela umenzi wokwakha ukuthi aklame ukwakhiwa okuningiliziwe ukuze ahlangabezane nakho.
Ukusatshalaliswa kwethusi Isilinganiso sethusi esisele, isidingo se-resin, ibhalansi yobukhulu kanye nengozi ye-warpage. Sebenzisa ithusi elilinganisiwe lapho umsebenzi wesekethe uvumela khona futhi ubuyekeze inhlanganisela yethusi elincane kakhulu/ithusi elisindayo kusenesikhathi.

Kungani "ukuklama okulinganiselwe" kungadala izinkinga zokukhiqiza

Uhlelo lwe-PCB CAD luvame ukumela injongo eqediwe. Ifektri kumele ikhiqize ukuze ifinyelele kulowo mphumela oqediwe ngezinqubo ezifaka futhi zisuse izinto. Ukufakwa kwemigodi kunciphisa ububanzi obubhoboziwe. Ukuqopha kususa ithusi eceleni. Ukubopha kushintsha ukujiya kwe-dielectric. Ukwelashwa kwendawo kanye nemaski yokusongelwa kwenezela izendlalelo ezibonakalayo. Kukhona isinxephezelo se-CAM sokuvala leyo miphumela.

Ngakho-ke ubudlelwano obukhiqiza kakhulu phakathi komklami ne-CAM busebenza kusukela ezidingweni eziqediwe kanye nomkhawulo wenqubo . Umklami kufanele achaze ngokucacile ukuthi yini okumele ibe yiqiniso ebhodini eliqediwe; unjiniyela we-CAM kufanele achaze idatha yokukhiqiza ekhokhelwayo edingekayo ukuze ifezeke.

Imibuzo Ejwayelekile Yobunjiniyela be-CAM nokuthi Kungani Yenzeka

Imibuzo yobunjiniyela ayilona ngempela ubufakazi bomklamo omubi. Yindlela esemthethweni yokuvimbela idatha engacacile ukuthi ibe yizinqumo zokukhiqiza ezingenakuguqulwa. Izizathu ezivamile zifaka phakathi ukungafani phakathi kokudweba nedatha ye-Gerber, incazelo engacacile ye-PTH/NPTH, usayizi wembobo oqediwe ophikisana nosayizi wephedi, ukungabi khona kwesikhala sethusi noma ithusi eliya emaphethelweni, ithagethi ye-impedance engahambisani ne-stackup enikeziwe, i-slot engachazwanga efakwe i-plated, ukungqubuzana kokuphela kwendawo, ukubuyekezwa komklamo okuxubile, noma isici somshini esingenalo ulwazi lokujula/lokubekezelelana.

Amaqembu okuklama anganciphisa isikhathi sokushintsha ngokuphendula ama-EQ kumayunithi afanayo futhi axhumanise izinkomba ezisetshenziswa kuphakheji yokukhiqiza kanye nokubuyisela ukubuyekezwa okukodwa okuvunyiwe okuhlanganisiwe kunokulandelana kwama-patch amafayela angahlobene.

Imiphumela ye-CAM Eqhuba Ifektri ye-PCB

Ngemva kokuvunyelwa, i-CAM ikhiqiza okungaphezu kwe-"Gerber yokukhiqiza." Isethi ephelele yedatha yokukhiqiza ingafaka amafayela okuthwebula izithombe angaphakathi nangaphandle, izinhlelo zokubhoboza ezikhokhelwayo, izinhlelo zomzila, idatha ye-V-score, ama-panel arrays, i-solder-mask kanye nedatha ye-legend, idatha yereferensi ye-AOI, uhlu lwe-netlists yokuhlolwa kukagesi, amakhuphoni e-impedance, ama-targets okubhalisa ungqimba, izici zamathuluzi kanye namafayela athile enqubo yokusebenza okukhethekile.

Umhambi we-ERP/MI ubopha lawo mafayela ngokulandelana. Umklamo ofanayo we-PCB ungadinga umzila ohlukile kuye ngokuthi usebenzisa imigodi ejwayelekile, ama-vias angaboni/afihliwe, i-resin-filled via-in-pad, igolide elikhethiwe, i-edge plating, i-controlled-depth routing noma izinto ezikhethekile. Yingakho i-CAM kanye nokuhlela inqubo kufanele kube ngaphakathi kwenqubo yokukhiqiza ye-PCB, hhayi ngaphandle kwayo.

Kusukela ku-PCB Eqediwe kuya ku-PCB Assembly

Ukwenziwa kwe-PCB kukhiqiza ibhodi lesifunda eliphrintiwe elingenalutho. Ukuhlanganiswa kwe-PCB kuqala ngemva kokuba ibhodi elingenalutho selidlulile ekuhlolweni kokugcina. Lapho ukwenziwa nokuhlanganiswa kuhlanganiswe, izinqumo ze-CAM zingasekela nokusebenza kahle kwenqubo ye-SMT ngokucabangela ama-panel rails, ama-fiducial, imigodi yamathuluzi, ukulenga kwengxenye kanye nokususwa kwamapaneli.

Inqubo evamile yokuhlanganisa i-PCB ifaka phakathi ukuhlolwa okungenayo, ukuphrinta nge-solder-paste, i-SPI lapho kudingeka khona, ukukhetha nokubeka, ukugoqa kabusha, i-AOI, ukuhlolwa kwe-X-ray kwamalunga afihliwe njenge-BGA/QFN, ukufakwa kwembobo kanye nokugoqa ngegagasi/ukukhetha/okwenziwa ngesandla njengoba kufanele, ukuhlanza, ukuhlela kanye nokuhlola okusebenzayo. Uhlelo lokuhlanganisa i-PCB oluyi-turnkey lungahlanganisa nokuthola izingxenye kanye nokuhlanganiswa komkhiqizo wokugcina.

Ukugcina ubunjiniyela bokukhiqiza nokuhlanganisa buxhunyiwe kuwusizo kakhulu kuma-via-in-pad, i-fine-pitch BGA, izixhumi ezifakwa ngokucindezela, iziqephu ezikhethiwe, izixhumi ezisemaphethelweni kanye nemiklamo yamaphaneli okumele idlule emishinini ye-SMT ezenzakalelayo.

Uhlu Lokuhlola Lokukhiqiza Ama-PCB Ngaphambi Kokukhishwa Kwabaklami Be-PCB

  1. Qinisekisa ukuthi ifayela ngalinye lokukhiqiza lingelayo isibuyekezo somklamo esifanayo.
  2. Nikeza uhlaka lwebhodi olucacile olungenazo izingqimba eziphindaphindayo noma ezingqubuzanayo.
  3. Khomba i-PTH, i-NPTH, ama-slots, ama-microvia, ama-blind vias kanye nama-billed vias ngokungaqondile.
  4. Bonisa ubukhulu bemigodi eqediwe kanye nokubekezelelana kwemigodi ebalulekile.
  5. Hlola indandatho ehlanganisiwe usebenzisa i-realistic drill kanye ne-registration allowance.
  6. Hlola ukuvuleka kwe-hole-to-copper kanye ne-copper-to-edge, hhayi kuphela i-CAD DRC default.
  7. Qondanisa umugqa/isikhala esincane nesisindo sethusi esikhethiwe kanye nobuchwepheshe bebhodi.
  8. Chaza ukujiya kwebhodi eliqediwe kanye nokubekezelelana.
  9. Nikeza i-stackup noma ugunyaze umenzi ukuthi ayiphakamise.
  10. Thola amanethi okulawula ukuvimbela, imigomo kanye nokubekezelelana.
  11. Isimo ngokwelashwa: ivuliwe, ivalwe ngetende, ivalwe nge-plug, igcwele i-resin/ivalwe nge-cap noma okunye.
  12. Gcina isikrini sesilika kude nama-pads ashiswayo kanye nezindawo zokuthintana.
  13. Chaza ukuqeda kobuso, okuhlanganisa nezindawo zegolide eliqinile noma izindawo ezihlanganisiwe.
  14. Izikhala ezimbozwe ngosayizi, ama-castellations, ama-edge plating kanye nezici ezikhethekile zomphetho.
  15. Chaza ngokugcwele izindawo zokulungisa amapayipi, izindawo zokulungisa amapayipi kanye nomzila olawulwayo ojulile.
  16. Buyekeza ibhalansi yethusi kumadizayini enziwe ngezingqimba eziningi kanye nethusi elisindayo.
  17. Chaza izimfuneko ze-V-score, i-routing, amathebhu noma i-array enikezwe amakhasimende.
  18. Nikeza idatha ye-netlist/ehlakaniphile lapho itholakala khona ukuze kuqinisekiswe ukuxhumana.
  19. Susa izendlalelo zemishini eziphelelwe yisikhathi, amamephu okubhoboza kanye namanothi okubuyekeza amadala kuphakheji yokukhululwa.
  20. Xazulula imibuzo yobunjiniyela be-CAM ngaphambi kokuba idatha yokukhiqiza ikhishwe.

Indlela Inqubo Yokukhiqiza ye-PCB Eshintsha Ngayo Ngokwezinhlobo Zebhodi

Uhlobo lwebhodi Umehluko wenqubo ebalulekile Ukugxila kwe-CAM/umklamo
I-PCB enezinhlangothi ezimbili Akukho ukubekwa kwezingqimba eziningi kwama-core esignali angaphakathi; i-metallization edlula ngembobo ixhuma izinhlangothi ezimbili zethusi. Incazelo ye-PTH/NPTH, isithombe sesendlalelo sangaphandle, i-plating kanye nephrofayili.
I-Multilayer PCB Ingeza izithombe ezingaphakathi/i-AOI, i-layup, i-lamination kanye nokulawula ukubhaliswa kwangaphakathi. Ukufakwa kwe-stackup, ibhalansi yethusi, indandatho ehlanganisiwe kanye nokususwa kwengqimba kusuka embobeni kuya engqimbeni engaphakathi.
I-HDI PCB Kwengeza ukwakheka kwe-laser microvia kanye nemijikelezo ye-lamination elandelanayo. Ngesakhiwo ngomjikelezo we-lamination, ukwelashwa nge-in-pad, umugqa omncane/isikhala kanye nokubhaliswa.
I-PCB yethusi elinzima Kudinga ukugqwala okudinga kakhulu, ukubekwa kweplati kanye nokulawulwa kokugeleza kwe-resin. Umugqa/isikhala vs isisindo sethusi, ubuningi bethusi kanye nokugcwaliswa kwe-lamination.
I-RF / i-microwave PCB Isebenzisa izinhlelo zezinto ezilahlekelwa kancane noma ezixubile ezinokuzwela kukagesi okuqinile. Incazelo yezinto ezibonakalayo, ukuvimba okulawulwayo, iphrofayili yethusi kanye nokuvumelana kwe-stackup.
I-PCB eguquguqukayo eqinile Ihlanganisa izinhlelo zezinto eziqinile neziguquguqukayo kanye nezindawo zokubopha ezikhethiwe kanye nezindawo zokushintsha kwemishini. Umngcele oqinile/oguquguqukayo, indawo yokumboza, indawo yokugoba, izinto zokuqinisa, ukulandelana komzila kanye nokulandelana kwe-lamination.

Lapho Ikhwalithi Yakhelwe Khona Ekukhiqizweni kwe-PCB

Ukuqinisekiswa kwekhwalithi ye-PCB akuyona ukuhlolwa kokugcina okukodwa. Kuwuchungechunge lokuvimbela nokuqinisekisa. I-CAM DFM ivimbela i-geometry engahambisani ukuthi ingene ekukhiqizweni. I-AOI yengqimba yangaphakathi ivimbela abaqhubi abanephutha ukuthi bangangcwatshwa. Ukulawula ukubhalisa kuvikela ukuhambisana kwengqimba nembobo. Ukulawula iplati kuvikela ubuqotho bembobo nodonga. I-AOI yangaphandle ibamba amaphutha omqhubi ngaphambi kwemaski ye-solder. Ukuhlolwa kukagesi kuqinisekisa inethiwekhi eqediwe. Ukuhlolwa kokugcina kobukhulu nokubukwayo kuqinisekisa ukuthi ibhodi lihlangabezana nezidingo zalo zemishini nezomsebenzi.

Yingakho inqubo yokukhiqiza i-PCB enamandla ngobuchwepheshe iklanyelwe ezindaweni zokuhlola. Ukuhlolwa ngakunye kufanele kubambe uhlobo lwephutha elingalungiswa noma elivikelwe kuleso sigaba esikhundleni sokuthembela kumhloli wokugcina ukuthola konke ngemuva kokuba izindleko zebhodi seziqongelelene.

Indlela i-Highleap Esondela Ngayo EbuNjiniyela Bokukhiqiza be-PCB

I-Highleap Electronics isekela izinsizakalo zokwenziwa kwe-PCB kusukela ku-prototype kuya ekukhiqizweni, kufaka phakathi i-multilayer, i-HDI, i-controlled-impedance, i-heavy-copper, i-high-frequency kanye nezinye izakhiwo ezithuthukisiwe. Ulwazi olushicilelwe lwekhono le-Highleap luhlanganisa amabhodi aqinile afinyelela ezingqimbeni ezingama-60 kanye nekhono le-HDI elincane elifinyelela ku-2/2 mil kumadizayini afanelekayo; ukukhiqizwa kwangempela kuncike esisindweni sethusi, ukuhlanganiswa, ukusatshalaliswa kwezici kanye nokubuyekezwa kwe-DFM.

Konjiniyela abahlola ukwakhiwa, indawo yokuqala ewusizo kakhulu akuyona nje ithebula lamandla amancane. Thumela iphakheji ephelele yokuklama ukuze ithimba le-CAM likwazi ukuhlola umklamo njengohlelo: ukwakhiwa kwezingqimba, umugqa/isikhala, ama-drill, amasongo azungezile, ukuvuleka kwemigodi kuya kuthusi, umphetho webhodi, imaski yokubopha, ukuqeda kobuso, i-impedance, izici zemishini kanye ne-panelization.

Kumaphrojekthi aqhubeka ngale kwebhodi elingenalutho, i-Highleap ingathwala idatha yokukhiqiza ekhishwe iye ekuhlanganisweni kwe-PCB noma ohlelweni lokuhlanganiswa kwe-PCB oluyi-turnkey , igcina ukwenziwa, ukutholakala kwezingxenye, ukuhlanganiswa kanye nezidingo zokuhlola ngaphansi komsebenzi owodwa wobunjiniyela.

Imibuzo Evame Ukubuzwa Ngenqubo Yokukhiqiza ye-PCB

Ama-PCB enziwa kanjani?

Ama-PCB ezimboni enziwa ngokuguqula idatha yokuklama i-PCB ibe idatha yokukhiqiza i-CAM, ukulungiselela izinto ezimbozwe ngethusi, ukudweba kanye nokufaka izendlalelo zomqhubi, ukubopha izakhiwo ezinezingqimba eziningi, ukubhoboza kanye nokufaka insimbi, ukwakha izendlalelo zangaphandle, ukusebenzisa imaski yokubopha kanye nokuqeda ubuso, ukufaka iphrofayili ebhodini, ukulihlola ngogesi kanye nokuqedela ukuhlolwa kokugcina. Amabhodi athuthukile angangeza ukubhoboza nge-laser, ukubopha ngokulandelana, ngokugcwalisa, ukubopha okukhethayo noma imisebenzi ekhethekile yemishini.

Iyini i-CAM ekukhiqizweni kwe-PCB?

I-CAM, noma ubunjiniyela bokukhiqiza obusizwa yikhompyutha, yisigaba esiguqula idatha yokuklama ye-PCB yamakhasimende ibe idatha elungele ukukhiqizwa. Onjiniyela be-CAM benza ukuhlolwa kwe-DFM, balungise idatha yesendlalelo futhi babhoboze, basebenzise isinxephezelo sokukhiqiza esivunyiwe, badale amaphaneli namathuluzi, bakhiqize amafayela omshini futhi basekele umzila wenqubo ye-ERP/MI osetshenziswa yifektri.

Ingabe i-CAM iyafana nomklamo we-PCB?

Cha. Umklamo we-PCB uchaza inhloso yesekethe kanye nomkhiqizo. Ubunjiniyela be-CAM bulungiselela lowo mklamo wenqubo ethile yokukhiqiza. I-CAM kufanele ilondoloze umklamo osebenzayo ngenkathi ibheka izithombe, ukuqopha, ukubhoboza, ukuplata, ukulamina, imaski yokusoda, ukuphrofayilisha kanye nezidingo zokuhlola.

Kungani umklamo ungadlula i-CAD DRC kodwa wehluleke i-PCB DFM?

I-CAD DRC ihlola imithetho ehlelwe ngumklami. I-DFM yefektri ihlola umklamo ngokumelene nezimo zangempela zokukhiqiza njengesisindo sethusi, isinxephezelo sokubhoboza, ukubekezelela ukubhaliswa, isakhiwo se-lamination, ikhono le-solder-mask, umzila we-plating, i-panelization kanye nezinqubo ezikhethekile. Ngakho-ke umthetho we-CAD ungasebenza ngogesi kodwa ungaphelele ngokombono wokukhiqiza.

Kungani umenzi we-PCB eshintsha ububanzi bomkhondo noma usayizi wokubhoboza ku-CAM?

Abakhiqizi bangase basebenzise isinxephezelo esilawulwayo ukuze ibhodi eliqediwe lihlangabezane nobukhulu obuceliwe ngemva kokuqopha nokuqopha. Isibonelo, umsebenzi wobuciko ongaphandle ungadinga isinxephezelo sokuqopha, kuyilapho ukubhoboza kokukhiqiza imbobo eqophayo kungahluka kumbobo oqediwe ngoba ithusi lizobekwa odongeni lwembobo kamuva. Izinguquko zomsebenzi ngaphandle kwesinxephezelo sokukhiqiza esivunyelwene ngaso kufanele ziqinisekiswe nekhasimende.

Yimaphi amafayela okufanele ngiwathumele ukuze kukhiqizwe i-PCB?

Iphakheji yokukhulula eqinile ivame ukufaka ithusi, imaski ye-solder kanye nedatha ye-legend; amafayela okubhoboza e-NC; uhlaka lwebhodi; umdwebo wokwenziwa; ukuhlanganiswa kwezingqimba; ukujiya okuqediwe; izidingo zethusi; ukuqeda kwendawo; izidingo zokuvimbela okulawulwayo; amanothi akhethekile omshini; kanye nesethi yedatha ehlakaniphile noma uhlu lwedatha lapho lutholakala khona. Wonke amafayela kufanele amele ukubuyekezwa okufanayo.

Yini ebangela imibuzo eminingi yobunjiniyela be-CAM?

Izimbangela ezivamile zifaka phakathi ukubuyekezwa okungqubuzanayo, isimo se-PTH/NPTH esingacacile, indandatho enganele ye-annular noma i-hole-to-copper clearance enganele, izikhala ezingachazwanga noma izici zokujula ezilawulwayo, ukungqubuzana kokuphela kwendawo, izidingo ze-stackup/impedance ezingacacile, ithusi eliseduze kakhulu nomphetho oqondisiwe kanye namanothi okwenziwa angavumelani nedatha yomklamo wangempela.

Ingabe ukuhlanganiswa kwe-PCB kuyingxenye yenqubo yokukhiqiza i-PCB?

Ngokwesisho esiqinile, ukwenziwa kwe-PCB kukhiqiza ibhodi elingenalutho bese i-PCB assembly ifaka izingxenye kuyo. Ekusebenzeni kokukhiqiza izinto zikagesi ezishintshashintshayo, ziyizingxenye ezilandelanayo zochungechunge olulodwa lokukhiqiza. Ukuzihlanganisa kusenesikhathi kusiza ukuthuthukisa ukwakheka kwamaphaneli, ama-fiducial, ngokwelashwa, ukuqeda ubuso kanye nokususa amaphaneli e-SMT kanye ne-through-hole assembly.

Inothi lobunjiniyela: Imikhawulo yokukhiqiza incike ekubalweni kwezingqimba, isisindo sethusi, uhlelo lwezinto ezibonakalayo, ukujiya kwebhodi, ubuningi besici kanye nomzila wenqubo. Amanani amancane akufanele asetshenziswe njengemithetho yokuklama yendawo yonke. Imiklamo eseduze nomkhawulo wefektri kufanele ithole isibuyekezo se-CAM/DFM esiqondene nephrojekthi ngaphambi kokukhishwa.

Thumela Umklamo Ngaphambi Kokuba Ifektri Yakhe Ibhodi

Inqubo yokukhiqiza i-PCB esheshayo akuyona enezinyathelo ezimbalwa zokukhiqiza. Yileyo esusa ukungaqiniseki ngaphambi kokuba kuqale ukukhiqiza. Thumela i-Highleap idatha yakho ye-PCB, i-stackup, izidingo zokubhoboza kanye namanothi okukhiqiza ukuze kubuyekezwe i-CAM/DFM. Ithimba lethu lobunjiniyela lingabona izinkinga zokukhiqiza, liqinisekise umzila wenqubo futhi lixhume ukukhiqiza kwebhodi elingenalutho ngqo kumhlangano we-PCB uma kudingeka.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Masikwenzele ukuhlaziywa kwe-DFM/DFA futhi sibuyele kuwe ngombiko.

Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu.

Sidinga ulwazi olulandelayo ukuze sikunikeze isaphulelo:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha

Ngokungeziwe ekwenziweni kwe-PCB, sinikezela ngohlu olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA (I-Printed Circuit Board Assembly), kanye nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho. Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB