I-PCB Reverse Engineering Advanced Technology

Isingeniso

I-PCB reverse engineering, eyaziwa nangokuthi ubuchwepheshe obuhlanekezelwe, iyinqubo yokukhiqiza kabusha, ukuhlaziya, nokucwaninga ukwakheka kwebhodi le-PCB eliqondiwe. Le nqubo ibandakanya ukudonsa nokuthola idizayini yomkhiqizo, ukugeleza kokucubungula, ukwakheka, izici zokusebenza, nezinto zokucaciswa kobuchwepheshe ukuze kukhiqizwe imikhiqizo enezici ezifanayo. Ubunjiniyela obuhlehlayo busuka ekuhlaziyweni kwezingxenyekazi zekhompuyutha emikhakheni yezohwebo nezempi, lapho inhloso eyinhloko kuwukuhlaziya imikhiqizo eqediwe futhi kukhishwe izimiso zokuklama kwayo lapho ulwazi lokukhiqiza oludingekayo lungatholakali kalula.

I-Highleap inikezela ngezinsiza eziphelele zobunjiniyela be-PCB, ezisebenza ngokukhethekile ekukhiqizeni kabusha ngokucophelela kwamabhodi e-PCB, okuhlanganisa zonke izingxenye. Ithimba lethu lochwepheshe linekhono emabhodini onjiniyela ahlehlayo anama-IC ahleliwe, izingxenye zangokwezifiso, nezingxenye ezingasasebenzi, lidala yonke idatha edingekayo ukuze kuphindeke okunembile.

Inqubo yethu iqala ngokukhonjwa ngokucophelela kwazo zonke izingxenye ze-elekthronikhi ebhodini, okulandelwa ukwakhiwa kwebhili enemininingwane yezinto. Sibe sesithwebula zonke izingxenye zebhodi futhi sisuse ngokucophelela futhi sinamathisele ingxenye ngayinye endaweni yayo ekhophini ukuze ireferensi.

Njengoba sithuthuka, sihlunga umthethosivivinywa wezinto zokwakha ngokulinganisa amanani ama-resistors nama-capacitor. Okokugcina, sakha amabhodi angenalutho amasha ngokusekelwe kulokho esikutholile. Isampula ehlanganisiwe ithunyelwa ekhasimendeni ukuze lihlolwe ngokugcwele, kuqinisekiswe ikhwalithi ephezulu nokunemba enqubweni yethu yokuphindaphinda.

Iyini i-PCB Reverse Engineering?

I-PCB reverse engineering iyinqubo ecophelelayo ebandakanya ukuqaqa kanye nokuhlaziywa okuningiliziwe kwebhodi lesekethe eliphrintiwe lomkhiqizo wenyama (PCB) ukuze kukhiqizwe imibhalo ebanzi, kube lula ukwenziwa kabusha, kanye nokuthola imininingwane mayelana nokwakheka nokusebenza kwawo kwasekuqaleni. Le nqubo ibalulekile ekusizeni amakhasimende ukuthi athuthukise imikhiqizo yawo, adlule izimbangi ngokuqonda nokuphindaphinda izimiso zokuklama ezibalulekile.

Inqubo ngokuvamile iqala ngokuqedwa ngokucophelela kwe-PCB, lapho ingxenye ngayinye ihlonzwa khona, futhi indawo yayo kanye nokuxhumana kwayo kubhaliwe phansi. Amasu okuthwebula izithombe athuthukisiwe, njenge- X-ray imaging kanye nezithombe ezinekhwalithi ephezulu, avame ukusetshenziswa ukuthwebula imininingwane eyinkimbinkimbi yokwakheka kwe-PCB.

Ngemva kwesigaba sokuqala sokubhalwa kwemibhalo, onjiniyela bahlaziya ngokucophelela idatha ethathiwe ukuze bakhe kabusha umdwebo wohlelo kanye nebhili yezinto zokwakha (BOM). Le nqubo yokwakha kabusha ihilela ukuhlonza izinhlobo namanani ezingxenye ze-passive kanye nama-capacitor, kanye nokusebenza kwamasekhethi ahlanganisiwe (ama-IC) nezinye izingxenye ezisebenzayo.

Enye yezinselelo ezibalulekile ku-PCB reverse engineering ukubhekana nezinto zangokwezifiso noma ezingasasebenzi. Ezimweni ezinjalo, onjiniyela bangase badinge ukusebenzisa amasu akhethekile, njengokunqanyulwa kwe-IC noma ubunjiniyela obuhlehlayo bangokwezifiso ze-ASIC, ukuze baqonde ngokugcwele ukusebenza kwabo futhi bawaphindaphinde ngokunembile.

Ngaphezu kwalokho, ubunjiniyela obuhlehlayo buhlanganisa nokuqonda izinqubo zokukhiqiza ze-PCB, okuhlanganisa izinto ezisetshenziswayo, ukunqwabelana kwezingqimba, nezindlela zokwenziwa. Lolu lwazi lubalulekile ekwenzeni kabusha i-PCB ibe kumazinga ekhwalithi afanayo neyokuqala.

Sekukonke, ubunjiniyela bokuhlehla be-PCB kuyinqubo eyinkimbinkimbi kodwa ebalulekile enika izinkampani amandla okuthuthukisa ukuncintisana kwemikhiqizo yazo ngokuthola ukuqonda okujulile kwemiklamo nobuchwepheshe babaqhudelana nabo. Isebenza njengethuluzi elibalulekile lokusungula izinto ezintsha, okwenza izinkampani zihlale ziphambili emhlabeni osheshayo wokukhiqiza izinto zikagesi.

PCB Reverse Engineering Services by Highleap electronic

I-Highleap electronic ingumhlinzeki oholayo wezinsizakalo zobunjiniyela be-elekthronikhi ezizinze e-Guangzhou, e-China, onolwazi olungaphezu kweminyaka eyishumi yobunjiniyela. Ithimba lethu elizinikele lisebenza ngokukhethekile kwihadiwe ye-elekthronikhi yobunjiniyela, enikeza inhlobonhlobo yezinsizakalo ukuhlangabezana nezidingo zakho.

Izinsizakalo zethu zobunjiniyela be-PCB zibandakanya:

1. Buyekeza Ubunjiniyela Nokukhiqiza Kabusha:
   • Senza kahle kakhulu kumabhodi esekethe ye-elekthronikhi aphelelwe yisikhathi futhi angasekelwe nobunjiniyela kanye nama-card asembling.
   • Ithimba lethu linganquma ukuthi into yaklanywa futhi yasebenza kanjani, iphinde ikhiqize kabusha isuka ebhodini lesekethe ephrintiwe iye kusikimu.
2. Lungisa, Kopisha, noma I-Clone:
   • I-Highleap electronic inikeza izinsiza zokulungisa, zokukopisha, noma zokuhlanganisa amabhodi esekethe aphrintiwe angasasekelwa umkhiqizi wemishini yoqobo (OEM).
   • Siqinisekisa ukuthi iyunithi yokumiselela iyifaniso enembile ngendlela, ilingana, nomsebenzi, ihlangana noma idlule izicaciso zangempela.
3. Ukuthobelana namalungelo empahla yobuhlakani:
   • Ngaphambi kokuqala umsebenzi, senza uphenyo olunzulu kanye nokuhlola umkhiqizo ukuze siqinisekise ukuthi awekho amalungelo empahla yengqondo ephulwayo.
   • Izinqubo zethu zinamathela ngokuqinile ezindinganisweni zokuziphatha kanye nezimfuneko zomthetho ukuze sivikele impahla yengqondo yamakhasimende ethu.

Kwa-Highleap electronic, sizibophezele ekunikezeni ukwesekwa kwamakhasimende okuhle kakhulu embonini ye-PCB clone kanye ne-PCB yamakhophi. Sikumema ukuthi ukhethe i-Highleap electronic kuzo zonke izidingo zakho zobunjiniyela be-PCB.

Ukwengeza, inqubo yethu yobunjiniyela be-PCB ehlehlayo ingasebenzisa ubuchwepheshe bokuskena be-3D, obufana nezikena ze-laser, iziguquli zomthombo wokukhanya ezihlelekile, noma i-X-ray tomography, ukukala ubukhulu ngokusekelwe ezintweni ezikhona ezibonakalayo. Lobu buchwepheshe busivumela ukuthi sakhe amamodeli abonakalayo e-3D nge-CAD, CAM, CAE, noma enye isofthiwe.

Kubhodi lokukopisha le-PCB kanye nokucazululwa kwe-chip, sihlaziya imikhiqizo ye-elekthronikhi ebonakalayo kanye namabhodi wesekethe ukuze siguqule amafayela e-PCB omkhiqizo wokuqala, amafayela ebhili yezinto ( i-BOM ), amafayela e-schematic kanye nobuchwepheshe, kanye namafayela okukhiqiza i-PCB silkscreen. Lawa mafayela abe esesetshenziselwa ukukhiqizwa kwebhodi le-PCB, ukusonta izingxenye, ukuhlolwa kwe-probe endizayo, ukulungisa amaphutha ebhodi yesekethe, kanye nokugcwalisa ikhophi ephelele yethempulethi lebhodi yesekethe yokuqala. Ukucazululwa kwe-chip kuhilela ukuthola ngqo ifayela lokuhlela elibethelwe ku-MCU ngemishini nezindlela ezithile, okuvumela ukukopisha, ukuhlela, noma ukuqaqa ukuze kubhekwe futhi kucwaningwe okwengeziwe.

Ngosizo lwemishini ekhethekile noma okokusebenza okuzenzela, onjiniyela bethu abanekhono bangasebenzisa ubuthakathaka noma ukukhubazeka kwesofthiwe ekwakhiweni kwe-chip eyodwa ukuze kukhishwe ulwazi olubalulekile futhi bathole uhlelo kuyi-single-chip microcomputer ngezindlela ezihlukahlukene zobuchwepheshe, ukuqinisekisa ukuthi kuphelele futhi kunembile. hlehlisa imiphumela yobunjiniyela.

Inqubo elula ye-PCB Reverse Engineering

I-PCB reverse engineering, evame ukubizwa ngokuthi ukukopisha, ukwenza i-cloning, noma ukulingisa, inqubo ecophelelayo ebandakanya ukukhipha nokubuyisela amafayela e-PCB wamabhodi esekethe omkhiqizo we-elekthronikhi. Le nqubo ivumela ukuphindwaphindwa kwemikhiqizo ye-elekthronikhi, iqinisekisa ukuthi ibhodi elikopishiwe lifana nelokuqala ngendlela, ukulingana, kanye nokusebenza. Kwa-Highleap electronic, onjiniyela bethu abangongoti balandela inqubo yokugeleza enemininingwane ukuze baqinisekise ukunemba kanye nekhwalithi yenqubo yobunjiniyela ehlehlayo.

1. Ukuhlola kokuqala:
   • Qoqa lonke ulwazi olubalulekile mayelana ne-PCB, okuhlanganisa imodeli, amapharamitha, nezindawo zengxenye.
   • Sebenzisa ikhamera yedijithali ukuze uthwebule izithombe ze-PCB kanye nokuma kwengxenye, unake kakhulu ukuma kwe-diode, i-transistor, ne-IC.
2. Ukususwa Nokuhlanza Ingxenye:
   • Susa zonke izingxenye ku-PCB futhi uyihlanze kahle ngotshwala.
   • Khipha ithini embotsheni ye-PAD ukuze ulungise i-PCB ukuze iskenwe.
3. Ukuskena nokucutshungulwa kwesithombe:
   • Beka i-PCB ehlanziwe kusikena futhi ulungise izilungiselelo zokuthwebula izithombe ezicacile.
   • Skena izendlalelo ezingaphezulu neziphansi ngokuhlukene ngombala bese ulondoloza izithombe njengamafayela efomethi ye-BMP emnyama nemhlophe (TOP.BMP ne-BOT.BMP).
   • Sebenzisa isofthiwe yokuhlela izithombe njenge-Photoshop ukulungisa ukugqama nokukhanya kwezithombe ukuze uqinisekise imigqa ecacile.
4. Ukuguqulwa kufomethi ye-PROTEL:
   • Guqula amafayela efomethi ye-BMP abe amafayela efomethi ye-PROTEL futhi udlulise izendlalelo ezimbili ku-PROTEL.
   • Qondanisa izindawo ze-PAD ne-VIA ukuze uqinisekise ukuthi lezi zingqimba ezimbili ziyahambisana.
5. Ukulandela nokubeka:
   • Guqula ungqimba oluphezulu lwe-BMP lube yi-TOP.PCB bese ulandelela imigqa esendlalelo se-TOP ngokomdwebo osuka ekuhloleni kokuqala.
   • Beka izakhi ku-TOP ungqimba njengokwangempela Ukuhlelwa kwe-PCB bese ususa isendlalelo se-SILK ngemva kokudweba.
6. Ukuhlanganisa Izendlalelo:
   • Ngenisa i-TOP.PCB ne-BOT.PCB ku-PROTEL futhi uzihlanganise zibe isithombe esisodwa.
7. Ukuphrinta Nokuqinisekisa:
   • Phrinta I-TOP LAYER kanye NE-BOTTOM LAYER kufilimu ebonisa ngale usebenzisa iphrinta ye-laser ngesilinganiso esingu-1:1.
   • Beka ifilimu ku-PCB bese uyiqhathanisa neyokuqala ukuze uhlole amaphutha.
8. Ukuhlola Nokuqinisekisa:
   • Hlola i-PCB ekopishiwe ukuze uqinisekise ukuthi ukusebenza kwayo kwe-elekthronikhi kufana nalokho kwebhodi langempela.
   • Yenza noma yiziphi izinguquko ezidingekayo ukuze uqinisekise ukuthi ibhodi elikopishiwe lisebenza ngokufana nelokuqala.
9. Ukuqedela:
   • Uma ibhodi elikopishiwe seliphumelele zonke izivivinyo nokuqinisekiswa, inqubo yobunjiniyela ehlehlayo isiphelile.
   • Ibhodi elikopishiwe manje selilungele ukusetshenziswa ekushintsheni noma ezinhlelweni zokuphindaphinda.

Kumabhodi anezendlalelo eziningi, izinyathelo ezengeziwe ziyadingeka, okuhlanganisa ukupholishwa ngokucophelela kwezingqimba zangaphakathi nezinyathelo zokukopisha eziphindaphindiwe. Onjiniyela abanekhono be-Highleap electronic baphatha isinyathelo ngasinye ngokunemba nangokucophelela ukuze baqinisekise imiphumela yekhwalithi ephezulu kakhulu kubunjiniyela obuhlanekezelanayo be-PCB.

I-Multilayer PCB Reverse Engineering Process

Isinyathelo 1: Ukulungiselela

• Hlola ibhodi lesifunda ukuze uthole izingxenye ezisezingeni eliphezulu futhi urekhode imininingwane yazo njengenombolo yendawo, iphakheji, kanye nenani lokushisa.
• Skena i-PCB ngaphambi kokususwa kwengxenye njengesipele.
• Susa izingxenye eziphezulu kuqala bese uskena futhi ukuze urekhode izithombe, uqinisekise ukulungiswa okungu-600dpi.
• Hlanza indawo ye-PCB kahle ngaphambi kokuskena ukuze uqinisekise ukubonakala okucacile kwamamodeli e-IC nezinhlamvu ze-PCB.

Isinyathelo sesi-2: I-Component Disassembly kanye ne-BOM Creation

• Sebenzisa isibhamu somoya esincane ukuze ushise futhi ususe izingxenye, uqale ngama-resistors, bese kuba ngama-capacitor, futhi ekugcineni ama-IC.
• Lungiselela ithebula elinemininingwane yengxenye futhi urekhode izinto ezifana nenombolo, iphakheji, imodeli, kanye nenani.
• Linganisa inani lezingxenye ngebhuloho, uqinisekise ukunemba ngokulinganisa ngemva kokwehla kwezinga lokushisa ledivayisi.
• Faka idatha yengxenye kukhompuyutha ukuze igcinwe kungobo yomlando.

Isinyathelo sesi-3: Ukususwa kwethini ku-Surface

• Sebenzisa i-flux ukuze ususe amanyela ethayela asele endaweni ye-PCB lapho izingxenye zikhishwe khona.
• Lungisa izinga lokushisa lensimbi ye-solder ngokufanele ama-PCB anezingqimba eziningi futhi ukhiphe ithini ngokucophelela ukuze ugweme ukushisa uyinki.
• Geza i-PCB ngamanzi okugeza ibhodi noma amanzi amancane futhi uyomise kahle.

Isinyathelo sesi-4: Ukusebenza kwesikhathi sangempela ku-PCB Copy Software

• Setha izithombe ezingaphezulu eziskeniwe njengezendlalelo ezingaphezulu nezingaphansi futhi uziguqule zibe izithombe ezibonakalayo zokukopisha isofthiwe.
• Pakisha izingxenye, okufaka isikrini sikasilika esincane, indawo yokuvula iphedi, nezimbobo zokubeka, ngokuya ngezithombe ezingezansi.
• Lungisa izinhlamvu ukuze zifane nebhodi langempela bese ususa isihlabathi esikrinini sikasilika, uyinki, nezinhlamvu endaweni ye-PCB ukuze uveze ithusi elikhanyayo.

Isinyathelo sesi-5: Ukuhlola kanye Nokulungiswa Ngokunembayo

• Sebenzisa isofthiwe yokucubungula izithombe nesofthiwe yokudweba ye-PCB ukuze wenze ukwahlulela okunembile okungu-100% kwe-PCB ekopishiwe.
• Hlola i-impedance kanye nezinkomba ze-PCB ukuze uqinisekise ukuthi ziyahambisana nebhodi langempela.
• Lungisa futhi ulungise ibhodi lokukopisha ukuze linembayo, ugxile ekunembeni kwesofthiwe kanye nekhwalithi yesithombe soqobo.
• Setha i-DPI (amachashazi ngeyintshi ngayinye) ngokusekelwe ekunembeni okudingekile kwebhodi, nge-DPI ephezulu ukuze uthole izidingo zokunemba okuphezulu.

Highleap electronic follows a meticulous process for ubunjiniyela obubuyela emuva be-PCB obunezingqimba eziningi, ensuring accurate replication of electronic products. The detailed steps, from preparation to precision adjustment, guarantee the quality and functionality of the copied PCB, meeting the high standards of our clients.

I-PCB Reverse Engineering Techniques

I-PCB reverse engineering ibandakanya inqubo yokudalula isakhiwo sangaphakathi noxhumo lwebhodi lesekethe ephrintiwe (PCB) ngokusebenzisa izindlela ezingabhubhisi noma ezilimazayo. Lezi zindlela zibalulekile ekuqondeni ukwakheka nokusebenza kwama-PCB akhona ngezinjongo ezahlukahlukene njengokukhanda, ukuphindaphinda, noma ukuhlaziya. Lapha, sizohlola kokubili amasu angabhubhisi nawonakaliyo.

I-PCB Engabhubhisi I-Reverse Engineering Technique

Amasu angabhubhisi athola ukuduma ngenxa yezindleko zawo eziphansi, ubude besikhathi esifushane, kanye nekhono lokubona amaphutha. Enye yezindlela ezivame kakhulu ezingabhubhisi i-X-ray tomography, evumela ukuthwebula izithombe ze-PCB yonke ngaphandle kokubambezeleka.

I-X-ray tomography iyindlela yokuthwebula engahlanyisi ehlinzeka ngolwazi oluningiliziwe mayelana nesakhiwo sangaphakathi se-PCB, okuhlanganisa ukuxhumana, ngezimbobo, nemikhondo, ngaphandle kokulimaza i-PCB. Le nqubo ithwebula zonke izendlalelo ze-PCB (ngaphambili, ingaphakathi, nangemuva) ngeseshini eyodwa yokucabanga.

Inqubo ye-tomography ihilela ukuthola uchungechunge lwezithombe ze-X-ray ze-2D kusuka kuma-engeli ahlukene kanye nokusebenzisa ama-algorithms ezibalo ukuze kwakhiwe kabusha isithombe se-3D se-PCB. Amapharamitha afana namandla omthombo, inhloso yomtshina, ukuhlunga, nesikhathi sokuchayeka kubalulekile ekuthuthukiseni ikhwalithi yesithombe.

Ngemva kokwakha kabusha isithombe se-3D, ukuhlaziya ingaphakathi nesakhiwo sangaphandle kungenzeka, okuvumela ukuhlolwa okuningiliziwe kwezingxenye ze-PCB nokuxhumana.

Amasu Obunjiniyela Ahlehlayo e-PCB

Izindlela ezilimazayo zibandakanya ukubambezeleka ngokomzimba i-PCB ukuze iveze izendlalelo zayo zangaphakathi. Le nqubo ivamise ukusetshenziselwa ama-PCB anezingqimba eziningi futhi ihilela izinyathelo ezintathu eziyinhloko: ukususwa kwemaski ye-solder, ukubambezeleka, nokuthwebula izithombe.

1. Ukususwa Kwemaski Solder: Imaski ye-solder iyasuswa ukuze kuvezwe iminonjana yethusi kwizendlalelo ezingaphezulu nezingaphansi ze-PCB. Lesi sinyathelo sibalulekile ukuze uthole umbono ocacile wemikhondo yethusi.
2. Iyalibazisa: Ukubambezeleka kuyinqubo yokufinyelela izendlalelo zethusi zangaphakathi ze-PCB enezingqimba eziningi. Lokhu kwenziwa ngezindlela ezingokomzimba, ezilimazayo ngemva kokukhipha zonke izingxenye ku-PCB.
3. Ukucabanga: Uma izendlalelo zangaphakathi ziveziwe, izithombe ngazinye zesendlalelo ngasinye zitholwa kusetshenziswa izindlela zokuthwebula ezingabhubhi njenge-X-ray noma ukuskena kwe-Computerized Tomography (CT).

Lezi zindlela zinikeza imininingwane ebalulekile ekwakhiweni nasekusebenzeni kwe-PCB, okuvumela ukuphindaphinda noma ukuhlaziya. Kodwa-ke, kubalulekile ukuqaphela ukuthi amasu alimazayo angalimaza i-PCB, ayenze ingakufanelekeli ukusetshenziswa futhi. Ngakho-ke, ukukhetha phakathi kwamasu okubhubhisa nokungabhubhi kuncike ezidingweni ezithile zephrojekthi.

Isiphetho

I-PCB reverse engineering iyinqubo ebalulekile ekuvumela ukuthi wakhe kabusha ibhodi lesifunda eliphrintiwe ukusuka kumklamo walo wokuqala. Ngaphandle kobunzima obukhulayo bama-PCB esimanje, ubunjiniyela obuhlehlayo bungenziwa ngempumelelo ngesethi ecacile yezinhlelo kanye nobuchwepheshe obufanele.

Onjiniyela abahlehlayo abaqeqeshiwe bangasiza ukuthuthukisa izinsiza zakho zokukhiqiza ngogesi ngokuphatha izici eziyinkimbinkimbi kakhulu zenqubo. Ubuchwepheshe babo nolwazi lwabo luqinisekisa ukuthi inqubo yobunjiniyela ehlehlayo yenziwa ngendlela efanele futhi enembile, okuholela emiphumeleni yekhwalithi ephezulu.

Imibuzo Evame Ukubuzwa ku-PCB Reverse Engineering

1.Iyini inhloso enkulu ye-PCB vias?

I-PCB vias inikeza indlela yokuqondisa ukuze amasignali kagesi adlule ezendlalelo ezahlukene ze-PCB. Abalulekile ekuhambiseni amasiginali namandla phakathi kwezendlalelo ze-PCB enezingqimba eziningi.

2.Yini i-Reverse Engineering?

Ubunjiniyela obuhlehlayo yinqubo esetshenziselwa ukukhiqiza kabusha, ukuphinda, noma ukuthuthukisa ama-chips namasistimu ngokuhlaziya idivayisi yoqobo noma isistimu. Kuzinhlelo ze-elekthronikhi, ubunjiniyela obuhlehlayo bungenziwa emazingeni e-chip, ebhodini, nakumasistimu, okubandakanya ukuhlaziywa kwezendlalelo eziningi ukuze kuqondwe ukwakheka kwangaphakathi nokuxhumana.

3.Uyini umehluko phakathi kwe-PCB ne-PCBA?

I-PCB (Ibhodi Lesifunda Eliphrintiwe) ibhodi elisetshenziselwa ukuxhuma izinto zikagesi futhi lisekele ngokumshini, kuyilapho i-PCBA (Printed Circuit Board Assembly) iyi-PCB enezinto ezidayiselwe kuyo.

4.Uyini umehluko phakathi komdwebo wohlelo kanye nesakhiwo se-PCB?

Umdwebo wohlelo uwumdwebo wezintambo obonisa izingxenye nokuthi zixhumeke kanjani, kuyilapho isakhiwo se-PCB siwumfanekiso obonakalayo wohlelo, ochaza ukubekwa kwezingxenye kanye nomzila wokulandela umkhondo ebhodini langempela.

5.Kungani kubalulekile ukukhiqiza amafayela e-Gerber?

Amafayela e-Gerber ayadingeka ekwenzeni i-PCB, njengoba aqukethe ulwazi lwejometri oludingekayo ukuze udale isifunda ebhodini. Akhiqizwa ezithombeni ze-X-ray ze-3D ezitholwe ngesikhathi senqubo yobunjiniyela ehlehlayo.

6.Iyini inqubo yokuhlanganisa izendlalelo ngesikhathi sobunjiniyela be-PCB obuhlanekezelwe?

Ukuze uhlanganise izendlalelo ku-PCB enezingqimba ezimbili, uthola amanetha ahambisanayo kusendlalelo ngasinye bese uwaxhuma usebenzisa i-vias. Le nqubo iqinisekisa ukuthi konke ukuxhumana phakathi kwezendlalelo kubalwa ngakho ohlwini lokugcina lwenetha.

7. Ngingakha kanjani uhlu lwe-netlist uma ngisebenzisa i-PCB yobunjiniyela obuhlukile?

Ukuze ukhiqize uhlu lwe-net, uthola izingxenye namaphedi kusendlalelo ngasinye, bese udala ukuxhumana phakathi kwakho ngokusekelwe ekuxhumekeni kwawo kagesi. Lolu lwazi lusetshenziselwa ukudala uhlu lokuxhumana lwenethi ngayinye.

8.Yini ukubaluleka kwe-BOM ngesikhathi se-PCB yobunjiniyela obuhlanekezelwe?

Umthethosivivinywa Wezinto Zokusebenza (BOM) ubalulekile ekuhlonzeni zonke izingxenye ezidingekayo ukwenza i-PCB. Iqinisekisa ukuthi izingxenye ezifanele zisetshenziswa futhi inikeza imibhalo yenqubo yokuhlanganisa ye-PCB.

9.Ngingakwazi ukuhlehlisa unjiniyela noma iyiphi i-PCB?

Ukuba nokwenzeka kokuhlehla konjiniyela be-PCB kuncike ezintweni ezifana nobunzima bobuchwepheshe, ezomnotho, nokutholakala kwedatha. Ama-PCB asetshenziswa kabanzi kanye nezindleko eziphezulu zeyunithi ngayinye zingamakhandidethi angcono onjiniyela ohlehlayo.

10.Ubani onamalungelo empahla yengqondo ye-PCB reverse engineered schematic?

Umthuthukisi wohlelo oluhlanekezelwe uphethe amalungelo okuvikela ubunikazi bokusungula alelo cebo elithile. Nokho, amalungelo elungelo lobunikazi omkhiqizo wokugcina noma isistimu angase abanjwe omunye umuntu.

11.Uyini umehluko phakathi kwe-PCB ye-double layer ne-Multilayer PCB?

I-PCB enezingqimba ezimbili inezendlalelo ezimbili zokuqondisa, ezivumela umzila wokulandela phakathi kwezendlalelo. I-PCB enezingqimba eziningi inezendlalelo eziqhutshwayo ezingaphezu kwezimbili, ezivumela ukuminyana kwesekethe ephakeme nokuba yinkimbinkimbi.

12.Uyini umehluko phakathi kwe-PCB ne-PCBA?

I-PCB (Ibhodi Lesifunda Eliphrintiwe) ibhodi elisetshenziselwa ukuxhuma izinto zikagesi futhi lisekele ngokumshini, kuyilapho i-PCBA (Printed Circuit Board Assembly) iyi-PCB enezinto ezidayiselwe kuyo.

13.Uyini umehluko phakathi komdwebo wohlelo kanye nesakhiwo se-PCB?

Umdwebo wohlelo uwumdwebo wezintambo obonisa izingxenye nokuthi zixhumeke kanjani, kuyilapho isakhiwo se-PCB siwumfanekiso obonakalayo wohlelo, ochaza ukubekwa kwezingxenye kanye nomzila wokulandela umkhondo ebhodini langempela.

14.Yini i-Reverse Engineering?

Ubunjiniyela obuhlehlayo yinqubo esetshenziselwa ukukhiqiza kabusha, ukuphinda, noma ukuthuthukisa ama-chips namasistimu ngokuhlaziya idivayisi yoqobo noma isistimu. Kuzinhlelo ze-elekthronikhi, ubunjiniyela obuhlehlayo bungenziwa emazingeni e-chip, ebhodini, nakumasistimu, okubandakanya ukuhlaziywa kwezendlalelo eziningi ukuze kuqondwe ukwakheka kwangaphakathi nokuxhumana.

15.Ingabe i-Computerized Tomography inemikhawulo?

I-Computerized Tomography (CT) inemikhawulo mayelana nenkambu yosayizi wokubuka, engathinta ikhwalithi nokulungiswa kwezithombe ezitholiwe. Amasegimenti amaningi angase adinge ukudalwa futhi athungwe ndawonye ukuze kucutshungulwe yonke i-PCB.