Ukukhiqiza i-RO4003C Hybrid Multilayer PCB

Leli khasi liyingeniso lokuthengwa nokukhiqiza kwamabhodi e-RO4003C RF kanye ne-hybrid multilayer. Kufanele liphendule ukuthi ukwakhiwa kwe-RO4003C okucacisiwe kuguqulwa kanjani kube yi-stackup ekhiqizwayo nokuthi i-PCB eqediwe ihlolwa kanjani ngaphambi kokukhiqiza okuphindaphindiwe.

Ukukhiqizwa kwe-RO4003C hybrid multilayer PCB kusebenza lapho into ngayinye inikezwe injongo kagesi ecacile ku-stackup. Izendlalelo ze-RF zidinga i-dielectric elawulwayo kanye ne-conductor geometry, kuyilapho izingxenye ze-FR4 zinganikeza izinzuzo zemishini noma zezindleko lapho isabelomali se-RF sizivumela khona. I-RO4003C ivame ukuba yindawo lapho iphrojekthi ye-RF iyeka khona ukuziphatha njengebhodi elijwayelekile le-FR-4. Ushintsho aluqhutshwa yigama lento kuphela. Ngokuvamile kwenzeka ngoba ukulahlekelwa kokufakwa, ukuhambisana kwesigaba, impendulo yesihlungi, ukuzinza kokuphakelwa kwe-antenna noma ukuphindaphindwa kokukhiqiza akusakwazi ukubekezelela ukusabalala okuhlobene nokwakhiwa kwe-epoxy okujwayelekile. Ukwakhiwa kwe-laminate ekhethiwe kufanele kuhanjiswe ekulawulweni kokwenziwa kwe-RO4003C , okuhlanganisa ukubhoboza, ukubopha kanye nokuqinisekiswa kwebhodi eliqediwe.

I-Highleap Electronics isekela ukwenziwa kwe-RO4003C PCB kusuka kumasampula obunjiniyela ngokukhiqiza okuphindaphindiwe, kufaka phakathi ama-Rogers–FR-4 hybrid stackups, i-controlled impedance, i-plated ngokusebenzisa izimbobo, izindawo ezikhethiwe ze-solder-mask kanye nokuhlanganiswa kwe-PCB okuzikhethela. I-Highleap Electronics isiza amaqembu obunjiniyela kanye nokuthola ulwazi ukuthi anqume ukuthi ukuthuthukiswa kufanelekile yini nokuthi i-stackup ekhishwe ingakhiwa ngokuphindaphindiwe.

Ububanzi bezinto ezibonakalayo: Leli khasi liphathelene nokwakhiwa kwe-PCB kusetshenziswa izinto ezishiwo yiRogers. I-Highleap Electronics ikhiqiza ibhodi eliqediwe kanye ne-PCBA; ukukhiqizwa kwe-laminate kanye nokuthengiswa kwezinto ezibonakalayo kungaphandle kobubanzi besevisi yethu.

Kufanele Bashintshe Nini Onjiniyela Basuke Ku-FR-4 Baye Ku-RO4003C PCB?

Isizathu esinamandla kakhulu sokusuka ku-FR-4 akusikho ukuphindaphinda ngokwako. I-RF trace emfushane nebekezelayo ingasebenza ekwakhiweni kwe-FR-4 okuchazwe ngokucophelela, kuyilapho isihlungi se-narrowband noma inethiwekhi yokuphakelayo ehambisana nesigaba ingadinga i-laminate elawulwayo ngemvamisa ephansi. Isinqumo kufanele siboshwe kumkhawulo kagesi onyamalala lapho ubukhulu be-dielectric, i-Dk, iphrofayili yethusi kanye ne-etch geometry kuhluka phakathi kwamaphaneli kanye nezindawo zokukhiqiza.

Yini okumele ihlale ihambisana nemodeli ye-RF?

URogers ushicilela izinqubo kanye namanani e-dielectric e-RO4003C, kodwa imodeli yokukhiqiza isancike ekujikeni kwe-laminate okuqondile, i-copper foil, i-copper yokugcina, ukuphela kwendawo kanye nesimo se-solder-mask yendawo. Ikhotheshini echaza kuphela i-"RO4003C" ishiya isikhala esiningi sokuhumusha. Umdwebo wokwenziwa kufanele ukhombe isikhala se-dielectric esiqediwe ngaphansi kwemigqa ye-RF elawulwayo futhi usho ukuthi ububanzi bomugqa noma i-impedance yiwona yini umgomo wokwamukelwa olawulayo. I-Highleap ibuyekeza ukuguquka phakathi kwamasethi ezinto ngaphambi kwe-lamination. Okuqukethwe kwe-resin, ukujiya kwe-dielectric okuqediwe, ukubhaliswa kanye nebhalansi yethusi konke kuthinta i-geometry ye-multilayer eqediwe, ngakho-ke i-hybrid stack kufanele ikhishwe njengokwakhiwa okukodwa. Amanani empahla yezinto ezibonakalayo aqondile kufanele ahlolwe ngokumelene nemibhalo yamanje yomhlinzeki webanga elicacisiwe kanye nokwakhiwa.

Ukungalungi kwethusi kudinga ukunakwa okukhethekile. Uma ukulahlekelwa kwe-dielectric sekunciphile, ukulahlekelwa komqhubi kungadla ingxenye enkulu yesabelomali. Iphrofayili yefoyili esetshenziswa ekulingiseni kufanele ifane nokwakhiwa kwezentengiselwano okuzothengwa. Kuma-filters amancane noma ama-couplers, ukuma komugqa oqediwe kanye negebe kungabalulekile kunekhuphoni ejwayelekile engu-50-ohm, ngakho-ke ubukhulu obubalulekile kufanele buphawulwe ngokucacile.

Ukuze uthole ulwazi oluthe xaxa mayelana nokuthi ukwakhiwa okuxubile kufaneleke nini, bheka umhlahlandlela we-Highleap wezinto ze-FR-4 kanye ne-Rogers PCB . Isinqumo kufanele senziwe ngaphambi kokuba umzila uqandiswe, ngoba ukuhambisa ungqimba lwe-RF kamuva kungashintsha i-impedance, ukuxhuma kanye ne-geometry.

Indlela i-Highleap Ekhiqiza Ngayo i-RO4003C Hybrid Stackup PCB

I-hybrid multilayer akuyona nje ishidi le-RO4003C elicindezelwe ebhodini le-FR-4. Ukwakhiwa okukhishwe kumele kubhekele ukugeleza kwe-resin, ukusatshalaliswa kwethusi, ukuziphatha kokulungisa, ukunyakaza kobukhulu kanye nendawo yezindiza zokubhekisela ze-RF. Emaphrojekthini amaningi, indlela ezinzile kakhulu ukubeka i-RO4003C core lapho ubukhulu bayo obulawulwayo be-dielectric busekela ngqo ungqimba lwe-RF, kuyilapho izingqimba zokubopha nezesekelo zikhethwa ukuze kuhlangatshezwane nesidingo sobukhulu bebhodi kanye nokuthembeka okuphelele.

I-hybrid lamination kanye nezinqumo zokwakha ezilandelanayo

Eminye imiklamo ingaqedwa ngomjikelezo owodwa we-lamination; eminye idinga i-lamination elandelanayo ngenxa yama-vias angaboni, izakhiwo ezifihliwe noma ama-subassemblies ahlukene e-RF. I-lamination elandelanayo yengeza ukubhaliswa kanye nokuvezwa kokushisa okuqongelelekayo. Kufanele isetshenziswe kuphela lapho ukwakheka kwe-interconnect kudinga khona. I-Highleap ibuyekeza ibhalansi yethusi, ukugcwalisa i-bondply, ukulandelana kokucindezela, ama-drill spans kanye nobukhulu bokugcina ngaphambi kokuba i-stackup ibuyiselwe ukuze ivunywe.

Ukubhalisa kubaluleke kakhulu uma i-RF core encane ifakwa ngaphakathi kwebhodi elinezingqimba eziphakeme. Isinxephezelo sokunwebeka kwezingqimba zangaphakathi, ukuhlelwa kwezithombe kanye nedatha yomzila kumele kuhlanganiswe. Okufanayo kusebenza ezimbobeni ezifakwe ipulasitiki: imbobo idlula ezintweni ezinesimo esihlukile somshini, ngakho-ke ikhwalithi yokubhoboza, ukulungiswa kwembobo nodonga kanye nobukhulu bethusi kudingeka kuhlolwe njengokuxhumana okuphelele.

Ukubuyekezwa kwenqubo ye- lamination ye-PCB ye-hybrid ye-Highleap kuyasiza lapho ibhodi lihlanganisa i-RF laminate, i-FR-4 ejwayelekile, i-metal backing, imigodi noma imijikelezo eminingi yokucindezela. Kumigqa yokudlulisa elawulwayo, i-stackup nayo ihlolwa ngokuhambisana nezidingo ze-impedance elawulwayo yephrojekthi kunokuphathwa njengokwakhiwa kwekhathalogi.

Isibonelo esisebenzayo sebhodi elihlanganisiwe

Cabanga ngemojuli yokuxhumana ene-front end ye-RF, ukulawula kwedijithali, ukuguqulwa kwamandla kanye nezixhumi zebhodi kuya ebhodini. Ukwakhiwa okugcwele kwe-RO4003C kungangeza izindleko ezingadingekile futhi kunciphise ukwakhiwa kwangaphambili okutholakalayo. Umklamo ohlanganisiwe ungagcina i-RO4003C yezendlalelo zokufanisa ze-antenna, isihlungi kanye ne-amplifier ngenkathi kusetshenziswa uhlelo lwe-high-Tg FR-4 lwezingxenye zedijithali nezamandla. Umphumela ungaba izindleko ezincane zezinto ngaphandle kokuhambisa izindiza ezibalulekile zokubhekisela ze-RF. Kumadizayini azwela izindleko, ukushintshana kwesicelo se-RO4003C kanye ne-FR-4 kungasiza ekunqumeni ukuthi imfuneko ye-RF iyaluthethelela uhlelo oluhlukile lwezinto.

Ukushintshana kuyinkimbinkimbi yokukhiqiza. Iphakheji yobunjiniyela kumele ichaze ukuthi yiziphi izendlalelo ezibaluleke kakhulu ngogesi, yiziphi izikhala ze-dielectric ezingenakulungiswa kanye nalapho ukushintshwa kungavunyelwe khona. Uma ubukhulu obuphelele noma ukusatshalaliswa kwethusi kushintsha, i-geometry ye-RF kungadingeka ibalwe kabusha esikhundleni sokumane ulinganise ibhodi.

I-RO4003C PCB Prototype kanye Nokucatshangelwa Kokukhiqiza

Ubuningi beprototype bubalulekile uma impendulo kagesi incike ezinguqukweni eziningana zokukhiqiza ngesikhathi esisodwa. Isihloko sokuqala esiwusizo senza okungaphezu kokuqinisekisa ukuqhubeka. Sihlobanisa ubukhulu be-dielectric obuqediwe, ububanzi bomugqa, i-impedance noma amapharamitha e-S, ikhwalithi yembobo ehlanganisiwe kanye nokuziphatha kwe-RF okuhlanganisiwe. Lokhu kuvumela ithimba lokuklama ukuhlukanisa inkinga yemodeli ye-laminate kumphumela we-etch, launch, housing noma assembly.

Yini okufanele ibukezwe ngaphambi kokukhishwa komkhiqizo?

Esikhundleni sohlu lokuhlola olujwayelekile lwe-RFQ, i-Highleap isebenzisa isibuyekezo sobunjiniyela esigxile ezinguqulweni ezimbalwa ezikwazi ukushintsha impendulo ekhishwe. Okufakwayo okuvamile yi-Gerber noma i-ODB++, i-stackup, i-callout yezinto zokwakha nezethusi, ithebula le-impedance, ubukhulu be-RF obubalulekile, izidingo zokuqeda ubuso, ukugcinwa kwe-solder-mask, idatha yokubhoboza, ubuningi kanye nanoma yikuphi ukuhlolwa kwe-RF okudingekayo noma komshini.

Amabhodi e-RO4003C anganikezwa njengama-PCB angenalutho noma athuthelwe ekutholeni izingxenye, ekuhlanganisweni kwe-SMT, ekuhlanganisweni kwemigodi edlula kanye nokuhlolwa okusebenzayo noma kwe-RF lapho kuchazwa khona izinto ezidingekayo kanye nemikhawulo. Kumaphrojekthi adinga ukwakhiwa okuphelele, izinsizakalo zokuhlanganiswa kwe-PCB ze-Highleap zingahlanganiswa nezinto ezifanayo kanye nokubuyekezwa kwe-stackup okusetshenziselwa ukwenziwa.

Isikhathi sokulethwa sincike ekujikeni okuqondile kwe-laminate, ukwakhiwa kwethusi, umzila wokucindezela we-hybrid kanye nobuningi. Ukukhiqizwa kwe-prototype prototype kungenzeka ngemuva kokutholakala kwezinto kanye nephakheji yokukhiqiza sekuqinisekisiwe. Ama-oda aphindaphindwayo azuza ekushintsheni kwezinto eziqandisiwe, idatha ye-stackup egciniwe kanye namarekhodi okukhiqiza asekelwe eningini.

Imibuzo evamile yesinqumo

Ingabe i-RO4003C ingathatha indawo ye-FR-4 ngaphandle kokushintsha ukwakheka? Ngokuvamile akunjalo. I-Dk, isikhala se-dielectric kanye nokuqagela kwethusi kuyahluka, ngakho-ke ububanzi bemigqa kanye nezakhiwo ze-resonant kufanele kubalwe kabusha.

Ingabe isendlalelo esisodwa noma ezimbili kuphela zingasebenzisa i-RO4003C? Yebo, ukwakhiwa kwe-hybrid kuvame ukuba wusizo, kodwa ukubopha, ukubhaliswa kanye nokuthembeka kumele kuqinisekiswe njengesitaki esisodwa.

Ingabe ikhuphoni ejwayelekile ye-impedance yanele? Ingase yanele imigqa yokudlulisa, kodwa izihlungi, ama-couplers nama-antenna zivame ukudinga ubukhulu obuqediwe noma ukuhlangana kwe-RF-response. Ukuze uthole isilinganiso esihlanganisiwe, thumela i-stack egcwele yezendlalelo, izindawo zezinto, izinsimbi zethusi, ubukhulu bethagethi, izidingo ze-impedance kanye nobuningi. Lokhu kugwema ukucaphuna isigaba se-RF kanye nesigaba se-FR4 njengezakhiwo ezingahlobene.