Umkhiqizi we-PCB weSeva Yesitoreji Sebhizinisi

I-Highleap Electronics ingumkhiqizi we-PCB weseva yokugcina ama-OEM esitoreji sebhizinisi, ama-ODM e-hyperscaler, abahlinzeki besitoreji samafu, kanye nabakhi besistimu yokugcina emphethweni. Iphothifoliyo yethu ihlanganisa amabhodi amakhulu eseva yokugcina (i-single-controller, i-dual-controller esebenzayo/esebenzayo, ama-scale-out storage cluster nodes), ama-backplane e-NVMe ama-PCIe Gen4 kanye nama-hot-swap drive e-Gen5 (U.2, U.3, E1.S, E3.S), ama-backplane e-SAS kanye nama-SAS expanders e-chassis ye-hybrid kanye ne-bulk-storage, amabhodi e-carrier e-HBA kanye nama-NVMe switch carriers , amabhodi e-carrier e-RAID controller , amabhodi e-NVMe-oF host kanye nama-adapter target , kanye nesethi ephelele yamabhodi okuphatha kanye nengqalasizinda ngaphakathi kwe-chassis yesitoreji yesimanje. Amabhodi akhelwe ku -IPC-A-600 Class 2 standard enokwamukelwa kwe -Class 3 etholakalayo , aqinisekiswe ku- IATF 16949 , afanelekela i-Tier-1 storage OEM AVL , ngokulawula ushintsho okubhaliwe kanye nezinhlelo zokulethwa okuhleliwe ezisekela amapulatifomu okugcina eminyaka eminingi.

Okuqukethwe

1. Lokho Okudingwa Ama-OEM Eseva Yesitoreji Kumkhiqizi We-PCB
2. Ukwakhiwa Kwebhodi Elikhulu Leseva Yesitoreji — I-Node Eyodwa, Elawula Kabili, Ekhipha Izikali
3. Ukukhiqizwa Kwe-NVMe Backplane — Gen4, Gen5, U.2/U.3/EDSFF
4. I-SAS Backplanes, Expanders kanye ne-Hybrid Drive Chassis Buildings
5. Ukukhiqiza iBhodi Yezithwali ze-HBA, RAID kanye ne-NVMe Switch
6. Ukwakhiwa kweBhodi le-NVMe-oF Host & Target Adapter
7. Ukubandakanya i-Highleap njengomkhiqizi we-PCB yeseva yakho yokugcina izinto

1. Lokho Okudingwa yi-OEMs Storage Server kumkhiqizi we-PCB

Izinhlelo zeseva yokugcina zisebenza ngokwezomnotho ezahlukene kuneseva yokubala. Amavolumu ngokuvamile aphezulu ngepulatifomu ngayinye (umugqa womkhiqizo wokugcina owodwa ungathumela amayunithi angaphezu kuka-50,000 ngonyaka kuzo zonke iziteshi ze-hyperscaler kanye nezamabhizini); imijikelezo yokuphila komkhiqizo mide (iminyaka engu-5-7 emakethe ivamile); izingxenye ezisele kanye nokusekelwa kwamayunithi angashintshwa ensimini kunwebeka iminyaka engu-7-10 ngaphezu kokuphela kokukhiqiza. Umkhiqizi we-PCB osekela uhlelo lokugcina uzibophezele kulezo zikhathi zesikhathi. Sihlinzeka kuyo yonke iphothifoliyo yeseva yokugcina ngaphansi kokugeleza kwekhwalithi okufanayo okunika amandla izinhlelo zethu zokukhiqiza ze-PCB zeseva ebanzi.

Izidingo zeqembu lobunjiniyela

• Ubambiswano lokuklama i-backplane ye-NVMe: ukuhlanganiswa kwesixhumi esishintshashintshayo, umzila wokuvimbela okulawulwayo kusukela ku-drive bay kuya kusilawuli, ama-vias abhobozwe emuva okulawula i-stub ye-Gen5 NVMe.
• Ukuhlanganiswa kwe-DFM ye-Dense drive: Ama-drive bay angu-24, 36, 60, ngisho angu-90 nge-chassis ye-4U — indawo ye-backplane PCB incane uma kuqhathaniswa nesixhumi kanye nobuningi be-routing obudingekayo.
• Isibuyekezo sokwakheka kwe-SAS expander: ama-expander anenani elikhulu lama-port (ama-port angu-24 kuya kwangu-36 nge-chip ngayinye) adinga ukuhanjiswa ngokucophelela ukuze kugcinwe ubuqotho besiginali ye-SAS ku-12/22.5 Gbps.
• Ithusi elinzima lokusabalalisa amandla eshasi lokugcina: Amadrayivu angaphezu kuka-60 adonsa ama-W angu-600+ uma engasebenzi, amaningi kakhulu ngaphansi komsebenzi oqhubekayo; izindiza zamandla ze-backplane zidinga ithusi elingu-2-3 oz ezingqimbeni ezizinikele ngaphakathi I-PCB ye-multilayer ukuqoqwa kwempahla.
• Imibhalo yokushintshaniswa kwezinto: Imijikelezo emide yempilo yomkhiqizo isho ukuthi kuzokwenzeka izehlakalo ze-EOL ezibonakalayo; izindlela zokufaka esikhundleni ezibhalwe phansi zibalulekile.

Izidingo zethimba lokuthenga

• Ukuzibophezela kokuhlinzeka ngeminyaka eminingi: Amapulatifomu okugcina impahla athunyelwa iminyaka emi-3-5; amanye ama-spare ship athunyelwa eminye iminyaka emi-5-7.
• Umthamo oqhutshwa ukubikezela: Isidingo sesitoreji se-hyperscaler singakhuphuka ngo-5-10× ngekota epulatifomu entsha; ukwabiwa kwamandla uma kuqhathaniswa nokubikezela okujikelezayo kubalulekile.
• Iziqu ze-AVL ezigabeni eziningi: Ama-OEM esitoreji se-Tier-1, abalingani be-ODM abaphezulu, kanye nabahlanganisi bamakhasimende bokugcina bonke bangase babe nama-AVL ahlukene.
• Ukucaca kwezindleko ezingeni le-PCB: izinto zokwakha, isisindo sethusi, inani lezingqimba, kanye nokufakwa kwamaphaneli konke kuthinta izindleko zamayunithi; ukuhlaziywa kwezinga le-BOM okusobala kusekela imizamo yokwehlisa izindleko.
• Ukuthengwa kwesixhumi esishintshashintshayo: Ezinye izinhlelo zithenga izixhumi ze-SAS noma ze-NVMe njengezinto ezithunyelwe; umhlinzeki uphatha ukuhlanganiswa ngaphandle kokuthatha ubunikazi bezinto.
• Imibhalo yokuthobela imithetho ye-EMC: Imikhiqizo yokugcina idlula ku-FCC, CE, kanye nokuhlolwa okulawulwayo; ukwakheka kwe-PCB kanye nokuvumelana kokwenziwa kwayo kusekela ukuphumelela ekuhlolweni kokuqala.

Ukuhambisana nohlelo kanye nokulungiswa kwekhwalithi

• Isitifiketi se-IATF 16949: isisekelo sabahlinzeki be-PCB bezinga lezimboni.
• I-ISO 9001: isisekelo sesistimu yekhwalithi yomhlaba wonke.
• Ukuqashelwa kwe-UL: yemikhiqizo yokugcina edinga isitifiketi sokuphepha.
• Ukusekelwa kokuhlukaniswa kwe-ECCN: kwemikhiqizo yokugcina elawulwa ukuthunyelwa kwamanye amazwe ekhonza izimakethe zikahulumeni, eziseduze nezokuvikela, noma ezingqalasizinda ezibalulekile.
• Ukubika ngezimbiwa ezingqubuzanayo: Ukuhambisana nesigaba 1502 nokubika okubhaliwe kwabaphakeli besigaba esingaphansi.

2. Ukwakhiwa Kwebhodi Elikhulu Leseva Yesitoreji — I-Node Eyodwa, Elawulwa Kabili, Enesilinganiso Sokuphuma

Amabhodi amakhulu eseva yesitoreji ahlanganisa ububanzi obubanzi bezakhiwo kunebhodi elikhulu leseva yokubala. Amaphethini amakhulu esiwakhayo:

Amabhodi amakhulu esilawuli esisodwa (ukungena kanye nesitoreji se-SMB)

• I-Architecture: isokhethi elilodwa le-CPU (noma i-SoC elilodwa) elinamathiselwe ngqo ku-drive backplane kanye ne-interface yenethiwekhi yomsingathi.
• Izinketho ze-CPU: I-Intel Atom yokungena; I-Intel Xeon-D, i-AMD Ryzen Ifakwe kwimikhiqizo yokungena esebenza kahle kakhulu.
• Isibalo sesendlalelo: Izingqimba ezingu-8-12 ezijwayelekile.
• I / O: Amachweba angu-2-4 GbE, i-USB 3.x yekhonsoli yokuphatha, i-PCIe slot yokwandisa i-HBA.
• Volume: isitoreji se-SMB esiphezulu kanye ne-prosumer; umklamo we-PCB ongabizi kakhulu.
• Material: I-370HR noma i-IS410 kuye ngokuthi izindleko zihloselwe ini; i-FR408HR uma kudingeka i-PCIe yezinga eliphezulu.

Amabhodi amakhulu asebenzayo/asebenzayo alawula kabili (ama-array esitoreji sebhizinisi)

• I-Architecture: izilawuli ezimbili zesitoreji ku-chassis efanayo enokufinyelela okwabiwe kwe-backplane; ukuhluleka kanye nokulinganisela umthwalo ngaphakathi kwe-array.
• Inani lesendlalelo ngasinye sesilawuli: ngokuvamile izendlalelo ezingu-12-18.
• Isixhumanisi se-Inter-controller: isixhumanisi sesivinini esikhulu phakathi kwabalawuli (i-PCIe Gen4/Gen5, i-NTB, noma ngokwezifiso) ukuze kube nokuvumelana kwe-cache kanye nokuvumelanisa isimo sokuhluleka.
• Isixhumi esibonakalayo se-backplane esabiwe: Womabili abalawuli afinyelela kuwo wonke amadrayivu ngezindlela ze-SAS noma ze-NVMe ezingafuneki.
• Ukusekelwa kwe-cache esekelwa yibhethri: indawo yokusebenza kanye nekagesi ye-BBU noma i-supercapacitor cache backup.
• Ukwethembeka: Ukwamukelwa okuvamile kwe-IPC Class 3; ukuthengwa okuthembekile kakhulu kwama-capacitor, izixhumi, nezinye izingxenye.

Amabhodi amakhulu e-node yesitoreji esikaliwe (isitoreji esisatshalalisiwe)

• I-Architecture: ibhodi elikhulu leseva elibamba isitaki sesofthiwe yokugcina (i-Ceph, i-MinIO, i-Lustre, i-GlusterFS, isitaki se-hyperscaler esenziwe ngokwezifiso) esine-NVMe yendawo enamathiselwe kanye ne-interface yenethiwekhi ye-bandwidth ephezulu.
• Izinketho ze-CPU: Amaprosesa e-Xeon, EPYC, ARM HPC anesokhethi elilodwa noma amabili.
• Isibalo sesendlalelo: Izendlalelo ezingu-12-20.
• Ukuxhumana kwenethiwekhi: I-100G noma i-200G NIC yethrafikhi yesitoreji; eminye imiklamo ye-hyperscaler ifaka i-400G.
• Amadrayivu e-NVMe: ngaphakathi kwebhodi i-M.2 kanye namadrayivu e-U.2 noma e-EDSFF angaphambili.
• Ukufakwa okuvamile: isitoreji sezinto eziningi se-hyperscaler, isitoreji esichazwe yisofthiwe yebhizinisi, izisekelo zesitoreji samafu zomphakathi.

I-JBOF (iqembu nje le-flash) kanye namaseva e-NVMe aminyene

• I-Architecture: izivikelo ze-NVMe ezixinene kakhulu ezine-compute yendawo encane; i-NVMe-oF target yabalawuli abanamathiselwe bangaphandle.
• Inani lamadrayivu: Amadrayivu e-NVMe angu-24, 36, 60, noma ngisho angu-90+ ngeshasi ngayinye.
• Indima yebhodi eliyinhloko: Iswishi ye-NVMe kanye nokuphathwa; isilawuli sikhishwe ku-JBOF.
• Inethiwekhi: I-interface ye-100/200/400G Ethernet noma i-InfiniBand NVMe-oF.
• Ubunzima be-PCB: I-backplane iyi-PCB eyinkimbinkimbi kakhulu ohlelweni; i-mainboard ilula kakhulu.

Ukwenziwa kwebhodi elikhulu le-JBOD (nje-iqembu lamadiski)

• Ibhodi enkulu yokwandisa i-SAS: ngokuvamile izendlalelo ezingu-6-10 ezine-chip ye-SAS expander (uchungechunge lwe-Broadcom SAS3xxx) kanye nezixhumi ze-SAS kuma-host angaphandle.
• Ukusekelwa kwe-Drive bay: Ama-drive bay angu-24, 60, noma angu-90 angu-3.5″ noma angu-2.5″ ku-chassis engu-4U noma engu-5U.
• Ukuphathwa kwamandla nokupholisa: ukupholisa okusatshalalisiwe kanye nokuqapha amandla kuyo yonke i-chassis.

3. Ukukhiqizwa Kwe-NVMe Backplane — Gen4, Gen5, U.2/U.3/EDSFF

Ukwakhiwa kanye nokwakhiwa kwe-PCB ye-backplane ye-NVMe kungenye yezindawo ezidinga kakhulu kwihadiwe yeseva yokugcina. Ubuningi be-drive, ukuthembeka kwe-hot-swap, kanye ne-speed signaling konke kuhlangana ku-backplane.

Ukwenziwa kwe-backplane ye-PCIe Gen5 NVMe

• Izinga lokubonisa: Ama-32 GT/s ngomzila ngamunye; Ama-drive anemizila emi-4 ajwayelekile, anemizila eyi-8 kuma-drive ebhizinisi.
• Ukuphazamiseka komehluko: 85Ω ±5% kuma-critical traces.
• Ubude bokulandelela: Imigqa ye-backplane kusukela kusixhumi sedrayivu kuya ku-host/switch ngokuvamile ingamasentimitha angu-2-8; isabelomali sokulahlekelwa okuncane ku-16 GHz Nyquist.
• Material: I-I-Tera MT40 iyamukeleka kumashaneli amafushane e-Gen5; I-Tachyon 100G inconywa kuma-backplanes anezimbobo eziningi noma ama-backplanes alandela umkhondo omude.
• Ukubhoboza ngemuva: okuphoqelekile kuma-via esignali ye-Gen5; ukubhoboza emuva kuya ku-≤8 mil i-stub esele.
• Isibalo sesendlalelo: Izendlalelo ezingu-12-20 kuye ngokuthi idrayivu ingakanani.

Ukwenziwa kwe-backplane ye-PCIe Gen4 NVMe

• Izinga lokubonisa: 16 GT/s ngomzila ngamunye.
• Ukuphazamiseka komehluko: 85Ω ± 10% ejwayelekile.
• Material: I-FR408HR noma i-I-Tera MT40 kuye ngobude bomkhondo kanye nobuningi.
• Ukubhoboza ngemuva: ukubekezelelana okunconywayo kodwa okukhululekile kuyamukeleka kuneGen5.
• Isibalo sesendlalelo: Izingqimba ezingu-10-16 ezijwayelekile.

Ukwakhiwa kweplane yangemuva ye-U.2 ne-U.3

• Isixhumi se-SFF-8639: isixhumi se-U.2/U.3 sisekela i-SAS, i-SATA, kanye ne-NVMe ngendlela efanayo.
• Isici sefomu lokushayela: Ubukhulu obungu-2.5″ × 15mm noma 7mm; usayizi ojwayelekile we-server bay.
• Ukucushwa okujwayelekile: Amaseva angu-12-bay 2U, amaseva angu-24-bay 2U, amaseva angu-36-bay 4U.
• Ukuhlanganiswa kwesixhumi esishintshashintshayo: indawo yokuxhuma ngokunemba enokumelana okungu-±0.10 mm ukuze kube nokuthembeka kwe-blind-mate.

Ukwakhiwa kweplane yangemuva ye-E1.S kanye ne-E3.S EDSFF

• I-E1.S (eyayikade i-E1): isici somuthi werula samadrayivu okulayisha ngaphambili; izinketho zobukhulu obungu-5.9 mm, 9.5 mm, 15 mm, 25 mm.
• I-E3.S: I-SSD form factor phakathi kwe-U.2 kanye nerula, ukusetshenziswa okubanzi ngo-2024-2025.
• Inzuzo yobuningi: I-EDSFF ivumela inani eliphezulu lokushayela nge-chassis ngayinye kune-U.2.
• Izinto okufanele uzicabangele ngemuva: iphimbo lokuxhuma idrayivu nezikulufo zokufaka isakhiwo se-backplane yedrayivu; imininingwane ejwayelekile ye-SFF.
• Abashayeli bevolumu: imiklamo ye-hyperscaler (i-EDSFF yayiqhutshwa kakhulu yizidingo ze-hyperscaler) manje isisabalala iye emikhiqizweni ye-OEM yebhizinisi.

Ukugeleza kwekhwalithi yokwenziwa kwe-backplane

• Ukuqinisekiswa kwesikhundla sesixhumi: Ukulinganiswa kwe-CMM esihlokweni sokuqala esiqinisekisa indawo yesixhumi se-SFF-spec.
• Ukuqinisekiswa kwe-Impedance: Ikhuphoni le-TDR ngephaneli ngayinye ukuthola ukulandelwa kwe-control-impedance.
• Ukuhlolwa kokufakwa kwe-Hot-swap: ukuhlolwa komjikelezo wokuzalana kumasampula amele.
• Ukuqinisekiswa komthamo wamanje wendiza yamandla: ingxenye encane eqinisekisa ukujiya kwethusi ezindizeni zamandla.

4. Izindiza ze-SAS Backplanes, Expanders kanye ne-Hybrid Drive Chassis Buildings

I-SAS isalokhu iyisixhumi esibonakalayo esiyinhloko endaweni yokugcina izinto eziningi kanye ne-chassis yokugcina izinto ezixubile lapho izindleko ze-NVMe kanye nokusetshenziswa kwamandla kungaqinisekisiwe. I-SAS-12 (12 Gb/s) kanye ne-SAS-22.5 (22.5 Gb/s, SAS-4) zamanje; i-SAS-3 (12 Gb/s) itholakala yonke indawo ekukhiqizweni.

Ukwenziwa kwe-SAS-12 backplane

• Izinga lokubonisa: 12 Gb/s nge-port ngayinye.
• Ukuphazamiseka komehluko: Inhloso engu-100Ω ±10%.
• Material: I-FR408HR noma i-370HR yama-backplanes ahamba nge-short-trace; I-Tera MT40 yomzila webanga elide.
• Ukusekelwa kweDrayivu: I-SATA, i-SAS, ne-SAS ezifakwe ama-port amabili zonke zisekelwa ku-backplane efanayo.
• Isibalo sesendlalelo: Izingqimba ezingu-8-14 ezijwayelekile.

Ukwenziwa kwe-SAS-22.5 (SAS-4) backplane

• Izinga lokubonisa: 22.5 Gb/s nge-port ngayinye.
• Material: I-I-Tera MT40 noma i-FR408HR yeziteshi ezinde; i-370HR ingamukeleka yeziteshi ezimfushane.
• Ukubhoboza ngemuva: Kunconywa kuma-via esignali abalulekile.
• Volume: kuvela endaweni yokugcina impahla yebhizinisi ka-2024-2025; iyaqhubeka kuze kube ngu-2026-2027.

Ukwenziwa kwebhodi lokwandisa i-SAS

• Ama-expander chips: I-Broadcom SAS35x40 (amachweba angu-40), i-SAS35x36 (amachweba angu-36), kanye nemikhiqizo efanayo ye-Microchip.
• Isibalo sesendlalelo: Izendlalelo eziyi-10-14 kuye ngokuthi ingakanani imbobo kanye nobuningi bomzila.
• Isicelo: I-chassis yokugcina enama-bay angu-24, ama-bay angu-36, ama-bay angu-60, nama-bay angu-90 ene-expander eyodwa ngendawo ngayinye noma imiklamo ye-expander ehlukahlukene esatshalaliswe.
• Ukwethembeka: Ukwehluleka kwe-expander kuthinta wonke ama-drive anamathiselwe; ukutholakala okuthembekile kakhulu kwama-capacitor kanye nezixhumi.

Ukwenziwa kwe-backplane ye-hybrid (SAS + NVMe)

• I-Architecture: Amanye ama-drive bay asekela ama-drive e-SAS kanye ne-NVMe nge-SFF-8639 universal connector.
• Ukuhlonza idrayivu: I-backplane kanye nesilawuli zibona uhlobo lokushayela kanye nezimpawu zomzila ngendlela efanele.
• Ubuningi bomzila: zombili izinqubo ezithunyelwa ku-bay drive ngayinye zibalwa ngaphezu kwemiklamo ye-single-protocol.
• Ukukhetha okubalulekile: Izidingo zomzila we-NVMe zibusa ekukhethweni kwezinto zokwakha izindiza ezihlanganisiwe.

Amabhodi ekhebula angaphandle e-SAS / mini-SAS HD

• Ishasi ye-JBOD yangaphandle: i-mini-SAS HD (SFF-8644) noma ikhebula elisebenzayo le-SAS-4 lama-drive enclosures angaphandle.
• Ukwenziwa kwebhodi lekhebula: amabhodi amancane anemvamisa ephezulu afaka izixhumi zangaphandle ezine-interface elawulwayo-impedance kusilawuli sesitoreji sangaphakathi.

5. Ukukhiqiza iBhodi Yokuthwala ye-HBA, RAID kanye ne-NVMe Switch

I-logic yesilawuli sesitoreji — ama-adapter ebhasi lomsingathi, abalawuli be-RAID, kanye nokushintsha kwendwangu ye-NVMe — kusetshenziswa kumakhadi anikezelwe noma kuhlanganiswe kumabhodi amakhulu eseva yesitoreji. Sakha kokubili izithwali ezizimele kanye nemiklamo yamabhodi amakhulu ehlanganisiwe.

Ukwenziwa kwebhodi labathwali be-SAS HBA

• Ama-chips avamile: I-Broadcom MegaRAID, i-Adaptec SmartRAID, i-Microchip SmartIOC.
• Isici sefomu: ikhadi le-PCIe slot elijwayelekile elinezixhumi zangaphandle ze-mini-SAS HD.
• Isibalo sesendlalelo: Izendlalelo ezingu-8-12.
• Material: FR408HR noma 370HR.
• Volume: amakhadi anomthamo omkhulu athunyelwa emikhiqizweni yokugcina impahla yebhizinisi.

Ukwenziwa kwe-NVMe HBA / NVMe switch carrier

• Ama-chips avamile: I-Microchip PM8536 SmartIOC, indwangu yokushintsha ye-Broadcom NVMe, izilawuli ze-NVMe ze-hyperscaler ezenziwe ngokwezifiso.
• umsebenzi: ukuhlanganisa amadrayivu amaningi e-NVMe ngemuva koxhumano olulodwa lwe-PCIe lomsingathi.
• Umzila we-PCIe Gen4/Gen5: ukuvimbela okulawulwayo, ukubhoboza emuva kuma-via abalulekile e-Gen5.
• Isibalo sesendlalelo: Izendlalelo ezingu-10-14.
• Material: I-I-Tera MT40 ejwayelekile.

Ukwenziwa kwenkampani yokuphatha isilawuli se-RAID sehadiwe

• Amaprosesa e-RAID-on-chip (RoC): Uchungechunge lwe-Broadcom MegaRAID 9xxx, uchungechunge lwe-Adaptec SmartRAID 3xxx.
• Inkumbulo ye-cache: i-cache ye-DDR4 enikezelwe ku-carrier; i-cache backup nge-supercap noma i-BBU.
• Isici sefomu: ikhadi le-slot le-PCIe elijwayelekile; eminye imikhiqizo e-OCP NIC form factor.
• Isibalo sesendlalelo: Izendlalelo eziyi-10-14 ezinesakhiwo sesignali exubile.

Ukwenziwa kwamakhadi okugcina isitoreji e-OCP NIC 3.0

• Isici sefomu esijwayelekile: Izilawuli zesitoreji se-OCP NIC 3.0 mezzanine carrier hosting, ama-adapter e-NVMe-oF, noma iziqalisi zendwangu.
• Ikhono lokushintshana okushisayo: isekela ukulungiswa kabusha kwe-hot-swap kwamakhadi okugcina kumaseva asebenzayo.
• Umthamo kumiklamo ye-hyperscale: ngokuya ngokuba yisici esiyinhloko sabalawuli besitoreji se-hyperscaler.

6. Ukwakhiwa kweBhodi ye-NVMe-oF Host & Target Adapter

I-NVMe phezu kwezindwangu (NVMe-oF) ihlukanisa isitoreji se-NVMe kusuka kuseva yomsingathi, ivumela isitoreji esabiwe ekusebenzeni kwe-NVMe okuseduze nendawo. Ama-adapter e-NVMe-oF (kuma-JBOF nama-array esitoreji) kanye nama-adapter e-NVMe-oF omsingathi (kumaseva ekhompyutha) angumugqa womkhiqizo we-PCB okhulayo.

Ukwenziwa kwebhodi le-adapter ye-NVMe-oF

• umsebenzi: i-adaptha eseceleni kwesiqalisi eveza isitoreji se-NVMe-oF esikude njenge-NVMe yendawo kumphathi.
• Ukuxhumana kwenethiwekhi: I-Ethernet engu-25/100/200/400G noma i-InfiniBand.
• Ama-chips avamile: Ama-DPU e-NVIDIA BlueField (asebenza futhi njenge-NVMe-oF host ene-offload), i-Pensando DPU, i-Marvell Octeon, ama-ASIC enziwe ngokwezifiso.
• Isibalo sesendlalelo: Izendlalelo ezingu-14-18.
• Material: I-Tachyon 100G noma i-I-Tera MT40 kuye ngesilinganiso sokubonisa kanye nobude besiteshi.

Ukwenziwa kwebhodi le-adapter ye-NVMe-oF

• umsebenzi: i-adaptha eseceleni eliqondiwe eveza amadrayivu e-NVMe endawo njengezindawo zokugcina ze-NVMe-oF kunethiwekhi.
• I-Architecture: ngokuvamile kuhlanganiswe ne-JBOF mainboard noma isilawuli se-storage array.
• Ukuthuthukisa ukusebenza: I-ASIC noma i-FPGA-accelerated target ikhipha i-CPU.

I-RDMA ngaphezu kwe-Converged Ethernet (RoCE)

• Ukubusa kwe-RoCE v2: I-RoCE v2 iyindlela ehamba phambili yokuthutha i-NVMe-oF ekusetshenzisweni kwe-hyperscaler; ezinye izinhlelo zokusebenza zebhizinisi zisebenzisa i-FC-NVMe noma i-NVMe/TCP.
• Izidingo ze-NIC: Ama-NIC anamandla e-RDMA angama-100G noma ngaphezulu ayimfuneko yomsingathi.
• Indwangu ye-Ethernet engenakulahlekelwa: I-RoCE v2 idinga ukucushwa kwendwangu yenethiwekhi ngokucophelela; imikhiqizo yokugcina ye-OEM ivame ukufaka isiqondiso sokucushwa kwendwangu ngemikhiqizo yabo ye-NVMe-oF.

Amakhadi e-FC-NVMe (Fibre Channel NVMe-oF)

• Icala lokusebenzisa: Izindawo ze-Fibre Channel SAN ezikhona manje zithuthela ku-NVMe-oF ngaphezu kwe-FC.
• Amakhadi e-HBA: Ama-HBA e-32G FC kanye nama-64G FC asekela kokubili amaphrothokholi e-SCSI/FCP akudala kanye namaphrothokholi e-NVMe-oF anamuhla.
• Amaphethini okukhiqiza: ukwehla kwamavolumu amayunithi uma kuqhathaniswa ne-NVMe-oF esekelwe ku-RoCE, kodwa isidingo sebhizinisi esizinzile.

7. Ukubandakanya i-Highleap njengomkhiqizi we-PCB yeseva yakho yokugcina izinto

Kuma-OEM eseva yesitoreji, ama-ODM e-hyperscaler, kanye nabathengisi besilawuli sesitoreji abahlola ozakwethu bokukhiqiza be-PCB, imodeli yethu yokuzibandakanya iyahlukahluka ngobubanzi bohlelo:

Izinhlelo zebhodi elikhulu leseva yesitoreji

• Ukwakhiwa kwesibonelo: Imodeli yezingcezu ezingu-25-100 ekuguqulweni kwezinsuku ezingu-7-10 zokusebenza kwamabhodi amakhulu anezingqimba ezingu-12-18.
• Amasampula okufaneleka: Izingcezu ezingu-200-1000 ezinemibhalo ephelele yesitayela se-PPAP.
• Ukukhiqizwa kwe-pilot: ukuqaliswa kwevolumu yokuqala kuhambisana nokulungela ukuqaliswa kwamakhasimende.
• Ukukhiqizwa komthamo: ukulethwa okuhleliwe ngokumelene nokubikezela okuqhubekayo; umthamo ugodliwe ngokumelene nokubophezeleka.

Izinhlelo ze-Backplane

• Ukuqinisekiswa kwesihloko sokuqala ngomshini: Ukulinganiswa kwe-CMM okuqinisekisa indawo yesixhumi ngokwe-SFF spec.
• Ukuqinisekiswa kwento yokuqala kagesi: Ukuqinisekiswa kwe-TDR impedance ngokulandelela kwe-impedance elawulwayo.
• Isampula yokuthembeka kokushintshana okushisayo: ukuhlolwa komjikelezo wokuhlangana ezindaweni zokushayela ezimele.
• Ukuhlela ivolumu: Isidingo se-backplane sivame ukusebenza ngesilinganiso esinqunyiwe uma siqhathaniswa nenani le-drive bay; ukuhlela okusekelwe esibikezelweni kulula.

Izinhlelo ze-HBA, RAID, kanye ne-switch carrier

• Ukuhlanganiswa okuqinile kwe-DFM: Umklamo wereferensi yabathengisi be-ASIC ngokuvamile uyindawo yokuqala; sizivumelanisa nomklamo oqondene namakhasimende.
• Izici ezijwayelekile zefomu le-PCIe: kunciphisa ingozi yamathuluzi kanye nokwakhiwa kwawo.
• Ukulinganisa ivolumu: amakhadi enkampani avame ukuthunyelwa ngobuningi obukhulu kunamabhodi amakhulu; ukwabiwa kwamandla kuqalwa kuqala.

I-Highleap inesitifiketi se-ISO 9001 kanye ne-IATF 16949. Sakha ama-PCB eseva yokugcina kusukela ezingqimbeni ezine kuya kwezingu-24, sinekhono le-HDI lokuxhuma okuqinile okudingekayo eduze kwama-ASIC amakhulu e-NVMe switch, i-impedance elawulwayo efinyelela ku-±5% kuma-trace abalulekile e-Gen5, ithusi elisindayo elifinyelela ku-3-4 oz kuma-backplanes anamandla amakhulu, kanye nokumbozwa kokuphela kobuso be-PCB (i-ENIG, isiliva lokucwiliswa, i-OSP, i-HASL engenalo i-lead). Ukulethwa okusheshayo okujwayelekile kwama-prototypes eseva yokugcina kuyizinsuku zokusebenza ezi-5-8 zama-backplanes kanye nezinsuku zokusebenza ezi-7-10 zama-mainboard eseva yokugcina.

Thumela amafayela e-Gerber, idatha yokubhoboza, imininingwane ye-stackup, inani eliqondiwe, kanye nesikhathi sohlelo ngokusebenzisa ingosi yethu yesilinganiso esiku-inthanethi ukuze uthole impendulo yamahora angama-24. Ngezinhlelo eziyinkimbinkimbi — ukuhlinzekwa komndeni okunamabhodi amaningi kwamapulatifomu amasha okugcina, ukugeleza kwe-AVL okuqondene ne-hyperscaler, izinhlelo zokusekela umjikelezo wempilo ende — ithimba lethu lesitoreji lingaxhumana ngqo ukuze lixoxe ngobubanzi kanye nomthamo. Ukuze uthole ukwakhiwa kwe-backplane yesitoreji elungiselelwe izindleko lapho isignali ye-Gen4/Gen3 yanele, bheka ikhono lethu lokukhiqiza le-FR4 PCB.