Usekelo Lokukhiqiza Nokukhiqiza Okudumile lwe-Taconic TLX-0 PCB

Ukukhiqizwa kwe-Taconic TLX-0 PCB

I-Highleap Electronics ikhiqiza ama-PCB e-Taconic TLX-0 ama-oscillator, amamojula e-MMIC, amasekethe okuhlola ama-microwave, amabhodi okulawula i-RF kanye nokushintsha isevisi. Sisekela ukwenziwa kabusha kwe-prototype, ukuqhubeka kwevolumu ephansi, ukukhiqizwa okuphindaphindiwe, ukubuyiswa kwamafayela okulawulwayo, ukwenziwa kwe-RF, ukuhlanganiswa kwezixhumi kanye nokuhlolwa okuchazwe ngamakhasimende kusuka kudatha yamakhasimende egunyaziwe.

I-TLX-0 ayiphathwa njenge-laminate ejwayelekile yamanje. Ngaphambi kokuba intengo noma ukulethwa kukhishwe, i-Highleap iqinisekisa ukubuyekezwa komdwebo wokuqala, ukuhlonza izinto, ukujiya, ithusi, amadokhumenti atholakalayo kanye negunya lokufaka esikhundleni. Lokhu kuvikela imikhiqizo efakwe ezinsizeni ezingabhalisiwe noma izinguquko zejiyometri.

Izici Zezinto Eziyigugu ze-TLX-0 kanye Nokulawula Ukudweba

I-TLX-0 ivela emidwebweni emidala ye-Taconic RF, kodwa amathebula emikhiqizo ye-AGC amanje afaka i-TLX-8 esikhundleni se-TLX-0 njengomnikelo oyinhloko we-TLX. I-TLX-8 iyi-laminate ye-PTFE elukiwe ngengilazi ene-Dk 2.55 ± 0.04 eshicilelwe kanye ne-Df 0.0018; akuyona into efanayo noma ukwakhiwa okufanayo ne-TLX-0 ngokuzenzakalelayo.

Into yokulawula ifa Kungani kubalulekile Isenzo se-Highleap
Ubunikazi bezinto zokuqala Ilebula le-TLX elingakahleleki lingasusa ibanga eliqondile lomlando, ukujiya noma ithusi. Sebenzisa imidwebo elawulwayo, izitifiketi, amarekhodi okuthenga noma imvume yamakhasimende ukuze ukhulule lokho okuqukethwe.
Ubuciko be-RF kanye nesilinganiso Idatha yesithombe esidala noma i-Gerber ingafaka isinxephezelo esihlobene nenqubo yokuqala. Qhathanisa ukubuyekezwa kwedatha, amayunithi, ulwazi lwembobo, ubukhulu kanye namasampula aziwayo.
I-PTH kanye nokwakhiwa kwemishini Amamojula e-Oscillator/MMIC angancika emininingwaneni yesixhumi, imbobo kanye nesisekelo. Khipha imbobo, ukuqondisa, ukubopha kanye nokubekezelelana kwemishini ngaphambi kokusebenzisa amathuluzi.
Igunya lokufaka esikhundleni Ibanga le-TLX lamanje lingashintsha ubude bukagesi, ukulungiswa noma ukuhambisana. Caphuna ushintsho njengoshintsho olulawulwayo ngokuqinisekiswa okuchazwe yikhasimende.

Ukuze uthole umongo wamanje wezinto ezibonakalayo, bheka ikhasi lomkhiqizo elisemthethweni le-AGC TLX-8. I-Highleap isebenzisa uhlu lwayo lokuhlola lokubuyekezwa kwefayela le-Gerber ukuvala izikhala zedatha yefa ngaphambi kokukhiqizwa.

Ukusekelwa Kokukhiqiza Nokuqhubeka Kwe-Taconic TLX-0 PCB

I-Highleap isekela imiklamo ye-TLX-0 endala esetshenziswa kuma-oscillator, amasekethe okuhlola e-MMIC, amamojula we-microwave kanye neminye imikhiqizo ye-low-Dk RF. Singabuyekeza ukukhiqizwa kabusha kwebhodi elingenalutho, ukwakhiwa kabusha okulawulwayo, ukukhiqizwa kwensizakalo encane, ukwakhiwa kokufakwa esikhundleni kwe-NPI kanye nokuhlanganiswa okuphelele. Inhloso iwukulondoloza ukucushwa kukagesi nokwemishini okukhishwe, hhayi ukuhumusha kabusha umdwebo omdala ngaphandle kwemvume.

Ukusekelwa Kokukhiqiza Ama-PCB Akudala e-Highleap

Indawo yephrojekthi Ukusekelwa kwephrojekthi ye-Highleap
Ukuthola idatha Ukubuyekezwa kwe-Gerber elawulwayo, i-drill, imidwebo, uhlu lwe-netlists, ama-stackup kanye namarekhodi esampula anikezwe amakhasimende
Ukukhiqizwa okwakhelwe ukuphrinta Ukwakhiwa kwe-single/double-side, PTH kanye ne-multilayer/hybrid RF okuvunyelwe amakhasimende
Ukuphindaphinda ngomshini Izindawo zokuxhuma, izinhlaka eziqondisiwe, imigodi, imigodi yokufaka kanye nezici ze-interface yensimbi
Ukuqhubeka komhlangano Ukubuyekezwa kwe-BOM, ezinye izindlela ezivunyiwe, i-SMT/THT, izixhumi ze-RF, izihlangu kanye nohlelo
Ukuqinisekiswa kwe- Ubukhulu be-athikili yokuqala, ukuhlolwa kukagesi, ukuhlolwa kokusebenza/kwe-RF okuchazwe ngamakhasimende kanye nokuqhathaniswa namarekhodi avunyiwe
Ukulawula ukuhleleka okuphindaphindiwe Ukubuyekezwa, izinto, inqwaba kanye namarekhodi enqubo agcinwe ngamaqoqo enkonzo alandelayo

Amandla Okukhiqiza e-Highleap Rigid RF PCB

Izibalo ezingezansi ziyimingcele yefektri ye-Highleap eqinile-ye-PCB eshicilelwe. Idizayini ye-TLX-0 endala ikhishwa kuphela ngemva kokuqinisekiswa kobunikazi bezinto ezibonakalayo, ukujiya, ithusi, idatha yokubhoboza kanye nokubekezelelana kokudweba; umdwebo omdala awufanelekeli ngokuzenzakalelayo yonke imikhawulo ebhalwe ohlwini. Bheka ithebula eliphelele lamandla e-PCB eqinile ye-Highleap ukuze uthole imininingwane yefektri eshicilelwe.

Into yokukhiqiza Amandla e-Highleap ashicilelwe Isimo sephrojekthi ye-RF/PTFE
Isibalo esiphezulu sesendlalelo Kufika ku-60 izendlalelo Inani lezingqimba ze-RF/PTFE ethile noma i-hybrid stackup liyaqinisekiswa ngemuva kokuncishiswa, ukubhaliswa, ukubuyekezwa kwezinto kanye nokwengezwa kwezinto.
Umkhondo/isikhala esincane esingaphakathi 2/2 mil (0.05/0.05 mm) I-geometry ye-RF ekhishwe incike nasekujiyeni kwethusi, uhlobo lwe-foil, isinxephezelo se-etch kanye nokubekezelelana kobukhulu obubalulekile.
Umkhondo/isikhala esincane esingaphandle 2/2 mil (0.05/0.05 mm) Izikhala ezincane ze-RF kanye nezakhiwo ezihlangene zidinga izindlela zokuhlola kanye nokwenzeka kwephrojekthi ethile.
Ibanga lokujiya kwebhodi I-0.2-8.0 mm Ubukhulu obutholakalayo bokwakhiwa kwe-Taconic/AGC okuqanjwe ngegama buxhomeke ku-laminate gauge, indlela yokubopha kanye ne-stackup evunyiwe.
Ukubekezelelana kobukhulu bebhodi ± 0.1 mm ngaphansi kuka-1.0 mm; ± 10% ku-1.0 mm nangaphezulu Ukuqaliswa kwesixhumi se-RF kanye nezixhumi ezivalekile kufanele kuveze noma yiziphi izidingo eziqinile ezingeni lomkhiqizo.
Usayizi webhodi oqediwe okungenani 10 × 10 mm Amasekethe amancane angadinga ukulethwa kuphaneli yokukhiqiza noma i-array ukuze kwenziwe futhi kuhlanganiswe.
Usayizi webhodi ophelele oqediwe 22.5 × 47.5 in (571.5 × 1206.5 mm) Amabhodi e-PTFE amakhulu adinga ukubuyekezwa okuhlukile kosayizi weshidi lezinto, ukubhaliswa, ukuba yisicaba, ukuhanjiswa kanye nokuthunyelwa.
Indandatho encane yomshini wokubhoboza / indandatho ejikelezayo 0.15 mm / 0.127 mm Umklamo wokugcina uncike ekujiyeni kwebhodi, isilinganiso sesici, isidingo sokufaka iplati kanye nenqubo yokubhoboza eqondene nezinto ezithile.
Indandatho encane ye-laser drill / indandatho ye-annular 0.075 mm / 0.075 mm Ama-microvia e-laser angaphansi kobukhulu be-dielectric, ukwakheka kwe-capture-pad, ukwakheka kwethusi kanye nokubuyekezwa kwe-sequentially-lamination.
Isilinganiso sesici sokubhoboza ngomshini Kuze ku-20: 1 Isilinganiso esingafinyeleleka sokwakhiwa kwe-RF/PTFE kumele siqinisekiswe ngosayizi wembobo oqediwe, ukujiya kwebhodi kanye nesidingo sokufaka iplati.
Isilinganiso sesici se-laser-drill 1:1 I-Microvia geometry ikhishwa kuphela ngemva kokubuyekezwa kwe-stackup nokuthembeka.
Ithusi elingaphakathi/elingaphandle eliphezulu Kufika ku-10 oz Ithusi elikhulu alikwazi ukuhlanganiswa ngokuzenzakalelayo nomkhondo/isikhala esihle kakhulu noma yonke into eyakhiwe nge-PTFE.
Ukubekezelelana kwe-PTH / NPTH I-PTH ±0.075 mm; I-NPTH ±0.05 mm Izimbobo zokuxhuma kanye ne-RF grounding kufanele zibone ububanzi obuqediwe kanye nanoma yisiphi isidingo sokulingana okuqinile.
Ukubekezelelana kwe-contour ± 0.1 mm Ukuqaliswa komphetho, imigodi, izikhala kanye nezindawo zokuxhuma kungadinga uhlelo olukhethekile lokulawula ubukhulu.
Ukubekezelelana kwe-impedance okulawulwayo I-single-end kanye ne-differential: ±5 Ω ku-≤50 Ω; ±7% ngaphezu kwama-50 Ω Ukubekezelelana okucashuniwe kusebenza endleleni evunyiwe yokuqoqa ama-stackup, isu lekhuphoni kanye nendlela yokulinganisa.
Ukuqedwa kwendawo okutholakalayo I-ENIG, i-ENEPIG, i-OSP, i-HASL, isiliva lokucwilisa, ithini lokucwilisa, igolide elikhanyayo, iminwe yegolide eqinile negolide Ukukhethwa kokuqeda kubuyekezwa ngokulahlekelwa yi-RF, ukushiswa kwe-solder, ukubopha ucingo, ukuxhumana kwesixhumi kanye nezidingo zemvelo.

Isaziso sokuhlanganiswa kwamandla: amanani etafuleni ayimingcele yamandla efektri ngayinye. Inani lezingqimba, i-geometry engu-2/2 mil, ithusi elingu-10 oz, usayizi wephaneli ophezulu, isilinganiso sesici esingu-20:1 kanye nokwakhiwa kwebhodi elincane kakhulu akucatshangwa ukuthi kungafezeka ngasikhathi sinye. I-Highleap iqinisekisa inhlanganisela esebenzisekayo ngemuva kokubukeza izinto eziqondile, i-stackup, ithusi, i-drill, ukubekezelelana kwe-RF, ukuqeda kwendawo kanye nephakheji yokuhlanganisa.

Umtapo wolwazi wezobuchwepheshe we-AGC usabhekisela ku-TLX-0 emsebenzini we-oscillator we-legacy, kuyilapho ithebula lomkhiqizo we-RF oyinhloko wamanje libala i-TLX-8 njengomkhiqizo we-TLX osebenzayo. Bheka umtapo wolwazi we-AGC technical-article kanye nekhasi lomkhiqizo we-TLX-8 wamanje. I-Highleap iqinisekisa ukuthi i-oda lidinga isitoko sokuqala se-TLX-0, izinto ezinikezwe amakhasimende, noma ushintsho oluvunyiwe. I-TLX-8 ayithathwa njengenye indawo yokufaka.

Ukukhishwa komkhiqizo kulandela uhlu lokuhlola lokubuyekezwa kwefayela lokukhiqiza le-Highleap ukuze amanothi akudala, i-stackup, idatha yokubhoboza, ama-callout ezinto kanye nolwazi lokuhlanganisa luhlanganiswe ngaphambi kokusetshenziswa kwamathuluzi.

Ukuthola Iphakheji Engakhiqizwa Kumafayela E-Legacy

Amaphrojekthi amadala e-TLX-0 angafika njenge-Gerber, imidwebo eskeniwe, amafayela okubhoboza ingxenye, ibhodi lesampula, uhlu lwezingxenye noma ikhodi yezinto zangaphakathi. I-Highleap ikhomba ukuthi yini elawulwayo nokuthi yini edinga ukuqinisekiswa kwamakhasimende.

Okokufaka kwefa Isibuyekezo se-Highleap Isinqumo sekhasimende esidingekayo
Amafayela amadala e-Gerber kanye ne-drill Ukuqondanisa ungqimba, ukuhumusha kwe-aperture, uhlu lwe-net olungekho, uhlaka kanye nemephu ye-drill Vumela iphakheji yokukhiqiza evuselelwe kanye nokubuyekezwa.
Umdwebo wokwenziwa okuskeniwe Izinto, ukujiya, ithusi, ukubekezelelana, ukuqeda kanye namanothi Nikeza amanani alawulwayo lapho isithombe singacacile khona.
Isampula ebonakalayo Ubukhulu, inkomba yesendlalelo, ukuqeda, izingxenye kanye nesigaba esingaba khona Qinisekisa ukuthi ukuhlaziywa kwesampula kungasiza yini ekudwebeni okusha okulawulwayo.
Isikhalo sezinto eziphelelwe yisikhathi Ukutholakala kwamanje kanye nezinye izindlela ezingaba khona Vuma umzila wesitoko sokuqala, izinto zamakhasimende noma ushintsho olufanelekile.
Idatha yokuhlanganisa engaphelele I-BOM, i-polarity, izixhumanisi, imidwebo kanye nokuhlolwa Khipha amadokhumenti e-PCBA angekho ngaphambi kokukhiqizwa.

I-Highleap isebenzisa ukuhlola kwe-PCB DFM ukubuyisela uhlu lwemibuzo ebhaliwe. Izinguquko ku-geometry ye-RF, i-dielectric, ithusi, inani lengxenye noma isixhumi esibonakalayo zidinga imvume yomklamo nomnikazi.

Ukuqinisekiswa Kwezinto Ezibalulekile kanye Nemizila Yokuguquka Evunyiwe

Ubunikazi bezinto ze-TLX-0 buqinisekiswa ngemininingwane yokuqala elawulwayo, amadokhumenti akhona asele, amalebula ezindawo, izitifiketi kanye nokuvunyelwa kwamakhasimende. I-laminate efanayo ye-PTFE ephansi ayikwazi ukukhethwa kuphela ngegama lomkhiqizo nomndeni.

Ukutholakala Kwezinto Ezibalulekile ze-TLX-0 kanye Nokuguqulwa Okuvunyiwe

Uma isitoko sokuqala se-TLX-0 singenakuqinisekiswa, i-Highleap ingabuyekeza izinto ezinikezwe amakhasimende noma ukushintshela okuvunyelwe ngokusemthethweni ezintweni zamanje. Iphakheji yokushintsha ikhomba imodeli ye-Dk/loss, ukujiya, ithusi, umthelela wobuciko, inqubo ye-PTH, uhlelo lokuhlola kanye nemibhalo; akufihliwe ngaphakathi kwesilinganiso sokukhiqiza.

  1. Indlela yokuqala yezinto ezibonakalayo: sebenzisa isitoko se-TLX-0 esiqinisekisiwe esineminyaka eyamukelekayo, isimo, ubukhulu kanye nokulandeleka.
  2. Umzila ohlinzekwa ngamakhasimende: hlola ubunikazi, ubuningi, ubukhulu, isimo sobuso kanye nosayizi wephaneli ongasetshenziswa ngaphambi kokukhiqiza.
  3. Umzila wezinto zamanje ezivunyiwe: ikhasimende likhetha futhi lifanelekele ibanga lamanje, bese likhipha i-stackup entsha kanye ne-geometry.
  4. Indlela yokwakha ukuqhathanisa: ukukhiqiza ukucushwa kwefa kanye nokungafaneleki okunemibandela yokwamukelwa kwe-RF echaziwe.
  5. Umzila wokuthenga okokugcina: gcina izinto zesidingo sesevisi esibikezelwe ngaphansi kwezimo zokubuyekezwa nokugcinwa okulawulwayo.

Izinketho ezibanzi zingabuyekezwa kusetshenziswa umhlahlandlela wezinto ze-Highleap ze-Taconic/AGC PCB kanye nokuqhathaniswa kwezinto ze-RF . Noma yiluphi ushintsho oluphakanyisiwe lubhalwe ngokuhlukile ekwakhiweni kwefa.

Izilawuli Zokukhiqiza ze-Oscillator kanye ne-MMIC Circuits

Amabhodi e-Oscillator kanye ne-MMIC angaba nomuzwa wobude bomugqa, ubukhulu benethiwekhi obuhambisanayo, ukuhanjiswa komhlaba, i-geometry yephedi yedivayisi kanye nokuqaliswa kwesixhumi. I-Highleap ibona ubukhulu obubalulekile kanye nezixhumi zokuhlangana ngaphambi kokukhishwa kwe-CAM.

  • i-critical microstrip/CPWG geometry ibuyekezwe nge isiqondiso se-microstrip esivame kakhulu;
  • ukujiya kwe-dielectric, isimo sethusi kanye ne-solder-mask eqandisiwe esitokisini sokukhiqiza;
  • ama-vias aphansi abholiwe futhi afakwe ipulasitiki ahlolwe ububanzi obuqediwe, ukubhaliswa kanye nethusi;
  • ubukhulu bomphetho kanye nezindawo zokubhekisela zesixhumi ezilinganiswa ngomdwebo womshini;
  • ukuqeda kobuso okukhethiwe ngenxa yokuphela kwengxenye kanye nesidingo sokulahlekelwa yi-RF;
  • ukuhlolwa kwe-RF kwesihloko sokuqala okunobukhulu, ukuvinjelwa noma ukuhlolwa kwe-RF okuchazwe ngamakhasimende okuvunyelwene ngakho ngaphambi kokukhishwa kwevolumu.

I-Highleap ingafaka phakathi i-impedance elawulwayo ngokulawulwa kwe-RF impedance kanye nobufakazi bukagesi/i-RF ngokuhlolwa kwe-RF PCB.

Ukusekelwa Kokuhlanganiswa Kwe-TLX-0 Yesikhathi Esidlule kanye Nokusekelelwa Kwangemva Kokuthengisa

I-Highleap ingahlanganisa ama-oscillator, ama-MMIC, ama-RF passives, izixhumi, izihlangu kanye nezingxenye zokulawula kusetshenziswa izingxenye ezinikezwa amakhasimende, ezithunyelwe noma ezijikiwe. Ukuphelelwa yisikhathi kanye nengozi yombumbulu kuyabuyekezwa kuma-BOM amadala, futhi akukho ngxenye ehlukile efakwa ngaphandle kwemvume.

  • Umjikelezo wokuphila we-BOM kanye nokubuyekezwa okunye ngokusebenzisa ukuthola ingxenye;
  • Inqubo ye-SMT kanye nokubuyekezwa kwe-stencil ngokusebenzisa Umhlangano we-SMT PCB;
  • umswakama, i-ESD kanye nezilawuli zokugcina zamadivayisi e-RF abucayi;
  • Ukuhlolwa kwe-AOI, i-X-ray noma ngesandla ngokwengozi yephakheji;
  • izinhlelo kanye ukuhlolwa kokusebenza ukusebenzisa izinto zamakhasimende noma uhlelo lokuthuthukisa ukuhlolwa olucashuniwe;
  • ukulandeleka okulandelanayo kanye nokubuyekezwa kwesevisi kanye nokubuyiselwa kwensimu.

Ngemva kokulethwa, i-Highleap ingalandelela izinto, indawo yokukhiqiza, indawo yokuhlanganisa kanye nerekhodi lokuhlola; ixhumanise ukugcinwa; ibuyekeze amayunithi abuyiselwe; futhi ikhiphe amadokhumenti okulungisa lapho imbangela yokukhiqiza noma yokuhlanganisa itholakala.

Uhlobo lwe-TLX-0, Isikhathi Sokuhola, kanye Nesilinganiso

Ishejuli iqala ngokubuyiselwa kwedatha nokuqinisekiswa kwezinto. Indawo yokukhiqiza esheshayo ayikwazi ukukhokhela izinto ezingakaxazululwa noma iphakheji yefa engaphelele. I-Highleap inikeza izinsuku ezihlukene zokukhishwa kobunjiniyela, ukulungela izinto, into yokuqala, ukuhlanganiswa/ukuhlolwa kanye nokuthunyelwa kokugcina.

Ukuze uthole umzila ophelele we-PCB kanye ne-PCBA, i-Highleap ingahlanganisa ukubuyekezwa kwe-RF laminate nobunjiniyela bokuhlanganisa be-RF PCB kanye nesilinganiso sokukhiqiza esisemthethweni.

Isikhathi sekhotheshini esidala sincike ekupheleleni kwedatha kanye nomthamo wefektri. I-Highleap ihlukanisa ukubuyiswa kwamafayela, ukuvunyelwa kwezinto ezibonakalayo, ukwakhiwa kwesihloko sokuqala, ukuqinisekiswa kwamakhasimende kanye nokuphinda ukukhiqizwa kube yizigigaba ezibonakalayo ukuze ukuthengwa kukwazi ukuhlela isitokwe sesevisi ngaphandle kwesithembiso esingasekelwa.

Thumela yonke i-Gerber etholakalayo, i-drill, imidwebo, uhlu lwe-net, ulwazi lwebhodi lesampula, amadokhumenti okuqala ezinto ze-TLX-0, ubuningi, ukulethwa okuqondiwe, i-BOM, izixhumanisi, imidwebo yokuhlanganisa, i-firmware kanye namarekhodi okuhlola nge- Highleap Electronics . Sebenzisa isibuyekezo se-PCB DFM uma iphakheji yedatha ingaphelele.

Ukuze uthole inketho yamanje ye-TLX, buyekeza ulwazi lokukhiqiza lwe-TLX-8 PCB kanye nolwazi lwezinto ze-TLX-8 . Ukuze uthole ukuhlela kwezentengiselwano kuwo wonke umndeni we-TLX, bheka intengo ye-Taconic TLX PCB.

Ingabe i-Highleap ingakhiqiza amafayela amadala e-TLX-0 Gerber?

Yebo, ngemva kokuba ungqimba, ukubhoboza, uhlaka, izinto zokwakha, ukuqoqa, ukuqeda, ukubekezelelana kanye nokubukeza kuxazululwe ngokubhala phansi.

Ingabe i-TLX-8 ithatha indawo ye-TLX-0 ngqo?

Akukho ukulingana okuzenzakalelayo okucatshangelwayo. Umehluko kagesi, ukujiya, ithusi, ukucubungula kanye neziqu kumele ubuyekezwe futhi uvunyelwe.

Ingabe i-Highleap ingakwazi ukuthola izingxenye eziphelelwe yisikhathi zokuhlanganisa?

I-Highleap ingabuyekeza izinketho zokuthola ulwazi, kodwa ukutholakala, ubuqiniso, umjikelezo wokuphila kanye nezinye izindlela ezivunyiwe kumele kuvunyelwane ngazo nekhasimende.

Ingabe i-Highleap ingakwazi ukusekela amaqoqo amancane esikhathi esizayo?

Yebo, ngamarekhodi okubuyekezwa alawulwayo, ukuhlela ukuqhubeka kwezinto ezibonakalayo, ukugcinwa kwamathuluzi/idatha kanye nokubuyekezwa kwezentengiselwano okuphindaphindiwe.

Yini edingekayo ukuze ucaphune indawo ye-TLX-0 noma isakhiwo sesevisi?

Nikeza wonke amafayela alawulwayo, amarekhodi ezinto zangaphambilini kanye ne-stackup, ulwazi lwebhodi olwaziwayo, idatha ye-BOM/yokuhlanganisa, izinqubo zokuhlola, ubuningi kanye negunya lezinye izindlela zezinto noma izingxenye.

Ingabe i-Highleap inikeza ukwesekwa kokwehluleka kanye nokwesekwa kwangemva kokuthengisa?

Yebo. I-Highleap ingabuyekeza amarekhodi ezindawo, izinto zokwakha, ukuhlanganiswa kanye nokuhlolwa, isekele ukulawulwa kanye nesenzo sokulungisa, futhi isebenzise izinguquko ezivunyiwe ngaphansi kokulawulwa kokubuyekezwa.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

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Ungasithola kanjani isilinganiso sama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB