Usekelo Lokukhiqiza Nokukhiqiza Okudumile lwe-Taconic TLX-0 PCB
I-Highleap Electronics ikhiqiza ama-PCB e-Taconic TLX-0 ama-oscillator, amamojula e-MMIC, amasekethe okuhlola ama-microwave, amabhodi okulawula i-RF kanye nokushintsha isevisi. Sisekela ukwenziwa kabusha kwe-prototype, ukuqhubeka kwevolumu ephansi, ukukhiqizwa okuphindaphindiwe, ukubuyiswa kwamafayela okulawulwayo, ukwenziwa kwe-RF, ukuhlanganiswa kwezixhumi kanye nokuhlolwa okuchazwe ngamakhasimende kusuka kudatha yamakhasimende egunyaziwe.
I-TLX-0 ayiphathwa njenge-laminate ejwayelekile yamanje. Ngaphambi kokuba intengo noma ukulethwa kukhishwe, i-Highleap iqinisekisa ukubuyekezwa komdwebo wokuqala, ukuhlonza izinto, ukujiya, ithusi, amadokhumenti atholakalayo kanye negunya lokufaka esikhundleni. Lokhu kuvikela imikhiqizo efakwe ezinsizeni ezingabhalisiwe noma izinguquko zejiyometri.
Izici Zezinto Eziyigugu ze-TLX-0 kanye Nokulawula Ukudweba
I-TLX-0 ivela emidwebweni emidala ye-Taconic RF, kodwa amathebula emikhiqizo ye-AGC amanje afaka i-TLX-8 esikhundleni se-TLX-0 njengomnikelo oyinhloko we-TLX. I-TLX-8 iyi-laminate ye-PTFE elukiwe ngengilazi ene-Dk 2.55 ± 0.04 eshicilelwe kanye ne-Df 0.0018; akuyona into efanayo noma ukwakhiwa okufanayo ne-TLX-0 ngokuzenzakalelayo.
| Into yokulawula ifa | Kungani kubalulekile | Isenzo se-Highleap |
|---|---|---|
| Ubunikazi bezinto zokuqala | Ilebula le-TLX elingakahleleki lingasusa ibanga eliqondile lomlando, ukujiya noma ithusi. | Sebenzisa imidwebo elawulwayo, izitifiketi, amarekhodi okuthenga noma imvume yamakhasimende ukuze ukhulule lokho okuqukethwe. |
| Ubuciko be-RF kanye nesilinganiso | Idatha yesithombe esidala noma i-Gerber ingafaka isinxephezelo esihlobene nenqubo yokuqala. | Qhathanisa ukubuyekezwa kwedatha, amayunithi, ulwazi lwembobo, ubukhulu kanye namasampula aziwayo. |
| I-PTH kanye nokwakhiwa kwemishini | Amamojula e-Oscillator/MMIC angancika emininingwaneni yesixhumi, imbobo kanye nesisekelo. | Khipha imbobo, ukuqondisa, ukubopha kanye nokubekezelelana kwemishini ngaphambi kokusebenzisa amathuluzi. |
| Igunya lokufaka esikhundleni | Ibanga le-TLX lamanje lingashintsha ubude bukagesi, ukulungiswa noma ukuhambisana. | Caphuna ushintsho njengoshintsho olulawulwayo ngokuqinisekiswa okuchazwe yikhasimende. |
Ukuze uthole umongo wamanje wezinto ezibonakalayo, bheka ikhasi lomkhiqizo elisemthethweni le-AGC TLX-8. I-Highleap isebenzisa uhlu lwayo lokuhlola lokubuyekezwa kwefayela le-Gerber ukuvala izikhala zedatha yefa ngaphambi kokukhiqizwa.
Ukusekelwa Kokukhiqiza Nokuqhubeka Kwe-Taconic TLX-0 PCB
I-Highleap isekela imiklamo ye-TLX-0 endala esetshenziswa kuma-oscillator, amasekethe okuhlola e-MMIC, amamojula we-microwave kanye neminye imikhiqizo ye-low-Dk RF. Singabuyekeza ukukhiqizwa kabusha kwebhodi elingenalutho, ukwakhiwa kabusha okulawulwayo, ukukhiqizwa kwensizakalo encane, ukwakhiwa kokufakwa esikhundleni kwe-NPI kanye nokuhlanganiswa okuphelele. Inhloso iwukulondoloza ukucushwa kukagesi nokwemishini okukhishwe, hhayi ukuhumusha kabusha umdwebo omdala ngaphandle kwemvume.
Ukusekelwa Kokukhiqiza Ama-PCB Akudala e-Highleap
| Indawo yephrojekthi | Ukusekelwa kwephrojekthi ye-Highleap |
|---|---|
| Ukuthola idatha | Ukubuyekezwa kwe-Gerber elawulwayo, i-drill, imidwebo, uhlu lwe-netlists, ama-stackup kanye namarekhodi esampula anikezwe amakhasimende |
| Ukukhiqizwa okwakhelwe ukuphrinta | Ukwakhiwa kwe-single/double-side, PTH kanye ne-multilayer/hybrid RF okuvunyelwe amakhasimende |
| Ukuphindaphinda ngomshini | Izindawo zokuxhuma, izinhlaka eziqondisiwe, imigodi, imigodi yokufaka kanye nezici ze-interface yensimbi |
| Ukuqhubeka komhlangano | Ukubuyekezwa kwe-BOM, ezinye izindlela ezivunyiwe, i-SMT/THT, izixhumi ze-RF, izihlangu kanye nohlelo |
| Ukuqinisekiswa kwe- | Ubukhulu be-athikili yokuqala, ukuhlolwa kukagesi, ukuhlolwa kokusebenza/kwe-RF okuchazwe ngamakhasimende kanye nokuqhathaniswa namarekhodi avunyiwe |
| Ukulawula ukuhleleka okuphindaphindiwe | Ukubuyekezwa, izinto, inqwaba kanye namarekhodi enqubo agcinwe ngamaqoqo enkonzo alandelayo |
Amandla Okukhiqiza e-Highleap Rigid RF PCB
Izibalo ezingezansi ziyimingcele yefektri ye-Highleap eqinile-ye-PCB eshicilelwe. Idizayini ye-TLX-0 endala ikhishwa kuphela ngemva kokuqinisekiswa kobunikazi bezinto ezibonakalayo, ukujiya, ithusi, idatha yokubhoboza kanye nokubekezelelana kokudweba; umdwebo omdala awufanelekeli ngokuzenzakalelayo yonke imikhawulo ebhalwe ohlwini. Bheka ithebula eliphelele lamandla e-PCB eqinile ye-Highleap ukuze uthole imininingwane yefektri eshicilelwe.
| Into yokukhiqiza | Amandla e-Highleap ashicilelwe | Isimo sephrojekthi ye-RF/PTFE |
|---|---|---|
| Isibalo esiphezulu sesendlalelo | Kufika ku-60 izendlalelo | Inani lezingqimba ze-RF/PTFE ethile noma i-hybrid stackup liyaqinisekiswa ngemuva kokuncishiswa, ukubhaliswa, ukubuyekezwa kwezinto kanye nokwengezwa kwezinto. |
| Umkhondo/isikhala esincane esingaphakathi | 2/2 mil (0.05/0.05 mm) | I-geometry ye-RF ekhishwe incike nasekujiyeni kwethusi, uhlobo lwe-foil, isinxephezelo se-etch kanye nokubekezelelana kobukhulu obubalulekile. |
| Umkhondo/isikhala esincane esingaphandle | 2/2 mil (0.05/0.05 mm) | Izikhala ezincane ze-RF kanye nezakhiwo ezihlangene zidinga izindlela zokuhlola kanye nokwenzeka kwephrojekthi ethile. |
| Ibanga lokujiya kwebhodi | I-0.2-8.0 mm | Ubukhulu obutholakalayo bokwakhiwa kwe-Taconic/AGC okuqanjwe ngegama buxhomeke ku-laminate gauge, indlela yokubopha kanye ne-stackup evunyiwe. |
| Ukubekezelelana kobukhulu bebhodi | ± 0.1 mm ngaphansi kuka-1.0 mm; ± 10% ku-1.0 mm nangaphezulu | Ukuqaliswa kwesixhumi se-RF kanye nezixhumi ezivalekile kufanele kuveze noma yiziphi izidingo eziqinile ezingeni lomkhiqizo. |
| Usayizi webhodi oqediwe okungenani | 10 × 10 mm | Amasekethe amancane angadinga ukulethwa kuphaneli yokukhiqiza noma i-array ukuze kwenziwe futhi kuhlanganiswe. |
| Usayizi webhodi ophelele oqediwe | 22.5 × 47.5 in (571.5 × 1206.5 mm) | Amabhodi e-PTFE amakhulu adinga ukubuyekezwa okuhlukile kosayizi weshidi lezinto, ukubhaliswa, ukuba yisicaba, ukuhanjiswa kanye nokuthunyelwa. |
| Indandatho encane yomshini wokubhoboza / indandatho ejikelezayo | 0.15 mm / 0.127 mm | Umklamo wokugcina uncike ekujiyeni kwebhodi, isilinganiso sesici, isidingo sokufaka iplati kanye nenqubo yokubhoboza eqondene nezinto ezithile. |
| Indandatho encane ye-laser drill / indandatho ye-annular | 0.075 mm / 0.075 mm | Ama-microvia e-laser angaphansi kobukhulu be-dielectric, ukwakheka kwe-capture-pad, ukwakheka kwethusi kanye nokubuyekezwa kwe-sequentially-lamination. |
| Isilinganiso sesici sokubhoboza ngomshini | Kuze ku-20: 1 | Isilinganiso esingafinyeleleka sokwakhiwa kwe-RF/PTFE kumele siqinisekiswe ngosayizi wembobo oqediwe, ukujiya kwebhodi kanye nesidingo sokufaka iplati. |
| Isilinganiso sesici se-laser-drill | 1:1 | I-Microvia geometry ikhishwa kuphela ngemva kokubuyekezwa kwe-stackup nokuthembeka. |
| Ithusi elingaphakathi/elingaphandle eliphezulu | Kufika ku-10 oz | Ithusi elikhulu alikwazi ukuhlanganiswa ngokuzenzakalelayo nomkhondo/isikhala esihle kakhulu noma yonke into eyakhiwe nge-PTFE. |
| Ukubekezelelana kwe-PTH / NPTH | I-PTH ±0.075 mm; I-NPTH ±0.05 mm | Izimbobo zokuxhuma kanye ne-RF grounding kufanele zibone ububanzi obuqediwe kanye nanoma yisiphi isidingo sokulingana okuqinile. |
| Ukubekezelelana kwe-contour | ± 0.1 mm | Ukuqaliswa komphetho, imigodi, izikhala kanye nezindawo zokuxhuma kungadinga uhlelo olukhethekile lokulawula ubukhulu. |
| Ukubekezelelana kwe-impedance okulawulwayo | I-single-end kanye ne-differential: ±5 Ω ku-≤50 Ω; ±7% ngaphezu kwama-50 Ω | Ukubekezelelana okucashuniwe kusebenza endleleni evunyiwe yokuqoqa ama-stackup, isu lekhuphoni kanye nendlela yokulinganisa. |
| Ukuqedwa kwendawo okutholakalayo | I-ENIG, i-ENEPIG, i-OSP, i-HASL, isiliva lokucwilisa, ithini lokucwilisa, igolide elikhanyayo, iminwe yegolide eqinile negolide | Ukukhethwa kokuqeda kubuyekezwa ngokulahlekelwa yi-RF, ukushiswa kwe-solder, ukubopha ucingo, ukuxhumana kwesixhumi kanye nezidingo zemvelo. |
Isaziso sokuhlanganiswa kwamandla: amanani etafuleni ayimingcele yamandla efektri ngayinye. Inani lezingqimba, i-geometry engu-2/2 mil, ithusi elingu-10 oz, usayizi wephaneli ophezulu, isilinganiso sesici esingu-20:1 kanye nokwakhiwa kwebhodi elincane kakhulu akucatshangwa ukuthi kungafezeka ngasikhathi sinye. I-Highleap iqinisekisa inhlanganisela esebenzisekayo ngemuva kokubukeza izinto eziqondile, i-stackup, ithusi, i-drill, ukubekezelelana kwe-RF, ukuqeda kwendawo kanye nephakheji yokuhlanganisa.
Umtapo wolwazi wezobuchwepheshe we-AGC usabhekisela ku-TLX-0 emsebenzini we-oscillator we-legacy, kuyilapho ithebula lomkhiqizo we-RF oyinhloko wamanje libala i-TLX-8 njengomkhiqizo we-TLX osebenzayo. Bheka umtapo wolwazi we-AGC technical-article kanye nekhasi lomkhiqizo we-TLX-8 wamanje. I-Highleap iqinisekisa ukuthi i-oda lidinga isitoko sokuqala se-TLX-0, izinto ezinikezwe amakhasimende, noma ushintsho oluvunyiwe. I-TLX-8 ayithathwa njengenye indawo yokufaka.
Ukukhishwa komkhiqizo kulandela uhlu lokuhlola lokubuyekezwa kwefayela lokukhiqiza le-Highleap ukuze amanothi akudala, i-stackup, idatha yokubhoboza, ama-callout ezinto kanye nolwazi lokuhlanganisa luhlanganiswe ngaphambi kokusetshenziswa kwamathuluzi.
Ukuthola Iphakheji Engakhiqizwa Kumafayela E-Legacy
Amaphrojekthi amadala e-TLX-0 angafika njenge-Gerber, imidwebo eskeniwe, amafayela okubhoboza ingxenye, ibhodi lesampula, uhlu lwezingxenye noma ikhodi yezinto zangaphakathi. I-Highleap ikhomba ukuthi yini elawulwayo nokuthi yini edinga ukuqinisekiswa kwamakhasimende.
| Okokufaka kwefa | Isibuyekezo se-Highleap | Isinqumo sekhasimende esidingekayo |
|---|---|---|
| Amafayela amadala e-Gerber kanye ne-drill | Ukuqondanisa ungqimba, ukuhumusha kwe-aperture, uhlu lwe-net olungekho, uhlaka kanye nemephu ye-drill | Vumela iphakheji yokukhiqiza evuselelwe kanye nokubuyekezwa. |
| Umdwebo wokwenziwa okuskeniwe | Izinto, ukujiya, ithusi, ukubekezelelana, ukuqeda kanye namanothi | Nikeza amanani alawulwayo lapho isithombe singacacile khona. |
| Isampula ebonakalayo | Ubukhulu, inkomba yesendlalelo, ukuqeda, izingxenye kanye nesigaba esingaba khona | Qinisekisa ukuthi ukuhlaziywa kwesampula kungasiza yini ekudwebeni okusha okulawulwayo. |
| Isikhalo sezinto eziphelelwe yisikhathi | Ukutholakala kwamanje kanye nezinye izindlela ezingaba khona | Vuma umzila wesitoko sokuqala, izinto zamakhasimende noma ushintsho olufanelekile. |
| Idatha yokuhlanganisa engaphelele | I-BOM, i-polarity, izixhumanisi, imidwebo kanye nokuhlolwa | Khipha amadokhumenti e-PCBA angekho ngaphambi kokukhiqizwa. |
I-Highleap isebenzisa ukuhlola kwe-PCB DFM ukubuyisela uhlu lwemibuzo ebhaliwe. Izinguquko ku-geometry ye-RF, i-dielectric, ithusi, inani lengxenye noma isixhumi esibonakalayo zidinga imvume yomklamo nomnikazi.
Ukuqinisekiswa Kwezinto Ezibalulekile kanye Nemizila Yokuguquka Evunyiwe
Ubunikazi bezinto ze-TLX-0 buqinisekiswa ngemininingwane yokuqala elawulwayo, amadokhumenti akhona asele, amalebula ezindawo, izitifiketi kanye nokuvunyelwa kwamakhasimende. I-laminate efanayo ye-PTFE ephansi ayikwazi ukukhethwa kuphela ngegama lomkhiqizo nomndeni.
Ukutholakala Kwezinto Ezibalulekile ze-TLX-0 kanye Nokuguqulwa Okuvunyiwe
Uma isitoko sokuqala se-TLX-0 singenakuqinisekiswa, i-Highleap ingabuyekeza izinto ezinikezwe amakhasimende noma ukushintshela okuvunyelwe ngokusemthethweni ezintweni zamanje. Iphakheji yokushintsha ikhomba imodeli ye-Dk/loss, ukujiya, ithusi, umthelela wobuciko, inqubo ye-PTH, uhlelo lokuhlola kanye nemibhalo; akufihliwe ngaphakathi kwesilinganiso sokukhiqiza.
- Indlela yokuqala yezinto ezibonakalayo: sebenzisa isitoko se-TLX-0 esiqinisekisiwe esineminyaka eyamukelekayo, isimo, ubukhulu kanye nokulandeleka.
- Umzila ohlinzekwa ngamakhasimende: hlola ubunikazi, ubuningi, ubukhulu, isimo sobuso kanye nosayizi wephaneli ongasetshenziswa ngaphambi kokukhiqiza.
- Umzila wezinto zamanje ezivunyiwe: ikhasimende likhetha futhi lifanelekele ibanga lamanje, bese likhipha i-stackup entsha kanye ne-geometry.
- Indlela yokwakha ukuqhathanisa: ukukhiqiza ukucushwa kwefa kanye nokungafaneleki okunemibandela yokwamukelwa kwe-RF echaziwe.
- Umzila wokuthenga okokugcina: gcina izinto zesidingo sesevisi esibikezelwe ngaphansi kwezimo zokubuyekezwa nokugcinwa okulawulwayo.
Izinketho ezibanzi zingabuyekezwa kusetshenziswa umhlahlandlela wezinto ze-Highleap ze-Taconic/AGC PCB kanye nokuqhathaniswa kwezinto ze-RF . Noma yiluphi ushintsho oluphakanyisiwe lubhalwe ngokuhlukile ekwakhiweni kwefa.
Izilawuli Zokukhiqiza ze-Oscillator kanye ne-MMIC Circuits
Amabhodi e-Oscillator kanye ne-MMIC angaba nomuzwa wobude bomugqa, ubukhulu benethiwekhi obuhambisanayo, ukuhanjiswa komhlaba, i-geometry yephedi yedivayisi kanye nokuqaliswa kwesixhumi. I-Highleap ibona ubukhulu obubalulekile kanye nezixhumi zokuhlangana ngaphambi kokukhishwa kwe-CAM.
- i-critical microstrip/CPWG geometry ibuyekezwe nge isiqondiso se-microstrip esivame kakhulu;
- ukujiya kwe-dielectric, isimo sethusi kanye ne-solder-mask eqandisiwe esitokisini sokukhiqiza;
- ama-vias aphansi abholiwe futhi afakwe ipulasitiki ahlolwe ububanzi obuqediwe, ukubhaliswa kanye nethusi;
- ubukhulu bomphetho kanye nezindawo zokubhekisela zesixhumi ezilinganiswa ngomdwebo womshini;
- ukuqeda kobuso okukhethiwe ngenxa yokuphela kwengxenye kanye nesidingo sokulahlekelwa yi-RF;
- ukuhlolwa kwe-RF kwesihloko sokuqala okunobukhulu, ukuvinjelwa noma ukuhlolwa kwe-RF okuchazwe ngamakhasimende okuvunyelwene ngakho ngaphambi kokukhishwa kwevolumu.
I-Highleap ingafaka phakathi i-impedance elawulwayo ngokulawulwa kwe-RF impedance kanye nobufakazi bukagesi/i-RF ngokuhlolwa kwe-RF PCB.
Ukusekelwa Kokuhlanganiswa Kwe-TLX-0 Yesikhathi Esidlule kanye Nokusekelelwa Kwangemva Kokuthengisa
I-Highleap ingahlanganisa ama-oscillator, ama-MMIC, ama-RF passives, izixhumi, izihlangu kanye nezingxenye zokulawula kusetshenziswa izingxenye ezinikezwa amakhasimende, ezithunyelwe noma ezijikiwe. Ukuphelelwa yisikhathi kanye nengozi yombumbulu kuyabuyekezwa kuma-BOM amadala, futhi akukho ngxenye ehlukile efakwa ngaphandle kwemvume.
- Umjikelezo wokuphila we-BOM kanye nokubuyekezwa okunye ngokusebenzisa ukuthola ingxenye;
- Inqubo ye-SMT kanye nokubuyekezwa kwe-stencil ngokusebenzisa Umhlangano we-SMT PCB;
- umswakama, i-ESD kanye nezilawuli zokugcina zamadivayisi e-RF abucayi;
- Ukuhlolwa kwe-AOI, i-X-ray noma ngesandla ngokwengozi yephakheji;
- izinhlelo kanye ukuhlolwa kokusebenza ukusebenzisa izinto zamakhasimende noma uhlelo lokuthuthukisa ukuhlolwa olucashuniwe;
- ukulandeleka okulandelanayo kanye nokubuyekezwa kwesevisi kanye nokubuyiselwa kwensimu.
Ngemva kokulethwa, i-Highleap ingalandelela izinto, indawo yokukhiqiza, indawo yokuhlanganisa kanye nerekhodi lokuhlola; ixhumanise ukugcinwa; ibuyekeze amayunithi abuyiselwe; futhi ikhiphe amadokhumenti okulungisa lapho imbangela yokukhiqiza noma yokuhlanganisa itholakala.
Uhlobo lwe-TLX-0, Isikhathi Sokuhola, kanye Nesilinganiso
Ishejuli iqala ngokubuyiselwa kwedatha nokuqinisekiswa kwezinto. Indawo yokukhiqiza esheshayo ayikwazi ukukhokhela izinto ezingakaxazululwa noma iphakheji yefa engaphelele. I-Highleap inikeza izinsuku ezihlukene zokukhishwa kobunjiniyela, ukulungela izinto, into yokuqala, ukuhlanganiswa/ukuhlolwa kanye nokuthunyelwa kokugcina.
Ukuze uthole umzila ophelele we-PCB kanye ne-PCBA, i-Highleap ingahlanganisa ukubuyekezwa kwe-RF laminate nobunjiniyela bokuhlanganisa be-RF PCB kanye nesilinganiso sokukhiqiza esisemthethweni.
Isikhathi sekhotheshini esidala sincike ekupheleleni kwedatha kanye nomthamo wefektri. I-Highleap ihlukanisa ukubuyiswa kwamafayela, ukuvunyelwa kwezinto ezibonakalayo, ukwakhiwa kwesihloko sokuqala, ukuqinisekiswa kwamakhasimende kanye nokuphinda ukukhiqizwa kube yizigigaba ezibonakalayo ukuze ukuthengwa kukwazi ukuhlela isitokwe sesevisi ngaphandle kwesithembiso esingasekelwa.
Thumela yonke i-Gerber etholakalayo, i-drill, imidwebo, uhlu lwe-net, ulwazi lwebhodi lesampula, amadokhumenti okuqala ezinto ze-TLX-0, ubuningi, ukulethwa okuqondiwe, i-BOM, izixhumanisi, imidwebo yokuhlanganisa, i-firmware kanye namarekhodi okuhlola nge- Highleap Electronics . Sebenzisa isibuyekezo se-PCB DFM uma iphakheji yedatha ingaphelele.
Ukuze uthole inketho yamanje ye-TLX, buyekeza ulwazi lokukhiqiza lwe-TLX-8 PCB kanye nolwazi lwezinto ze-TLX-8 . Ukuze uthole ukuhlela kwezentengiselwano kuwo wonke umndeni we-TLX, bheka intengo ye-Taconic TLX PCB.
Ingabe i-Highleap ingakhiqiza amafayela amadala e-TLX-0 Gerber?
Yebo, ngemva kokuba ungqimba, ukubhoboza, uhlaka, izinto zokwakha, ukuqoqa, ukuqeda, ukubekezelelana kanye nokubukeza kuxazululwe ngokubhala phansi.
Ingabe i-TLX-8 ithatha indawo ye-TLX-0 ngqo?
Akukho ukulingana okuzenzakalelayo okucatshangelwayo. Umehluko kagesi, ukujiya, ithusi, ukucubungula kanye neziqu kumele ubuyekezwe futhi uvunyelwe.
Ingabe i-Highleap ingakwazi ukuthola izingxenye eziphelelwe yisikhathi zokuhlanganisa?
I-Highleap ingabuyekeza izinketho zokuthola ulwazi, kodwa ukutholakala, ubuqiniso, umjikelezo wokuphila kanye nezinye izindlela ezivunyiwe kumele kuvunyelwane ngazo nekhasimende.
Ingabe i-Highleap ingakwazi ukusekela amaqoqo amancane esikhathi esizayo?
Yebo, ngamarekhodi okubuyekezwa alawulwayo, ukuhlela ukuqhubeka kwezinto ezibonakalayo, ukugcinwa kwamathuluzi/idatha kanye nokubuyekezwa kwezentengiselwano okuphindaphindiwe.
Yini edingekayo ukuze ucaphune indawo ye-TLX-0 noma isakhiwo sesevisi?
Nikeza wonke amafayela alawulwayo, amarekhodi ezinto zangaphambilini kanye ne-stackup, ulwazi lwebhodi olwaziwayo, idatha ye-BOM/yokuhlanganisa, izinqubo zokuhlola, ubuningi kanye negunya lezinye izindlela zezinto noma izingxenye.
Ingabe i-Highleap inikeza ukwesekwa kokwehluleka kanye nokwesekwa kwangemva kokuthengisa?
Yebo. I-Highleap ingabuyekeza amarekhodi ezindawo, izinto zokwakha, ukuhlanganiswa kanye nokuhlolwa, isekele ukulawulwa kanye nesenzo sokulungisa, futhi isebenzise izinguquko ezivunyiwe ngaphansi kokulawulwa kokubuyekezwa.
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Ungasithola kanjani isilinganiso sama-PCB
Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:
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- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha
Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.
