Isilinganiso Sentengo Nokukhiqiza se-Taconic TLX PCB
I-Highleap Electronics inikeza izingcaphuno zentengo ze-Taconic TLX PCB zama-prototypes, amabhodi okuqinisekisa i-antenna kanye ne-microwave, ama-oda esevisi yakudala kanye nokukhiqizwa okuphindaphindiwe. Isilinganiso singafaka ukuthengwa kwezinto, ukwenziwa kwe-RF, ukuhlolwa okulawulwayo, ukuhlanganiswa kwe-PCB, ukuhlolwa okuchazwe ngamakhasimende, ukupakisha kanye nokulethwa kwamanye amazwe.
Intengo ye-TLX evumelekile idinga ibanga eliqondile kanye nokwakhiwa. I-TLX-8 yamanje kanye ne-TLX-0 yakudala inemibandela ehlukile yokuhlinzeka, imibhalo kanye neziqu. I-Highleap ikhomba umzila wezinto ezilawulwayo ngaphambi kokubala ukusetshenziswa kwephaneli, izindleko zokukhiqiza kanye nesikhathi sokuhola.
Izici Zomndeni Wezinto Ezibalulekile ze-TLX Ezishintsha Izindleko
I-AGC TLX-8 yamanje iyinto ye-PTFE elukiwe ebekwe ekwakhiweni kwemiklamo ye-microwave enezinga eliphansi, ama-antenna kanye nezingxenye ezingasebenzi. I-AGC ishicilela i-Dk 2.55 ± 0.04 kanye ne-Df 0.0018. Amabanga e-TLX akudala kumele acashunwe kusukela ekucacisweni kwekhasimende elilawulwayo ngoba ukujiya, ithusi kanye nokutholakala kungase kungafani ne-TLX-8 yamanje.
| Isici sezindleko | Kungani intengo ye-TLX ishintsha | Ukwelashwa kwekhotheshini |
|---|---|---|
| Izinga/isimo esiqondile | Izinto zamanje nezesikhathi esidlule zinezindlela ezahlukene zokuthenga kanye nemibhalo. | Isitoko sesifundazwe, i-MOQ, isikhathi sokukhokha, izitifiketi kanye nezinye izindlela ezivunyiwe ngokwehlukana. |
| Ubukhulu be-dielectric/ithusi | Inhlanganisela ekhethekile ithinta inani lokuthenga, i-geometry ye-impedance kanye ne-etch yield. | Caphuna ukwakheka okuqondile kunesilinganiso sendawo yesikwele se-TLX ejwayelekile. |
| Usayizi wephaneli kanye nokusetshenziswa kwayo | Amasekethe amakhulu e-antenna noma ukusebenza kahle okuphansi kokwakha izidleke kwandisa ukusetshenziswa kwe-laminate. | Ukubuyiselwa kwamaphaneli kanye nokwehlukaniswa kwenani lapho kunciphisa khona izindleko kakhulu. |
| Izidingo zokwamukelwa kwe-RF | Ubukhulu obuqinile, amakhuphoni, ukuhlolwa kwe-PIM noma kwe-RF kwengeza ukuhlolwa okulawulwayo kanye nezindleko zokulungiswa. | Izindleko zokusetha zesikhathi esisodwa ezihlukile, ezesihloko sokuqala kanye nezokuqinisekisa eziphindaphindayo. |
Sebenzisa ikhasi lomkhiqizo elisemthethweni le-AGC TLX-8 ukuthola umongo wamanje womkhiqizo kanye nesiqondiso sezindleko ze-PCB ezivame kakhulu ze- Highleap zabathuthukisi bezindleko zokukhiqiza ezibanzi.
Intengo ye-Taconic TLX PCB: Ibanga Eliqondile kanye Nokwakhiwa
“Intengo ye-Taconic TLX PCB” akuyona intengo eyodwa yezinto ezibonakalayo. Imidwebo ye-TLX ingacacisa ibanga elidala njenge-TLX-0, ukwakhiwa kwe-TLX-8 yamanje, noma incazelo yangaphakathi yekhasimende. I-Highleap iqinisekisa kuqala ibanga elisemthethweni, ubukhulu be-dielectric, ithusi, usayizi webhodi, ubuningi kanye nezitifiketi ngaphambi kokufaka intengo.
Lokho i-Highleap engakufaka ku-TLX Quote
| Indawo yephrojekthi | Ukusekelwa kwephrojekthi ye-Highleap |
|---|---|
| Umzila wezinto ezibonakalayo | Izinga lamanje noma elidala, ukujiya, ithusi, i-MOQ, izitifiketi kanye nenqubomgomo yokufaka esikhundleni |
| Ukwakhiwa kwe-PCB | I-CAM, amathuluzi, i-RF etching, i-PTH, izici zemishini, ukuhlolwa kukagesi kanye nokuhlolwa kokugcina |
| Ubufakazi bekhwalithi | Idatha yobukhulu obubucayi, amarekhodi e-impedance/PIM/RF kanye nokubika kwesihloko sokuqala uma kuchaziwe |
| Umhlangano we-PCB | Izingxenye, i-stencil/NRE, i-SMT/THT, izixhumi ze-RF, izihlangu kanye nokuhlanza |
| Testing | Ukuhlela, izinhlelo zokusebenza kanye nokuqinisekiswa kwe-RF okuchazwe ngamakhasimende |
| Ukulethwa/ngemuva kokuthengisa | Ukupakisha, ukuqagela kwempahla, ukuthunyelwa okuhlukanisiwe, ukulandeleka kanye nokulawulwa kokushintsha kwe-oda eliphindaphindwayo |
Amandla Okukhiqiza e-Highleap Rigid RF PCB
Imikhawulo yefektri eshicilelwe ngezansi ichaza imvilophu yenqubo ye-rigid-PCB esetshenziselwa ikhotheshini ye-TLX. Ibanga le-TLX elikhethiwe, ukujiya kwezinto, ithusi, usayizi webhodi kanye nokubekezelelana kwe-RF kunquma ukuthi yimiphi imikhawulo engahlanganiswa nokuthi ithinta kanjani intengo. Bheka ithebula eliphelele lamandla e-Highleap rigid PCB ukuze uthole imininingwane yefektri eshicilelwe.
| Into yokukhiqiza | Amandla e-Highleap ashicilelwe | Isimo sephrojekthi ye-RF/PTFE |
|---|---|---|
| Isibalo esiphezulu sesendlalelo | Kufika ku-60 izendlalelo | Inani lezingqimba ze-RF/PTFE ethile noma i-hybrid stackup liyaqinisekiswa ngemuva kokuncishiswa, ukubhaliswa, ukubuyekezwa kwezinto kanye nokwengezwa kwezinto. |
| Umkhondo/isikhala esincane esingaphakathi | 2/2 mil (0.05/0.05 mm) | I-geometry ye-RF ekhishwe incike nasekujiyeni kwethusi, uhlobo lwe-foil, isinxephezelo se-etch kanye nokubekezelelana kobukhulu obubalulekile. |
| Umkhondo/isikhala esincane esingaphandle | 2/2 mil (0.05/0.05 mm) | Izikhala ezincane ze-RF kanye nezakhiwo ezihlangene zidinga izindlela zokuhlola kanye nokwenzeka kwephrojekthi ethile. |
| Ibanga lokujiya kwebhodi | I-0.2-8.0 mm | Ubukhulu obutholakalayo bokwakhiwa kwe-Taconic/AGC okuqanjwe ngegama buxhomeke ku-laminate gauge, indlela yokubopha kanye ne-stackup evunyiwe. |
| Ukubekezelelana kobukhulu bebhodi | ± 0.1 mm ngaphansi kuka-1.0 mm; ± 10% ku-1.0 mm nangaphezulu | Ukuqaliswa kwesixhumi se-RF kanye nezixhumi ezivalekile kufanele kuveze noma yiziphi izidingo eziqinile ezingeni lomkhiqizo. |
| Usayizi webhodi oqediwe okungenani | 10 × 10 mm | Amasekethe amancane angadinga ukulethwa kuphaneli yokukhiqiza noma i-array ukuze kwenziwe futhi kuhlanganiswe. |
| Usayizi webhodi ophelele oqediwe | 22.5 × 47.5 in (571.5 × 1206.5 mm) | Amabhodi e-PTFE amakhulu adinga ukubuyekezwa okuhlukile kosayizi weshidi lezinto, ukubhaliswa, ukuba yisicaba, ukuhanjiswa kanye nokuthunyelwa. |
| Indandatho encane yomshini wokubhoboza / indandatho ejikelezayo | 0.15 mm / 0.127 mm | Umklamo wokugcina uncike ekujiyeni kwebhodi, isilinganiso sesici, isidingo sokufaka iplati kanye nenqubo yokubhoboza eqondene nezinto ezithile. |
| Indandatho encane ye-laser drill / indandatho ye-annular | 0.075 mm / 0.075 mm | Ama-microvia e-laser angaphansi kobukhulu be-dielectric, ukwakheka kwe-capture-pad, ukwakheka kwethusi kanye nokubuyekezwa kwe-sequentially-lamination. |
| Isilinganiso sesici sokubhoboza ngomshini | Kuze ku-20: 1 | Isilinganiso esingafinyeleleka sokwakhiwa kwe-RF/PTFE kumele siqinisekiswe ngosayizi wembobo oqediwe, ukujiya kwebhodi kanye nesidingo sokufaka iplati. |
| Isilinganiso sesici se-laser-drill | 1:1 | I-Microvia geometry ikhishwa kuphela ngemva kokubuyekezwa kwe-stackup nokuthembeka. |
| Ithusi elingaphakathi/elingaphandle eliphezulu | Kufika ku-10 oz | Ithusi elikhulu alikwazi ukuhlanganiswa ngokuzenzakalelayo nomkhondo/isikhala esihle kakhulu noma yonke into eyakhiwe nge-PTFE. |
| Ukubekezelelana kwe-PTH / NPTH | I-PTH ±0.075 mm; I-NPTH ±0.05 mm | Izimbobo zokuxhuma kanye ne-RF grounding kufanele zibone ububanzi obuqediwe kanye nanoma yisiphi isidingo sokulingana okuqinile. |
| Ukubekezelelana kwe-contour | ± 0.1 mm | Ukuqaliswa komphetho, imigodi, izikhala kanye nezindawo zokuxhuma kungadinga uhlelo olukhethekile lokulawula ubukhulu. |
| Ukubekezelelana kwe-impedance okulawulwayo | I-single-end kanye ne-differential: ±5 Ω ku-≤50 Ω; ±7% ngaphezu kwama-50 Ω | Ukubekezelelana okucashuniwe kusebenza endleleni evunyiwe yokuqoqa ama-stackup, isu lekhuphoni kanye nendlela yokulinganisa. |
| Ukuqedwa kwendawo okutholakalayo | I-ENIG, i-ENEPIG, i-OSP, i-HASL, isiliva lokucwilisa, ithini lokucwilisa, igolide elikhanyayo, iminwe yegolide eqinile negolide | Ukukhethwa kokuqeda kubuyekezwa ngokulahlekelwa yi-RF, ukushiswa kwe-solder, ukubopha ucingo, ukuxhumana kwesixhumi kanye nezidingo zemvelo. |
Isaziso sokuhlanganiswa kwamandla: amanani etafuleni ayimingcele yamandla efektri ngayinye. Inani lezingqimba, i-geometry engu-2/2 mil, ithusi elingu-10 oz, usayizi wephaneli ophezulu, isilinganiso sesici esingu-20:1 kanye nokwakhiwa kwebhodi elincane kakhulu akucatshangwa ukuthi kungafezeka ngasikhathi sinye. I-Highleap iqinisekisa inhlanganisela esebenzisekayo ngemuva kokubukeza izinto eziqondile, i-stackup, ithusi, i-drill, ukubekezelelana kwe-RF, ukuqeda kwendawo kanye nephakheji yokuhlanganisa.
Iphothifoliyo yamanje ye-AGC RF/microwave ikhomba i-TLX-8 njengento ye-antenna enevolumu ephezulu ene-Dk 2.55 ±0.04 kanye ne-Df 0.0018, kuyilapho izinkomba zobuchwepheshe zesikhathi esidlule zifaka ezinye izinkomba ze-TLX. I-Highleap ayisebenzisi amanani e-TLX-8 noma i-geometry yomdwebo we-TLX-0 ngaphandle kwemvume.
| Okufakiwe okudingekayo | Kungani ishintsha intengo |
|---|---|
| Ibanga eliqondile le-TLX | Inquma isimo samanje/sefa, umthombo, ukucubungula kanye neziqu. |
| Ubukhulu be-dielectric kanye nokubekezelelana | Ilawula i-SKU yezinto ezibonakalayo, i-MOQ, i-geometry ye-RF kanye nokutholakala kwephaneli. |
| I-foil yethusi kanye nesisindo | Ishintsha izindleko ze-laminate, ukulahlekelwa ngumqhubi, inqubo yokusika kanye nobukhulu obuqediwe. |
| Ubukhulu bebhodi nephaneli | Inquma ukusetshenziswa nokuphathwa kwezinto. |
| Ukubekezelelana kwe-RF kanye nokuhlolwa | Ingeza ubunjiniyela, amakhuphoni, ukulinganisa kanye nezilawuli zokukhiqiza. |
| Ububanzi bokuhlanganisa/bokuhlola | Kungadlula izindleko zebhodi elingenalutho kuye ngokuthi i-BOM kanye nezinsimbi zisebenza kanjani. |
Ukuthengwa Kwezinto Ezibalulekile, i-MOQ, kanye Nengozi Yokunikezwa Kwempahla Eyifa
Ikhotheshini ye-Highleap ihlukanisa isimo sezinto zokwakha. Intengo yeyunithi ephansi ayisizi uma izinga elishiwo lingakwazi ukusekela isibikezelo noma umhlinzeki engakwazi ukunikeza amadokhumenti ezindawo adingekayo.
Amanani I-TLX Yefa Ngaphandle Kokufihla Ingozi Yokunikezwa
Ngebanga elinqunyelwe lefa, i-Highleap ikhombisa ukuthengwa kwezinto kanye nesivuno esingasetshenziswa ngokwehlukile ekukhiqizweni. Lokhu kuvimbela ikhotheshini esekelwe ezintweni ezingatholakali. Lapho ikhasimende livumela enye indlela yamanje, imizila yokuqala neyenguquko icashunwa ngokuqagela kobunjiniyela kanye neziqu okuhlukile.
- isitokwe samanje esijwayelekile noma izinto ezi-oda zasefektri;
- ukujiya okungekho ezingeni noma ithusi elinenani elincane lokuthenga;
- isitoko esidala esidinga ubuwena kanye nokuqinisekiswa kwesimo;
- izinto ezinikezwa amakhasimende ezidinga ukwamukelwa okungenayo;
- okunye okuvunyelwe okudinga ukukhishwa okusha kanye nobunjiniyela;
- izinto ezibekelwe ukukhiqizwa okuphindaphindwayo okuhleliwe.
Ukuhlela ukuthengwa kwempahla kulandela isiyalo sokukhetha izinto zokwakha ezintweni ze-Taconic PCB kanye nokuqagela kwezentengiselwano ezicaphunweni zesabelomali ezinembile . I-Highleap ithi izinto ze-MOQ, inani elingasetshenziswa, ububanzi besitifiketi kanye nesikhathi sokuhola esinikezweni.
Izindleko Zokukhiqiza: Okungaphezu Kwendawo Yebhodi
Intengo yokwenziwa kwe-TLX PCB ithintwa yi-geometry ye-RF, ukubhoboza, ukucwebezela, ukuqeda ubuso, umzila kanye nobufakazi bekhwalithi. Amanani aphezulu kakhulu ahambisana nokugeleza kokukhiqiza okukhiqizwa kusuka kuphakheji yangempela yedatha.
| Isici sokukhiqiza | Indlela yezindleko | Ukuthuthukisa okungenzeka |
|---|---|---|
| Ukusetshenziswa kwephaneli | Imfucuza yezinto ezibonakalayo kanye nezingcezu ngephaneli ngayinye | Lungisa ama-rails, ukujikeleza noma i-array lapho ukuqondiswa kwe-RF kuvumela khona. |
| Ukubekezelelana kwe-etch | Ukulawulwa kwenqubo kanye nokukhiqiza emigqeni/izikhala ezibalulekile | Hlukanisa ubukhulu be-RF obubalulekile emisebenzini yobuciko evamile. |
| Ukuminyana okuhamba phansi | Inani lokubhoboza, ukuguguleka kwamathuluzi, ukubekwa kwamapulangwe kanye nokuhlolwa kukagesi | Hlanganisa ubukhulu bokubhoboza kuphela ngemvume yomklamo. |
| I-PTH noma imigodi ekhethekile | Ukulungiselela nokuhlola okuhambisana ne-PTFE | Sebenzisa izilinganiso zobukhulu kanye nokubekezelelana okungenziwa. |
| Ukuqedwa kwendawo | I-Chemistry, ukucubungula okukhethayo, isitoreji kanye nomphumela we-RF | Khetha ukuqeda kusukela ekuhlanganisweni nasezidingweni ze-RF. |
| Imibiko/ukuhlolwa | Amakhuphoni, ukulinganisa, izingxenye ezincane, izinto ezifakiwe ze-PIM/RF | Chaza ubufakazi obudingekayo ngaphandle kokuhlolwa okuphindwe kabili. |
Ukuze uthole izishayeli zezindleko ze-RF ezibanzi, buyekeza izindleko ze-PCB ezivame kakhulu kanye nokubekezelelana kwe-RF PCB . I-Highleap ingabuyisa iziphakamiso zokwehlisa izindleko ngaphandle kokushintsha umsebenzi we-RF okhishwe.
Intengo Yesibonelo Nevolumu Yakhiwe Ngendlela Ehlukile
Intengo yesibonelo ithwala ubunjiniyela besikhathi esisodwa, ukuthengwa kwezinto kanye nokusetha inani elincane. Intengo yobuningi iyazuza ngokufakwa kwamaphaneli okuzinzile, izinto ezigciniwe, amathuluzi aphindaphindwayo kanye nokukhiqizwa okuhleliwe. Iqoqo lesevisi ye-TLX-0 elidala lingase lihlale lidinga ukusetha okuningi ngisho noma umklamo umdala.
| Icala lezentengiselwano | Isakhiwo senani | Okufakiwe komthengi okunconyiwe |
|---|---|---|
| Iphrothokholi yokuqala | Ubuncane bezinto ezibonakalayo, i-CAM/amathuluzi, ukwenziwa kanye nobufakazi obuyisisekelo | Inani elilodwa noma amabili kanye nokulethwa okuqondiwe. |
| Ukuqinisekiswa kobunjiniyela | Imibiko yohlobo kanye nemibiko yesihloko sokuqala kanye nokuhlolwa | Uhlelo lokwamukela kanye nokuma kokubuyekezwa. |
| I-PCBA yokushayela | Ibhodi elingenalutho, i-BOM, ukusetha, ukuhlanganisa, ukuhlola, ukuhlela kanye nokuhlola | Iphakheji ephelele yokuhlanganisa kanye nezinye izingxenye ezishintshanayo. |
| Ukukhiqizwa kwevolumu | Ukwephulwa kwenani, ukubikezela, ukubhukha izinto kanye nokukhishwa okuhleliwe | Isidingo saminyaka yonke kanye nesivinini sokulethwa. |
| Iqembu lesevisi yakudala | Ukutholwa kwedatha/izinto ezibonakalayo, ukusetha kanye nokukhiqizwa kwenani elincane | Isidingo esisele sempilo yonke esilindelekile. |
Ngezindleko zokuhlanganisa, i-Highleap isebenzisa izici ezichazwe ezindleleni zokuhlanganisa ze-PCB futhi ingacaphuna umsebenzi wevolumu ephansi ngokusebenzisa ukuhlanganiswa kwe-PCB kwevolumu ephansi.
Isikhathi Sokuhola se-TLX kanye Nokukhiqizwa Okusheshayo
Ishejuli ye-TLX ezinikele incike kuqala ebangeni kanye nesimo sezinto ezibonakalayo. I-TLX-8 yamanje, i-TLX-0 yakudala, ukujiya okungekho ezingeni kanye ne-laminate enikezwa amakhasimende kulandela izindlela ezahlukene ezibalulekile. Izingcaphuno ze-Highleap zobunjiniyela, izinto zokwakha, ukwenziwa, ukuhlanganiswa kanye nezinyathelo zokuhlola ngokwahlukana.
Ngemva kokuthola idatha ephelele, i-Highleap iqinisekisa ukulungela izinto zokwakha, ubunjiniyela, ukwenziwa, ukuhlanganiswa kanye nokuhlolwa ngaphambi kokulungisa ukulethwa. Ukukhiqizwa okubalulekile kungacashunwa ngendlela yezinsizakalo ze-PCB ezisheshayo , kodwa isikhathi sokuhola izinto zokwakha kanye nokuvunyelwa kwamakhasimende kusalokhu kuyimingcele ebonakalayo.
- ukuhlela okujwayelekile kwezinto ezikhishwe kanye nedatha ephelele;
- ukukhiqizwa okubalulekile ngokusebenzisa ukukhiqizwa kwe-PCB okusheshisiwe lapho izinto sezilungile khona;
- ukuthunyelwa kwento yokuqala noma okungenalutho ebhodini lokuqala ukuze kuqinisekiswe i-RF kusenesikhathi;
- ukukhiqizwa okuhlukanisiwe lapho izingxenye noma izinto zokuhlola zisala ngemuva kokwenziwa kwebhodi elingenalutho;
- ukuhlela isibikezelo/izinto ezigciniwe ukuze kuhlinzekwe ngokuphindaphindiwe okuzinzile.
Intengo yokusheshisa ibonisa imisebenzi yangempela ebaluleke kakhulu kanye nomthelela womthamo. I-Highleap ayifaki "iphesenti lokushesha" elijwayelekile ngaphambi kokuqinisekisa ukuthi izinto zokwakha, ukwenziwa, ukuhlanganiswa noma ukuhlolwa kuyisithiyo sangempela.
Thola Isilinganiso Se-TLX PCB Ne-Assembly Esiqinile
Thumela ibanga eliqondile le-TLX, idokhumenti yezinto ezibonakalayo, i-stackup, i-Gerber/ODB++, umdwebo, idatha yokubhoboza/yomzila, ithusi, i-RF geometry/impedance, ukuqeda, amakhefu enani, usuku oluqondiwe nendawo yokulethwa. Engeza i-BOM, i-centroid, imidwebo yokuhlanganisa, i-firmware kanye nokuhlolwa kwe-PCBA. Thumela ngesilinganiso esisheshayo se-Highleap noma uxhumane ne-Highleap.
Ukuze uthole ukukhiqizwa kwe-TLX-8 kwamanje, bheka i-Taconic TLX-8 PCB . Ukuze uthole umdwebo we-TLX-0 wesikhathi esidlule, sebenzisa isevisi yokuqhubeka kwe-TLX-0 PCB.
Ingabe i-Highleap inganikeza intengo ye-TLX PCB ngaphandle kwebanga eliqondile?
Isabelomali esincane kuphela. Intengo eqinile idinga ibanga elisemthethweni, ukujiya, ithusi, idatha yebhodi, ubuningi, ukuqeda kanye nezidingo zokuhlola.
Kungani i-TLX yakudala ingabiza ngaphezu kwezinto zamanje?
Isitoko esilinganiselwe, ukuthengwa okuncane, ukuphathwa okukhethekile, amadokhumenti kanye nokusethwa kweqembu elincane kungabusa intengo yamayunithi.
Ingabe i-Highleap inganciphisa izindleko ze-TLX PCB?
Yebo, ngokusebenzisa amaphaneli, izakhiwo ezijwayelekile ezitholakalayo, ukubekezelelana okufanele, ukuthengwa kwezibikezelo kanye ne-PCBA ehlanganisiwe—kuncike ekuvunyelweni kwamakhasimende.
Ingabe i-Highleap ingaletha ikhotheshini eYurophu noma eNyakatho Melika?
Yebo. Nikeza indawo oya kuyo kanye nokukhetha kwe-Incoterm ukuze kuchazwe ukupakisha, ukuthutha kanye nokuqagela kwentela.
Yiluphi ulwazi oludingekayo ngentengo ye-TLX PCB yenkampani?
Nikeza ibanga eliqondile, ukujiya, ithusi, i-Gerber/ODB++, imidwebo, i-stackup, i-RF kanye nokubekezelelana kwemishini, ubuningi, ukulethwa okuqondiwe, i-BOM, amafayela omhlangano kanye nezidingo zokuhlola.
Ingabe i-Highleap ingacaphuna i-PCB engenalutho kanye ne-PCBA njengezinketho ezihlukene?
Yebo. I-Highleap ingabuyisa ibhodi elingenalutho, i-consigned assembly, i-turnkey assembly kanye nezinketho zokuhlola ukuze ukuthenga kuqhathanise ububanzi bokukhiqiza obuphelele.
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Uhlu lokuqukethweRF-35 vs RO4350B Ukuthengwa kanye...
Ungasithola kanjani isilinganiso sama-PCB
Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:
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- Gerber, ODB++, noma .pcb, spec.
- Uhlu lwe-BOM uma udinga ukuhlangana
- Ubuningi
- Isikhathi sokushintsha
Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.
