Umkhiqizi we-Taconic TSM-DS3 PCB we-Thermally Stable RF Multilayers

I-Highleap Electronics yakha futhi ihlanganise ama-PCB e-Taconic TSM-DS3 ukuze asetshenziswe kuma-radar, ama-array ahlukaniswe ngezigaba, ama-ATE, ama-amplifier, izihlungi, i-aerospace RF, kanye nama-multilayer amakhulu. Lesi silinganiso sigxile ekwakheni okuphelele—ama-core e-TSM-DS3, izinto zokubopha, ukujiya okucindezelwe, ukubhaliswa, ukubhoboza, ukubopha, amakhuphoni, ukuhlanganiswa, kanye nokwamukelwa kwemvelo—hhayi nje ishidi ledatha le-laminate.

Usekelo lokukhiqiza lwe-Highleap: I-Highleap ibuyekeza izendlalelo eziningi ze-TSM-DS3 RF kusukela ekwakhiweni okuphelele, okuhlanganisa i-core kanye nesistimu yokubopha, ukujiya okucindezelwe, ukubhaliswa, ukubhoboza, ukubopha, amakhuphoni, ukuhlanganiswa, kanye nokwamukelwa kwemvelo. Amaphrojekthi athintana nokushisa noma athintana nokuxhumana okuyinkimbinkimbi athola isibuyekezo senqubo ngaphambi kokuba umzila wokwakha uqinisekiswe.

Ububanzi Bokwakha I-TSM-DS3 Multilayer e-Highleap

I-Highleap isekela izingqimba eziningi ze-RF ezilahlekelwa kancane ezakhiwe nge-TSM-DS3, okuhlanganisa i-PTFE noma ukwakhiwa kwe-hybrid, i-impedance elawulwayo, i-lamination elandelanayo, izakhiwo eziqinile, kanye nezakhiwo zokuxhumanisa ezithuthukisiwe phakathi kwezingqimba lapho kubuyekezwa i-stackup ephelele. Amaphaneli amakhulu, imigqa yezibopho engavamile, isikhala esincane se-dielectric, kanye nokubhaliswa okubalulekile kwe-RF kuhlolwa ngokuqhathaniswa nokwakhiwa kwangempela kuneshadi lamandla ajwayelekile.

Okubalulekile: Ukwakhiwa kwe-TSM-DS3 kungasekelwa kusuka kumasampula obunjiniyela kanye nezindawo zokufaneleka ngokukhiqizwa kwevolumu ephindaphindwayo. Amaphrojekthi anezidingo ezidinga ukushisa, isigaba, ukuthembeka, noma ukuxhumana athola isibuyekezo senqubo ngaphambi kokuba kuqinisekiswe indlela yokugcina yokwakha.

Uma i-TSM-DS3 iyinto engcono kakhulu ye-RF

I-Taconic TSM-DS3 iyi-laminate ye-PTFE ephansi, egcwele i-ceramic enenani elincane lokuqinisa i-fiberglass. I-AGC ishicilela i-Dk ejwayelekile engu-3.0 ± 0.05, ukuhanjiswa kokushisa okungaba ngu-0.65 W/m·K, futhi igcizelela ukuzinza kwe-dielectric ngaphezu kokushisa. Inani layo lezentengiselwano aligcini nje “ngokulahlekelwa okuphansi.” Kuyinhlanganisela yokubikezela kwe-RF, ukuziphatha kokushisa, ukuqinisa, kanye nokufaneleka kwezingqimba eziningi.

I-TSM-DS3 ivame ukuba yigugu ngemva kokuba umklami ethole inkinga yesistimu—isigaba esincike ekushiseni, ukuzwakala okungazinzile, ukubhaliswa kuphaneli enkulu, noma i-RF multilayer enzima—hhayi ngoba nje umkhiqizo usebenza ngesivinini esiphezulu.

Amakhono Okukhiqiza Ezendlalelo Eziningi ze-TSM-DS3

I-Highleap ingabuyekeza amabhodi e-RF aqinile, ukwakhiwa kwe-TSM-DS3 okunezingqimba eziningi, kanye nama-stackups e-hybrid. Amaphrojekthi angafaka i-fastRise 27 noma enye into yokubopha evunyiwe, i-lamination elandelanayo, efakwe izimbobo, izakhiwo ezingaboni noma ezibhobozwe nge-laser, i-impedance elawulwayo, kanye ne-turnkey assembly. Into ngayinye iqinisekiswa ngokumelene nomklamo wangempela; alikho ikhasi lezinto ezijwayelekile elingasungula inani lezingqimba elingenzeka noma ngesakhiwo.

Iphrothokholi, ivolumu ephansi, kanye nokukhiqizwa okuphindaphindiwe kungacashunwa. Ukushintshela ekukhiqizeni kudinga ubunikazi bezinto eziqandisiwe, ukwakhiwa kwabezindaba, idatha yokulinganisa, kanye nezindlela zokukhulula; ngaphandle kwalokho ingxenye ngayinye iba ukuhlolwa okusha.

Izidingo Zokuklama Zokusebenza Kwe-RF Okuzinzile Kokushisa

Inkulumo ethi “i-laminate eqinile ekushiseni” ayichazi ukusebenza komkhiqizo. Impendulo yebhodi nayo ithintwa ukwanda kwethusi, ukucindezeleka kwendlu, amalunga e-solder, izixhumi, izingxenye, ukuhamba komoya, kanye nokusatshalaliswa kokushisa. Ngakho-ke i-RFQ kumele ihumushe imfuneko yemvelo ibe yibhodi elilinganisekayo noma imigomo yomkhiqizo.

Nikeza lezi zinto ezifakwa ngogesi kanye nokushisa

• ububanzi bokushisa bokusebenza nokugcina;
• ukuvumela ukuguquka kwe-impedance, isigaba, ukubambezeleka, i-resonance, noma ukushintsha kokulahlekelwa kokufakwa phezu kokushisa;
• ububanzi bemvamisa, izinga lamandla, umjikelezo womsebenzi, kanye nemithombo yokushisa yendawo;
• i-reference-plane, i-connector, i-antenna, kanye nezakhiwo zokulinganisa;
• izindawo zokusebenzelana ezishisayo, izithwali zensimbi, izisabalalisi zokushisa, i-torque yokufaka, kanye nemikhawulo yokuvala;
• ukuhlolwa kokushisa okudingekayo, ukushaqeka, ukusha, noma ukusebenza kahle;
• ukuhambisana kwekhuphoni nomkhiqizo kanye nendlela yokususa ukushumeka kwekhasimende.

I-Highleap ingadala ngokumelene nalezi zidingo, kodwa i-RF yezinga lesistimu kanye ne-thermal qualification kusalokhu kungumsebenzi wobunjiniyela ohlanganyelwe. Umphumela we-bare-board impedance ekushiseni kwegumbi awukwazi ngokwawo ukufakazela ukusebenza kwe-phased-array kulo lonke uhla lokusebenza.

Ukwakha i-TSM-DS3 nge-fastRise 27 noma ezinye izinto zokubopha

Ku-PCB ye-RF enezingqimba eziningi, umugqa wesibopho oqinisiwe ungqimba lukagesi. Ubukhulu bawo buyakhiwa ngesikhathi se-lamination futhi buxhomeke ekwakhiweni kwangaphambilini, iphesenti lethusi, i-topography, ingcindezi, izinga lokushisa, i-vacuum, usayizi wephaneli, kanye nokugeleza kwe-resin. Ubukhulu beshidi elingavuthiwe abuyona i-dielectric space eqinisekisiwe.

1. Qinisekisa ukuhambisana. Qinisekisa izinto zokubopha ezikhethiwe ngezindawo ze-TSM-DS3, ukwelashwa kwethusi, umjikelezo wokwelapha, umlando wokushisa, kanye nezinto eziseduze.
2. Imephu yesidingo se-resin. Buyekeza ukuminyana kwethusi, izindawo ezinkulu ezicacile, imigodi, izindawo ezigcwala kalula, kanye nokuphakama kwesici sendawo.
3. Setha ama-targets okujiya okucindezelwe. Sebenzisa ukwakheka kwe-ply okutholakalayo kanye nedatha yokukhiqiza esikhundleni senani elilinganiselwe.
4. Hlela i-lamination elandelanayo. Bala umjikelezo ngamunye wokucindezela kanye nokuvezwa kokushisa okuqongelelekayo kwama-cores, izici ezifakwe ama-plated, nama-microvias.
5. Lawula ukunyakaza okunesilinganiso. Sebenzisa imigomo yokulinganisa kanye nokubhalisa ngokusekelwe kuphakheji ephelele yabezindaba.
6. Amakhuphoni ahlobene. Qinisekisa ukuthi ikhuphoni libona izinto ezifanayo, ithusi, umjikelezo wokucindezela, kanye ne-plating njengesekethe esebenzayo.

Ukuze uthole imininingwane eyengeziwe, bheka i-fastRise 27 prepreg ka-Highleap kanye nomhlahlandlela we-RF nge-design.

Izicelo: Lokho Okuxazululwa Yizinto Ezibalulekile Kumkhiqizo

Ama-elekthronikhi e-Phased-array kanye ne-radar

Ukusebenza kwe-array kuncike ekuqineni kwesigaba, i-geometry yokuphakelayo ephindaphindwayo, ukuziphatha kwezinga lokushisa, kanye nokubhaliswa kuphaneli enkulu. I-TSM-DS3 ingasekela lezi zidingo lapho ikhasimende lilawula i-geometry yezinto, izixhumi, i-radome, ukulinganiswa, kanye ne-gradients yokushisa yezinga lomkhiqizo.

Izakhiwo ze-interface ye-ATE kanye ne-probe-card

Usayizi webhodi elikhulu, inani eliphezulu lezingqimba, ama-vias aminyene, i-impedance elawulwayo, ukuthamba komshini, kanye nokujikeleza kokushisa kungenzeka ndawonye. Umklamo kufanele usho ukuthi yiziphi izilinganiso kanye nezindlela zikagesi ezilawula ukunemba kwemishini; ukusebenzisa ukubekezelelana okuqinile yonke indawo kwandisa izindleko ngokungadingekile.

Ama-amplifier, izihlungi, kanye ne-RF yendiza

Ukulahlekelwa okuphansi kanye nokuzinza kwezinga lokushisa kunganciphisa ukukhukhuleka, kodwa ukuminyana kwamandla, isisekelo, ukuthembeka kwemigodi ehlanganisiwe, ukufakwa kwemishini, kanye nokuhlanzeka kwenhlangano kusalokhu kubalulekile. I-laminate ingenye yezinhlelo zokulawula.

Izingqimba eziningi ze-RF zefomethi enkulu

Ukuqina kanye nokuziphatha kwezinto ezibonakalayo kungasekela ukwakheka okufuna ubukhulu obuhlukahlukene, kodwa ibhalansi yethusi, ukulandelana kokucindezela, ukukala amaphaneli, ukubhoboza, kanye nokusekelwa kokuhlanganiswa kumele kwakhiwe ngokuqondile ngobukhulu bebhodi.

Izindleko kanye Nezinto Ezithinta Isikhathi Sokuhola

Isikhathi sokuhola sezinto zokwakha kanye nobuningi be-oda elincane kumele kuhlolwe ukwakhiwa okuqondile. I-Highleap ngeke icaphune uhlobo olubonakala lushesha kakhulu isebenzisa i-stackup eyodwa bese ihambisa umkhiqizo komunye buthule.

Okufanele Ukuthumele Ukuze Uthole Isilinganiso Se-TSM-DS3

Nikeza ibanga eliqondile le-TSM-DS3 kanye nobukhulu obuphakathi, uhlobo lwethusi kanye nesisindo, izinto zokubopha, i-stackup egcwele, ama-targets okujiya okucindezelwe, ithebula le-impedance, ububanzi bemvamisa, imikhawulo yesigaba noma yokulahlekelwa, izinga lokushisa lokusebenza, ngezakhiwo, ubukhulu bokubhalisa obubalulekile, usayizi webhodi nephaneli, ukuqeda kwendawo, ubuningi, isibikezelo, i-target yokulethwa, kanye nezidingo zekhwalithi/zokuhlolwa.

Ukuze uhlanganise, engeza i-BOM, i-centroid, imidwebo, imininingwane yesixhumi nesivikelo, izixhumi ezisetshenziswa ekushiseni, imikhawulo yokugeleza kabusha nokuhlanza, ukumboza, ukufinyelela kokuhlola, ulwazi lwe-fixture, iphrofayili yezemvelo, kanye nokulindela ukubika.

Umphumela owusizo ovela ku-Highleap yiphakheji yezinqumo zokukhiqiza: ukutholakala kwezinto ezibonakalayo, ukuhlanganiswa okuhlongozwayo, izinkinga zokukhiqiza, ukuvunyelwa kwamakhasimende okudingekayo, indlela yenqubo, ubufakazi bokuhlola/bokuhlola, izishayeli zezindleko, kanye nezingozi zesikhathi sokukhokha. Yilokho umthengi akudingayo ukuze anqume ukuthi ifektri ingawakha yini umkhiqizo.

Imibuzo Evame Ukubuzwa Yezentengiselwano

Ingabe i-Highleap ingakhiqiza i-PCB ye-Taconic TSM-DS3 enezingqimba eziningi?

Yebo, amaphrojekthi e-TSM-DS3 afanele anezingqimba eziningi kanye ne-hybrid angabuyekezwa. Ukwenzeka kokugcina kuncike ezintweni zokubopha, ukujiya okucindezelwe, inani lezingqimba, ubukhulu, ngezakhiwo, ukubhaliswa, ukuhlanganiswa, kanye nezidingo zokuhlola.

Ingabe i-TSM-DS3 ingcono kune-TLY-5?

Akuvamile. I-TSM-DS3 ivame ukukhethwa ngenxa yokuqina kwezinga lokushisa kanye nokubikezela kwezingqimba eziningi; i-TLY-5 iyakhanga kakhulu ngezakhiwo ze-Dk eziphansi kakhulu kanye ne-antenna elahlekelwa kancane noma i-mmWave. Khetha ngokwesidingo somkhiqizo, hhayi ngokwezinga elilula.

Ingabe i-fastRise 27 ingasetshenziswa njengezinto zokubopha?

Kungase kufanelane nokwakhiwa okuqinisekisiwe, kodwa ukuhambisana, inani lama-ply, isidingo se-resin, ukujiya okucindezelwe, umjikelezo wokucindezela, kanye nomlando wokushisa oqongelelekayo kumele kubuyekezwe ukuze kuhlanganiswe yonke i-stackup.

Yiziphi izivivinyo ezingafakwa?

Kuye ngephrojekthi, ikhotheshini ingafaka ukuhlolwa kukagesi, ukuhlolwa kobukhulu obubalulekile, ukususwa kwe-microsection, impedance, amakhuphoni e-resonator noma e-phase, ukujikeleza kokushisa, i-AOI/X-ray, ukuhlolwa kokusebenza, noma ukuhlolwa kwe-RF okuchazwe ngamakhasimende.

Intengo inqunywa kanjani?

Intengo incike ekwakhiweni kwezinto, usayizi webhodi, inani lezingqimba, imijikelezo yokucindezela, ngesakhiwo, ukubekezelelana okubucayi, ubuningi, ubunzima bokuhlanganiswa, kanye nobufakazi be-RF noma bezemvelo obudingekayo. Thumela iphakheji yedatha ephelele ukuze uthole ikhotheshini yenkampani.