Isevisi Yokubopha I-Taconic fastRise 27 Prepreg PCB kanye Nokwenziwa kwe-HDI

I-Highleap Electronics ibuyekeza i-Taconic fastRise 27 njengento yokubopha ngaphakathi kwe-RF multilayer ephelele noma i-HDI PCB. Sisekela ukubuyekezwa kobunjiniyela kwezinto ezihambisanayo eziyinhloko, ukujiya kwe-bond-line elungisiwe, ukugcwaliswa kwethusi, i-lamination elandelanayo , ama-microvia abhobozwe nge-laser, i-impedance elawulwayo, ukuhlanganiswa, kanye neziqu ezichazwe ngamakhasimende.

Ububanzi Bokwakha Okulungiselelwe Ngaphambi Kokuqala kwe-fastRise 27

I-Highleap ibuyekeza i-fastRise 27 njengengxenye yokwakhiwa okuphelele kwe-multilayer prepreg , okuhlanganisa ama-cores ahambisanayo, ukusatshalaliswa kwethusi, isidingo se-resin, ama-bond-line target acindezelwe, i-sequential lamination, izigaba ze-HDI, kanye ne-impedance elawulwayo. Lapho ukwakheka kudinga ukuxhumana okuthuthukisiwe noma kwanoma yiluphi ungqimba, ukulandelana kokucindezela okugcwele, ukuthembeka kwe-microvia, ukuhambisana kwezinto, kanye nobufakazi bokuhlola kuhlolwa ngaphambi kokuba umzila wokwakha uqedwe.

Okubalulekile: Lo msebenzi usekela ukwakheka kobufakazi kanye namasampula okufaneleka kanye nokukhiqizwa okuphindaphindiwe uma isakhiwo esivunyiwe sesiqandisiwe. Ukubuyekezwa kwasekuqaleni kubaluleke kakhulu ezintanjeni zokubopha ezingavamile, imijikelezo eminingi yokucindezela, ithusi eliqinile, noma izidingo zokuthembeka okuphezulu.

Kuyini i-fastRise 27—nokuthi Yini Oyithengayo Empeleni

I-Taconic fastRise FR-27-0040-43F iyi -prepreg ephansi, engaqiniswanga esetshenziselwa ukubopha ama-cores ahambisanayo ku-RF, i-microwave, i-mmWave, kanye nama-PCB e-lamination alandelanayo. I-AGC ishicilela i-Dk ejwayelekile engu-2.77, i-Df engu-0.0014, i-Tg ecishe ibe ngu-188°C, kanye nokuqhuba ukushisa okucishe kube ngu-0.25 W/m·K kokwakhiwa okucashuniwe.

Akuyona ingqikithi embozwe ngethusi eyedwa, futhi i-“fastRise 27 PCB” akuyona incazelo ephelele yokuthenga. Ikhasimende lithenga i-multilayer eqediwe esebenza ngogesi encike entanjeni yesibopho esilungisiwe phakathi kwezinye izinto. Leyo ntambo yesibopho idalwe umjikelezo wokucindezela, i-topography yethusi, inani lama-ply, ukunyakaza kwe-resin, kanye nomklamo wephaneli.

Amandla e-Highleap okwakha ama-fastRise 27 Multilayer kanye ne-HDI

I-Highleap ingabuyekeza i-fastRise 27 njengengxenye yesakhiwo se-RF multilayer esiqinile, i-hybrid PCB, noma isakhiwo se-lamination esilandelanayo. Insizakalo ingafaka ukubuyekezwa kokuhambisana kwezinto, ukwakhiwa kwe-press, ukuhlaziywa kokugcwalisa ithusi, ukubhoboza nge-laser, ukubhoboza ngomshini, ukufakwa kwe-plated ngokusebenzisa imigodi, ama-microvia, i-impedance elawulwayo, ukuhlolwa kwebhodi elingenalutho, ukuthola izingxenye, ukuhlanganiswa, kanye nokuhlolwa okuchazwe amakhasimende.

Uhlobo lwesibonelo, ubuningi obuphansi, kanye nokwakhiwa komkhiqizo kungahlolwa, kodwa izinto ezifanayo ezivunyiwe kanye nokuqagela kokucindezela kumele kuhambisane nokukhiqiza. Isampula ecindezelwe ngokufakwa esikhundleni esifanelekile ayifaneleki umklamo ohlosiwe.

Ubukhulu Obucindezelwe, Ukugeleza Kwe-Resin, kanye Nezidingo Zokugcwalisa Ithusi

Ubukhulu bomugqa wesibopho obuqediwe buwumphumela wokukhiqiza. Bushintsha ngamaphesenti ethusi, ukuphakama kwesici, izindawo ezivulekile, ingcindezi, izinga lokushisa, i-vacuum, usayizi wephaneli, izinto zokukhulula, kanye nokuthi ingakanani i-resin egeleza ezindaweni ezingenalutho. Ngakho-ke ubukhulu obujwayelekile bokulungiselela abwanele ukuvimbela okulawulwayo noma isikhala sesikhala.

Idatha edingekayo kumakhasimende

• ubuciko obugcwele noma amamephu amele ukuminyana kwethusi;
• ukwakhiwa komkhiqizo we-fastRise kanye nenani lama-ply eliphakanyisiwe;
• izinto ezibhekene nomgogodla, ukwelashwa kwendawo, kanye nephrofayili yethusi;
• i-dielectric target ecindezelwe kanye nokubekezelelana;
• izindawo ezinethusi elinzima, izimbobo ezinkulu, imigodi, ngokusebenzisa izakhiwo ezigcwalisiwe noma ezifakwe ngaphakathi;
• izidingo ze-impedance kanye nesigaba ezincike emgqeni wesibopho;
• ubukhulu bephaneli, ukuthamba, ukubhaliswa, kanye nemikhawulo ye-warpage.

I-Highleap ingase ilungise inani lama-ply, ukulinganisela kwethusi lendawo, amapharamitha okucindezela, noma ukujiya kwe-stackup ukuze kudalwe ukwakhiwa okukhiqizwayo. Noma yiluphi ushintsho oluthinta imodeli kagesi lubuyiselwa ukuze luvunyelwe amakhasimende ngaphambi kokusebenzisa amathuluzi.

Ukuhlela i-Lamination elandelanayo kanye ne-Microvia

I-fastRise 27 iyakhanga i-HDI kanye ne-lamination ephindaphindwayo, kodwa "isekela i-lamination elandelanayo" akusho ukuthi yonke i-stacked-microvia architecture iyamukeleka. Ukuthembeka kuncike kububanzi, ubukhulu be-dielectric, i-capture pad, i-copper fill, i-offset noma i-stacked arrangement, i-press sequence, kanye nenani lemijikelezo yokushisa.

1. Chaza ukulandelana kokwakhiwa kwezendlalelo. Khombisa ukuthi yiziphi izendlalelo ezikhona esigabeni ngasinye sokucindezela nokuthi i-microvia ngayinye ibholwa nini, ibekwe, futhi igcwaliswa nini.
2. Bala umlando wokushisa oqongelelekayo. Yonke i-lamination kanye ne-assembly reflow elandelayo ifudumeza kabusha ama-dielectric angaphambilini kanye nama-plated interconnect.
3. Buyekeza ukubhaliswa kanye nokunyakaza kobukhulu. Izintambo ezincane ezingaqiniswanga zidinga ukuphathwa nokulungiswa okulawulwayo.
4. Amakhuphoni amele ukuklama. Faka phakathi i-microvia stack yangempela, ukugcwaliswa kwethusi, ukuvezwa kwe-dielectric, kanye nokushisa.
5. Setha ubufakazi bokwamukela. Ukuqhubeka kukodwa kungase kunganeli; chaza izigaba eziwela phansi, ukujikeleza kokushisa, i-IST, noma okunye ukuhlolwa kokuthembeka lapho ingozi yomkhiqizo ikwenza kufaneleke khona.

Bheka umhlahlandlela we-Highleap we-HDI stackup kanye nokuhlolwa kwe-PCB DFM ukuze uthole izidingo zokukhishwa ezihlobene.

Lapho i-fastRise 27 Ingeza Inani

Izingqimba eziningi zeradar ezingama-77 GHz

Umugqa wesibopho ongenangilazi ungasekela izakhiwo ze-RF ezincane kanye nokususwa kwe-laser, kodwa ama-cores aseduze, izendlalelo ze-antenna, iphrofayili yethusi, kanye nendlela yokulinganisa kusanquma impendulo ye-mmWave.

I-TSM-DS3 kanye nezinye izendlalelo eziningi ezilahlekelwa kancane

I-fastRise 27 inganikeza umzila wokubopha ohambisana kahle nokulahlekelwa okuphansi lapho inhlanganisela yezinto ivunyiwe. I-core kanye ne-prepreg kumele ziphathwe njengohlelo olulodwa lwe-dielectric; i-Dk efanayo ayibonisi ukuhambisana.

Ama-Hybrid RF/ama-PCB edijithali

I-prepreg ingasiza ukubopha ama-core e-RF kwezinye izendlalelo ezisebenzayo, kodwa i-mixed chemistry ingenisa ukwelashwa, i-CTE, ukunamathela, ukubhaliswa, kanye nezingozi ze-warpage. I-hybrid stackup kufanele ibuyekezwe ngaphambi kokuba ukwakheka kuqandiswe.

I-HDI yokulandelelana ngokulandelana

Izinto ezingaqiniswanga kanye nokucutshungulwa kwe-laser kungasekela izakhiwo ze-microvia. Inani lebhizinisi livela lapho i-HDI ixazulula inkinga yangempela yokuqhuma, ukuxhumana, noma ukuguquka kwe-RF; imijikelezo yokucindezela engadingekile yandisa kuphela ingozi yezindleko kanye nokuthembeka.

Izindleko kanye Neshejuli Yokushayela Isakhiwo Esisheshayo se-Rise 27

Isikhathi sokuhola se-PCB laminate eqinile silandela ukuqinisekiswa kwezinto ezibonakalayo kanye nokubuyekezwa kwenqubo. Ukucaphuna egameni lokulungiselela kuphela akunaki iziguquguquki ezilawula ngempela ukwakhiwa.

Uhlu Lokuhlola lwe-RFQ lwephrojekthi yezinto ezihambisanayo

Nikeza i-stackup ephelele, ukuqokwa komkhiqizo we-fastRise okuqondile, izinto eziyinhloko ezibhekene, inani lama-ply, izisindo zethusi namamephu, ithagethi yokujiya okucindezelwe, izidingo ze-impedance, ukulandelana kokwakhiwa kwezingqimba, izigaba ze-blind/microvia, itafula lokubhoboza, usayizi wephaneli, ukuba yisicaba, ukubhaliswa, ukulandeleka kwezinto, ubuningi, isibikezelo, ithagethi yokulethwa, kanye nohlelo lokufaneleka.

Ku-PCBA, faka i-BOM, imidwebo yokuhlanganisa, i-centroid, uhlu lwephakheji yezingxenye, inani lokugeleza kabusha, uhlelo lokusekela ibhodi, izidingo zokuhlanza/zokugqoka, ukuhlolwa, ukuhlolwa kokusebenza, kanye nanoma yikuphi ukuhlolwa kwemvelo noma kokuthembeka.

Ikhotheshini ye-Highleap kufanele isho okwaziwayo, okusadinga ukuvunyelwa ngamakhasimende, kanye nobufakazi bokuhlola obufakiwe. Lokho kuwusizo kakhulu kunesithembiso esijwayelekile sokuthi ifektri "iyayisekela i-fastRise."

Izinsiza ezihlobene: i-hybrid PCB lamination kanye nezidingo ze-control-impedance.

Imibuzo Evame Ukubuzwa Yezentengiselwano

Ingabe i-Taconic fastRise 27 iyi-core laminate?

Cha. Kuyi-dielectric engaqiniswanga yokulungiselela/yokubopha esetshenziswa phakathi kwezinto zesekethe ezihambisanayo. I-callout ephelele ye-PCB kumele ibone ama-core abheke phansi, ukwakhiwa kwe-ply, kanye nobukhulu obucindezelwe.

Ingabe i-Highleap ingakha ama-PCB e-sequential-lamination kanye nama-microvia nge-fastRise 27?

Izakhiwo ezifanele zingabuyekezwa futhi zicashunwe. Ukusebenziseka kuncike ekulandeleni kwesendlalelo, ukujiya kwe-dielectric, nge-geometry, ukugcwaliswa kwethusi, ukubhaliswa, imijikelezo yokucindezela, usayizi wephaneli, kanye nezidingo zokuthembeka.

Ingabe ubukhulu be-prepreg eluhlaza bulingana nomugqa wesibopho ophilisiwe?

Cha. Ubukhulu obuqediwe buxhomeke ekwakhiweni kwe-ply, i-topography yethusi, ukugeleza kwe-resin, ingcindezi, izinga lokushisa, i-vacuum, kanye nomklamo wephaneli. Sebenzisa i-stackup yokukhiqiza evunyiwe, hhayi ubukhulu beshidi elingahluziwe kuphela.

Ingabe i-fastRise 27 ingabopha noma iyiphi i-RF core?

Cha. Ukuhambisana kumele kuqinisekiswe ngamakhemikhali, ukwelashwa kwendawo, umjikelezo wokwelapha, i-CTE, ukunamathela, ukwelashwa ngethusi, kanye nokuvunyelwa komhlinzeki/ikhasimende.

Yini edingekayo ukuze uthole ikhotheshini?

Thumela ukwakhiwa kwesendlalelo esiphelele, izinto zokwakha, amamephu ethusi, ithagethi yokujiya okucindezelwe, ukulandelana kwe-microvia, impedance, ubukhulu, ubuningi, ukulethwa, iphakheji yokuhlanganisa, kanye nohlelo lokuhlola.