Lamination Okulandelanayo: HDI PCB Build-Up Process Guide

Isingeniso

Ukubopha ngokulingana kuyinqubo ebalulekile ekukhiqizweni kwe-HDI PCB evumela ukuxhumana kwezingqimba eziningi ngokusebenzisa ukubopha ngobuningi nangemijikelezo yokwakheka. Le ndlela ethuthukisiwe ivumela abakhiqizi ukuthi bakhe amabhodi wesekethe anabantu abaningi anezakhiwo eziyinkimbinkimbi zokuqondisa ezingenakufezwa ngezindlela zokukhiqiza ezivamile zokucindezela okukodwa.

Njengoba amadivaysi e-elekthronikhi adinga ukusebenza okwengeziwe ezicini zefomu elincane, i-lamination elandelanayo isibalulekile ekukhiqizeni amabhodi esimanje e-HDI anezingxenye zephimbo elihle kanye nezibalo eziphezulu ze-I/O. Inqubo idinga ukulawula okunembile kokunemba kokubhalisa, ukukhethwa kwezinto ezibonakalayo, nokuphathwa kokushisa kuwo wonke umjikelezo wokwakha ngamunye ukuze kuqinisekiswe ukuxhumana okuthembekile nokugcina ukuzinza kobukhulu.

Iyini i-Sequential Lamination ku-HDI PCB?

I-lamination elandelanayo iyinqubo yokwakha izendlalelo zesekethe ezengeziwe ku-substrate eyinhloko ngokusebenzisa imijikelezo ephindaphindiwe ye-dielectric lamination, i-laser drilling, kanye ne-copper plating. Ngokungafani namabhodi ezendlalelo eziningi zendabuko acindezelwe ekusebenzeni okukodwa, amabhodi e-HDI akhiwa ngokuqhubekayo, engeza izendlalelo ezinyathelweni ezilawulwayo ukuze akhe ama-microvia astakiwe noma amile anika amandla ukuxhumanisa okuqondile kwephimbo elihle.

I-Sequential Build-Up Architecture

Izakhiwo eziwumphumela zivame ukuchazwa ngokuthi 1+N+1, 2+N+2, noma noma yisiphi isendlalelo se-HDI, lapho izinombolo zimelela izendlalelo zokwakha ezingezwe ohlangothini ngalunye lwengqikithi. Isakhiwo esingu-1+N+1 sihlanganisa umjikelezo owodwa wokulambisa ohlangothini ngalunye, kuyilapho u-2+N+2 uhlanganisa okubili. Umjikelezo ngamunye owengeziwe unyusa ukuminyana koxhumano kanye nokuguquguquka kwemizila kodwa futhi ukhulisa ubunkimbinkimbi benqubo kanye nezidingo zokulawula ukubhalisa. Ingqikithi, ngokuvamile equkethe izendlalelo zesignali ezimbili kuya kwezine, isebenza njengesisekelo somshini nesikagesi senqubo yokwakheka okulandelanayo.

Ukugeleza Kwenqubo Yomjikelezo We-Lamination ngamunye

• Ukulungiswa kwendawo - Ukuqiniswa kwemishini noma kwamakhemikhali kwendawo yethusi ekhona kuqinisekisa ukunamathela okufanele kwesendlalelo se-dielectric esilandelayo.
• I-Dielectric Lamination - I-resin-coated copper foil (RCC) noma ifilimu ye-dielectric ebonakalayo isithombe iqondaniswe futhi i-laminated ngaphansi kwezimo zokushisa ezilawulwayo nezingcindezi.
• I-Laser Drilling - Ama-Microvias anobubanzi obungu-75–150 µm abholwa ngokunembile ukuze axhumeke namaphedi ethusi angaphansi.
• I-Desmear ne-Copper Deposition - I-Plasma noma i-chemical desmear ihlanza ngezindonga, ilandelwa yi-electroless copper plating ukuze kutholwe ukuqhutshwa kwe-conductivity.
• Ukucwenga Iphethini nokunamathisela - Ithusi elengeziwe liyaputshwa ukwenza imikhondo futhi ligcwalise ama-microvias, bese liqoshwa ukuze kuchazwe izici zesekethe.
• I-Surface Planarization - I-Chemical or mechanical planarization idala indawo ebushelelezi yemijikelezo yokucwala elandelayo.
• Ukuphindaphinda Komjikelezo - Inqubo yokwakha iphinda kuze kube yilapho kufinyelelwa isibalo sesendlalelo esidingekayo, ngomjikelezo ngamunye okhulayo ukuminyana kodwa futhi wethula ukubhaliswa kanye nezinselele zengcindezi yokushisa.

Umjikelezo ngamunye olandelanayo we-lamination wandisa ukuminyana kwezingqimba kodwa futhi wethula ukubhaliswa kanye nezinselele zengcindezi yokushisa okufanele ziphathwe ngokucophelela.

Ukugeleza Kwenqubo Yokucwenga Okulandelanayo ku-HDI Build-Up

Inqubo ye-lamination elandelanayo iqala ngokwakhiwa okuyisisekelo, lapho i-substrate evamile ye-multilayer ikhiqizwa nge-imaging ye-layer yangaphakathi, ukwelashwa kwe-oxide, kanye ne-lamination ye-prepreg ne-copper foil. Ingqikithi, ngokuvamile equkethe izingqimba ezimbili kuya kwezine zesignali, inikeza ukuzinza komshini futhi isebenza njengesisekelo semisebenzi yokwakha.

Ngemuva kokubhoboza, ukucwenga, nokuqedwa kwendawo ukuze kuxhumeke ngembobo, izinhloso zokubhaliswa kwe-optical zengezwa ukuze kuqinisekiswe ukuqondana okunembayo phakathi nemijikelezo yokucwala elandelayo.

I-Lamination Cycle yokuqala

Ukwakhiwa kokuqala kuguqula umongo ube yisakhiwo esingu-1+N+1 ngokwenza i-laminating dielectric material kuzo zombili izindawo ezingaphandle. Amafoyili ethusi agqize nge-resin noma ama-dielectrics efilimu eyomile aqondaniswa kusetshenziswa amasistimu okubona noma ama-X-ray abhekisela kumamaki okubhalisa adalwe kumongo.

I-Lamination yenziwa ngaphansi kwezinga lokushisa elilawulwayo kanye nengcindezi yokuqinisekisa ukugeleza okuphelele kwe-resin ngaphandle kwe-voids. Ngemva kokupholisa, i-laser drilling yakha ama-microvias axhumeka kumaphedi ongqimba angaphandle omongo, ngokuvamile anokunemba kokubeka indawo okungu-±25 µm.

• Ukulungiswa kwendawo - I-Roughening ithuthukisa ukunamathela phakathi kwezingqimba ze-core kanye ne-dielectric.
• Ukulawula ukuqondanisa - Amasistimu okusebenza agcina ukunemba kwesikhundla ngaphakathi kokucaciswa.
• I-Lamination press - Izinga lokushisa elilawulwayo nokucindezela kuqinisekisa ukwelapha okugcwele kwe-resin kanye nokubopha.
• I-Laser microvia drilling – I-Vias of 75–150 µm iyakhiwa ukuze ifinyelele kumaphedi okuqondiwe.
• I-Metallization yethusi - I-Desmear, i-electroless copper, kanye nephethini yokucwenga kwakha izindlela ezisebenzayo.

Imijikelezo yokuLamination elandelayo

Imijikelezo yakamuva ilandela ukugeleza komsebenzi ofanayo kodwa yengeza ubunkimbinkimbi njengoba izendlalelo ezintsha ze-dielectric zenziwe nge-laminated phezu kokwakhiwa kwangaphambilini. Ekucushweni kwe-2+N+2, ama-microvias angase anqwabelene ngokuqondile phezu kwe-vias yeleveli yokuqala noma agxamalazele kumaphedi aseduze.

Ukushintsha kwe-Dimensional kusuka ekushiseni okuphindaphindiwe kudinga ukulungiswa okuhle kokubhalisa ukuze kugcinwe ukunemba kwesendlalelo kuya kwesendlalelo. Umjikelezo ngamunye uhlanganisa i-laser drilling, i-copper plating, i-planarization, nokulungiswa kwendawo ukuze kulondolozwe ukunamathela nokuthembeka.

Umjikelezo wokugcina udlula ekuthwetshulweni kwesendlalelo sangaphandle, ukuqoshwa, ukufakwa kwemaski ye-solder, kanye nokuqedwa kwendawo. Ukugcina ukuhambisana kuzo zonke izigaba ze-lamination kubalulekile ukuqinisekisa ukuzinza kobukhulu kanye nobuqotho bokuxhumana ezakhiweni eziyinkimbinkimbi ze-HDI.

Izinselelo Zobunjiniyela ku-Lamination Elandelanayo

Ubunzima bobuchwepheshe bokunamathelana kwe-lamination buletha izinselele eziningana ezibalulekile abakhiqizi okumele bazibhekane nazo ngokulawula inqubo enembile kanye nokukhetha izinto . Lezi zinselele zihlangana nomjikelezo ngamunye wokwakha owengeziwe futhi zidinga izindlela zobunjiniyela ezihlelekile ukuze kulondolozwe isivuno nokuthembeka.

Ukubhalisa kanye Nokulawula Ubukhulu

Ukunemba kokubhalisa kuchaza imikhawulo yekhono le-lamination elandelanayo. Umjikelezo ngamunye oshisayo wethula izinguquko ezinobukhulu kusuka ekwandeni kwethusi ne-dielectric, ukugeleza kwe-resin, kanye nokubekezelelana kwamathuluzi okuqoqiwe.

Amasistimu okubhalisa okubona aqondanisa isinyathelo ngasinye sokucwala nesokubhoboza kusetshenziswa okuhlosiwe okusuka kungqimba lwangaphambilini, kuyilapho amasistimu e-X-ray ephatha izinto ezikhanyayo. Abakhiqizi abathuthukile basebenzisa isilawuli senqubo yezibalo ukuze babikezele futhi balungise amashifu e-dimensional ahlelekile.

• Imiphumela yomjikelezo oshisayo - Ukunwetshwa nokufinyela kusuka ekushiseni okuphindaphindiwe kudinga isinxephezelo emijikelezweni yakamuva.
• Ukuzinza kwezinto - Ama-dielectric e-CTE ephansi kanye nama-foil ethusi afanayo anciphisa ukukhukhuleka kokubhalisa.
• Ukunemba kwethuluzi - Amasistimu wokuqondanisa anembile agcina ukuma kwe-interlayer ngaphakathi kokubekezelelana okuqinile.
• Cubungula impendulo - Ukuqapha kwesikhathi sangempela kwenza ukulungiswa okunamandla kwamaphutha okuqondanisa.

Ukubekezelela okunqwabelanayo kuvame ukukhawulela ukulayishwa okulandelanayo kube imijikelezo emithathu noma embalwa yokwakha ohlangothini ngalunye ngaphambi kokuthi ukunemba kwendawo kulimaze imiklamo ye-HDI enephimbo elihle.

Ukuhambisana Kwezinto kanye Nokunamathela

Ukuhambisana kwezinto kubalulekile ukuze kugwenywe ukulandelana okuthembekile. I-CTE yomgogodla, i-dielectric, nethusi kufanele ifaniswe eduze ukuze kuncishiswe ingcindezi ngesikhathi sokuhamba ngebhayisikili okushisayo.

Ukulungiswa kwendawo engaphezulu kuqinisekisa ukunamathela okufanele, ngobunzima obulawulwayo obukhuthaza ukuhlangana ngaphandle kokuphazamisa ukusebenza kwe-impedance. Izinhlelo ze-resin kufanele zimelane nokulimala kokumba nge-laser, zihlale zihambisana namakhemikhali nezinqubo zokucwenga, futhi zigcine ukuzinza ngemijikelezo eminingi yokugeleza kabusha.

Ukucatshangelwa Kwedizayini Ye-Lamination elandelanayo

I-lamination elandelanayo ibeka izithiyo ezithile kusitaki se-HDI nokwakheka kwesakhiwo. Ukucatshangelwa kusenesikhathi kwemikhawulo yenqubo kusiza ukuqinisekisa ukwenziwa, isivuno, nokwethembeka kwesikhathi eside. Isakhiwo esikhethiwe sokwakha sithonya ngokuqondile izindleko, isikhathi sokuhola, nokusebenza.

Ukukhethwa Kwesakhiwo Sesitaki

Abaklami kufanele basebenzise ukwakheka okulula okuhlangabezana nezinhloso zokuminyana kwesekethe. Isakhiwo esingu-1+N+1 sinikeza inhlanganisela elinganiselayo yokuminyana, izindleko, kanye nesivuno, kuyilapho 2+N+2 noma imiklamo yanoma iyiphi isendlalelo inika amandla ukuminyana okuphezulu ngezindleko zokulawula inqubo okuqinile nemijikelezo emide yokwenziwa.

Ugqinsi olubalulekile kufanele luncishiswe ukuze kuthuthukiswe ukunemba kokubhalisa kuyilapho kugcinwa ukuzinza kwemishini. Ubukhulu be-Dielectric kufanele bulinganise ukulawulwa kwe-impedance, imikhawulo yokumba i-laser, nange-aspect ratios. Ukukhethwa kwezinto kufanele kubeke phambili ukuzinza kokushisa, i-CTE efanisiwe, nokuhambisana kuyo yonke imijikelezo yokugcwalisa.

Ngesu Nokubekwa

Ukucushwa kwe-Microvia kuthinta kakhulu ukwethembeka nokwenziwa. I-Vis egxadazayo isakaza ingcindezi futhi inciphisa ubungozi bokusakazeka kokuqhekeka kodwa idinga indawo eyengeziwe yomzila. Ama-vias astakiwe kufanele akhawulelwe kumaleveli amabili, nendawo yephedi eyanele ukuze kufakwe ukubekezelelwa kokubhaliswa.

• Lungiselela ngesakhiwo - Khetha izakhiwo ezinyakazayo ukuze uthole ukwethembeka okuthuthukisiwe.
• Gcina imvume - Vumela ukwakheka kokubekezelelana okuvela emijikelezweni eminingi yokubeka.
• Nciphisa izendlalelo zokwakha - Imijikelezo embalwa ithuthukisa isivuno futhi yehlise izindleko.
• I-akhawunti ngokugcwalisa - I-Via-in-pad idinga ama-microvias agcwalisiwe futhi ahleliwe.
• Lawula impedance - Gcina iyunifomu yokuqina kwe-dielectric kuzo zonke izingqimba.

Ukuxhumana Nezokukhiqiza

Ukusebenzisana kusenesikhathi nomkhiqizi we-PCB kubalulekile. Imithetho yedizayini eqondene nenqubo ethile yosayizi, ubukhulu bephedi, ukunemba kokubhaliswa, nemikhawulo yokufakwa kwe-lamination kufanele iqondise izinqumo zesakhiwo.

Ukukhetha okubalulekile kufanele kuhambisane nesethi yempahla efanelekile yomkhiqizi kanye nekhono lempahla. Izibuyekezo zedizayini yokukhiqiza zisiza ekuboneni ubungozi besivuno njengokuhluka kokubhaliswa, ngezinkinga ze-aspect ratio, noma izitaki ezigcizelelwe ngokushisa.

Abakhiqizi abanolwazi njenge- Highleap Electronics bangasiza ekwenzeni ngcono ukucushwa kwe-stack-up kanye namapharamitha e-lamination ukuze kufezwe ukwakheka kwe-HDI okuthembekile ngokuguquguquka kwenqubo elawulwayo.

Ukwethenjelwa kanye nokuhlolwa ku-Lamination elandelanayo

I-lamination elandelanayo yethula izinselele eziyingqayizivele zokuthembeka uma kuqhathaniswa nama-PCB ajwayelekile anendlalelo eziningi. Imijikelezo eminingi yokushisa nokusebenzelana kwezinto kungadala amaphuzu angaba khona okuhluleka okufanele aqinisekiswe ngokuhlolwa okufanele.

Izindlela Zokwehluleka Ezivamile

I-Microvia cracking yiyona nto ekhathaza kakhulu, ikakhulukazi enqwabelene ngemiklamo. Ukuhamba ngebhayisikili okushisayo ngesikhathi sokuhlanganisa noma ukusebenza kudala ukungezwani kokunwetshwa kusixhumi esibonakalayo se-via-to-pad, okuholela ekwakhekeni kokuqhekeka kanye namasekhethi avulekile okungenzeka. I-Interlayer delamination ingase ibe umphumela wokunamathela okubi, ukungcoliswa komhlaba, noma izinto ezingahambelani, kuyilapho ukukhula kwe-Conductive Anodic Filament (CAF) kungenzeka ezindaweni ezinomswakama ngaphansi kokuchema kukagesi uma kukhona ukungcoliswa kwe-ionic phakathi kwezingqimba.

Ukuqinisekisa kanye Nokulawulwa Kwekhwalithi

Ukuhlaziywa kwe-Microsection kuvumela ukuhlolwa okuqondile ngobuqotho, ukugcwaliswa kwe-resin, kanye ne-interlayer bonding. Iqinisekisa ukuthi umjikelezo we-lamination ngamunye uthole uxhumano olufanele lwesendlalelo ngaphandle kwe-voids noma ukungahambi kahle.

Izindlela zokuhlola ukwethembeka ezibalulekile zifaka:

• Ukuhamba ngebhayisikili okushisayo - Lingisa ukugeleza kabusha kanye nezingcindezi zokusebenza ukuze kutholwe ngokukhathala noma ukuqhekeka.
• I-Interconnect Stress Test (IST) - Isheshisa izindlela zokwehluleka ngaphansi kwengcindezi eshisayo nekagesi.
• Ukuhlolwa kwezigaba ezahlukene - Iqinisekisa i-copper plating, ikhwalithi yokugcwalisa, nokuvumelana kokunamathela.
• Ukuqapha ukumelana - Ithola ukuwohloka kancane kancane ngaphambi kokwehluleka.

Abakhiqizi benza lezi zivivinyo ngesikhathi sokufaneleka nokukhiqiza ukuze kugcinwe ukuqina nokwethembeka kwenqubo. Ukucindezela okulawulwayo okulawulwayo, ukubhaliswa okunembile, nokukhetha kwezinto ezifanele kubalulekile ukuze kuqinisekiswe ukusebenza kwesikhathi eside kwama-HDI PCB alandelanayo.

Isiphetho

I-lamination elandelanayo inika amandla izakhiwo ze-HDI ezisekela ukuminyana kwesekethe ephezulu kanye nezingxenye ze-pitch-pitch emihle ngemijikelezo elawulwayo ye-lamination, i-laser drilling, kanye ne-copper plating. Nakuba inikeza amandla okuxhumana aphakeme, futhi yethula inkimbinkimbi yenqubo edinga ukubhaliswa okunembile, ukuhambisana kwezinto ezibonakalayo, nokuphathwa kokushisa. Idizayini ethuthukisiwe yokupakisha nezinto eziqinisekisiwe ziyisihluthulelo sokugcina isivuno nokwethembeka kwesikhathi eside.

I-Highleap Electronics Sequential Lamination Amakhono

I-Highleap Electronics inikeza izixazululo ze-lamination ezilandelanayo kusukela ekuqaleni kuya ekugcineni zama -PCB e-HDI nge:

• Ukulawulwa kwenqubo okuthuthukisiwe - Ukubhaliswa okunembile kanye namaphrofayili wezindaba athuthukisiwe okwakhiwa kwemijikelezo eminingi.
• Ubuchwepheshe bezinto ezibonakalayo - Izinto ezifanelekile ezine-CTE efanisiwe nokusebenza okuqinisekisiwe kwe-lamination.
• Ukwesekwa kwedizayini - Ukubuyekezwa kwe-DFM kanye nokwenza kahle isitaki sokwenziwa kanye nokusebenza kahle kwezindleko.
• Ukuqinisekisa ikhwalithi - Ukuhlolwa kokuthembeka okubandakanya ukuwela izigaba, ukuhamba ngebhayisikili okushisayo, kanye ne-IST.
• Ukucushwa okuguquguqukayo - Ukusekelwa kwe-1+N+1, 2+N+2, nanoma yisiphi isendlalelo se-HDI izakhiwo.

Ithimba lobunjiniyela le-Highleap lisebenzisana namakhasimende ukuletha izixazululo ze-PCB ezinokwethenjelwa nezinobukhulu obuphezulu ezilungiselelwe ukusebenza kahle kanye nokukhiqizwa kalula. Xhumana nethimba lethu lobuchwepheshe ukuze nixoxe ngephrojekthi yenu elandelayo ye-HDI.