Inguquko ye-AI Server PCB ka-2026

I-Al Server PCB Evolution

I-NVIDIA Blackwell GB300 idinga izendlalelo ze-PCB ezingama-28-34 ezine-M7-grade ultra-low-loss dielectrics. I-Vera Rubin (H2 2026) izodlulela ezingqimbeni ezingaphezu kuka-40 kanye nezinto ze-M10 — ukuhlolwa kuqinisekiswe ngoMashi 13, 2026. Shintsha ngezithombe zakho zasefektri noma zomkhiqizo.

Imakethe Yomhlaba Wonke Ye-PCB ka-2026
$ 100.64B
Ubuhlakani bukaMordor Jan 2026
I-AI Server PCB CAGR
> 25%
uma kuqhathaniswa nemakethe iyonke engu-4.83%
Ama-Racks e-NVIDIA 2026
60,000 +
2x 2025 — Morgan Stanley
8 CSP CapEx 2026
>$60B
+40% YoY — TrendForce
Isidingo Sezingqimba Ezingaphezu Kwengu-18
+ 18.5%
Unyaka we-Q1 2025 — iPrismark

Imakethe ye-PCB yomhlaba wonke idlule u-$100.64 billion ngo-2026 - ingqophamlando eqhutshwa kakhulu yiseva ye-AI kanye nengqalasizinda yekhompyutha esebenza kahle kakhulu. Abasebenzi be-Hyperscale basebenzise amaseva angaba yizigidi ezingu-1.2 alungiselelwe i-AI ngo-2025 kuphela, ngalinye lihlanganisa ama-accelerator e-GPU angu-8 kuya kwangu-16 adonsa ngaphezu kwe-1.0 kW ngesokhethi. Isilinganiso sesibalo se-PCB seseva ye-AI sikhuphuke sisuka ku-18 ngo-2023 saya ku-32 ngo-2025 - ukwanda ngo-78% eminyakeni emibili nje.

NgoMashi 13, 2026, umhlaziyi we-supply chain uGuo Mingqi uqinisekisile ukuthi i-NVIDIA kanye ne-Wus Printed Circuit seziqalile ukuhlola izinto ze-M10 CCL zesizukulwane esilandelayo ezihlose isici sokusaphazeka esingaphansi kuka-0.002 — ngaphansi kwengxenye yezinto ze-M7 zamanje. Lokhu kuphawula ukuvulwa komjikelezo wokuthuthukisa ozochaza imininingwane ye-PCB yeseva ye-AI kuze kube ngu-2027 nangale kwalokho.

ISHADI 1 — IMAKETHE YE-PCB YOMHLABA WONKE
Usayizi Wemakethe Ye-PCB Yomhlaba Wonke 2021-2026 (USD Billion)
Imithombo: Mordor Intelligence (isibuyekezo sikaJanuwari 2026); Prismark; ukuvumelana kwemboni
2021
$ 76.7B

2022
$ 81.5B

2023
$ 78.2B

2024
$ 87.6B

2025
$ 95.8B

2026
$ 100.64B
Unyaka Wokuqala WamaRandi ayizigidi eziyi-100

$0
$ 50B
$ 100.64B

"Uma uthuthukisa kusuka ku-400G kuya ku-800G noma ku-1.6T, intengo yama-PCB ayikhuphuki ngo-20-30%. Iyaphindeka kabili."

— Ukuhlaziywa kwe-Huadian Technology / 36Kr, ngoJanuwari 2026

Ileveli Yobuchwepheshe: Indlela Isizukulwane Sepulatifomu Ngayinye Esiphinda Kabili Intengo Ye-PCB

Isizukulwane ngasinye sepulatifomu ye-NVIDIA sidinga ukucaciswa kwe-PCB okuhlukile ngokuyisisekelo. Ukuqhubeka akukona okwenyukayo — kuwumsebenzi wesinyathelo odinga izinto ezintsha, izinqubo ezintsha, kanye namanani aphezulu kakhulu. Ku-224 Gbps (Blackwell), i-M7 ultra-low-loss CCL iyimpoqo ngentengo ephindwe ka-6-9 kune-FR4 ejwayelekile. Ku-448 Gbps+ (Vera Rubin), izinto ze-M9/M10 zizobiza u-15-20x FR4. Ukuphindaphinda ngakunye kwesilinganiso sesiginali kuletha intengo ephindwe kabili.

ISHADI 2 — UKUZIGUQULA KWEPLATFORM
I-AI Server PCB: Ukubalwa Kwezingqimba kanye Nokuphindaphinda Kwamanani Ngeplatifomu
Imithombo: 36Kr; UGPCB; EIPC Jan 2026; Ucwaningo lukaGuo ​​Mingqi Mashi 13, 2026

H100 / H200 (Hopper) · Umthamo: 2022-2024
18-24 Izendlalelo
I-112 Gbps
Ibanga le-CCL: M6
Ibha yokubala izingqimba (18-24L isilinganiso esingu-21 = 52.5% wama-40L aphezulu)
Izendlalelo ze-18-24
Intengo uma iqhathaniswa nesisekelo se-H100
Isisekelo esingu-1x

GB200 / GB300 (Blackwell) · Umqulu: 2025-2026
28-34 Izendlalelo
I-224 Gbps
Ibanga le-CCL: M7
Ibha yokubala izingqimba (28-34L isilinganiso esingu-31 = 77.5% wama-40L aphezulu)
Izendlalelo ze-28-34
Intengo uma iqhathaniswa nesisekelo se-H100
~2x — intengo iphindwe kabili
I-M7 Ultra Low Loss CCL = izindleko ze-FR4 eziphindwe kabili kusukela ku-H100.

I-VR200 / VR300 (i-Vera Rubin) · Irempu ye-H2 2026
Izendlalelo ezingu-32-40+ + HDI
448 Gbps+
UKUHLOLWA KWE-M9/M10
Ibha yokubala izendlalelo (32-40+ L = 100% wesilinganiso)
Izendlalelo ezingu-32-40+ + noma iyiphi i-HDI yezendlaleloMAX
Intengo uma iqhathaniswa nesisekelo se-H100
~3-4x — intengo ngokuphindwe kathathu / kane
I-M9/M10 CCL = izindleko ze-FR4 ezingu-15-20x | UKUHLOLWA KWE-M10 KUQINISEKISIWE mhla ziyi-13 kuNdasa 2026 (Guo Mingqi)

Izinto ze-M10: Lokho Okushiwo Ngempela NgoMashi 13

Ukuqinisekiswa kocwaningo lomhlinzeki wezinto oluqhutshwa umhlaziyi uGuo Mingqi lwangoMashi 13, 2026 lokuthi i-NVIDIA kanye ne-Wus Printed Circuit bahlola izinto ze-M10 CCL kuyisibonakaliso sokuqala somjikelezo olandelayo wokuthuthukisa. I-M10 ihlose i-Df ngaphansi kuka-0.002 - okuvumela amazinga okubonisana angu-448 Gbps+ adingwa yisakhiwo se-Vera Rubin esihlelelwe ukukhiqizwa kwevolumu ye-H2 2026.

Umjikelezo wokufaneleka kwezinto ezibonakalayo uyacindezela: lokho okwakuthatha izinyanga ezingu-18-24 ngaphambili manje sekucindezelwa izinyanga ezingu-12 ngenxa yengcindezi yokuncintisana. Abahlinzeki be-CCL abangakathuthukisi izinto ze-M10-grade basengozini yokukhishwa esizukulwaneni esilandelayo sezinhlelo zokufaneleka zebhodi leseva ye-AI.

I-CSP CapEx: Isignali Yesidingo Sesakhiwo

I-TrendForce ibuyekeze ukukhula kwayo kwe-CSP CapEx ka-2025 kusuka ku-+61% kuya ku-+65% phakathi nonyaka. Ngo-2026, i-CSP CapEx iyonke kulindeleke ukuthi idlule amaRandi ayizigidigidi ezingama-60 - ukwanda okungu-40% unyaka nonyaka. I-IDC ibikezela ukuthi imakethe yeseva ye-AI yomhlaba wonke izokhula isuka kumaRandi ayizigidigidi ezingama-30.7 ngo-2023 idlule amaRandi ayizigidigidi ezingama-90 ngo-2028 ku-24% CAGR.

Idola ngalinye lemali engenayo yeseva ye-AI lidonsa inani lokuqukethwe kwe-PCB eliphindwe kathathu kuya kane leseva yokubala ejwayelekile. Lokhu akuwona umjikelezo wokusebenzisa imali - kuwukwabiwa kabusha kwesakhiwo samandla okukhiqiza ama-elekthronikhi emhlabeni jikelele.

ISHADI 3 — ISILINGO SEZINDLEKO ZE-CCL
Isiphindaphindi Sezindleko Zezinto Ze-CCL vs I-FR4 Ejwayelekile (2026)
Ububanzi bebha = izindleko uma kuqhathaniswa ne-FR4 (isikali: 1x kuya ku-20x). Imithombo: UGPCB; PCBOnline; EIPC Jan 2026; Ucwaningo lukaGuo ​​Mingqi Mashi 13, 2026

Ibanga / I-Df / Isilinganiso Esiphezulu Sesignali
Izindleko uma ziqhathaniswa ne-FR4

I-FR4 (Ejwayelekile)
I-Df 0.020-0.025 | <10 Gbps

1x

I-M4 (Ukulahlekelwa Okuphansi)
I-Df 0.010-0.013 | 56 Gbps

I-2-3x

I-M6 (Ukulahlekelwa Okuphansi Kakhulu)
I-Df 0.005-0.008 | 112 Gbps

I-4-6x

I-M7 (Ukulahlekelwa Okuphansi Kakhulu)
NJENGAMANJE
I-Df 0.003-0.005 | 224 Gbps

I-6-9x

M9
UKUQHUBEKA NGO-2026
I-Df <0.003 | 448 Gbps

I-10-15x

M10
UKUHLOLA Mashi 13, 2026
I-Df <0.002 target | 448+ Gbps | I-NVIDIA + Wus Printed Circuit iqinisekisiwe

I-15-20x

Izindleko eziphezulu kakhulu — izinto zesizukulwane esilandelayo

1x (isisekelo se-FR4)
I-10x
20x (ubuningi be-M10)

IZIMEMEZELO ZOKUTSHALWA KWEMALI OKUKHULU KA-2026
I-RMB 20B
Ubuchwepheshe beShenghong
I-HDI + umthamo ophezulu, eShayina
I-RMB 4.3B
I-Foxconn FIT Thailand
Isikhungo se-HDI esithuthukisiwe, eNingizimu-mpumalanga ye-Asia
EUR 1.2B
I-AT&S Malaysia (Disemba 2025)
I-substrate ye-IC, izimoto + ama-AI chips
I-KRW 31T
SK Hynix Yongin (Mashi 1, 2026)
Inkumbulo ye-HBM / AI enhle kakhulu kuze kube ngu-2030
+ 10.6%
Iqembu le-SCHMID (Mashi 11, 2026)
Ukwenyuka kwesitoko ngosuku loku-oda kwemishini ye-HDI

Imakethe Ehlukanisayo: Abaphumeleleyo vs Abasindile ngo-2026

Abakhiqizi Abavezwe Nge-AI — Ukuchuma
+I-Victory Giant HDI board imajini ephelele ~ 39% ku-Q1 2025
+Amanani e-PCB aphezulu anyukile 37.8% Unyaka ngo-2025
+Abenzi abayi-10 abaphezulu babamba 52% isabelo semakethe (+3pp ngo-2025)
+Ukuchayeka kwe-AI kuyaletha +2-3pp ukuthuthukiswa kwe-gross margin ngonyaka
Imikhiqizo Ejwayelekile — Ngaphansi Kwengcindezi
-Izinto zokusetshenziswa ~60% we-BOM ngaphandle kwamandla entengo okunciphisa
-Isikhathi sokuhola sisukela emavikini angu-4-6 kuya ku- 12-16 amaviki
-Izikhathi zokulethwa kwemishini ezisukela ku-$12B; izinyanga ezingu-15-18
-Ama-SME aphuma emakethe ephakathi nendawo; ukuhlanganiswa kuyashesha

Mayelana ne-Highleap Electronics: I-Highleap Electronics ikhiqiza ama-PCB anezingqimba eziningi futhi inikeza izinsizakalo ezigcwele zokuhlanganisa i-PCBA ze-AI server, izimboni, kanye nezinhlelo zokusebenza zokuxhumana. Sisekela imiklamo ye-HDI enezingqimba eziningi kanye nokucaciswa kwezinto ezithuthukisiwe okuhlanganisa ama-laminate e-M6 kanye ne-M7 grade. Cela isilinganiso se-PCB esinezingqimba eziningi

Imithombo: Umbiko Wemakethe we-PCB we-Mordor Intelligence (isibuyekezo sedatha sikaJanuwari 2026); I-EIPC SpeedNews Issue 1, Jan 2026 (ingxoxo kaChiu Shih-fang / TPCA); Ucwaningo lwe-supply chain kaGuo ​​Mingqi Mashi 13, 2026 (nge-Futunn News); 36Kr “2026: Amaseva e-AI Azobiza Kakhulu”; Ukuhlaziywa kwe-TrendForce CSP CapEx 2026; Idatha yemakethe ye-Prismark Q1 2025; Isibikezelo sesidingo se-rack yeseva ye-Morgan Stanley AI; Umbiko wemakethe yeseva ye-IDC AI; I-PCBOnline “Ama-PCB: Amandla Amaseva e-AI”; Isitatimende sabezindaba se-SCHMID Group Mashi 11, 2026; Ukuqedwa kwe-AT&S Malaysia Disemba 2025; I-TTM Technologies Nov 2025; Isimemezelo sokutshalwa kwezimali se-SK Hynix Yongin Mashi 1, 2026.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Masikwenzele ukuhlaziywa kwe-DFM/DFA futhi sibuyele kuwe ngombiko.

Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu.

Sidinga ulwazi olulandelayo ukuze sikunikeze isaphulelo:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikezela ngohlu olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA (I-Printed Circuit Board Assembly), kanye nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho. Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB