Deredza Mari Yako Yekupofumadza Yakavharwa Nemachira Gumi Nemutengo wePCB

Mari yePCB inoonekwa seyakavharirwa nePCB inowanzo nzwisiswa zvisirizvo — hurukuro zhinji dzemitengo dzinomira pa "mari ye10 inodarika 8-layer" pasina kutsanangura kuti ndeapi magadzirirwo chaiwo anoita kuti musiyano wacho uvepo. Muchokwadi, mhando yedhizaini yakavigwa, kuchera kumashure kwechiratidzo cheSerDes, dhizaini yekufambisa marongero emagetsi, uye giredhi remukati mechinhu chiri mukati isarudzo dzakazvimiririra dzinowedzera kana kubvisa mutengo wakakosha. Dhizaini inoenderana nezvinodiwa zvakanyanya munzvimbo dzese ina inogona kudhura 2–3× kupfuura dhizaini inoita sarudzo dzakafanana dzekufambisa nekushandisa nzira dzakanangwa. Gwaro iri rinoongorora mutengo wega wega, rinotsanangura shanduko dzeinjiniya, uye rinoratidza kuti mari yakawanda inowanikwa kupi — pasina kukanganisa mashandiro emagetsi.

Tora Mutengo Wako weHDI weZvikamu gumi

1) Chii Chinosimudzira Mutengo weHDI weMara gumi Kupfuura Kuverengwa kweMara

1.1 Sarudzo Ina Dzinochinja Mutengo

Kuverengwa kwezvikamu chinhu chinokanganisa mutengo, asi kwete chinonyanya kukosha. Sarudzo ina dzekugadzira dzinonyanya kukanganisa mutengo we10-layer HDI — zvichienderana nekukanganisa:

• Kuvigwa kuburikidza nesarudzo (Rudzi rwekutanga vs. Rudzi rwechitatu): Kuwedzera ma-vias akavigwa mukati memukati kunowedzera ma-lamination cycles 1-3 uye kunogona kuwedzera mitengo yeprototype ne40-100%+ kupfuura Type I equivalent (nhamba yekutarisa - mhedzisiro chaiyo inosiyana). Mazhinji madhizaini e10-layer HDI haadi ma-vias akavigwa. Kusimbisa izvi usati wagadzira ndiyo nzira yepamusoro-soro yekuvandudza ROI iripo.
• Kuboorera kumashure kwezviratidzo zvinomhanya zvakanyanya: Kuboora back-drilling kunongoreva zvemagetsi chete kumaSerDes interfaces anopfuura 10 Gbps. Kuitsanangura yemagadzirirwo ePCIe Gen3 kana DDR4 kunowedzera mutengo wekugadzira pasina rubatsiro rwechiratidzo runoyerwa. Sarudzo chaiyo inoda kutevedzera stub resonance yehukobvu hwe stackup yako chaiyo - kwete kushandisa back-drilling senzira yekudzivirira.
• Kuyera kwezvinhu pazvikamu zvemukati memukati: Kutsanangura premium low-loss laminate (Megtron 6, I-Tera MT40) pama layers ese gumi apo ma layers ekunze chete ane high-frequency traces ndiyo inonyanya kutsanangurwa zvakanyanya mu 10-layer HDI. hybrid stackup — premium outer buildup layers, standard high-Tg FR-4 inner core — inoita 88–92% yekushanda kwemagetsi kwakazara pamutengo wakaderera wezvinhu (reference).
• Magadzirirwo ekufambisa ndege yemagetsi: Kushandisa ma-vias akavigwa pakati pema-power planes pane ma-vias anoburitswa nepakati pema-hole vias kunomanikidza kuchinja kubva paType I kuenda kuType III processing — kunyangwe kana masaini ese ekutumira masaini anogona kuwanikwa muType I. Kuiswa kwe-symmetric power plane kunobvisa zvachose mutyairi wemari uyu.

1.2 Nei Mari yeMaraki Gumi Isingadhuri Pane Kuwedzera Kwemaraki Kunoratidza

Kuwedzera machira maviri emukati kune dhizaini yeHDI ine machira masere kunowanzo kuwedzera mutengo ne25–40% pahuwandu hweprototype - pasi pemuenzaniso wemutengo wepachikamu chimwe nechimwe. Chikonzero: zvinokonzeresa mutengo mukuru muHDI inhamba yekufamba kwelamination uye setup yekuchera nelaser, izvo hazvina kuchinja kana ukawedzera machira emukati akajairwa pamhando imwecheteyo yeHDI. Mutengo wepakati inguva yezvinhu uye yekufungidzira chete.

Zvinoreva zvakananga: kana huwandu hwenzira yako yekufambisa huchida huwandu hwakawanda, kubva pa8-layer Type I kuenda ku10-layer Type I kazhinji inodhura zvishoma pane kubva pa8-layer Type I kuenda ku8-layer Type II. Ma layer akawanda paHDI type imwe chete anodhura zvishoma pane ma layer count akafanana paHDI type yakakwira. Kuti uenzanise mitengo ye8-layer HDI ne stackup type, ona 8-layer blind yakavigwa kuburikidza nePCB price breakdown.

1.3 Rudzi I vs. Rudzi III: Kuvigwa Kuburikidzwa Nesarudzo mu10-Layer HDI

Sarudzo inonyanya kukosha yemutengo mumwe chete wedhizaini yeHDI ine layer gumi ndeyekuti ma-vias akavigwa mukati melayer anodiwa here. Uku kusarudza kwekugadzira nzira, kwete sarudzo yemhando yepamusoro - zvinofanirwa kutungamirirwa nekuti nzira dzako dzemasaini dzinoda here inner-layer kuburikidza nekuchinjana pakati pema-layer asiri pedyo ayo asingagone kuwanikwa nema-vias akaburitswa mukati melayer.

Hwaro hwekutarisa: kuwanda kwemitengo kwakaenzana uye kunosiyana zvichienderana nefekitori, saizi yebhodhi, uye magadzirirwo azvo. Nhamba dzese ndedzekuenzanisa chete — tumira Gerber yako kuti uwane mutengo chaiwo.

Muruzivo rweHighleap rweDFM, zvingangoita 60–70% yemagadzirirwo akaiswa seType III anogona kuzadzisa zvinangwa zvavo zvekufambisa muType I kana Type II mushure mekuongororwa kwe stackup - kubvisa 1–3 lamination cycles usati watanga kugadzira.

2) Kuchera Zvisikwa: Sarudzo yemutengo wechiratidzo chakavimbika kune HDI ine mativi akawanda

2.1 Nei Kushandiswa KwemaStubs Kuchikosha Zvikuru Pazvikamu gumi

Kana gomba rinobatanidza L1 neL5 pabhodhi rine zvidimbu gumi, bharero rinoenderera mberi nepakati peL6-L10 segomba risina kushandiswa. Stub iyi inoshanda se resonator yemutsara wekutumira, ichiratidza simba pa frequency apo urefu hwe stub hwakaenzana ne quarter-wavelength. Stub ye 0.8mm mu FR-4 (εr ≈ 4.3) ine resonant null yayo yekutanga pa 28 GHz.

Dambudziko rinova guru pamatanho gumi nekuti bhodhi racho rakakora, zvidimbu zvesimbi zvakareba, uye mafrequency e resonant anodzikira — padyo nekushandiswa kwema interfaces emazuva ano anomhanya zvakanyanya:

2.2 Kuboorera Musana vs. Kuboorera Nekupofoma: Kusarudza Nzira Yakakodzera

Pane nzira mbiri dzekubvisa kuburikidza ne stub resonance pabhodhi re HDI rine layer gumi. Sarudzo chaiyo inoenderana ne geometry yenzira yechiratidzo:

• Kupofumadza kuburikidza nekusvika: Hapana stub inogadzirwa nekuti via inogumira padanho rakatarwa. Inoshanda pakuchinja kubva padanho rekunze kuenda mukati (L1→L2, L1→L3, L9→L8, nezvimwewo). Haikwanise kusvika pakuchinja kwedanho remukati kuenda mukati. Zvakanakisa pakugadzira kubva pakutanga — hapana danho rekuwedzera rekuita, uye kugadzirisa patsva kwenzira kunogona kuderedza huwandu kuburikidza nekuverenga. Ona mapofu uye akavigwa kuburikidza nemitemo yekugadzira kune miganhu yekudzika uye zvinodiwa nerin'i ye annular.
• Maitiro ekuboorera kumashure: Inoshanda pakuchinja kwemukati-ku-mukati uko ma-blind vias asingakwanise kusvika. Inowedzera mashandiro echipiri ekuboorera kwemechanical anodzorwa nekudzika mushure mekugadzirwa kukuru. Inowedzera mutengo wepabhodhi (reference: inenge $8–$22 pahuwandu hwema-piece makumi mashanu - inosiyana zvakanyanya zvichienderana nekuverenga, kushivirira, uye fekitari). Inoda kuyera kudzika uye kuongororwa kweX-ray. Inodiwa kune magadzirirwo ekare ane zvipingamupinyi zvakatarwa kuburikidza nekuisa.

Pamabhodhi e400G Ethernet, kufambisa masaini ekumhanya kwakanyanya uchishandisa ma-blind vias chero kupi kwacho kuchinja kubva kunze kuenda mukati - uye kuchengetedza kuchera kumashure chete kwekuchinja kwemukati kuenda mukati - kazhinji kunoderedza kuchera kumashure kuburikidza nekuverenga ne40-60% zvichienzaniswa nekufambisa kwese-kuburikidza negomba. Ona gwara rehunyanzvi hwePCB rekuchera kumashure kuti uwane zvirevo zvekudzora kudzika uye kushivirira kwezvimedu zvinosara.

2.3 Zvikamu zveMari yeKuchera Mushure

Mari yekuboorera kumashure inoenderana zvakanyanya nemutengo wekugadzirisa wakatarwa (nhamba dzekutarisa - mitengo chaiyo inosiyana zvichienderana nefekitori nedhizaini):

• Kugadzika kwepaneru (kuyera kudzika, kuyedza kuboora makuponi): inenge $35–$80 pani — chinhu chakasimbiswa chinoita kuti kuchera kumashure kudhure pamutengo wakaderera
• Kuboorera kwega kwega: inenge $0.012–$0.028/kuburikidza nekushandisa michina yekuboorera yakadzama
• Kuongorora kudzika kweX-ray: inenge $4–$9 pakuongorora kwakawedzerwa
• Kushivirira kwakasimba kwezvimedu zvakasara: +/−0.05mm zvichienzaniswa ne +/−0.1mm zvinowedzera mutengo wekugadzirisa nekugadzirisa

Pamabhodhi mashanu, kuderedzwa kwemari yekuisa mapaneti ndiko kunonyanya kukosha pamutengo wekuboorera kumashure kwebhodhi rega rega. Pamabhodhi mazana mashanu, mutengo weper-via unotungamira huwandu hwese. Kune magadzirirwo anomhanya zvakanyanya anoda kubviswa kwestub, mutengo wacho unonzwisisika - asi kufananidzira kwechiratidzo usati wazvipira kuboorera kumashure kunogara kuchikosha nguva yekumodela.

3) Kugadzirwa kwePlane yeMagetsi uye Kukanganisa Kwayo Mari Yakavanzika

3.1 Maitiro Ekushandisa Simba Kugadzirisa Rudzi Rwechitatu

Chinhu chinowanzo tariswa chinopa mutengo weHDI ine layer gumi: kubatana kwesimba remagetsi nepasi pakati pe layer. Kana vagadziri vachifambisa simba pakati pe layer dzemukati dzisiri pedyo vachishandisa ma vias akavigwa (semuenzaniso, akavigwa kuburikidza nekubatanidza L4 kuL7 kuti vagovere power rail), vanoda kugadziriswa kweType III — kunyangwe kana nzira dzese dzekutumira masaini dzichigona kuitwa muType I.

Imwe nzira ndeye symmetric power plane architecture ine through-hole vias, iyo inoita kuti simba risvike zvakaenzana pasina chirango cheType III processing:

3.2 Nei Kufambisa Simba Nemaburi Kwakakwana Mumagadzirirwo EHDI Akawanda Ane Matunhu Gumi

Ma "through-hole vias" akachipa ne3–5× pa "via" pane ma "build vias" uye haadi "lamination cycle" yekuwedzera. Pakugoverwa kwesimba, akaenzana nemagetsi nema "build vias" muma "design" akawanda e "10-layer HDI" nekuda kwezvikonzero zvitatu:

• Simba remhepo rinodzorwa ne capacitance yendege uye kuiswa kwe capacitor inosanganiswa — kwete kuburikidza nerudzi rwemhando.
• Ma "via" anobatanidza ma "power planes" nema "decoupling capacitors" ane simba rakakwana rekutakura magetsi emagetsi emhando ye "10-layer HDI"
• Kuburikidza ne stub resonance (iyo inosimudzira sarudzo dzekuboorera kumashure kwemasaini ekumhanya kwepamusoro) haisi nyaya yendege dzemagetsi - kuendeswa kwemagetsi idambudziko risingawanzoitiki.

Kunze kwesimba remagetsi rine simba rakawanda mumabhodhi akakora zvikuru uko ma-via anoburitswa nepakati anoshandisa nzvimbo yakawanda yekufambisa pamatanho echiratidzo. Muganho uyu unowanzoonekwa panhamba dzematanho dziri pamusoro pe16, kwete pamatanho gumi ane symmetric plane allocation.

4) Kusarudzwa Kwezvinhu: Hurongwa Hwekusanganisa Hwakabatana hweMatanda gumi

4.1 Nei Giredhi reZvinhu zvemukati memukati risingakoshi kupfuura zvinofungidzirwa nemainjiniya

Mubhodhi reHDI rine mativi gumi rine symmetric stackup rinotsanangurwa muChikamu 3, mativi ekunze ekuvaka (L1–L2 naL9–L10) ane ma "high-frequency traces" akakosha zvikuru. L3–L8 i "reference planes" kana kuti "inner signal layers" anoshanda pama "frequency" akaderera. Dielectric loss tangent (Df) inonyanya kukosha pamatanho apo ma "high-frequency signals" anofamba madaro marefu - inova "outer buildup", kwete "core".

Kutsanangura Megtron 6 (Df ~0.002 pa10 GHz) pama layers ese gumi apo L1–L2 chete ndiyo inotakura masaini ari pamusoro pe5 GHz kuri kubhadhara mari yemagetsi isina kuyera pa layers masere pa gumi. Maitiro ekugadzirisa mutengo:

Mari yese inofungidzirwa inhamba dzekuenzanisa. Mitengo chaiyo inoenderana neGerber yako chaiyo, saizi, uye kuwanikwa kwezvinhu zviripo pari zvino. Tumira dhizaini yako kuti uwane mutengo wakarurama.

4.2 Kuomarara kweCopper Foil: Kugadziriswa Kwakanangwa kweMagadzirirwo e5–25 GHz

Kune magadzirirwo ari muchikamu che5–25 GHz uko kukwidziridzwa kwelaminate yepamusoro kuri pamuganhu, kutsanangura foil yemhangura yakaderera (LP) pazvikamu zvekunze zvechiratidzo inzira inonyanya kudhura pane kusimudzira zvikamu zvese. Mhangura yakajairwa ine electrodeposition ine roughness yepamusoro Rz ~3.5–5µm; mhangura yeLP inoderedza izvi kusvika ~1.5–2.5µm, zvichideredza kurasikirwa kwekuisa ne8–15% pa10 GHz pazvikamu zvechiratidzo zvakakosha.

Mhangura yeLP pazvikamu zvekunze inowedzera inenge 12–18% pamutengo wezvinhu zvekunze — chikamu chidiki chemutengo webhodhi — zvichienzaniswa nekuvandudza laminate stack yese iyo inokanganisa zvikamu zvese gumi. Kune magadzirirwo ane marginal link budget pa10–15 GHz, mhangura yeLP pazvikamu zvekunze pamwe neFR-4 yakajairwa pachikamu chepakati kazhinji ndiyo musanganiswa wemutengo/kushanda kwakanakisa. Ona sarudzo yePCB yezvinhu zvinokurumidza yeDf ne data rekuenzanisa mhangura roughness pamagiredhi ese.

5) 10-Layer HDI vs. 12-Layer Standard: Kana imwe neimwe ichikunda pamutengo

5.1 Nzvimbo yeRouting Density Crossover

Kugadzira mapuranga kwakajairika — "10-layer HDI inodhura kupfuura 12-layer standard" — kunongoshanda chete kune mhando chaiyo yeBGA pitches. Kugadzira mapuranga kwakakosha: 10-layer HDI inodhura zvakanyanya pabhodhi asi kunogonesa kuderedza huwandu hwema routing uye saizi yebhodhi izvo standard 12-layer isingakwanise kuita pasina kuwedzera mapuranga.

Kuchinjika kunoitika kana bhodhi remhando ye12-layer richida 14 kana 16 layers kuti riwane routing density iyo inopa 10-layer Type I HDI — ipapo mutengo webhodhi remhando ye10-layer unodarika mutengo weHDI board. BGA pitch ndiyo inosarudza kuti crossover iyoyo inowira kupi:

• BGA pitch ≥0.8mm: Maburi ane zvidimbu gumi nezviviri anowanzo shandiswa zvakanaka. Kuburikidza nepfupa rembwa nepfupa kunopa fanout yakakwana pasina kuboorwa nelaser.
• BGA pitch 0.5–0.65mm: Muganho wemuganhu — zvinoenderana nehuwandu hweI/O uye saizi yebhodhi. Shandisa magadzirirwo ese ari maviri kuburikidza neDFM kuti uone kuti ndeipi inozadzisa zvinangwa muzvikamu zvishoma.
• BGA pitch 0.4–0.5mm: 10-layer Type I HDI inowanzo shanda zvishoma pane 14-layer standard board inodiwa kuti pave nehuwandu hwakaenzana hwefeni.
• BGA pitch <0.4mm: HDI inodiwa. Kupfuudza neburi kuburikidza nedogbone routing hazvigoneki padanho iri; kuenzanisa PCB kwakajairika hakuchashandi.

5.2 Mutengo Wese Wesystem Uchienzaniswa Nemutengo Wepamwe Chete

Kune zvigadzirwa zvine kuderedzwa kwenzvimbo yebhodhi kune kukosha - nharembozha, zvinopfekwa, mamota emotokari uko nzvimbo yekurongedza iri shoma - kuenzanisa mutengo pabhodhi kunoratidza kukosha kweHDI. Bhodhi reHDI rine 10-layer diki ne20% pane 12-layer standard equivalent rinobvumira nzvimbo diki, vhoriyamu yekubatanidza yakaderera, uye zvingangoita kuti chigadzirwa chive chinhu chisingakwani mubhodhi.

Mutengo wepamusoro weHDI sarudzo unogona kuwanikwa zvizere mukuchengetedza maturusi ekuvhara, kuderedza huremu hwekutumira, kana kusiyanisa chigadzirwa kunotsigira mutengo wekutengesa wakakwira. Mutengo wese wesystem - kwete chinhu chePCB - ndiwo kuenzanisa kwakarurama.

5.3 Kana Mwero weZvikamu 12 uri Sarudzo Yakajeka

Mutengo we 12-layer unodarika 10-layer HDI kana zvese zvinotevera zvichishanda:

• Zvese zvikamu zvine pitch ye ≥0.8mm uye fanout ye dogbone yakajairwa inogoneka
• Saizi yebhodhi haina kuganhurirwa nechinhu chakavharirwa
• Mafrequency echiratidzo ari pasi pe5 GHz (hapana mukana wechiratidzo kubva pakureba kwakaderedzwa kweHDI)
• Hapana zvikamu zveBGA zvinoda kuboorwa nelaser zvakanaka kuburikidza nekuisa zvinhu

Kana izvi zvikaitika, kutsanangura 10-layer Type I HDI kunowedzera mutengo wekugadzira pasina routing, signal integrity, kana saizi better. Kugadzira multilayer PCB padanho re standard through-hole ndiyo nzira yakanakisisa yemutengo.

6) Mitengo Yekuenzanisira uye Zvinoita Kuti Ifambe

6.1 Maitiro Ekuverenga Aya MaReference Ranges

Mifananidzo iri pazasi imhando dzezviratidzo zvebhodhi re100×100mm pasi pemamiriro emusika akajairika. Iripo kuti ibatsire mainjiniya kunzwisisa kukosha kwemitengo yezvisarudzo zvekugadzira — kwete kutsiva mutengo wefekitori. Mitengo yePCB inotemerwa neGerber yako chaiyo, kwete netsananguro dzezvikamu. Bhodhi reHDI rine mativi gumi rine saizi dzisingawanzoitiki, kupedzisa kwakakosha, kana zvinodiwa zvishoma nezvishoma zvinogona kuve nemutengo wakasiyana zvikuru neaya mativi kune chero divi.

Mifananidzo inoratidza mabhodhi e100×100mm akajairwa, ma-stagged vias, IPC Class 2. Mutengo wako chaiwo unoenderana nemafaira ako ekugadzira uye zvirevo. Tumira Gerber yako kuti uwane mutengo wakarurama.

6.2 Nzira Shanu Dzakajairika Dzinoshandiswa Nemainjiniya Kubhadhara Zvakawandisa PaHDI YemaLayer 10

Zvichibva paongororo dzeDFM dzemagadzirirwo eHDI ane layer gumi, magadzirirwo aya anonyanya kuoneka uye ane mhedzisiro yakakura pamutengo:

• Kutsanangura Type III apo nzira yekufambisa inogona kuwanikwa muType I: Chikanganiso chinowanzoitika uye chinodhura zvikuru. Hazvigone kusimbiswa pasina ongororo yeDFM inoongorora zvakavigwa chaizvo kuburikidza nekudikanwa - kwete kungofungidzirwa kubva pakuwanda kwezvikamu chete.
• Kuboorera kumashure kwePCIe Gen3 kana DDR4: Hazvidikanwi kuti ma interface speed aya ashande pabhodhi rine 10-layer apo stub resonance inowira pamusoro pehuwandu hwemasignal frequency. Inowedzera mutengo wekugadzira pasina kuvandudzwa kwemasignal kunoyerwa.
• Megtron 6 pazvikamu zvese gumi apo zvikamu zviviri zvekunze chete zvine masaini ane mafrequency akakwira: Kugadzirwa kwemagetsi kweHybrid kunoita kuti magetsi ashande zvakafanana nemutengo wezvinhu wakaderera ne35–55% (ona muenzaniso).
• Kuiswa muzvikamu kuburikidza nezvivakwa kana ma-vias akarongwa aizoita kuti dhizaini ienderane neizvi: Ma "stacked vias" anoda "resin fill" uye "planarization" pakati pe "lamination cycles". Kushandura kuita "stagged via placement" kunobvisa danho iroro rekuita uye kunodhura zvachose.
• IPC Kirasi 3 yemabhodhi ekuratidza mienzaniso: Kirasi 3 inowedzera magwaro, chikamu chakasiyana, uye zvinodiwa zvekuongorora zvakakodzera kuti pave nekukodzera kugadzirwa - kwete kutanga kusimbiswa kwemuenzaniso wekutanga.

7) Kuwana Quote Yakarurama ye10-Layer HDI kubva kuHighleap

7.1 Chii Chinoita Kuti Mashoko Ave Akarurama — uye Zvinokanganiswa Nemareferensi

Mareferensi ari muchinyorwa chino anobatsira pakuenzanisa mutengo uye kuronga - haasi mashandisirwo emutengo uchienzaniswa nedhizaini yako chaiyo. Zvinhu zvinonyanya kukanganisa mitengo chaiyo yeHDI ye10-layer hazvina kutorwa netsananguro dzezvikamu:

• Zviyero zvebhodhi uye mashandisirwo epaneru: Bhodhi re120×100mm rinokwana mabhodhi gumi nematanhatu papaneru rimwe chete rinodhura zvishoma pane bhodhi re82×115mm rinokwana mabhodhi makumi maviri papaneru rimwe chete. Kushanda zvakanaka kwepaneru, kwete nzvimbo yebhodhi chete, ndiko kunoita kuti pave nemari yezvinhu.
• Kuburikidza nekuverengwa kwenhamba uye kupatsanurwa kwemhando: Pofoma kuburikidza nekuverenga, buri rinopinda kuburikidza nekuverenga, uye kana paine zvinhu zvakaunganidzwa kuburikidza nezvirongwa zvinoda resin kuzadza pakati pematanho e lamination.
• Tsanangudzo yekuchera shure: Kuburikidza nenzvimbo dzinoda kuchera kumashure, kureba kwenzvimbo dzakasara, uye kirasi yekutsungirira kudzika.
• Zvinodiwa zve impedance zvinodzorwa: Makoshero ekudzivirira chinangwa, kushivirira (±10% vs. ±5%), uye kuti ndeapi machira chaiwo ane zviratidzo zvekudzivirira-kudzora.
• Purogiramu yehuwandu: Huwandu hweodha yekutanga uye huwandu hwegore hunotarisirwa — huwandu hwegore negore hunosarudza kana mitengo yezvinhu zvekugadzirwa ichienderana neodha yekutanga.

7.2 Ongororo yeDFM Pasina Muripo

Kutumirwa kwese kweHighleap 10-layer HDI quote kunosanganisira ongororo yeDFM iyo inonyatsoongorora mapatani mashanu ekuwedzera muChikamu 6.2. Kana dhizaini yako ichigona kuwanikwa muType I pachinzvimbo cheType III, kana kana kuchera kumashure kusingakoshi kune ma frequency esignal yako, ongororo yeDFM inoratidza izvozvo usati wagadzira - kwete mushure mezvo. Ongororo yacho inopedzwa mukati memaawa 24-48. Kana shanduko yekugadzira ichizoderedza mutengo, mari inochengetwa inoverengerwa semari chaiyo kuitira kuti ugone kuongorora shanduko usati waita chibvumirano.

7.3 Zviyero zveKugadzira

Zviyero zvekugadzirwa kweHighleap zveHDI ine layer 10: Kubudirira kwerudzi rweI 95–97%; Kubudirira kwerudzi rwechipiri 92–95%; Kubudirira kwerudzi rwechitatu 88–93%. Mabhodhi ese eHDI ane layer 10 anogamuchira bvunzo yemagetsi ye100% (probe inobhururuka yemaprototypes, bvunzo yekugadzira), kuongororwa kweX-ray pachiyero chesampuli yerudzi rweI/II uye 100% yerudzi rwechitatu, uye data reTDR nekutumira kwega kwega kwakadzorwa-impedance.

Kuti uwane kuronga nguva yekubatsira pazvirongwa zveHDI zvine layer gumi, ona gwara rePCB rinoona nezveHDI . Kuti uwane hurongwa hwakazara hweHDI hunofukidza NRE amortization, yield loss modeling, uye total program cost, ona blind bidded via PCB cost analysis.

Tumira Gerber Yako Kuti Uwane Mutengo Wakarurama we10-Layer HDI