Kusarudzwa Kwezvinhu zvePCB zve112G uye Kugadzirwa kwePCB Kunokurumidza

"112G PCB material" inowanzoreva masisitimu elaminate akakodzera nzira dzemagetsi dze112 Gb/s-per-lane dzinoshandiswa muma chip-to-module, chip-to-chip uye backplane links. OIF CEI-112G inotsanangura makirasi akati wandei ekusvika, saka hapana chinhu chimwe chete chakakodzera bhodhi rega rega re112G.

Highleap Electronics inogadzira PCB nePCBA; isu hatigadziri laminate. Tinobatsira vatengi kuongorora sarudzo dzezvinhu zvakatenderwa, tobva tadzora stackup, copper, vias, connectors, assembly uye testing.

Ndezvipi zvinhu zvinodiwa pa112G PCB? Sarudza nebhajeti rekusvika kwechiteshi uye kurasikirwa, kwete nedata rate chete. Mashort VSR channels anogona kushandisa class yekurasikirwa yakasiyana kubva kuma long backplane channels. Df, copper roughness, glass weave, dielectric thickness, via stubs uye connector launches zvinofanira kuongororwa pamwe chete.

Zvinoreva "112G PCB Material" Chaizvo

Pepa redata re laminate rinopa hunhu hwakawanda; chiteshi che112G chinogadzirwa nekubatanidza. Chiteshi chapera chinosanganisira trace geometry, copper profile, vias, pads, connectors, reference transitions uye package breakouts.

VSR / chip-to-module

Kusvika padyo, asi mapakeji akakora uye kuburitswa kwezvinobatanidza kunoita kuti kusaenderera mberi kuve kwakakosha.

MR / chip-to-chip

Kuronga kwenguva refu kunoita kuti vanhu varasikirwe uye vanzwe sevanotaurirana.

LR / backplane

Machiteshi marefu uye maconnector akawanda anowanzoda magadzirirwo emagetsi asina kurasikirwa zvakanyanya kana rubatsiro rwetambo.

PCB yeOptical-module

Zvidimbu zvipfupi zvinoenderana nekuwanda kwakanyanya, simba uye zvipingamupinyi zvemakanika.

Iyi haisi sarudzo yechinhu chimwe chete kana kuti ye interface. Maitiro ekupedzisira anokonzerwa nekubatana kwe via stubs uye connector discontinuities nekurasikirwa kwe dielectric, nepo copper roughness uye glass-weave skew zvichiratidza kana dhizaini imwe chete ichigona kudzokororwa mumapaneru nema material lots. Ndosaka Highleap ichitanga nemafaira ebhodhi pachinzvimbo che generic product questionnaire.

Mutengi haafanire kunyatsonzwisisa mazwi ese ehunyanzvi muchikamu chino. Chinokosha ndechekuti mafaira anoratidza dunhu raanoda uye kuti fekitori igone kuona zvinhu zvinokonzeresa kugadzirwa. Highleap inoronga ongororo nenyanzvi dzakakodzera uye inotsanangura mhedzisiro yacho maererano nekukwanisika, mutengo, nguva yekutungamira uye kugamuchirwa.

Zvimiro zveZvinhu Zvakakosha pa112G

Mashandisirwo edata remagetsi haana kukwana kana bvunzo dzemagetsi dzisingakwanise kuona nzira inopfuura ongororo yechirongwa asi ichikundikana kuisa-kurasikirwa nemiganhu kana kusarongeka kusingatarisirwi pakati pemapairi akasiyana. Ongororo yacho inofanira kushandisa core chaiyo kana prepreg, copper profile , finished thickness uye via route. Apa ndipo panodzivirira mutengi kubva kune mumwe nemumwe kuti akwanise kududzira magwaro akawanda emutengesi ari ega.

Makoshero aDk neDf akaburitswa anongofanana chete kana nzira yekuyedza, ma frequency, resin content uye kugadzirwa kwemhangura zvanzwisiswa. Df yakaderera haina vimbiso yekuti chiteshi chapera chine kurasikirwa kwakaderera kana foil yakasarudzwa iri rough, dielectric yakakora kupfuura modeled kana kuti via field inounza discontinuities hombe. Highleap inoshandisa zvivakwa zviripo uye zvirevo zvemhangura zvakapedzwa pakuongorora kana kirasi yezvinhu zvakakumbirwa yakakodzera.

Makirasi Akajairika Ezvinhu zve112G PCBs

Zvichienderana nekusvika kwazvinoita, vagadziri vanogona kuongorora masisitimu ethermoset ane kurasikirwa kushoma, kurasikirwa kushoma, kurasikirwa kushoma kana kurasikirwa kwakanyanya. Mienzaniso inosanganisira mhuri dzinomhanya zvakanyanya kubva kuPanasonic, TUC, Isola, ITEQ, Nelco nevamwe vatengesi. Highleap haibati mabrandi aya seanozvimirira.

Kugadzirwa kwechinhu kunofanira kutsanangura laminate neprepreg, girazi, resin yakawanda, copper foil uye ukobvu. Zita remhuri rakadai sekuti “Megtron,” “ThunderClad” kana kuti “low-loss FR-4” harina kukwana.

Kudzokorora ndiyo bvunzo huru yekugadzira. Muenzaniso unogona kushanda kunyangwe kana hwindo rekugadzirisa rakafara, asi kugadzirwa kwehuwandu kunoratidza kusiyana kwezvinhu, kugoverwa kwemhangura, kurodha uye kuputira mapaneru. Tinoisa makuponi ekudzivirira nekurasikirwa, kuteverwa kwelaminate nefoil, kuenderana kwestackup nefield-solver uye back-drill kana HDI mukuburitswa kwekugadzira kuti tipe kuenzanisa kwakasimba pakati pemataipi. Kana EM-892K iri pane runyorwa rwezvinhu zvakatenderwa, kugadzirwa kweEM-892K kwemachaneli anomhanyisa kunofanirwa kuongororwa zvichienderana nezvinodiwa chaizvo zvestackup nechannel-loss.

Chinangwa chekugadzira uye muripo wefekitori zvine varidzi vakasiyana. Mutengi anotsanangura zvinodiwa zvemagetsi nekuvimbika; Highleap inoshandisa CAM yakatenderwa, kuchera, kuputira uye kugadzirisa lamination kunodiwa kuti isvike pamutengo wapera. Chero shanduko inokanganisa zvivakwa kana hunyanzvi inounzwa kuti ibvumidzwe pachinzvimbo chekuvanzwa mukati mekugadzirisa CAM.

Zvinorehwa nekusarudza zvinhu naDf Alone

• Mhangura isina kurongeka inogona kukonzera kurasikirwa kwakawanda kupfuura kuchengetedzwa kwekuvandudzwa kwe dielectric.
• Ma "long via stubs" anogona kugadzira ma "resonances" anotonga chiteshi.
• Kucheka-cheka kwegirazi kunogona kuderedza muganho wemaziso kunyangwe kurasikirwa nechinhu chakaiswa mukati kuchigamuchirwa.
• Ukobvu hwakadzvanywa husingadzorwi hunogona kufambisa impedance uye coupling.
• Kukanganisa kwekuburitswa kweconnector kunogona kukonzera kutadza kudzoka-kurasikirwa.
• Chinhu chinorasikirwa zvishoma chinogona kuwedzera mutengo pasina rubatsiro runoyerwa pamigero mipfupi.

Kudzokorora kugadzirwa kunounza imwe njodzi: imwe inogona kushandisa imwe nzira yekuvaka iripo asi iyo mhando yezvinhu zvemhando yepamusoro isingachinji. Highleap inonyora zvakatenderwa zve stackup, copper, process assumptions uye nzira yekuongorora kuitira kuti prototypes nekugadzirwa zvienzaniswe zvichienderana nehukuru hwakafanana hwekuburitswa.

Njodzi idzi dzinofanira kuderedza kushanda nesimba kunodiwa kuti munhu abate fekitori, kwete kuisimudza. Kana Highleap yangogamuchira mafaira eGerber kana ekugadzira, tinoongorora kutevedza kwakagamuchirwa kwelaminate nefoil, kuwirirana kwestackup nefield-solver, back-drill kana HDI review uye representative impedance uye loss coupons. Sarudzo dzinokanganisa mashandiro, kutevedzera mitemo, mutengo kana kutumira chete ndidzo dzinodzoserwa kumutengi.

112G Stackup uye Via Strategy

Highleap inoongorora kuiswa kwesignal-layer, reference continuity, copper profile, dielectric thickness, differential geometry uye via transitions. Back drilling , blind vias kana via-in-pad zvinogona kuderedza stubs, asi sarudzo yega yega ine mhedzisiro mukugadzirwa kwayo uye mutengo.

Kuchera kumashure

Inoda tafura yekuboorera yakaburitswa, dhayagiramu, muganho wezvimedu zvinosara uye nzira yekuongorora.

HDI

Inogona kupfupisa nzira dzekubuda nadzo uye kubvisa matanda anopinda nepakati, asi lamination yakatevedzana uye microvia dzakazadzwa zvinowedzera kuomarara.

Coupons

Kuponi dzeImpedance, insertion-loss kana S-parameter dzinofanira kuratidza huwandu chaihwo hwekugadzirwa uye copper.

Kudzokorora ndiyo bvunzo huru yekugadzira. Muenzaniso unogona kushanda kunyangwe hwindo rekugadzirisa rakafara, asi kugadzirwa kwehuwandu kunoratidza kusiyana kwezvinhu, kugoverwa kwemhangura, kurodha uye kuputira mapaneru. Tinoisa kuteverwa kwelaminate nefoil kwakatenderwa, kuenderana kwestackup uye field-solver, back-drill kana HDI review uye representative impedance uye loss coupons mukuburitswa kwekugadzira kuti tipe kuenzanisa kwakasimba pakati pezvinhu.

Nzira yakatwasuka inofanirwa kutariswa zvakafanana neyakaitwa nerouted trace. Kubuda kwega kwega kweBGA, shanduko yereferensi-plane, stub inopinda nepaburi uye kureba kweresteal back-drill kunokanganisa kurasikirwa kwekudzoka uye kushandurwa kwemode. Saka, stackup review inoratidza ma critical layer pairs, reference transitions uye via geometry isati yaitwa panelization. Kana HDI kana back drilling yakurudzirwa, nzira yekushivirira kugadzirwa uye yekuongorora inosanganisirwa mukuburitswa kwete kusiiwa sepfungwa yekugadzirwa isina kurongeka.

Kugadzira uye Kugadzira PCB yeHighleap 112G

Highleap inotsigira maPCB ane maPCB ane madiki-shoma, HDI, sequential lamination, via-in-pad, back drilling, controlled impedance, fine lines , low-profile copper constructions, AOI, electrical test uye cross-section. Optional TDR, S-parameter uye insertion-loss testing zvinogona kuverengerwa kana nzira nemiganhu zvatsanangurwa.

Pakusanganisa, tinopa nzira dzekuwana zvikamu, SPI, BGA/LGA placement, AOI, X-ray, press-fit, through-hole uye functional test.

Kuongorora kunosarudzwa zvichienderana nepakeji uye njodzi yekukanganisika. SPI inodzora kuiswa kwepaste, AOI inotarisa nzvimbo inoonekwa uye maficha e solder, uye X-ray inoshandiswa panowanikwa majoini akavanzwa. Ma interfaces chaiwo e optical, RF kana mechanical angadawo fixtures, datum checks kana mirairo yekubata vatengi.

Kugadzira kunotanga nekugadzirwa kwebhodhi risina chinhu. Warpage, copper balance, pad finish, via condition uye thermal mass zvinokanganisa kudhinda, kuisa uye kuyererazve. Highleap inoongorora PCB ne component layout pamwe chete kuitira kuti bhodhi rinosangana nemiedzo yebhodhi risina chinhu risave PCBA ine goho shoma mushure mekunge zvikamu zvine mutengo wakakwira zvaiswa.

Zvinodiwa zveKuburitsa Kugadzirwa kwe112G Channels

1. Omesa hurongwa hwezvinhu uye dzimwe nzira dzinobvumirwa.
2. Bvisa stackup ine nhamba yemazita uye yekutsungirira.
3. Tsvaga foil yemhangura uye fungidziro dzemhangura dzakapedzwa.
4. Ipa impedance uye zvinodiwa zvekurasikirwa nechiteshi.
5. Tsanangura magadzirirwo emusana kana microvia.
6. Ipai mamodheru ekubatanidza nemapakeji apo panodiwa kugadzirisa kutanga.
7. Bvumiranai dhizaini yemakuponi uye hukama hwebvunzo usati wagadzira.
8. Kudzora warpage yekubatanidza, kuyererazve kwemvura uye kuiswa kwechinongedzo.

Kufukidzwa kwebvunzo kunokanganisa mutengo nehurongwa, saka kunofanirwa kuenderana nenjodzi. Zvivakwa zvakakosha zvinowana kuongororwa kwakananga; zvinhu zvakagadzikana, zvisiri zvakakosha zvinogona kuvimba nekudzora maitiro kwakajairika. Mainjiniya akapihwa anobatsira kupatsanura bvunzo dzinobvumirwa kubva kudata reinjiniya rinobatsira uye hunhu hwesarudzo.

Bvunzo yemagetsi yakajairika inosimbisa kuvhurwa nekupfupika, asi hairatidzi zvese zvinodiwa pakushanda. Zvichienderana nedhizaini, chirongwa chinogona zvakare kushandisa makuponi e impedance, kuongorora back-drill, microsection uye sarudzo yekuisa-kurasikirwa kana kuchengetedzwa kweS-parameter. Highleap inosiyanisa kusimbiswa kwekugadzirwa kubva pakukodzera kwezvigadzirwa zvakakwana saka chiyero chebvunzo chakataurwa chinoenderana nesarudzo inotarisirwa kutsigira mhedzisiro.

Tumira Mafaira Ako Ekugadzira PCB e112G—Tichajekesa Zvimwe Zvose

Kuti muongorore kekutanga, tumirai mafaira eGerber kana mafaira ekugadzira ePCB emuno . Gwaro rakasiyana rinoratidza zvese zvinhu, mhangura, kurasikirwa uye zvinodiwa hazvidiwi kana zvinyorwa izvozvo zvatovepo mudata rekugadzira.

Sarudzo dzinokurumidza dzinoitwa neinjiniya

Mainjiniya weHighleap akazvipira achaongorora chimiro chechiteshi ichi nechikwata chedu chekugadzira masaini uye chekugadzira. Tichasimbisa zvinodiwa zvemhando yepamusoro, stackup, impedance, copper profile, HDI kana back-drill kuburikidza nekutaurirana zvakananga. Kutenga hakufanirwe kushandura dhizaini kuita cheki yehunyanzvi usati wakumbira mutengo.

Maitiro aya anopa mutengi mukana wekushandisa chimwe chinhu pane kutarisa zvinhu zvakawanda. Tanga waisa ruzivo rwebhodhi ; Highleap ichaongorora kugadzirwa kwezvinhu, ichaona sarudzo shoma dzinoda kusimbiswa, uye ichatungamira purojekiti kubva pamashoko akanyorwa kuburikidza nemuenzaniso uye kudzokorora kugadzirwa.

Kugadzirisa Mutengo wePCB we112G uye Zvinhu

Mutengo wezvinhu zvacho chikamu chimwe chete chemutengo wose. Kuwanda kwezvikamu, saizi yepaneru, mhangura isina kunyatsojeka, lamination yakatevedzana, kuchera kumashure, makuponi, nguva yekuyedza uye goho zvinogona kuva zvinhu zvikuru. Highleap inogona kuenzanisa zvivakwa mushure mekunge zvirambidzo zvemugero uye qualifiers zvazivikanwa.

Mabhodhi maviri ane saizi yakafanana uye nhamba yezvikamu zvakafanana anogona kuva nemitengo yakasiyana. Kuenzanisa kwakakodzera hakusi mutengo wezvinhu chete, asi nzira yekugadzira, mutoro wekuongorora, goho rinotarisirwa uye huwandu hwebasa reinjiniya kana rehunyanzvi rinodiwa kuti riburitswe.

Nguva yekushanda inowanzo dzorwa nekuwanikwa kwezvinhu, mhangura yakakosha, huwandu hushoma hwemutengesi, kugadziriswa kwakatevedzana kana hunhu hwekunze. Mainjiniya anoona chirambidzo chaicho chenguva uye anotarisa kana imwe nzira yakatenderwa inogona kuchibvisa pasina kuchinja zvinodiwa zvechigadzirwa.

Sarudza Mugero Wese, Wobva Waugadzira Nguva Dzose

"Zvinhu zve112G" hazvivimbiswi kuti zvichagadziriswa. Highleap inobatanidza laminate yakatenderwa nemhangura, stackup, kuburikidza nekugadzira, kugadzira, kuunganidza uye kuyedza kuitira kuti chiteshi chakavakwa chiratidze fungidziro dzekugadzira.

Mabasa ekambani achiri pachenawo. Vatengesi vezvinhu vanogadzira laminate, prepreg kana copper, uye vatengesi vezvikamu vanogadzira zvishandiso nezvinobatanidza. Highleap inotenga zvinhu zvinotenderwa uye inozvishandura kuita maPCB nemaPCBA apera nekutarisa, kuongorora uye kutaurirana nezvepurojekiti.

Bhodhi rakapedzwa rinofanira kuburitswa senzira imwe chete yemagetsi, yemakanika uye yekugadzira. Highleap inobatanidza mafaira evatengi nemakuponi emumiriri weimpedance uye ekurasikirwa, kuteverwa kwelaminate nefoil kwakatenderwa, hukama hwestackup uye field-solver pamwe nenzira yekuongorora yakabvumiranwa. Magwaro iwayo anobvumira prototype inobudirira kudzokororwa kana vhoriyamu yawedzera kana odha ikadzoka gare gare.

Kuvandudzwa kwezvinhu hakugone kutsiva kuburitswa kweconnector, nzira refu inosara kuburikidza ne stub kana nzira isina simba yekudzoka iyo yatove kushandisa mukana wechiteshi. Kusiyana neizvi, chiteshi chipfupi, chinodzorwa zvakanaka chingasade laminate inodhura zvakanyanya iripo. Basa reHighleap nderekuchengetedza fungidziro dzechiteshi dzakatenderwa mukugadzirwa nekubatanidzwa, ukuwo vachijekesa kuti ndeapi miganho iri mukugadzirwa kwesystem uye ndeapi anogona kudzorwa nePCB process.

Mibvunzo Inonyanya Kubvunzwa

PCB yega yega ye112G inoda laminate yakaderera-kurasikirwa here?

Kwete. Kurasikirwa kunodiwa kunoenderana nekusvika, topology, copper, connectors, vias uye system equalization.

Ko Highleap inogadzira laminate here?

Kwete. Tinogadzira PCB nePCBA tichishandisa masisitimu e laminate anotenderwa nevatengi.

Ko standard FR-4 inogona kutsigira 112G here?

Zvimwe zvimiro zvipfupi zvikuru zvinogona kuitika, asi hazvigone kufungidzirwa. Nzira yakazara inofanira kuenzaniswa uye kusimbiswa.

Chii chinonyanya kukosha, Df kana kuti copper roughness?

Zvese zviri zviviri zvinokosha. Mupiro wazvo unoenderana nehuwandu, jiyomethri, mhangura uye kureba kwemugero.

Highleap inogona here kuita basa rekuboorera kumashure uye HDI?

Ehe, zvinoenderana neDFM yepurojekiti uye zvinodiwa.

Chii chinofanira kutanga chatumirwa pakutenga mutengo we112G PCB?

Tumira mafaira eGerber kana mafaira ekugadzira PCB emuno. Mainjiniya weHighleap achaongorora purojekiti yacho mumwe nemumwe uye oronga zvinhu, kuunganidzwa, kuvharirwa uye kuburikidza nemibvunzo nechikwata chedu cheinjiniya.