Mabasa Ekugadzira PCB ECeramic Anotarisa Hunhu Hwebhodhi

Masevhisi ekugadzira maPCB eCeramic anotevera maitiro akasiyana zvachose nekugadzira mabhodhi eFR4. Kunyange hazvo kugadzirwa kweFR4 kuchisanganisira laminating copper foil kune substrates dzakagadzirwa kare dzeresin-glass, kugadzirwa kweceramic kunotanga ne substrates dzeceramic dzisina kugadzirwa dzinoda sintering patembiricha inodarika 1,500°C, zvichiteverwa ne metallization processes dzinobatanidza conductive layers kune ceramic surface kuburikidza nemakemikari kana michina.

Musiyano uyu unoreva kuti havasi vese mafekitori ePCB anogona kugadzira mabhodhi eceramic — kunyangwe vakaanyora pawebhusaiti yavo. Kunzwisisa zviri mukugadzirwa kwepurasitiki kunobatsira mainjiniya kutsanangura zvavanoda nemazvo uye kuongorora kana mupi wePCB weceramic achikwanisa kuita basa racho.

1. Chii Chinoita Kuti Kugadzirwa kweCeramic PCB Kusiyane neKugadzirwa kweStandard PCB

1.1 Kupisa Kwemaitiro

MaPCB eFR4 anogadziriswa pasi pe200°C kuti apiswe uye 260°C kuti apiswezve. Zvigadziko zveceramic, zvakasiyana, zvinopiswa pa850–1,700°C zvichienderana nechinhu chacho uye rudzi rwemagadzirirwo acho. Izvi zvinoda maovheni ekupisa kwepamusoro ane hunyanzvi hwekutonga mhepo chaiyo - michina iyo mafekitori ePCB asina.

1.2 Maitiro Ezvinhu

Ceramic haina kusimba. Kusiyana neFR4, iyo inogona kuboorwa, kuendeswa kune dzimwe nzvimbo, uye kubatwa nemaitiro akajairwa emakanika, ceramic substrates dzinoda kuboorwa nelaser kuti zviome, kunyorwa kwedhaimani kana kucheka nelaser kuti zviome, uye kubatwa nokungwarira panguva yekugadzira kudzivirira kutsemuka. Panel imwe chete isina kubatwa zvakanaka inogona kuputsa nzvimbo yese yekugadzira.

1.3 Kemistri yeKugadzira Metallization

Mhangura haibatiri zvechisikigo paceramic. Kugadzira danda remuchina wekufambisa zvinhu rakavimbika kunoda maitiro ekubatanidza akasarudzika — DBC (Direct Bonded Copper), kudhinda kwechidzitiro chefirimu rakakora, sputtering yefirimu rakatetepa, kana AMB (Active Metal Brazing) — imwe neimwe ine michina yakasiyana, zvinhu, uye maparamendi ekugadzirisa. Nzira yekugadzirisa simbi ndiyo inosarudza resolution yetrace resolution inogoneka, kugona kwekutakura magetsi, uye kuvimbika kwenguva refu kwebhodhi rapera.

2. Maitiro Ekugadzira: Nhanho Nenhanho

2.1 Overview

Nzira yakajairika yekugadzira PCB yeceramic inosanganisira:

1. Kugadzirira substrate: Kuongorora kwakaitwa pamusoro pezvinhu zvisina kucheneswa zveceramic (kuchena, saizi, kuomarara kwenzvimbo), kunoteverwa nekuchenesa nekunamira panzvimbo inodiwa.
2. Metallization: Kushandisa jira rekufambisa mvura kuburikidza neDBC bonding, kudhinda nekupisa firimu rakakora, kuisa firimu rakatetepa, kana maitiro eAMB
3. Kugadzira mapatani edunhu: Photolithography uye etching kutsanangura trace geometry kubva pamusoro pesimbi
4. Kuburikidza nekugadzira: Kuboorera nelaser kuburikidza ne ceramic substrate; kuburikidza nekuzadza ne conductive paste kana plating
5. Surface kupedzisa: ENIG, goridhe rakaoma, Ni/Ag, kana OSP — yakasarudzwa zvichienderana nenzira yekuungana uye mashandisirwo ayo
6. Kuenzanisa: Kunyora neLaser, kucheka madhaimani, kana kupatsanura mavanga kuti uparadzanise mabhodhi ega ega kubva pakugadzira.
7. Kuongorora uye kuyedza: Kusimbiswa kwehukuru, kuyedzwa kwekuenderera mberi kwemagetsi/kuyedzwa kwekuparadzanisa, kuongorora kwemaziso, uye kuyedzwa kwekuvimbika sezvakatsanangurwa

2.2 Kuchinja-chinja kwemaitiro neMetallization Method

Kuti uwane rumwe ruzivo rwakadzama nezvekugadzirwa kweDBC, ona gwara redu rekugadzira substrate reDBC.

3. Sarudzo dzeZvinhu uye Maitiro Adzinoita Kutungamira Kwemaitiro

Zvinhu zvakagadzirwa neceramic substrate hazvingogumiri pakuita kwekupisa nemagetsi kwebhodhi chete, asiwo kuti ndeapi maitiro ekugadzira anogona kushandiswa:

Kuti tiwane nhungamiro yakadzama yekuenzanisa uye kusarudzwa kwezvinhu, gwara redu rekugadzira alumina PCB rinotsanangura sarudzo inonyanya kushandiswa yesimbi yeceramic.

4. Magadzirirwo Akakosha Ekuita Anosarudza Hunhu hweBhodhi

4.1 Kudzora Kupisa Kwekutsvedza / Kubatanidza

Kubatana kweDBC kunoda kufanana kwekushisa kwechoto mukati me ±3–5°C munzvimbo yese inopisa. Kunyangwe kuderera kwekushisa kudiki kunokonzera simba rekubatana kwemhangura neceramic - rakasimba pakati, risina simba kumicheto - zvichikonzera kutadza kwekubvisa zvidimbu pasi pekupisa.

4.2 Kudzora Mhepo

Kubatana kweDBC nekupisa kwefirimu rakakora zvinoda kutarisirwa kwakanyatsojeka kwemhepo. Kubatana kweDBC kunoshandisa nitrogen ine oxygen inodzorwa (kazhinji 10–50 ppm O₂) kugadzira copper oxide interface iyo inogonesa kubatana. Okisijeni yakawandisa inogadzira oxidation yakawandisa; shoma inodzivirira kuumbwa kwebond. Kupisa kwefirimu rakakora kunoshandisa nitrogen kudzivirira oxidation yemuchina panguva yekupisa.

4.3 Kudzora Kwemadimikira

Zvigadziko zveCeramic zvinodzikira panguva yekusvina — kazhinji 15–20% zvichienderana nezvinhu uye maitiro acho. Kudzikira uku kunofanirwa kubhadharwa mudhizaini yegreen-tape (yeLTCC/HTCC) kana kudzorwa kuburikidza nekugona kusarudza substrate kune processes dze metallization dzakapfurwa. Kugona kwekupedzisira kwekugadzirwa kwe ceramic PCBs kunowanzova ±0.05–0.10 mm.

4.4 Simba rePeel

Kubatana pakati pemuchina wesimbi nesimbi — kwakayerwa ne90° peel test paIPC-TM-650 — ndiyo inonyanya kukosha pakuvimbika kwePCB yesimbi. DBC inodzorwa zvakanaka inosvika >8 N/mm; maitiro epakati anopa 4–5 N/mm. Taura zvinodiwa zvishoma zvekugamuchirwa muodha yako yekutenga.

5. Kupedzisa Pamusoro uye Kugadzirisa Mushure meKugadzirwa

Kusarudzwa kwemupendero wepamusoro kunoenderana nemaitiro ekugadzira pasi:

• ENIG (Nickel isina Electro / Goridhe rekunyudza): Standard yeSMT assembly; inopa nzvimbo yakati sandara, inogoneka kusungirirwa uye inogara kwenguva refu. Ni: 3–6 µm, Au: 0.05–0.1 µm
• Ndarama yakaoma (yemagetsi): Zvinodiwa pakubatanidza waya (Au kana Al wire) uye nzvimbo dzinobata waya zvakanyanya. Au: 0.5–2.5 µm pamusoro peNi barrier
• Ni/Ag: Zvakajairika pakusonesa mamodule emagetsi; zvinopa kugona kusonera zvakanaka uye zvinodhura zvishoma pane goridhe
• OSP: Sarudzo inodhura yemagadzirirwo achagadzirwa nguva pfupi mushure mekugadzirwa; nguva shoma yekushanda

Matanho ekugadzirisa mushure mekushandisa anogona kusanganisira kuchekerera ma resistor values ​​ne laser (yema thick-film circuits), kugaya cavity kuti zvikamu zvisavepo, uye kugaya edge chamfering kuderedza njodzi yekupwanya chipping panguva yekubata.

6. Maitiro Ekugadzirira Mafaira Ako Ekugadzira Ceramic

Kugadzirwa kwePCB yeCeramic kunoda magwaro akazara kupfuura maodha akajairwa eFR4. Mafaira ako anofanira kusanganisira:

• ☐ Mafaira eGerber (machira emhangura, chifukidziro chesolder, silkscreen, substrate outline, machira ekusimbisa/ekupinza kana zvichibvira)
• ☐ Dhirowa rekugadzira rine mativi ese, kushivirira, kuyera zvinhu, uye kupedzisa pamusoro
• ☐ Tsanangudzo yematanda (zvinhu zve substrate, ukobvu, nzira yekugadzirisa simbi, ukobvu hwemhangura)
• ☐ Zvinodiwa pakuedza magetsi (kuenderera mberi, kukosha kwekudzivirira kupatsanurwa)
• ☐ Zvinodiwa pakuedza kuvimbika (kutenderera kwekuvhunduka kwekupisa, simba shoma rekubvisa, voltage inomira ne dielectric)
• ☐ Zvinodiwa pakugadzira mapaneru (kana kubvumira mugadziri kuti agadzirise)

Zvinhu zvisipo kana kuti zvisina kujeka ndizvo zvinokonzera matambudziko emhando yepamusoro mukugadzirwa kwePCB dzesimbi. Shandisa nguva yakawanda uchitanga magwaro - zvinochengetedza mavhiki ekudzoka-dzoka uye kudzoka uye zvinogona kugadziriswazve.

Kumbira Mutengo Wekugadzira

7. Mabasa Ekugadzira PCB dzeCeramic dzeHighleap

Highleap Electronics inoshandisa mitsetse yakagadzirwa yePCB yeceramic muGuangzhou, China, ichitsigira huwandu hwese hwezvinhu zve substrate uye maitiro esimbi:

• Zvinhu: Al₂O₃ (96%, 99.6%), AlN, Si₃N₄ — ine ongororo inopinda uye kurongeka kwenzvimbo yega yega.
• Metallization: DBC (Cu 0.15–0.6 mm), firimu gobvu (Ag-Pd, Au), firimu rakatetepa (rakaputswa Cu/Au), AMB
• Kushivirira: ± 0.05 mm kurongeka kwehukuru; kugona kwelaser kusvika dhayamita ye0.1 mm
• Surface inopera: ENIG, goridhe rakaoma, Ni/Ag, OSP
• Hunhu system: ISO 9001 + ISO 13485 + IATF 16949 + ISO 14001
• Rutsigiro rweDFM: Ongororo yemahara yeinjiniya pane yega yega odha ine mhinduro chaiyo uye inoshanda

Tinopa masevhisi ekugadzira chete kumapoka anobata kuunganidza zvakasiyana, pamwe nekubatanidza kuunganidza kwakabatanidzwa + PCB kune avo vanoda mhinduro yemutengesi mumwe chete. Chikwata chedu cheinjiniya yekutarisira kupisa chiripo kuti chibatsire kugadzirisa sarudzo ye substrate uye kupisa kuburikidza nemazano usati wagadzira dhizaini yako.