Matambudziko Manomwe Akakosha Ekugadzira muDrone Optical Data Link PCBs

Iyo drone optical data link PCB ndiyo injini yekushandura electro-optical iri pakati pecheni yega yega yekutaurirana yeUAV ine fiber-tethered. Inoshandura masaini emagetsi kubva kukombiyuta yekubhururuka kuita modulated laser light yekutumira fiber, uye inoita shanduko yekudzokera kumashure pazviratidzo zve optical zvinouya - ichidzosera ma photon akagamuchirwa kuita data remagetsi iro processor inogona kushanda pariri. Mamwe mabhodhi ese ari mu tether system - spool controller, canister electronics, ground station - zvinoenderana nechikamu ichi chimwe chete chinoita shanduko yacho nekuvimbika kwakakwana zvekuti link yese inosangana nedata rate yayo, latency, uye bit-error-rate targets.

Chinoita kuti dhizaini yePCB ye optical data link ive yakaoma ndeyekugara pamwe chete kwenzvimbo dzemasaini dzisingaenderane pabhodhi rimwe chete: masaini e gigabit-rate differential kubva kuFPGA, circuit ye ​​analog laser drive inonzwisisika kune ruzha rwe microvolt-level, photodetector ine ruzha rwakaderera inoshanda pamucheto wekunzwa kwayo, uye nzvimbo dzakawanda dzesimba dzinofanira kuparadzaniswa dzichigovana substrate yakamanikana.

Tora Mutengo wePCB weOptical Data Link

Basa reSisitimu uye Kuyerera kweChiratidzo

PCB ye optical data link iri pakati peUAV's digital subsystem nefiber. Nzvimbo yayo mu tether chain ndiyo inosarudza bhajeti rekuvimbika kwesignal yezvese zviri kumusoro nepasi: chero simba re optical rinoitwa ne transceiver, chero nguva inokonzereswa neSerDes, chero BER inogadzirwa ne clock recovery circuit — ma parameter aya anosunga zvinogona kudzoserwa ne ground station.

Kuyerera kwechiratidzo munzira yekutumira: FPGA inogadzira data reLVDS kana CML rakasiyana pamutsetse → SerDes serializer inoshandura data rakafanana kuita serial stream ine kumhanya kukuru → mutyairi welaser wetransceiver anogadzirisa laser diode → fiber inotakura simba re optical kuenda kunzvimbo yepasi. Nzira yekugamuchira inoratidza izvi: simba re optical rinouya → photodetector → transimpedance amplifier → limiting amplifier → CDR (wachi uye data recovery) → FPGA deserializer → data rakafanana ne processor.

Bhodhi rinofanira kutonga zvese izvi munzvimbo ine UAV: ​​kudedera pakati pe10–2000 Hz, kuchinja kwekushisa kubva pa -20 °C pakureba kusvika pa +60 °C muzuva rakananga, kuvhunduka kweconnector kubva pakumhara, uye kudziviswa kwenguva refu kwemari yehuremu inoyerwa mumagiramu. Izvi zvinodiwa zvinoumba sarudzo yega yega kubva pakusarudzwa kwetransceiver kusvika kusarudzo yezvinhu zvePCB. Sisitimu yeUAV tether PCB inoisa zvimwe zvirambidzo zvemakanika pakutungamira kweconnector uye chimiro chebhodhi.

Kusarudzwa kweTransceiver: SFP, TOSA/ROSA Yakatengeswa, uye Custom

Sarudzo yekusarudza transceiver ine mhedzisiro yakawanda kupfuura chero imwe sarudzo mukugadzira optical data link board. Inosarudza rudzi rweconnector, cage geometry, footprint, thermal path, supply interface, uye — zvakanyanya — kana zvichikwanisika kutsiva field.

Pamagadzirirwo eSFP/SFP+ anobhurwa, kusarudza keji kunokosha kupfuura chinoshandiswa pamagetsi. Magasket eEMI, simba rekuchengetedza, uye chiyero chekudengenyeka zvinosiyana pakati pevagadziri vekeji. Makeji ane chiyero chendege ane nzira dzekukiya akakodzera chero UAV inofambiswa zvakanyanya. Keji inofanira kubatanidzwa nePCB kuburikidza nemagetsi anodziya kusvika pakudururwa kwemhangura, kwete kusiiwa kuti ipinde mumhepo.

Magadzirirwo eTOSA/ROSA akasungirirwa anobvisa kuomarara kwekeji asi anoda kuti mugadziri atsanangure mashandiro emagetsi kune laser driver neTIA zvakananga. Chinhu chakanaka ndechekuderedza huremu hwe3–6 g uye kubvisa kusimba kwekunzwa kwekeji — kwakakosha pamapuratifomu apo kuvimbika kweconnector pasi pekuzununguka kuri dambudziko.

Kuvimbika kweSignali Yekumhanya Kwakakwirira pa10 Gbps

Pa 10 Gbps, chikamu cheyuniti i100 ps. A via transition inowedzera 15 ps yekunonoka kusawirirana pakati pe differential pair inokanganisa kuvhurwa kweziso zvakanyanya. Sarudzo dzenzira dzinogamuchirwa pa 1 Gbps dzinogadzira marginal links pa 10 Gbps uye open failures pa 25 Gbps. Optical data link board ndiyo nzvimbo iyo signal integrity discipline inofanira kunge yakanyanya kuomarara mu drone PCB stack yese.

Kudzora kweimpedance yakasiyana: 100 Ω ±10% yeSFP/SFP+ host interface (zvinodiwa neIEEE 802.3). Izvi zvinoitwa kuburikidza ne controlled trace geometry — kazhinji 100 µm traces ine 100 µm spacing paFR-4, yakanyanya kusimba pazvinhu zvinorasikirwa zvishoma. Kuchinja kwese kwe layer kunoda reference return kuburikidza mukati me200 µm yechiratidzo chimwe nechimwe kuburikidza.

Kuburikidza nekutonga kwesimbi: Pamabhodhi akakora kupfuura 1.6 mm, nzira yekupinda nepakati pesimbi yakazara inogadzira simbi iri pasi pechiratidzo chinonzwika muhuwandu hwe10-20 GHz, zvichiburitsa maburi ekurasikirwa nekuisa uye kuratidzwa. Kuboorera kumashure kunobvisa simbi iri mukati me125 µm kubva pachiratidzo. Pakugadzira simbi yakawanda, simbi dzinovhara maziso kana dzakavigwa dzinobvisa simbi yacho nekugadzira kwayo - nzira yacho inongowanikwa chete pakati pezvikamu zvainofanira kubatanidza. Sarudzo pakati pesimbi dzinovhara maziso nesimbi dzinovhara maziso/dzakavigwa inoenderana neukobvu hwebhodhi, vhoriyamu, uye kushivirira kwemutengo.

Kugoverwa kwezvikamu: Kuendesa ma "high-speed differential pairs" pa "stripline layers" (inner layers pakati pe "reference planes") kwete pa "microstrip". Stripline ine symmetric return current distribution" uye yakadzivirirwa kubva ku "radiated emissions". Usambofa wakaendesa "10G pair" iri pedyo ne "power plane" - kusagadzikana kwe "impedance" uko "plane" inopatsanurana kana kuchinja voltage inogadzira "reflections" inovhura ziso.

Kubatana kweAC: Tsanangudzo yeSFP+ inoda kusanganiswa kweAC kudivi remubati, 100 nF mupakeji ye0402, yakaiswa mukati me5 mm kubva pamapedhi eSFP+. Ma capacitor eLow-ESL anodiwa — ceramics dzakajairwa dzakawanda muX5R/X7R dielectric. Ma coupling capacitors anoshandawo seDC block inodzivirira laser bias current kuti isayerere muFPGA SerDes.

Pamagadzirirwo akavakirwa paFPGA, ma differential pairs anobva muFPGA BGA fanout zone anoda kutariswa zvakanyanya. BGA via fields inoita kuti capacitive loading discontinuity isashande. Mugadziri anofanira kusarudza pakati penzira yekufambisa kuburikidza ne via field (zvinogamuchirwa kana field iri shoma) kana nzira yekufambisa ichitenderedza (zvinodiwa kuti pave ne dense arrays). Chero nzira, kureba kwakaenzana mukati me50 µm pakati peP neN traces dzepeya imwe neimwe kunodiwa kubva paBGA pad kuenda kuSFP cage pad. Nzira yeHDI PCB inoshandisa microvias inoderedza stub concerns uku ichibvumira BGA fanout yakasimba.

Dhizaini Yekupa Simba reLaser

Magadzirirwo anodiwa: switching converter inopa bhazi repakati (3.3 V kana 5 V), richiteverwa neLDO dzakatsaurirwa dzine ruzha rwakaderera kune imwe neimwe transceiver voltage rail. Ferrite bead ine high impedance pa100 MHz–1 GHz inobvisa LDO input kubva pa switching converter output. LDO output inobatanidza netransceiver kuburikidza nefirita: 22 µF bulk ceramic + 100 nF bypass + 100 pF high-frequency decoupling, zvese zviri mukati me3 mm kubva pama module power pins.

Madhijitari emagetsi eTransceiver: mamodule eSFP akajairwa anoda 3.3 V kusvika pa1 A. Mamodule eSFP+ angangoda 3.3 V yakaparadzana uye 1.8 V supply yemukati melogic. Zvinhu zviviri izvi zvinofanirwa kurongwa — logic isati yatanga power amplifier — zvichienderana nedanho remodule rekugadzirisa datasheet. Kutevedzana kusina kunaka kunokuvadza madhiraivha elaser. Kutevedzana kunoitwa muhardware (RC delay circuits kana sequencer IC yakatsaurirwa) pane kuvimba nehurongwa hwekutanga software, izvo zvisingavimbike muzviitiko zvekudzoreredza zvikanganiso.

Magetsi ekudzoka kwepasi anofanira kutariswa zvakafanana nemagetsi aripo. Nzira yekudzoka kwemagetsi ekutyaira kwelaser inofanira kunge iri kubatana kwakananga, kusingapindi simba kune referensi yepasi ye transmitter IC. Chero inductance iri munzira yekudzoka inowedzera kune inoshanda laser drive impedance uye inoderedza modulation bandwidth. Shandisa polygon yakasimba yemhangura iri pasi pe laser driver, yakasungirirwa pasi kuburikidza nemavias akawanda, pane nzira yerouted ground trace.

Gamuchira Path uye Photodetector Front End

Nzira yekugamuchira inotangira pa RD± pins dzeSFP cage (kana kuti ROSA's electrical output) uye inoguma paFPGA SerDes RX differential input. Chiratidzo chechiratidzo ndeichi: photodetector → TIA (transimpedance amplifier, mukati memodule) → limiting amplifier → CDR → FPGA input. Muma pluggable SFP architectures, TIA ne limiting amplifier zviri mukati memodule uye mugadziri anongoda kupa nzira yakachena yeAC-coupled differential kuenda kuFPGA. Muma ROSA-based designs, TIA inogona kunge iri external component paPCB.

Kunzwa kwemugamuchiri wemodule yakajairika yeSFP i-−22 dBm. Pa10G (SFP+), −9.9 dBm inowanzoitika kune maSR optics. Bhajeti remagetsi ekuona — simba rekutumira kunze kwekurasikirwa kwese kwemaziso (fiber, connectors, splices) kunze kwekunzwa kwemugamuchiri zvishoma — ndiyo link margin. Kune 1 km tether application ine 0.4 dB/km fiber loss uye maconnectors maviri pa0.3 dB imwe neimwe, kurasikirwa kwese kwemaziso kuri pasi pe2 dB — mukati me12+ dB bhajeti yeSFP+ optics yakajairika.

Kurongeka kwePCB yenzira yekugamuchira kunofanirwa kuderedza kutsveyama kwakasiyana uye kurodha kwe capacitive pa RD± traces. Chero kusawirirana pakati pe P ne N traces kunoshandura kutsveyama kwenguva paFPGA input, zvichideredza kuvhurwa kwemaziso. Dzivisa kuisa ma vias kana shanduko dze topology pane imwe trace ye peya pasina shanduko yakafanana pane imwe. CDR muFPGA SerDes inogona kutsungirira kushamisika, asi kwete muganho - physical layer inofanira kupa zviratidzo zvakachena kuti CDR irambe yakakiyiwa pa tembiricha yekushanda.

Kuongororwa kweDDM Kuongorora

Mamodule eSFP/SFP+ anoshandisa Digital Diagnostics Monitoring (DDM, inonziwo Digital Optical Monitoring kana DOM) zvichienderana neSFF-8472. Iyo I2C interface iri paaddress 0x51 inopa kudzokorora kwechokwadi kwe: laser transmit power (dBm), received optical power (dBm), laser bias current (mA), module temperature (°C), uye supply voltage (V). Parameter yega yega ine software-configurable alarm uye yambiro thresholds.

Data reDDM haringobatsiri chete pakuongorora nzvimbo - rinogonesa kugadzirisa zvinofanotaurwa. Kuwedzera kwelaser bias current nepo transmit power ichiramba yakasimba kunoratidza kukwegura kwelaser (mutyairi ari kubhadhara kushanda kwakaderera). Kuderera kwesimba re optical rinogamuchirwa nesimba re transmit rakagadzikana kunoratidza kuora kwe fiber kana connector. Kutevera mafambiro aya panguva yekubhururuka kunobvumira vashandi kuronga kugadzirisa usati wava ne marginal link yakundikana.

Bhazi reI2C reDDM rinofanira kufambiswa nekungwarira. Mapini eI2C eSFP+ cage ari pa3.3 V logic. Kana FPGA kana microcontroller I2C iri pavoltage yakasiyana, shanduro yemazinga inodiwa. Bhazi rinofanira kunge riine ma pull-up resistors kusvika ku3.3 V (kazhinji 4.7 kΩ) uye harifanirwe kugovera bhazi reI2C nezvimwe zvishandiso zvinogona kukonzera glitches zvichiita kuti module isagadziriswe zvakanaka. Chishandiso chekutarisa pasi chinoshanda paPCB yefiber optic canister , zvichiita kuti hutano hwekubatanidza huonekwe kubva kumativi ese panguva imwe chete.

Kuronga Layer Stack uye Impedance

Stack ine mativi matanhatu ndiyo inodiwa pabhodhi rekubatanidza data re10 Gbps rine signal integrity yakakwana uye simba rakagoverwa. Stack ine mativi masere inosarudzwa pakugadzira madhizaini ane dense BGA routing, multiple power domains, kana co-located analog uye digital circuitry.

Basa remazuva matanhatu: Chikamu 1 — zvikamu zvepamusoro uye zviratidzo zve microstrip; Chikamu 2 — plane reference plane; Chikamu 3 — mapeya e stripline ane kumhanya kukuru (FPGA kuenda kuSFP cage); Chikamu 4 — power planes; Chikamu 5 — ground; Chikamu 6 — zvikamu zvepasi uye zviratidzo zvechipiri. Mapurani maviri epasi (L2 neL5) anopa nzira dzekudzoka dzezviratidzo zvinomhanya zvakanyanya paL3 uye anodzivirira kugoverwa kwesimba paL4 kubva pakupenya kumusoro kuenda muzvikamu zvezviratidzo.

Pamagadzirirwo anoda impedance inodzorwa , mugadziri anofanira kuziva dielectric constant uye ukobvu hwe prepreg/core pair yega yega, target impedance ye layer yega yega, uye tolerance (±10% kune akawanda ma optical link applications, ±5% kune anonyanya kuda). Kuongororwa kweTDR kwema production boards kunosimbisa impedance chaiyo inopesana ne design targets. Kutsanangura controlled impedance mu manuals ekugadzira - kwete kungodhirowa traces pahupamhi hwakaverengerwa - kunodiwa kuti pave nekugadzirwa kwakafanana.

Kusarudzwa kwezvinhu zvinopfuura standard FR-4 kunova kwakakosha pa10 Gbps zvichikwira. FR-4 (Dk ~4.2–4.5 pa1 GHz, inokwira pa low frequency) inounza frequency-dependent depend depend iyo inoderedza edge rates pa long run. Kune board runs inodarika 100 mm pa10 Gbps, zvinhu zvinorasikirwa zvishoma zvakaita seIsola 370HR kana Panasonic Megtron 6 zvinoderedza insertion loss. Pa25 Gbps, zvinhu zvinorasikirwa zvishoma zvinodiwa, kwete sarudzo.

Thermal Management

Mamodule eSFP anopararira kubva pa0.5–1.5 W zvichienderana nerudzi uye mwero wedata. Mamodule eSFP+ anopararira kusvika pa2.5 W. Muimba yeUAV yakavharirwa ine mhepo shoma, kupisa uku kunofanira kuendeswa muPCB uye kunoenda kuairframe pane kuvimba ne convection.

Keji yeSFP inopa mukana wekupisa kuburikidza nepamusoro payo kana yakagadzirirwa iyo - chinhu chinoenderana nekupisa (TIM) chiri pakati pechivharo chekeji neUAV housing chinoendesa kupisa kwemodule zvakananga kune chassis. Keji-ku-PCB interface inoshandisa thermal vias: 0.3 mm drill diameter, 1 mm pitch, yakarongwa mugrid pasi pe cage footprint. Inner layer copper drips inounganidza kupisa kubva kuma vias uye inopararira kudivi isati yasvika kumucheto kwebhodhi kana nzvimbo dzekuisa chassis.

Pamidziyo yeTOSA/ROSA yakasungirirwa, nzvimbo diki inoisa kupisa munzvimbo diki, zvichiwedzera kuramba kupisa kwenzvimbo. Via array iri pasi pema optics akasungirirwa inoda pitch yakasimba (0.6 mm) uye copper pads dzakakura kuti dzitsigire. Kupisa kwejunction kunofanirwa kuongororwa zvichienderana nezvinodiwa nemudziyo mukupisa kwese kwekushanda - musanganiswa wekupisa kwemhepo padanho regungwa uye kuzvidziisa pachako kunogona kusvika pamiganhu nekukurumidza kupfuura zvinotarisirwa nemugadziri.

Kutevedzera kupisa kwakakodzera bhodhi iri: modhi yekupisa ye2D inoratidza kupararira kwekupisa mukati mebhodhi pasi pekupararira kwakanyanya pakupisa kwakanyanya kwemhepo inotora maawa mashoma uye inogona kudzivirira kudzoka kurongeka kwapera muchirongwa. Chikamu chekugadzira PCB inguva yakakodzera yekuona matambudziko ekupisa, kwete panguva yekuedzwa kwekukodzera kwezvakatipoteredza.

Kugadzira, Kuunganidza, uye Kuedza

Kudzora kupindirana neTDR verification ndicho chinhu chinodiwa pakugadzira mabhodhi e optical data link pa 10 Gbps. Mugadziri anoyera kupindirana kwetrace pa coupon kubva pane imwe neimwe panel uye anopa magwaro - kwete kungotaura kuti kupindirana kwakaedzwa. Kushivirira kuunganidzwa muFR-4: ±10% kunogoneka; ±5% inoda zvinhu zvepamusoro uye kudzora maitiro kwakasimba.

Kuungana kweBGA kwemidziyo yeFPGA kunoda:

• Kudhinda nestencil paste nestencil aperture ratio yakakodzera pitch — kazhinji 0.8 mm pitch BGA inoshandisa dhayamita ye 0.45 mm aperture pa stencil ye 0.15 mm.
• Kudzokorora chimiro kunoenderana nezvinodiwa nemupi weBGA — kazhinji kukwira kusvika pakunyura pa150–170 °C kunoteverwa nekunyura wozokwira kusvika pakukwira pa240–250 °C.
• Kuongororwa kweX-ray kwezvikamu zvese zveBGA kuti vaone kana paine madziro kana kuti maburi.
• Maikorosikopu yeAcoustic yezvidzidzo zveClass 3 kuti ione kana pasi pevhu paine chinhu chisina kujeka

Kuungana kwekeji yeSFP kunoda kuti keji ionekwe zvakanaka isati yatanga kuyerera - keji inodonha paPCB haizosanganisi mapini ese epasi zvakanaka uye ichaunza manzwi ari mugasket yeEMI. Zvidimbu zvekuchengetedza keji zvinofanirwa kubata module nesimba rakatarwa rekuisa uye kubvisa; makeji akasakara kubva pakubata panguva yekutorwa kwekeji anofanira kutsiviwa tisati tasanganazve.

Kuedza kushanda kwebhodhi rekubatanidza data re optical: batanidza fiber loopback (TX output → attenuator yakagadzirirwa kutevedzera bhajeti rekubatanidza → RX input), shandisa PRBS pattern pamutsetse, uye yera BER mukati menguva yakatarwa nehuwandu. BER iri pasi pe1×10⁻¹² ine 3 dB yekuwedzera attenuation kupfuura bhajeti rekubatanidza inosimbisa margin yakakwana. Highleap inopa kugadzirwa kweimpedance inodzorwa uye kuunganidza kwakaringana kwemabhodhi ekubatanidza data re optical ane kurongeka kwakazara kwemagwaro.

Mhando dzeDhizaini Dzakasiyana dzePuratifomu

Chibatiso chekutarisa chebhizinesi: SFP+ pa10 Gbps, chinogona kuvharwa kuti chishande zvakanaka mumunda, standard FR-4 ine back-drilling, 6-layer stack, DDM monitoring kuburikidza ne microcontroller. Bhodhi remagetsi re fiber optic drone riri muchikamu ichi rinonyatso shandiswa ne commercial-off-the-shelf SFP+ optics ine standard cage assemblies.

Puratifomu inoshandisika inotungamirirwa nefiber: TOSA/ROSA yakasungirirwa, kuvimbika kwekushandisa kamwe chete (kuyedzwa kunoshanda pamwe nekutsva, hapana coating inodiwa), huwandu hwema layer hwakagadziriswa. PCB yekudzora UAV inotungamirirwa nefiber inoda kuti bhodhi rekubatanidza data re optical rishande zvakavimbika kubva pakutanga kusvika kumagumo ebasa - kazhinji maminetsi makumi matatu kusvika makumi mapfumbamwe - pasina kuongororwa kuri kuenderera mberi kwekuongorora kunodiwa pamapuratifomu anogona kushandiswazve.

Puratifomu yeISR yekudzivirira: Polyimide substrate, IPC Class 3 assembly, conformal coating, MIL-STD-810 environmental qualification, inogona kunge yakagadziriswa transceiver kuti ive yakazvimirira pakugovera. Zvinodiwa zvakadzama zvechikamu ichi zviri muchimiro chePCB che drone yemauto.

FPV kumhanya/pedyo: 1 Gbps SFP yakakwana, dhizaini yakareruka, tether pfupi zvinoreva bhajeti shoma yekurasikirwa kwemaziso inobvumira kushandiswa kwefiber ye multimode uye 850 nm VCSEL transceivers (mutengo wakaderera, simba rinobuda rakawanda, kusanyanya kugadzikana kwewavelength). Fiber optic FPV drone PCB inomiririra huzivi hwekugadzira hwechikamu ichi.

Mune dzimwe mhando dzese, bhodhi rekubatanidza data re optical rinoshanda nePCB ye fiber optic tether kuburikidza netambo ye tether — kushushikana kwebhodhi re spool uye manejimendi ekupa magetsi zvinokanganisa zvakananga kusimba kwe fiber saka nekudaro bhajeti remagetsi re optical rinofanira kugadziriswa nebhodhi rekubatanidza data.

FAQ

Ndeipi data rates inowanzoonekwa kune masisitimu eUAV fiber tether aripo iye zvino?
Masisitimu ekutengesa anoshandiswa anowanzo shandisa 1 Gbps (SFP) kana 10 Gbps (SFP+). Madrone ekutarisa ane makamera akawanda e4K ane ma streams akawanda asina kudzvanywa anoda 10 Gbps shoma. Mapurogiramu epamusoro ari kufamba kuenda ku25 Gbps panzira imwe neimwe achishandisa QSFP28 kana ma interfaces eVCSEL-array akagadzirwa. Masisitimu ekare akabatana anoshandisa 100–400 Mbps; magadzirirwo mazhinji matsva haashandise mitengo iyi achifarira 1G kana 10G standards ine zvikamu zviripo.

Bhodhi rinogona kubata mavhidhiyo akawanda panguva imwe chete here?
Ehe — maFPGA multiplexes anoyerera achipinda muchiteshi che optical. Mastream matatu asina kumanikidzwa e1080p60 anoda anenge 9 Gbps, achikwana mukati me 10 Gbps link ine margin. Mastream matatu e4K30 anoda kudzvanywa kana kuendeswa ku25 Gbps. Basa reFPGA mukuunganidzwa kwestream rakasiyana nebasa re physical layer re optical data link board, asi FPGA ne optical transceiver zvine bhodhi rimwe chete uye marongerwo azvo anoshanda pamwe chete.

Chii chinosarudza kureba kwakanyanya kwe tether pakugadzirwa kwebhodhi rakapihwa?
Budget ye Optical link: simba rekutumira (SFP+ −1 kusvika +3 dBm) kubvisa kurasikirwa kweconnector (0.3–0.5 dB imwe neimwe) kubvisa fiber attenuation (0.35 dB/km pa1310 nm) kubvisa reacensitivity (−9.9 dBm inowanzoitwa neSFP+ SR, −20 dBm yeLR). 1310 nm LR SFP+ ine −3 dBm transmit uye −20 dBm inogamuchira acensitivity inopa bhajeti ye17 dB - inotsigira kurasikirwa kwefiber kwemakiromita anopfuura 40, kupfuura chero kushandiswa kwe tether. Miganhu mizhinji ye tether length ndeye mechanical (fiber huremu uye spool capacity), kwete optical.

Kudengenyeka kunokanganisa sei optical interface?
Makeji eSFP anobhurwa anonzwa kudedera kuburikidza nenzira mbiri: module inogona kushanda yakasununguka mukeji kana latch yekuchengetedza isina kubatwa zvakanaka, uye majoini emuchina wekusonesa ekeji kuenda kuPCB anogona kuneta kana paine kudedera kwenguva refu. Makeji ane chiyero chendege anotarisa zvese zviri zviviri: ane maitiro akasimba ekuchengetedza uye mapini epasi anorema. Kune magadzirirwo achaitwa bvunzo huru dzededera, zvakakosha kutsanangura makeji ane chiyero chendege muBOM pane magungano ekeji ekutengeserana akajairwa.

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