Isola I-Speed ​​PCB Material yeHigh Speed ​​​​Circuits

Sezvo magadzirirwo emaseva achikura achitsigira PCIe Gen 5 uye ma network ekutaurirana achipfuura 400G Ethernet, mainjiniya ehardware anotarisana nebhajeti rakasimba rekuchengetedza masaini. Ma laminates eFR-4 akajairika anounza kurasikirwa kusingagamuchirwi kwekuisa, zvichiita kuti madhiragi emaziso edhijitari aputsike pamusoro penzira refu dzekufambisa. Kuti zviratidzo zvirambe zvakajeka pasina kudhura zvakanyanya kwezvinhu zvePTFE (Teflon), mhinduro yakajairika yeindasitiri iyi iIsola I-Speed.

Zvisinei, kusarudza laminate yedhijitari inokurumidza kukwira ihafu yehondo. Dambudziko guru riri mukushanda kwefekitori. Mapuraneti eserver ane layer-count anoda kunyoreswa kwemechanical kwakakwana, kutonga kwakarurama kweimpedance, uye nzira dzepamusoro dzekuboorera kudzivirira ma short circuits emukati. Semugadziri wePCB weChina Isola I-Speed , Highleap Electronics yakagadzira gwara iri rehunyanzvi kuti rikubatsire kunzwisisa hunhu hwezvinhu, zvinokonzeresa mutengo wekugadzira, uye maitiro ekubudirira kushandura dhizaini yako yekumhanya kuita kugadzirwa kwakawanda.

Kumbira Mutengo weIsola I-Speed ​​​​Fabrication

Isola I-Speed ​​Datasheet: Zvimiro zveCore Material

Kana mainjiniya vachiongorora PCB yeIsola I-Speed ​​​​yepamusoro-soro yakagadzirwa, vanenge vachitsvaga substrate inobatanidza musiyano uripo pakati peepoxy yechinyakare neRF laminates dzinodhura. Isola I-Speed ​​inoshandisa sisitimu yeresini ine kurasikirwa kwakaderera pamwe chete nemagirazi epamusoro (akadai segirazi rakapararira) kuderedza "fiber weave effect" uye kuderedza timing skew mu differential pairs.

Zvikamu zvakakosha zvedatasheet zvinoraira kutendeseka kwechiratidzo zvinosanganisira:

• Dielectric Constant (Dk): Chidyiro 3.30 (pa10 GHz).Dk iyi yakaderera inobvumira masaini kuti afambe nekukurumidza uye inoderedza mutoro we capacitive pamatanho ekumhanya kukuru.
• Dissipation Factor (Df): Chinhu chakaderera zvakanyanya 0.0071 (pa10 GHz)Izvi zvinoderedza zvakanyanya kuderedzwa kwechiratidzo (kurasikirwa kwekuisa) mumatanho marefu ekufambisa masaini emusana.
• Thermal Robustness: Negirazi rekuchinja tembiricha (Tg) re180°C uye Decomposition Tembiricha (Td) re360°C, bhodhi reIsola I-Speed ​​​​circuit rinotsungirira ma "cycles" akawanda asina lead-free SMT reflow uye tembiricha yepamusoro yekushanda muma "dense server racks" pasina disamination.

Zvinokonzera Mari Yekugadzira muI-Speed ​​​​Multilayer Board Fabrication

Kune zvikwata zvinotenga, chinhu chinonyanya kukwezva cheIsola I-Speed ​​hakusi kushanda kwayo kwemagetsi chete, asiwo kugona kwayo kushandura FR-4. Kusiyana nemabhodhi ePTFE (Teflon) ane frequency yakakwira anoda sodium etching ine njodzi kana ma cycles anodhura evacuum plasma desmear, I-Speed ​​inogona kubviswa ganda uye kuputirwa uchishandisa mitsara yemakemikari yealkaline permanganate yakajairwa.

Kubatsira kweHybrid Stackup

Kuti vanyatso gadzirisa mutengo weIsola I-Speed ​​PCB yako , vagadziri vane ruzivo havawanzo shandisa zvinhu izvi zvepamusoro kune yega yega jira remasevha rine 24-layer. Pane kudaro, vanogadzira ma "hybrid stackups".

• Nekuti sisitimu yeI-Speed's resin ine hunyanzvi hwekugadzirisa hunoenderana uye tembiricha yekudzvanya ine standard high-Tg FR-4 (senge Isola 370HR), inogona kucheneswa pamwe chete muchimiro chimwe chete chekudzvanya kwelamination.
• Tinogara tichiisa I-Speed ​​pazvikamu zvakakosha zvekunze uye zvakananga zvemukati zvePCIe Gen 5 routing, uku tichishandisa 370HR inodhura zvishoma pamagetsi, pasi, uye zvishoma nezvishoma ma digital logic layers. Izvi zvinoderedza mitengo yezvinhu uku tichichengetedza panel yakati sandara isina asymmetric warpage.

Kudzivirira Kukundikana kweCAF muHigh-Density Backplanes

Sezvo michina yekutaurirana ichiderera, via pitch (daro riri pakati pemaburi akaboorwa) inova yakasimba zvikuru. Muma server board ane layer-count akawanda anoshanda pasi pe continuous voltage bias, dambudziko guru rekuvimbika iConductive Anodic Filament (CAF) failure. CAF inoitika kana copper ions dzichifamba pamwe chete neglass fiber bundles pakati pema vias maviri ari pedyo, zvichikonzera internal short circuit isingaoneki.

Dambudziko reMachine

Kunyange zvazvo resin yeI-Speed ​​yakagadzirwa nemakemikari kuti irambe yakasimba muCAF, michina isina kunaka yemufekitori inogona kuparadza dziviriro iyi. Kana fekitori yePCB yeseva yeIsola I-Speed ​​isina ruzivo ikashandisa madhiri asina kusimba kana kumhanya kusina kunaka (chip load) panguva yekugadzira bhodhi reI-Speed ​​​​multilayer, kukuvara kwemuchina kwakapfava kuchapwanya magirazi akakomberedza madziro. Kupwanyika uku kudiki-diki kunogadzira nzira dzema capillary dzisina chinhu kuti ma ions emhangura afambe nepakati.

Mhinduro yeHighleap Production

Kuti tive nechokwadi chekuti CAF yakavimbika, tinosimbisa mitemo yakasimba yekuboorera nekushandisa michina. Tinoderedza zvakanyanya muganho we "hit count" yemabhiti edu ekuboorera eCNC—tichiarasa kare kare kupfuura muganho weFR-4 wakajairwa kuti tive nechokwadi chekuti anochekwa nerazor-sharp. Nekugadzirisa maspindle RPMs uye kushandisa matekiniki ekuboorera nematanho epamusoro, tinocheka magirazi epamusoro pane kuabvarura, tichichengetedza kusimba kwe dielectric barrier.

Kutevedzera Kushivirira Kwekukurumidza Kutendeuka Isola I-Speed ​​PCB Prototype

Nguva yekutengeswa ndiyo inonyanya kukosha muindasitiri yemafoni. Kana uchikumbira Isola I-Speed ​​PCB prototype kuti ushandise Signal Integrity (SI) simulations yako, zvakakosha kuti upe zvinodiwa zvakakwana zve stackup uye impedance pakutanga.

Tisati tatanga kugadzira, mainjiniya edu eCAM achaita ongororo yakasimba yeDesign for Manufacturability (DFM). Isu tinoshandisa macalculator epamusoro e impedance (akadai sePolar Instruments) kuti tiongorore hupamhi hwetrace widths yako uye dielectric spacing tichienzanisa nehunyanzvi hwedu hwe physical etching. Kana paine kugadziriswa kunodiwa kuti usvike pa 50-ohm single-end kana 100-ohm differential targets dzako, tinokupa modified stackup report kuti ubvumire usati wagadzira.

Musangano weTurnkey SMT weHigh-Speed ​​​​Telecom Boards

Chigadziko chedhijitari chinomhanya zvikuru chakaoma zvikuru, chinowanzova nemapuranga emhangura anorema, zviuru zvemaBGA pads, uye thermal mass yakakura. Kuvimba nekugadzirwa kwebhodhi risina chinhu kune mumwe mutengesi uye kubatanidzwa kwezvikamu kune mumwe munhu kunounza njodzi huru dzekupisa panguva yekusonera.

Kushanda nemutengesi wePCB weIsola I-Speed ​​backplane uye mugadziri wePCB weIsola high speed kunobvisa mavanga asingaonekwe. Tinoshandura purojekiti yenyu kubva pamitsetse yedu yepamusoro-soro yebhodhi risina chinhu kuenda kunzvimbo yedu yekugadzira PCBA chaiyo.

Kuti tive nechokwadi chekuti mabhodhi eserver akakora uye anorema anotora kupisa zvakaenzana panguva yeSMT reflow pasina kuchinjika, mainjiniya edu ekugadzira mapurofayiri ekupisa akagadzirwa zvakanyanya. Nekushandisa tekinoroji ye3D Automated Optical Inspection (AOI) uye X-Ray (AXI), tinosimbisa yega yega BGA solder joint yakavanzwa, tichiona kuti 400G switches yako uye data center routers dzinoshanda zvakanaka mumunda. Ongorora sarudzo yedu yakakura yePCB laminate kana kuti bata timu yedu yeinjiniya nhasi kuti utange purojekiti yako yekumhanya-mhanya.