Ubunjiniyela be-PCB obunesivinini esiphezulu obuyi-10 be-DDR5 kanye ne-PCIe

I-PCB enesivinini esiphezulu enezingqimba eziyi-10 yokuqondisa i-DDR5 kanye ne-PCIe

Umfanekiso 1. I-PCB enesivinini esiphezulu enezingqimba eziyi-10 zomzila we-DDR5 kanye ne-PCIe.

Ibhodi elinezingqimba eziyishumi lingasekela izixhumanisi zedijithali ezidingayo, kodwa inani lezingqimba lodwa aliqinisekisi ukuhambisana. Umphumela uncike esiteshini esiphelele: iphakheji yokudlulisela, i-breakout, ama-via, umugqa wokudlulisela oqondiwe, isixhumi noma isixhumi sekhebula, iphakheji yokwamukela kanye nokulingana. Ibhodi eline-laminate ye-premium lisengahluleka ngenxa ye-resonant nge-stub noma indlela yokubuya ephukile; isiteshi esifushane ezintweni ezingabizi kakhulu singadlula lapho izinguquko ziklanywe kahle.

Leli khasi lihlelwe ngobunjiniyela beziteshi. Lihlukanisa amaqiniso ephrothokholi yomphakathi nemikhawulo ethile yesimo, libonisa indlela yokwaba ukulahleka kanye nomkhawulo wokungaqhubeki, futhi lichaza ubufakazi umenzi wezinto angabunikeza. I-geometry eningiliziwe ingeyencazelo yokulawula impedance , kanti ukwenziwa kwesakhiwo kungeyesiqondiso sokuqondisa.


Qala ngesiteshi, hhayi ilebula lephrothokholi

“I-PCIe Gen6 ekwaziyo,” “izinto ezibonakalayo ze-112G” kanye ne-“800G PCB” aziphelele. Iphrothokholi ingavela ngezindlela eziningana ngezixhumi ezahlukene, ama-reach kanye nama-channel mask. Izinga elifanayo ledatha lingadluliselwa kusixhumanisi esifushane se-chip-to-chip, isixhumanisi se-motherboard-to-add-in-card noma i-backplane enokwabiwa kokulahlekelwa okuhlukile kakhulu.

Okokufaka kwedizayini Okumele ukwaziwe ngaphambi kokwenza
Inhloso yokuthobela imithetho Imininingwane yesisekelo, i-CEM noma enye into efomini, isivumelwano sokusetshenziswa kwe-IEEE/OIF, umhlahlandlela wokulawula imemori noma imaski yamakhasimende.
Ama-endpoint esiteshi Kungakhathaliseki ukuthi isabelomali sihambisana nephakeji, iphakeji kuya kusixhumi, isixhumi kuya kusixhumi noma ibhodi kuphela.
Uhlu lwamaphutha Imvamisa ye-Nyquist kanye nama-harmonics aphezulu noma i-bandwidth edingekayo yimodeli yokuthobela imithetho.
I-Topology kanye nokufinyelela Ubude obuqondisiwe, izinguquko zesendlalelo, inani lezixhumi, i-geometry yokuqhuma kanye nanoma yisiphi isigaba sekhebula noma se-mezzanine.
Ukuqagela kokulingana Ukungagcizeleli kwe-Transmitter, i-CTLE/DFE yokwamukela kanye nama-preset avunyelwe. Lokhu akukwazi ukushintshwa ukukhetha okubalulekile.
Inzuzo yokukhiqiza Ukubekezelelana kwe-impedance, imodeli ye-dielectric neyethusi, ngenqubo, ikhono lokubhoboza emuva kanye nohlelo lwekhuphoni.

Umhlinzeki akufanele athembise ukwesekwa kwesixhumi esibonakalayo esivela kugama lezinto ezibonakalayo kanye nokubalwa kwezingqimba kuphela. Impendulo enesibopho inemibandela: ukwakhiwa okuhlongozwayo kungacashunwa futhi kwakhiwe ngemuva kokuthi izidingo zokulahlekelwa, ukuvinjelwa kanye nokuguquka kwekhasimende zifaniswe ne-stackup ekhishwe.


Lokho Okwenziwa Yizinga Ledatha—Nelingakutsheli Khona

Izinga ledatha lisungula indawo yokuqala yokuhlaziywa kwe-spectral, kodwa ukuguqulwa kwe-modulation kubalulekile. I-PCI Express 5.0 isebenza ku-32 GT/s isebenzisa i-NRZ, inikeza imvamisa ye-16 GHz Nyquist. I-PCI Express 6.0 isebenza ku-64 GT/s isebenzisa i-PAM4 futhi igcina imvamisa ye-16 GHz Nyquist ngenkathi ingeza ukusebenza kwe-FEC ne-FLIT. I-PCI Express 7.0 inguqulo 1.0 yakhishwa ngo-2025 ku-128 GT/s isebenzisa i-PAM4, ehambisa imvamisa ye-Nyquist ku-32 GHz. Lawa maqiniso omphakathi awachazi ngokwawo isabelomali sokulahlekelwa kwebhodi; incazelo yesimo esisebenzayo iyachaza.

Isibonelo sesixhumi esibonakalayo Iqiniso lokubonisa liwusizo ekuhleleni i-PCB Okusamele kuvele ezimisweni ezibusayo
PCIe 5.0 I-NRZ engu-32 GT/s; i-Nyquist engu-16 GHz. Imaski yokulahlekelwa yisiteshi, ukwabiwa kwephakheji, imodeli yesixhumi, i-topology kanye nendlela yokuhambisana nesici sefomu esikhethiwe.
PCIe 6.0 I-64 GT/s PAM4; I-Nyquist engu-16 GHz; Ukusebenza kwe-FEC/FLIT. Isiteshi esivunyelwe, ukulahleka kokubuyisa, ukuxoxa okuphambene kanye nokuqagela komthumeli/umamukeli.
PCIe 7.0 128 GT/s PAM4; 32 GHz Nyquist. Imikhawulo yesimo esikhishwe kanye nokufinyelela okuqondile kokusetshenziswa.
Umzila we-PAM4 ongu-112 Gb/s Ngokuvamile i-56 GBd kanye ne-28 GHz Nyquist. Imaski ye-IEEE noma ye-OIF efanele, indlela ye-COM, izixhumi kanye nokucatshangwa kwephakheji.
Umzila we-PAM4 ongu-224 Gb/s Ngokuvamile i-112 GBd kanye ne-56 GHz Nyquist. Isivumelwano sokuqalisa, iphakheji yereferensi, uhlelo lokuhlola kanye nokufinyelela okuvunyelwe.
DDR5 Isixhumi sememori esihambisanayo somthombo ohambisanayo; izidingo ziyahlukahluka kuye ngomlawuli, i-DRAM, imodyuli kanye ne-topology. Isikhathi somthengisi, i-topology, ukulayisha, ukuqeda, imodeli yephakheji kanye nemikhawulo yebhodi.

Imvamisa ye-Nyquist akuyona imvamisa ephezulu kakhulu ebalulekile. Isikhathi sokukhuphuka, i-jitter, ukulingana kanye nokungaqhubeki kudala ukuzwela ngaphezu kwe-Nyquist. Ngesikhathi esifanayo, ukusebenzisa imvamisa ephezulu ngokungahleliwe kukho konke ukubala kungacindezela ibhodi ngokweqile. Sebenzisa i-bandwidth kanye nama-masks ngendlela efanele yokuthobela imithetho.


Yakha Isabelomali Sokufaka-Ukulahlekelwa kanye Nokungaqhubeki

Isabelomali sesiteshi kufanele sibhekele yonke ingxenye ebonakalayo phakathi kwezindawo zokubhekisela ekuhambisaneni nomthetho. Isibonelo, izinto zomphakathi ze-PCI-SIG zibonise isabelomali sokulahlekelwa yi-insertion-loss esingu-36 dB ku-16 GHz yesiteshi se-PCIe 5.0 CEM. Lelo nani lingelaleso siteshi esichaziwe futhi akufanele lihlanganiswe kuwo wonke ama-topology angu-32 GT/s. Umklami webhodi kumele akhiphe isabelo sephakheji, isixhumi, ikhadi elingeziwe noma ibhodi lesisekelo elisebenza ekusetshenzisweni ngaphambi kokunquma ukuthi kungakanani ukulahlekelwa okutholakalayo.

Ukulahlekelwa akuyona into eyodwa engaguquki ye-dB-per-inch

Izinguquko zokulahleka kwe-trace ngemvamisa, ububanzi bomugqa, ukujiya kwe-dielectric, iphrofayili yethusi, ukwakhiwa kwengilazi nokuthi umzila uyi-microstrip noma i-stripline. I-Df yedatha ayikwazi ukuguqulwa ibe yindawo efinyeleleka kuyo yonke indawo. Isixhumi kanye nokulahleka nakho kuncike kwimvamisa, futhi i-stub resonance ingadala i-notch ejulile encane elimaza kakhulu kunokulahlekelwa okujwayelekile okubushelelezi.

Ukulahlekelwa kwembuyiselo kanye nomkhawulo wokudla okuxubile nakho

Isixhumanisi singahlangabezana nenombolo yokulahlekelwa kokufakwa futhi siqhubeke sihluleke ngoba ukungaqhubeki kwe-impedance, ukuguqulwa kwemodi, i-crosstalk eseduze noma ekude, noma umsindo wokunikezwa kwamandla kuvala iso. Ngakho-ke ukuhlolwa kwe-serial-link kufanele kusebenzise izilinganiso ezidingekayo zephrothokholi - njenge-channel operating margin, i-COM, i-statistical eye noma imodeli yesixhumanisi esithile somthengisi - esikhundleni sespredishithi yokulahlekelwa umkhondo kuphela.

Isici sesabelomali Indlela ejwayelekile yokumodela Ukuthembela ekukhiqizweni
Umkhondo ofanayo Ukukhishwa kwe-2D field-solver okune-dielectric encike emvamisa kanye nokulahleka komqhubi. Ukwakhiwa kwezinto, i-foil, i-cross-section eqoshiwe kanye ne-dielectric ecindezelwe.
Isignali nge Imodeli ye-3D EM noma imodeli yomtapo wolwazi eqinisekisiwe ehlanganisa ama-pads, ama-antipad kanye ne-stub esele. Usayizi wokubhoboza, ukugoba, ububanzi bezendlalelo, ukubekezelela ukubhoboza emuva kanye nokubhaliswa.
Unyawo lwesixhumi Imodeli yomthengisi kanye nokukhishwa kokuqaliswa kwebhodi. I-pad stack, ama-reference via, ama-antipad kanye nezindawo zokuvula izindiza zasendaweni.
I-Crosstalk Ukususwa kwesisulu/umhlaseli ngobude obufanayo kanye nokuguquka okungokoqobo. Isikhala sezingqimba, ubuningi bomzila, ukuqhubeka kokubhekisela kanye ne-geometry yokwenziwa.
Iphakheji nedivayisi Imodeli yokuthobela imithetho ye-IBIS-AMI, ipharamitha ye-S noma umthengisi. Ngokuvamile kungaphandle kokulawulwa kwebhodi elingenalutho kodwa kubalulekile ekwabiweni.

Ukwakheka kobuqotho besiginali ye-PCB yesivinini esiphezulu ngezingqimba eziyi-10

Umfanekiso 2. Ukwakheka kobuqotho besignali ye-PCB yesivinini esiphezulu ngezingqimba eziyi-10.

Khetha Izinto, Ithusi kanye neJiyomethri Kunye

Ukukhethwa kwezinto kufanele kusekelwe esiteshini esikhishwe, hhayi etafuleni lephrothokholi. Uhlelo lwe-dielectric, ubulukhuni bethusi kanye ne-stackup geometry zisebenza ndawonye. Umugqa obanzi ku-dielectric encane unganciphisa ukulahlekelwa ngumqhubi kodwa kudle isikhala somzila; izinto ezingaphansi kwe-Dk zingashintsha ububanzi obudingekayo ukuze kube ne-impedance efanayo; i-foil ebushelelezi kakhulu inganciphisa ukulahlekelwa kodwa idinga inqubo yokunamathela efanelekile.

Izakhiwo ze-hybrid zibeka uhlelo lokulahlekelwa okuncane nxazonke kwezingqimba ezithwala iziteshi ezibucayi kakhulu ngenkathi zisebenzisa izinto ezivamile ezifanelekile kwenye indawo. Zingabiza kahle, kodwa umbhangqwana wezinto ezibonakalayo, ungqimba lokubopha kanye nomjikelezo wokucindezela kufanele kukhishwe. Umhlahlandlela wokukhetha izinto uchaza ukuthi kungani imindeni ye-MEGTRON, i-I-Tera, i-Tachyon kanye ne-specialty low-loss laminate ingenakuphathwa njengezinto ezilingana ngokuzenzakalela.

Unganiki amagama e-laminate izizukulwane zephrothokholi

Izitatimende ezinjengokuthi “I-MEGTRON 6 isekela amasentimitha ayisishiyagalombili e-PCIe Gen5” noma “I-Tachyon iyadingeka ku-112G” azinazo iziguquguquko eziningi kakhulu ukuze zithembeke. Indlela emfushane ye-112G ingase ivale ezinhlelweni eziningana zokulahlekelwa okuncane; indlela ende enezixhumi eziningi ingadinga ukwakhiwa kokulahlekelwa okuncane noma ukwakheka kwesistimu okuhlukile. Umphumela ofanele umkhawulo olingiswayo womzila wangempela kanye nemodeli yokukhiqiza.

Ukuluka nokusonta ngengilazi

Ku-112G nangaphezulu, ukwehluka kokulibaziseka kwendawo kusuka ekulukweni kwengilazi kungaqhathaniswa nesabelomali se-skew sangaphakathi kwe-pair. Ingilazi esakazekayo, i-engeli yomzila, ububanzi be-trace kanye nokubekwa kwe-pair kufanele kukhethwe ngokwakhiwa kwangempela. Umdwebo webhodi kufanele ukhombe noma yiziphi izitayela zengilazi ezinqunyelwe noma ukunciphisa kwe-skew okusetshenziswa yisakhiwo.

 


 

Ngokushintshashintsha, Ukubhoboza Umgogodla kanye Nokuqhekeka

I-A through via ifaka phakathi i-pad capacitance, i-barrel inductance kanye nesigaba se-barrel esingasetshenziswanga ngaphansi noma ngaphezulu kokuxhumeka kwesignali. Leso sigaba esingasetshenziswanga sisebenza njenge-stub. I-resonance yayo incike kubude bukagesi kanye nendawo ye-dielectric, ngakho-ke ithebula "eliphezulu nge-protocol" elihleliwe liyi-heuristic yokuhlela kuphela. I-residual eyamukelekayo kumele ivele kumodeli yesiteshi kanye nekhono lokulawula ukujula lomhlinzeki.

Ukubhola emuva

Ukubhoboza ngemuva kususa umgqomo ongasetshenziswanga ngebhoboza lesibili elilawulwayo. Umklamo kumele uchaze uhlangothi olubhoboziwe, ungqimba oluqondiwe, i-stub esele, ukubekezelela ukujula okuvunyelwe, ubukhulu bokubhoboza ngokweqile, ukugcina kude nezici eziseduze kanye nendlela yokuqinisekisa. I-X-ray, amakhuphoni enqubo, i-microsection noma amarekhodi okujula komshini angasetshenziswa kuye ngohlelo lwekhwalithi. "I-X-ray eqinisekisiwe kuwo wonke amabhodi" akufanele ithembiswe ngaphandle kokuthi i-oda lidinga ngokucacile kanye namanani akhokhwayo.

Ama-vias angaboni kanye ne-HDI

Ama-microvia angaboni angafinyeza ukuguquka futhi athuthukise ubuningi bokuqhuma, kodwa izakhiwo ezihlanganisiwe zethula izinto ezicatshangelwayo zokuthembeka kwe-interfacial. Uhlobo lwe-via lukhethwa kusukela ekuphumeni kwe-BGA, ukufinyelela kwesendlalelo, ukuqondisa kanye nokufaneleka - hhayi kuphela kusukela esilinganisweni sedatha. I-through via evamile ene-antipad eklanywe kahle kanye ne-back-drill ingadlula i-microvia ehlanganisiwe engafaneleki kahle.

Izinguquko zokubhekisela

Uma isignali ishintsha ungqimba, ugesi wayo wokubuya udinga indlela eseduze phakathi kwezindiza zokubhekisela ezindala nezintsha. Uma zombili izinkomba ziphansi, ama-vias okuthunga anganikeza leyo ndlela. Uma izinkomba zishintsha phakathi kwamandla nomhlaba, kungadingeka indlela yokuhlukanisa ebekwe kahle. Isikhala sinqunywa yi-geometry yokuguquka kanye nemvamisa; umthetho we-50 mil ojwayelekile awuthathi indawo yokuhlaziywa.

 


 

I-PCB eshesha kakhulu enezingqimba eziyi-10 kanye nokubuyekezwa kwesiteshi

Umfanekiso 3. Ukuhlanganiswa kwe-PCB okusheshayo okuphezulu kanye nokubuyekezwa kwesiteshi kwezingqimba eziyi-10.

Ukuqinisekiswa Kwangaphambi Kokwenziwa kanye Nokuqinisekiswa Kwangemva Kokwenziwa

Ngaphambi kokwenza

Ukubuyekezwa kwangaphambi kokwenziwa kufanele kuqinisekise i-stackup, ukwakheka kwezinto, amakilasi e-impedance, imodeli yethusi, ukugxeka ngokusebenzisa ukuguqulwa, incazelo ye-back-drill kanye nohlelo lwekhuphoni. Ukuze uthole izixhumanisi zesivinini esiphezulu, qhathanisa ukukhishwa kwangemva kokwakheka nemodeli yokuthobela imithetho bese ufaka amakhona okukhiqiza kunokuba ufake i-geometry ejwayelekile kuphela.

Ikhululeka Lokho okubonisayo Lokho okungakubonisi
Ukubalwa kwe-stackup kanye ne-impedance okukhishwe I-geometry ephakanyisiwe ihambisana nokwakhiwa okukhethiwe. Ukuthobela imithetho yesiteshi esigcwele.
Ukulahlekelwa kokufakwa noma ukulingiswa kwesiteshi Ukusebenza kukagesi okulindelekile komzila namakhona abonisiwe. Lokho kukhiqizwa kuzofanelana nezinto ezingachazwanga noma i-foil.
Amapharamitha e-S nge/isixhumi Ukuziphatha kokuguquka phezu komkhawulokudonsa obonisiwe. Ukusebenza kwe-pad stack ehlukile noma inqubo yokubhoboza.
Umbiko wekhuphoni le-TDR Ukumelana okuphawulekayo kwesakhiwo sekhuphoni. Ukulahlekelwa, ukukhuluma noma ukungaqhubeki komzila wendawo.
Ukulandeleka kokubalulekile Izinga/inqwaba ethunyelwe ifana ne-oda. Ukulingana okuzenzakalelayo nemodeli yokulingisa ngaphandle kokuthi ukwakhiwa kuxhunyiwe.
Ukuqinisekiswa kokubhoboza emuva Ukuhambisana kokujula noma okusele kwe-stub nohlelo oluchaziwe. Qedela imajini yesiteshi ngaphandle kwemodeli kagesi ehambisanayo.

Ngemuva kokukhiqiza

Amarekhodi ajwayelekile ebhodi elingenalutho angafaka imiphumela yokuhlolwa kukagesi kanye nemiphumela yokuvimbela okulawulwayo uma i-odwa. Izinhlelo zesivinini esikhulu zingase zicele amakhuphoni okufaka nokulahlekelwa, izilinganiso zokubhoboza emuva, izigaba ezincane, izitifiketi zezinto noma idatha yepharamitha ye-S yesihloko sokuqala. Iphakheji yedokhumenti edingekayo kufanele kuvunyelwane ngayo ngaphambi kwekhotheshini; akulona iqiniso ukusho ukuthi yonke imibiko ethuthukisiwe ithunyelwa nayo yonke ibhodi.

I-IPC-TM-650 ifaka izindlela zokuvimbela okuphawulekayo kanye nokuhlolwa kokulahlekelwa yisignali, kodwa ikhasimende kusadingeka lichaze ikhuphoni elimele, umkhawulo wokwamukelwa, isampula kanye nokwabiwa kwenqwaba. Ngomkhiqizo obalulekile wokuthobela imithetho, hlanganisa idatha yekhuphoni nemodeli yomzila ekhishwe kunokuphatha ikhuphoni njengesitifiketi esizimele.


Ulwazi Oludingekayo Ukuze Kutholakale Isilinganiso Sokukhiqiza Esisheshayo

Isilinganiso singashesha kuphela uma iphakheji yobuchwepheshe isiqediwe. Nikeza idatha yokwenziwa kwemvelo, amafayela okubhoboza kanye nomzila, uhlu lwe-net, imikhawulo yokuqoqwa noma yokuqoqwa kwe-stackup ekhishwe, ithebula lokungavimbeli, umthetho wokuvunywa kwezinto, imfuneko yethusi, umdwebo wokubhoboza ngemuva, izincazelo zokujula okulawulwayo, ukuqeda kwendawo, ikilasi lebhodi, inani kanye nemibiko edingekayo.

Kumadizayini azwela iziteshi, nikeza futhi imininingwane yesikhombikubona/ifomu, izabelo zezendlalelo ezibucayi, izindlela eziphezulu zomzila noma izinhloso zokulahlekelwa ezikhishwe, noma yiziphi izinto ezivinjelwe noma izitayela zengilazi, nokuthi umenzi angayilungisa yini i-geometry elawulwayo. Khomba izici ezidinga ukuvunyelwa kwamakhasimende ngaphambi kokushintsha kwe-CAM.

Indlela yokukhiqiza kanye namarekhodi kuchazwe kumhlahlandlela wokukhiqiza onezingqimba eziyi-10 . Izindleko kufanele zihlolwe kusukela ekwakhiweni okuphelele, hhayi kusukela "enkokhelweni eyengeziwe yesivinini esikhulu" engaguquki.

Cela isibuyekezo se-PCB esinezingqimba eziyi-10 ezinesivinini esiphezulu


Amakhona Okukhiqiza Nokusebenza Kwamamodeli

Umphumela wesiteshi ojwayelekile awanele ukukhishwa komkhiqizo. Imodeli ekhishwe kufanele ifake amakhona angokoqobo aphezulu naphansi okulahlekelwa: ukujiya kwe-dielectric, i-Dk/Df, ububanzi obuqoshwe, ubulukhuni bethusi, ngokubhalisa kanye nokusala kwe-back-drill. Izinga lokushisa lingashintsha futhi ukuziphatha kwe-dielectric kanye ne-receiver margin. Inhloso akuyona ukuhlanganisa zonke izimo ezimbi kakhulu ngokungenangqondo, kodwa ukuhlonza iziguquguquko ezibusa i-margin nokuqinisekisa ukuthi ukubekezelelana kokuthengwa kuyayilawula.

Qondanisa idatha yokulingisa kanye nokwakhiwa esihlokweni sokuqala. Ikhuphoni le-TDR lingaqinisekisa i-impedance, ikhuphoni lokulahlekelwa lingaqinisekisa imodeli ye-dielectric/yethusi ekhethiwe, kanye nekhuphoni lokubhoboza emuva noma i-microsection lingaqinisekisa ukucabanga kwe-residual-stub. Uma idatha elinganisiwe ihlukile kumodeli, buyekeza imodeli noma inqubo ngaphambi kokusebenzisa ukwakhiwa njengeplatifomu yesivinini esiphezulu engasetshenziswa kabusha.

Ukuthobela imithetho yephrothokholi kusalokhu kungumthwalo wemfanelo wohlelo

Umhlinzeki webhodi elingenalutho angaqinisekisa ukwakhiwa, ukuqhubeka kukagesi, ukuvinjelwa okumelelayo kanye namakhuphoni avunyelwene ngawo. Akakwazi ukuqinisekisa isixhumanisi esiphelele se-PCIe, i-Ethernet noma imemori ngaphandle kwamadivayisi ahlanganisiwe, amaphakheji, izixhumi, i-firmware kanye nokusethwa kokuhlolwa kokuhambisana. Ulimi lwewebhusayithi kufanele luhlukanise "okwenziwe ngokwezidingo zesivinini esiphezulu ezikhishwe yikhasimende" nokuthi "oqinisekisiwe yiphrothokholi."



Isimo Sezindinganiso kanye Nemingcele Yokusetshenziswa

Amagama esixhumi kumele axhunywe ku-revision kanye ne-form factor esetshenziswa umkhiqizo. I-PCI Express 7.0 Version 1.0 yakhishwa ngo-2025, kanti imikhawulo yezinga lebhodi isancike kumadokhumenti ayisisekelo kanye ne-form-factor asebenzayo. I-IEEE 802.3df-2024 ihlanganisa i-400 Gb/s kanye ne-800 Gb/s Ethernet. Umsebenzi ku-1.6 Tb/s Ethernet kanye nezinye izendlalelo zomzimba ze-200/400/800 Gb/s uyaqhubeka ngaphansi kwe-IEEE P802.3dj, ngakho-ke umklamo osekelwe kulowo msebenzi kumele ukhombe uhlaka oluqondile noma imininingwane yamakhasimende esetshenzisiwe. Amaphrojekthi ekilasi le-OIF 224G nawo achaza izigaba eziningi zokufinyelela esikhundleni sesiteshi esisodwa se-PCB esijwayelekile.

Lo mehluko ubalulekile ekwakhiweni ngoba izifihla-buso zokulahlekelwa, izibikezelo zephakheji, izixhumi, izinto zokuhlola kanye nokulinganisa kuyahluka ngokusetshenziswa. Umhlinzeki akufanele aguqule u-“800G,” “1.6T” noma u-“224G” abe yinto eqondile, ubude bomkhondo noma inani lokubhoboza emuva ngaphandle kwencazelo yesiteshi esilawulayo.


Ukukhishwa Kwesiteshi Esisheshayo

  • Thola ukubuyekezwa kwesixhumi esibonakalayo, isici sefomu, ama-endpoints kanye nendlela yokuhambisana.
  • Yabela ukulahlekelwa, ukulahlekelwa kokubuyiselwa kwemali, ukuxoxa nge-crosstalk kanye ne-discontinuity margin kuwo wonke amaphakheji, amabhodi, ama-via kanye nezixhumi.
  • Khetha i-laminate, iphrofayili yethusi kanye ne-geometry kusuka esiteshini esikhishwe esikhundleni selebula lephrothokholi.
  • Amakhona okukhiqiza emodeli yobukhulu be-dielectric, i-Dk/Df, ubulukhuni bethusi, ububanzi bomugqa, ngokujula nokubhaliswa.
  • Chaza amakhuphoni okumelayo okuvimba kanye nokulahlekelwa ngokwehlukana nokuhlolwa kokuhambisana kwezinga lomkhiqizo.
  • Khipha izibuyekezo ezifanayo ze-stackup kanye ne-pad-stack ku-layout, simulation, factory kanye namaqembu okuhlola.

Kusukela Ekulingiseni kuya Ekuhlobaneni Kwesihloko Sokuqala

Imodeli yesiteshi iwusizo kakhulu lapho isihloko sokuqala esenziwe singahlotshaniswa nokucabanga kwaso. Uhlelo lokuhlobana kufanele lukhombe ukuthi yiziphi izilinganiso kanye neziguquguquko zezinto ezizolinganiswa, yiziphi amakhuphoni azohlolwa nokuthi leyo miphumela izoyibuyekeza kanjani imodeli.

Okokufaka kwemodeli Ubufakazi obungaba khona besihloko sokuqala
Isigaba esicindezelwe se-dielectric kanye ne-conductor Ikhuphoni elincane noma elinobukhulu obubonisa ukujiya kwangempela kanye ne-geometry yokulandelela kwe-trapezoidal.
I-impedance yesici Ikhuphoni le-TDR elimele elilinganiswa ngenqubo evunyelwene ngayo.
Ukulahleka kokulandelela okuncike emvamisa Ikhuphoni yomugqa wokudlulisela efanele noma ikhuphoni yokulahlekelwa kokufakwa, efakwe ngaphandle kwentambo lapho kudingeka khona.
Ukubhoboza emuva noma ngokusebenzisa i-geometry Ukulinganisa ukujula, i-X-ray lapho kufaneleka khona, ikhuphoni yokushintsha ehlukaniswe izingxenye noma enikezelwe.
Ukuqaliswa kwesixhumi noma iphakheji Isakhiwo sokwethulwa esinikezelwe, umkhiqizi noma isilinganiso sokuthobela izinga lomkhiqizo.

Ukuhlanganisa akusho ukuphoqa idatha elinganisiwe ukuthi ifane nemodeli enhle. Kusho ukubuyekeza imodeli ngokwakhiwa kwangempela okwenziwe kanye nokunquma ukuthi isiteshi sisahlangabezana yini nomkhawulo emasontweni enqubo kanye nokusebenza. Lapho ukuhlanganisa kwembula ukuthi ubulukhuni bethusi, okuqukethwe kwe-resin noma ukujula kuhlukile ekucabangeni, isenzo sokulungisa singaba ushintsho lokulawula izinto, ukwakhiwa kabusha koshintsho noma umkhawulo womzila obuyekeziwe - hhayi nje ukubekezelelana kwe-impedance okuqinile.

Izixazululo ze-Highleap PCB kanye ne-PCBA - cela ikhotheshini

Posts Kunconywe

Ungasithola kanjani isilinganiso sama-PCB

Ake siqhube ukuhlaziywa kwe-DFM/DFA bese sibuyela kuwe nombiko. Ungalayisha amafayela akho ngokuphephile ngewebhusayithi yethu. Sidinga ulwazi olulandelayo ukuze sikunike isilinganiso:

    • Gerber, ODB++, noma .pcb, spec.
    • Uhlu lwe-BOM uma udinga ukuhlangana
    • Ubuningi
    • Isikhathi sokushintsha
Ngokungeziwe ekwenziweni kwe-PCB, sinikeza uhla olubanzi lwezinsizakalo ze-elekthronikhi, okuhlanganisa i-PCB design, i-PCBA, nezixazululo ze-turnkey. Kungakhathaliseki ukuthi udinga usizo ngokwenza i-prototyping, ukuqinisekiswa kwedizayini, ukuthola ingxenye, noma ukukhiqizwa ngobuningi, sihlinzeka ngosekelo olusuka ekupheleni ukuze siqinisekise impumelelo yephrojekthi yakho.

Ngezinsizakalo ze-PCBA, sicela unikeze i-BOM yakho (I-Bill of Materials) kanye nanoma yimiphi imiyalelo ethile yomhlangano. Siphinde sinikeze ukuhlaziya kwe-DFM/DFA ukuze uthuthukise imiklamo yakho ukuze yenziwe futhi ihlanganiswe, ukuqinisekisa inqubo yokukhiqiza eshelelayo.

    Sitshele Ngephrojekthi Yakho Ye-PCB

    Awekho amafayela okuklama okwamanje? Akunankinga. Yabelana ngalokho okwaziyo, futhi sizolandela uma kudingeka imininingwane eyengeziwe.



    Faka amafayela (ngokuzikhethela)

    Amafayela e-PCB, i-BOM, i-PDF/STEP, i-TXT, izithombe, i-ZIP/RAR/7Z · Isamba esiphezulu esingu-50 MB