Umkhiqizi we-PCB Wezingqimba Ezingama-14 eShayina

Umkhiqizi we-PCB Wezingqimba Eziyi-14 eShayina: Amakhono kanye Nobubanzi Bokukhiqiza

I-Highleap Electronics ingumhlinzeki wokukhiqiza nokuhlanganisa ama-elekthronikhi we-PCB oseShayina. Ithebula lethu lamandla okukhiqiza ama-PCB aqinile elishicilelwe libala ukwakhiwa okuqinile okunezingqimba eziningi kuze kufike ezingqimbeni ezingama-60 , okunezithombe ezinhle, ukuxhumana okubhobozwe ngomshini nange-laser, i-impedance elawulwayo kanye nezinketho eziningana zokuqeda ubuso. Ngakho-ke, ibhodi eliqinile elinezingqimba eziyishumi nane lingaphakathi kwemvilophu yenkampani eshiwoyo yenani lezingqimba. Izibalo ezisohlwini lomphakathi zingamakhono ezinga lephothifoliyo , akusona isiqinisekiso sokuthi wonke umkhawulo ungahlanganiswa ku-stackup eyodwa.

Ukuze uthole iziqu ezinembile zomthengisi, ukunikezwa kokukhiqiza kuhlobene nomdwebo. Ibhodi elinezingqimba ezingu-14 elisebenzisa imigodi ejwayelekile kanye ne-FR-4 egcwele ezitolo lihlukile ebhodini elinezingqimba eziyishumi nane elihlanganisa iminonjana engu-2/2 mil, imigodi emincane kakhulu yemishini, ithusi elingaphakathi elisindayo kanye nezinto ezikhethekile eziphansi zokulahlekelwa. I-Highleap ibuyekeza i-stackup yangempela, ubukhulu obuqediwe, imbobo encane kakhulu kanye nesidingo se-plating, i-dielectric, i-trace geometry, i-assembly interface kanye nobuningi be-target lot ngaphambi kokuqinisekisa ukukhiqizwa.

Isevisi yokwenziwa kwe-PCB ye-Highleap kanye nokubuka konke kwemishini yasefektri kunikeza umongo owengeziwe oshicilelwe yinkampani. Imininingwane esekhotheshini, i-stackup evunyiwe kanye nomzila wokukhiqiza oqanjwe ngegama kufanele ithathe indawo yanoma yiliphi ithebula lokumaketha elijwayelekile. Lo mehluko uvumela amaqembu ephrojekthi ukuthi aqhathanise abahlinzeki kuphakheji yobunjiniyela evivinywayo kunohlu lwezibalo eziphezulu ezingahlobene.

Ingabe i-Highleap ingaqinisekisa ukwakhiwa okungejwayelekile kwezingqimba eziyishumi nane ngaphambi kwe-oda?

Yebo, ngemva kokuthola idatha yokwakha. Impendulo ingakhomba ukwakhiwa kwemishini ehlongozwayo, okunye uma izinga eliceliwe lingatholakali, izinkinga zokubhoboza noma zokuhambisa, amakhuphoni okuhlola ahlosiwe kanye nanoma yikuphi okuhlukile okudinga imvume ebhaliwe. Uma inhlanganisela ingaphandle kwefasitela lenqubo evunyiwe, kufanele iklanywe kabusha noma ifaneleke ngokukhethekile kunokuba ichazwe njengekhono elijwayelekile elinezingqimba ezingu-14.

Yimaphi amakhono okukhiqiza e-PCB anezingqimba ezingu-14 angahlanganiswa?

Ukwakhiwa kwezingqimba zethusi eziyishumi nane kudinga ukulandelana okulawulwayo kokuthwebula izithombe zezingqimba zangaphakathi, ukugoba, ukubhoboza, ukuplasta kanye nokuqedwa kokugcina. Ngaphambi kokwenziwa, i-Highleap ibuyekeza ukuhleleka kwezingqimba, ukujiya kwebhodi eliqediwe, isisindo sethusi somqhubi, uhlobo lwe-laminate, imikhawulo yokulandelela kanye nesikhala, isilinganiso se-hole aspect kanye nezici ezikhethekile. Isiphakamiso esivunyiwe sikhomba uhlelo lwangempela lwezinto kanye nomzila wokwakha kunokuphatha i-general capacity-table maximum njengokuvunyelwa okuhlanganisiwe.

Ebhodini elivamile elinezingqimba ezingu-14, imigodi ebholwe ngomshini ixhumanisa izendlalelo ezikhethiwe noma idlule esakhiweni njengoba kuklanyelwe. Ukuze kusetshenziswe indlela yokuphuma ebanzi, kungacatshangwa ukuthi kufakwe ama-via angaboniwe nafihliwe; i-lamination elandelanayo ihlotshaniswa nokwakhiwa kwesakhiwo esithile kunenombolo yeshumi nane. Ama-microvia, ama-stacked noma ama-stagged interconnect kanye ne-capped via-in-pad ngayinye yengeza izidingo zayo zokwakha nokuhlola. I-Highleap ibuyekeza izinketho zokwenziwa kwe-HDI ngokuqhathanisa nemephu yembobo kanye nemininingwane ye-laminate lapho umzila ojwayelekile ungahlangabezani nomklamo.

Iphakheji ejwayelekile yokwenziwa kufanele ifake umdwebo wohlaka, idatha ye-Gerber noma ye-ODB++/IPC-2581, amafayela okubhoboza e-NC, imephu yesendlalelo, izidingo zethusi eziqediwe, imaski ye-solder kanye ne-legend, incazelo yokuqeda kanye nencazelo yokwamukelwa. Kumanethi alawulwa yi-impedance, faka ithebula le-impedance eline-layer-indexed kanye nendlela yokuqinisekisa oyifunayo.

Ingabe i-Highleap ingakha ama-PCB anezingqimba ezingu-14 nge-impedance elawulwayo?

Yebo, ngaphakathi kwe-stackup evunyiwe yomklamo kanye nohlelo lokuhlola. Isigaba esiphambene somkhondo sincike kuthusi eliqediwe, ukujiya kwe-dielectric, izakhiwo zezinto kanye nezindiza zangempela zokubhekisela. I-Highleap ingabuyekeza i-target single-end kanye ne-differential impedance, iphakamise ukulungiswa okukhiqizwayo futhi icaphune amakhuphoni afanele noma amarekhodi okulinganisa uma kuchazwe. Ukubekezelelana okujwayelekile okushicilelwe akumele kucatshangwe ukuthi kusebenza kuyo yonke i-geometry yomqhubi ngaphandle kokuqinisekisa i-stackup ehlongozwayo.

Yiluphi ulwazi okufanele lunikezwe ukuze kuhlolwe ikhono lomkhiqizi?

Nikeza usayizi oqediwe ngokomzimba kanye nobukhulu; zonke izendlalelo zethusi eziyishumi nane; imephu yokubhoboza enezici ezifakwe ipulasitiki, ezingafakwanga ipulasitiki, ezingaboni/ezingcwatshwe kanye nezici zokudonsa ngemuva; isisindo sethusi ngesendlalelo ngasinye; ukukhetha kwezinto; umkhondo/isikhala esincane ngesendlalelo; izindawo zokuqeda ezithengiswayo noma ezixhumene; ithebula le-impedance; ikilasi le-IPC elidingekayo; kanye nobuningi bonyaka . Gqamisa isidingo esisodwa esibaluleke kakhulu: isibonelo, i-escape ye-BGA engu-0.8 mm-pitch, ukubekezelelana kwembobo eqediwe yesixhumi esiqinile, isabelomali sokulahlekelwa yi-RF noma isidingo sesikhala se-voltage ephezulu. Ngale mininingwane i-Highleap ingaphendula enkingeni yobunjiniyela elawula ngempela isivuno.

Le nkampani ingacaphuna ama-prototypes kanye nokwakhiwa okuphindaphindiwe ngaphansi komdwebo owodwa okhishwe, ngaphandle kwenqubo yokushintsha echazwe kusengaphambili. Ububanzi bokugcina befektri kanye nokuhlolwa kohlelo lwamakhasimende ngamanye buqinisekiswa kumadokhumenti ezentengiselwano nawokukhiqiza, hhayi okucatshangelwe kuphothifoliyo ephelele yewebhusayithi.

Ama-PCB enziwe ngokwezifiso anezingqimba eziyi-14 zeNethiwekhi, i-FPGA kanye ne-Elektroniki Yezimboni

I-PCB ye-switch yenethiwekhi enezingqimba ezingu-14 ingase ithwale izixhumi ze-serial ezisheshayo, ukusatshalaliswa kwewashi, ama-power rails kanye nezixhumi eziyinkimbinkimbi. Ukuhlela izingqimba kuqhutshwa umzila wesiteshi ohlukile, ukuqhubeka kwendlela yokubuyela kanye nemikhawulo yokufakwa nokulahlekelwa. Ukubhoboza emuva kungadingeka kuma-stubs akhethiwe afakwe imbobo, kanti umkhiqizo ohlukile wenethiwekhi ungahlangabezana nezidingo zesiteshi sawo ngaphandle kokusebenza okwengeziwe.

Ku-FPGA kanye namabhodi okuthwala e-embedded-computing, i-BGA escape ivame ukuba yiyo ebusa isinqumo sokuqondisa. Imikhawulo efanele yi-pad pitch, ububanzi besiteshi sokubalekela, ngesakhiwo, izindiza zokubhekisela ezitholakalayo kanye nobukhulu bebhodi. Ukuqondisa isignali ephezulu kungathinta nokukhethwa kokuhlanganiswa: ukuqeda iphedi ethengiswayo, ukwesekwa kwephaneli, ukufinyelela kokuhlolwa kwe-BGA kanye nokuba yisicaba kwebhodi kumele kucatshangelwe ndawonye.

Amaphrojekthi e-PCB ezenzakalelayo ezimbonini aletha izidingo ezahlukene. Izingxenye zeprosesa ne-Ethernet zingase zihlale eceleni kokufakwayo okuhlukanisiwe, izixhumi zokulawula i-motor, ukutholwa kwe-analog okunembile kanye nezixhumi zokulingana nokucindezela. Izindiza zethusi kanye nemikhawulo yokudonsa noma yokususa izintambo kulandela ukwakheka kukagesi, hhayi uhlelo olucatshangwayo olunezingqimba ezingu-14.

Isevisi yethu yokukhiqiza i-PCB esheshayo ibhekana ne-dielectrics elawulwayo, ukulahleka kwesiteshi kanye nemininingwane yokwenziwa kwemiklamo lapho ukusebenza kwesignali kulawula khona i-stackup. Isibuyekezo esinemininingwane se-stackup esinezingqimba ezingu-14 siyatholakala ukuze kwabelwe izingqimba zomzimba kanye nokukhetha izinto.

Yiziphi izinhlobo zamabhodi anezingqimba eziyishumi nane ezihlobene ezingabuyekezwa yi-Highleap?

I-PCB enezingqimba eziyishumi nane ingaba yisilawuli esiyinhloko ekuhlanganisweni okukhulu kwe-elekthronikhi. I-Highleap ingacabangela ama-PCB okulawula izimboni anezingqimba ezingu-14 , amabhodi okushintshanisa e-Ethernet nama-router, amabhodi okuthwala e-FPGA kanye ne-SoC anezingqimba ezingu-14 , amabhodi amakhulu e-network appliance, amakhadi okuthola idatha, amabhodi okucubungula uhlelo lokubona, amabhodi okuxhumana ekhompyutha afakiwe, amakhadi emishini yokuxhumana kanye nezinsimbi zesignali ezixubile. Ubuchwepheshe bebhodi lomndeni ngamunye bunqunywa yi-BOM, izixhumi zikagesi kanye nencazelo yesixhumi.

Ukuxhumana kwenethiwekhi kanye nedatha: amabhangqa okulawula ukuvimba, izindiza zokubhekisela eziqhubekayo, ukuguqulwa kwesixhumi kanye nokudonsa emuva okungenzeka kuthola kuqala. Thumela ukwabiwa kwesiteshi kanye nanoma yiziphi izidingo zokuhlolwa kokufakwa nokulahlekelwa. Ibhodi elisetshenziswa kuswishi yenethiwekhi aliyona ngokuzenzakalelayo isiteshi esisheshayo esihambisanayo ngoba nje linezendlalelo eziyishumi nane.

Amabhodi e-FPGA kanye ne-computing carrier: i-BGA pitch, ububanzi be-pad, i-escape geometry, ukusatshalaliswa kwe-power-rail kanye ne-flatness yebhodi kubusa ukubuyekezwa kobunjiniyela. Nge-FPGA exinene, isakhiwo esinezingqimba ezingu-14 singase sanele; lapho singenjalo, ama-microvia noma i-via-in-pad egcwele ingacatshangelwa. Ubuchwepheshe obuceliwe kumele bulandele insimu yephini kunomthetho wokubalwa kwezingqimba ojwayelekile.

Ukulawulwa kwezimboni kanye nezinsimbi: ama-processor kanye nama-circuits okuxhumana angahlala eceleni kwe-I/O ehlukanisiwe, iziphetho zangaphambili ze-analog kanye nokuguqulwa kwamandla. Ukuqhekeka/ukususwa, ithusi elisindayo elikhethiwe, izithiyo zokuhlukanisa, izixhumi ezifanelana nokucindezela noma ihadiwe ezwela ukudlidliza ingalawula ukwakhiwa ngaphezu kwamathrekhi amahle kakhulu. Umdwebo kufanele ukhombe izidingo zokufakwa kokushisa ezifanele kanye nokwamukelwa kwemishini.

Ukuqapha amandla kanye namabhodi axubile anomsinga ophezulu: izisindo zethusi ezihlukene kanye nokubekwa kwama-vias okushisa kungaba usizo kakhulu kunokwenza zonke izingqimba eziyishumi nane zibe yithusi elisindayo. Ithusi eliqediwe, izibonelelo ze-etch, ivolumu ye-resin yendawo kanye nomthwalo wokushisa wokuhlanganisa kudinga ukubuyekezwa okuhlangene. Imiklamo efuna enye indlela yokwakha eqinile enezingqimba eziyishumi nane ingahlolwa ngaphakathi kwephothifoliyo ebanzi ye-Highleap enezingqimba eziningi kanye ne-rigid-flex.

Ingabe i-Highleap ingakhiqiza amabhodi ahlobene njengomndeni owodwa womkhiqizo ofanayo?

Iphrojekthi ingahlukaniswa njenge-PCB yeprosesa eyinhloko enezingqimba eziyishumi nane kanye namabhodi ahlobene e-I/O, amandla, inzwa noma isixhumi. Gcina inombolo yengxenye yebhodi ngalinye, ukuhlolwa kukagesi kanye nokubuyekezwa okuvunyiwe kuhlukile, ngenkathi kuhlanganiswa ukuthengwa kwezinto, ukuhlanganiswa kanye nokuhlonza ukuthunyelwa ezingeni lohlelo. Usuku lokulethwa okwabiwe alusho ukuthi yonke i-PCB isebenzisa i-laminate efanayo, indlela yokuhlola noma umugqa wokukhiqiza.

Ukwakhiwa kwe-PCB Okuthuthukisiwe Okunezingqimba Eziyi-14: i-HDI, i-VIPPO kanye ne-Backdrilling

I-Highleap ingahlola inhlanganisela yezici ezidlula ibhodi elivamile le-FR-4 elinezingqimba eziyishumi nane. Izindawo zokuxhumanisa ezitholakalayo zomzila kanye nokuhlanganisa zingafaka phakathi ama-via angaboni futhi agqitshwe; ama-microvia abhobozwe nge-laser; ama-via agcwele i-resin noma agcwele ithusi; ambozwe nge-in-pad; ukubhoboza okujulile okulawulwayo; izindiza zethusi ezisindayo; imigodi yokufaka ukucindezela; ama-countersink noma ukugaya okujulile okulawulwayo; oxhumana nabo be-edge ngegolide eliqinile; kanye nokuqedwa kwama-pad okuhlukene okusongelwayo. Inketho ngayinye ihlolwa ngokubheka indawo yayo kanye nenhloso ekudwetshweni kwekhasimende.

I-Via-in-pad ifanelekile lapho indlela yokubaleka yengxenye noma isakhiwo sephedi yokushisa idinga i-via ngqo ezweni elithengiswayo. Ukugcwaliswa, ukuhlelwa kwepulani kanye nesivalo sethusi kumele kuhambisane nephakheji kanye nencazelo yephedi eqediwe. I-Backdrilling ifeza injongo ehlukile: isusa ubude obungasetshenziswanga bomgqomo ogqitshwe ngembobo ngenkathi ivikela ukuxhumana okudingekayo. Izinqubo ezimbili akufanele ziphathwe njengezengezo zezindleko ezishintshaniswayo. Ukubekezelelana okuningiliziwe kanye nokuhlolwa kuncike ezidingweni zokwakha ezivunyelwe nge-via-in-pad kanye ne -backdrill.

I-PCB enezingqimba eziyishumi nane ingahlanganisa nezindawo zethusi ezikhethiwe ezinomoya ophezulu kanye nezendlalelo zesignali ezicolekile, kodwa ukujiya kwethusi okuqediwe, ukuhlanzwa kwe-etching kanye nokugcwaliswa kwe-resin kumele kuhlolwe ndawonye. Ngokufanayo, indawo ye-SMT eqediwe nge-ENIG kanye nesixhumi esinomphetho wegolide oqinile kudinga izincazelo ezihlukene zokufaka i-plating. Lapho izici ezikhethekile zithinta izendlalelo ezahlukene noma izifunda zomkhiqizo, umdwebo wokukhiqiza kufanele ubize indawo efanele kanye nezinga lokuhlola ngqo.

Ingabe ibhodi elinezingqimba ezingu-14 lidinga i-HDI ngokuzenzakalelayo?

Cha. Izendlalelo eziyishumi nane zichaza inani lezendlalelo zethusi eziqhubayo. Ukwenziwa kwezingqimba eziningi ezijwayelekile ezinezimbobo ezidlulayo kungakwanelisa imiklamo eminingi yezimboni neyekhompyutha. I-HDI ichazwa lapho ubuningi bokuxhumana obudingekayo, ububanzi be-microvia noma i-geometry yokuphuma kwengxenye kuqinisekisa ukucutshungulwa okwengeziwe.

Yini eyenza kube nzima ukucaphuna i-PCB enezingqimba ezingu-14 enesici esikhethekile?

Ukusebenzisana phakathi kwezici kubaluleke kakhulu kunenani lezinketho ezibalwe. Isibonelo, ibhodi elijiyile eline-drill encane yemishini landisa ubunzima be-aspect-ratio; i-BGA egcwele ithusi ngaphansi kwe-BGA encane idinga isivalo esilingana kahle nesihlanganisiwe; umunwe wegolide oqinile udinga ukujiya okuhlukile kanye ne-bevel callout kusuka endaweni ye-ENIG SMT; futhi ukubhoboza emuva kuwusizo kuphela lapho imephu yesendlalelo kanye nesiteshi sedatha kuvumela ukususa umgqomo ongasetshenziswanga. Isilinganiso kufanele sichaze ukulandelana kokukhiqiza kanye nezindlela zokuhlola ezivunyelwe ngokwehlukana zalezi zici.

Cela umenzi ukuthi abuyisele uhlu olufushane lwezinto ezihlukile ekukhiqizeni. Ukushintsha izinto, izinguquko zokuqeda ama-pad kanye nokuguqulwa ngezingqimba noma izindandatho ezi-annular kufanele kuthathwe njengezinguquko zobunjiniyela. Kungathinta ubuqotho besiginali noma ukuhlanganiswa kwezingxenye noma ngabe ibhodi elibuyekeziwe lisaphumelela ukuhlolwa kukagesi okuyisisekelo kwe-netlist.

Izinto ze-PCB, Ubukhulu Obuqediwe kanye Nokuvunyelwa Kokuqoqwa Kwezinto Ezihlanganisiwe

I-High-Tg FR-4, i-laminate elahlekelwa kancane kanye nokwakhiwa kwe-hybrid akuzona izinto ezilingana nokushintsha. I-Tg ikhombisa isici sezinto ezishisayo; ukusebenza kwesiteshi esinejubane eliphezulu kuncike ekulahlekelweni kwe-dielectric, i-Dk, ubulukhuni bethusi, i-trace geometry kanye nokuguquka. Ukukhetha izinto kufanele kulandele izidingo zikagesi nezokuthembeka, i-stackup evunyiwe kanye namazinga agciniwe noma atholakalayo. I-Highleap ingabuyekeza izinketho ze-laminate ezinezinga eliphezulu njengengxenye yokukhishwa kokwenziwa.

Ubukhulu obungu-1.6 mm noma u-2.0 mm abufani nobukhulu obuqediwe obujwayelekile bama-PCB anezingqimba ezingu-14. Ubukhulu obufanele bulandela izidingo ze-dielectric zesendlalelo, ukulingana kwesixhumi, ukufakwa komshini kanye nezilinganiso zesici sokubhoboza. I-stackup ebonakalayo kumele ibhale phansi ama-cores/prepregs aphakanyisiwe, ithusi eliqediwe ngesendlalelo, isikhala esibalulekile se-dielectric kanye nokubekezelelana kobukhulu bokugcina. Uma i-PCB izohlanganiswa, iphrofayili yokugeleza kabusha elindelekile kanye nesidingo sokuba yisicaba nakho kubalulekile.

Izinguquko ekujiyeni kwe-dielectric okuvunyiwe, uhlelo lwe-resin noma iphrofayili yethusi zingashintsha i-impedance, i-plating noma ukuziphatha kokushisa. Ngakho-ke ezinye izinto kufanele zibuyekezwe futhi zigunyazwe ngaphambi kokwenziwa kunokuba zishintshwe buthule ngenxa yokuntuleka kwesitoko.

Ubufakazi Bokufaneleka Komhlinzeki Nokukhiqiza

Umkhiqizi we-PCB onokwethenjelwa onezingqimba ezingu-14 kufanele akwazi ukuxoxa ngokuthi uzoqinisekisa kanjani ibhodi lakho , hhayi nje ukunikeza ibheji yamandla ekhangayo. Isayithi lenkampani ye-Highleap lichaza indawo yokukhiqiza enezingqimba eziningi, i-AOI kanye nokuhlolwa kukagesi, kanye nemodeli yesevisi ye-PCB/EMS ehlanganisiwe. Lezi yizindawo zokuqala eziwusizo zokuhlola umhlinzeki; ama-oda adinga iziqu ezisemthethweni kufanele futhi acele isitifiketi samanje senhlangano esemthethweni yangempela kanye nendawo yokukhiqiza , ububanzi bezinqubo ezihlanganisiwe, kanye nesampula yamarekhodi okukhiqiza afanele.

Ukuze uthole ama-elekthronikhi athembeke kakhulu, chaza uhlobo olufanele lwe-IPC-6012 kanye nekilasi lokusebenza kanye nokulindelwe kokwamukelwa kwe-IPC-A-600 kanye nanoma yisiphi isengezo samakhasimende esisebenzayo. Amalebula embonini njengezokwelapha noma zezimoto awathathi indawo yomdwebo webhodi, uhlelo lokwamukelwa oluqondile kanye neziqu zefektri eziqinisekisiwe. Gwema ukucabanga ukuthi i-Class 3, i-IATF noma ukumbozwa kwedivayisi yezokwelapha kusebenza kuyo yonke i-oda ngaphandle kokuhlola indawo ekhethiwe kanye nesitifiketi.

Yini engenza i-Highleap ibe yisinqumo esifanelekile sohlelo lwe-PCB olunezingqimba eziyishumi nane?

Impendulo ephelele kufanele ifake inqwaba ekhiqizwayo, ukwakhiwa kwembobo/ithusi okungenazo iziphambeko noma okufanelekile ngokucacile, uhlelo lokuhlola, imithetho yokushintshanisa izinto ecacile, ikhotheshini ehlanganisa ubufakazi obuceliwe, kanye nendlela kusukela kusampula kuya ekukhiqizweni okuphindaphindiwe. Cela izibonelo zemibiko yokuhlola ehlungiwe kanye namarekhodi amakhuphoni uma inkontileka iwadinga. Ulwazi lokumaketha komphakathi lusungula iphrofayili yokuqala yomhlinzeki; ubufakazi obuqondene nephrojekthi yibo obusekela ukuvunyelwa kokugcina.

Ukuhlolwa kwe-PCB kwezingqimba eziyi-14, Ukuhlolwa Kukagesi kanye namarekhodi Ekhwalithi

Ukuqinisekiswa kwekhwalithi kuqala ngaphambi kokufakwa kwe-lamination. Ukuhlolwa kwe-AOI okungaphakathi kanye nokubhaliswa kubalulekile ngoba amaphutha obuciko bethusi awatholakali ngemva kokucindezela. Ukuhlolwa okulandelayo kubhekana nokubhoboza, ubuqotho be-plating, isimo sembobo ehlanganisiwe, isikhala se-conductor, uhlaka oluqediwe, imaski kanye nokuqeda okusongelwayo. Ukuhlolwa kukagesi okusekelwe ku-Netlist kuqinisekisa ukuqhubeka kwebhodi elingenalutho kanye nokuhlukaniswa; akuqinisekisi ukuvinjelwa noma umsebenzi wokuhlanganiswa okunabantu abaningi.

I-Highleap ingasebenzisa ukulinganisa kwekhuphoni elilawulwayo-impedance, ukuhlolwa kwe-microsection ekhethiwe, ukuhlolwa kwesihloko sokuqala kanye namarekhodi e-lot nge-oda. Uhlelo lokwamukela kufanele luhlonze isigaba sokusebenza se-IPC-6012 rigid-board esisebenzayo, noma yiziphi izindlela zokwamukelwa ezibonakalayo ze-IPC-A-600, ukuphambuka okuvunyiwe kanye nemibiko edingekayo. Ukuhlolwa okuqondile kwemvelo noma okubhubhisayo kufanele kucashunwe ngokwehlukana lapho kudingeka khona.

Yibuphi ubufakazi bokuhlola obungahambisana ne-oda le-PCB elinezingqimba ezingu-14?

Okulethwayo kungafaka phakathi ukwamukelwa kokuhlolwa kukagesi okuvunyelwene ngakho, ukuhlolwa kobukhulu, idatha yekhuphoni ye-impedance ecacisiwe kanye nobufakazi obukhethiwe obunezimbobo ezifakwe ipulasitiki. Indlela yokuhlola eqondile, ukusampula, ifomethi yombiko kanye nezidingo zokugcina kumele zishiwo kuphakheji yokuthenga. Akukho ukuhlolwa kwebhodi elingenalutho okufanele kumelelwe njengesiqinisekiso sobuqotho besignali yebhodi eligcwele abantu noma izimfanelo zemishini yokugcina.

Ukwakhiwa Nokuhlanganiswa Kwe-PCB Ezingqimba Eziyi-14 Ngaphansi Kohlelo Olulodwa

I-Highleap ingaxhumanisa ukwenziwa kwebhodi elingenalutho, ukuthengwa kwezingxenye okuvunyiwe, ukuhlanganiswa kwe-SMT/THT, uhlelo kanye nokuhlolwa kokusebenza okuchazwe yiphrojekthi. I-PCB engenalutho kufanele ikhishwe nedatha yokuhlanganiswa kusenesikhathi ukuqinisekisa ama-pads e-BGA, ngama-cap, izimbobo zokuxhuma, ukwesekwa kwephaneli kanye nokuhambisana kwendawo eqediwe. Ibhodi lingadlula ekuhlolweni kokwenziwa kodwa lidinga ushintsho olubizayo uma lezi zixhumi zingaxazululwanga.

Kumabhodi emishini egcwele abantu, isevisi yethu ye-turnkey enezingqimba ezingu-14 ze-PCBA ihlanganisa umthwalo wemfanelo wokuthola ulwazi, ukuhlolwa kwe-BGA/QFN, ubuchwepheshe obuxubile, i-firmware kanye nezidingo zokuhlolwa kwamakhasimende ngokuningiliziwe. I-turnkey ephelele, i-turnkey engaphelele kanye nokwakhiwa okuthunyelwe kusalokhu kuyimodeli yezentengiselwano ehlukile; ukushintsha izingxenye kanye nezinye izinguquko zobunjiniyela kulandela inqubo yokuvunyelwa kwekhasimende.

Ukunikezwa kwe-PCB yaseShayina, Izinguquko Zobunjiniyela kanye Nokulethwa Kwamanye Amazwe

Umkhiqizo we-Highleap kanye ne-EMS ohlinzekwa yi-Highleap useShayina uhlelelwe amaphrojekthi e-OEM aphesheya kanye nokukhiqiza izinkontileka. Ukuze kuthunyelwe okuphindaphindiwe emaqenjini obunjiniyela aseYurophu, akwa-Israyeli noma kwamanye amazwe, imininingwane yezentengiselwano esebenzayo kufanele kuvunyelwane ngayo ngaphambi kwe-oda lokuqala lokuthenga: I-Incoterms, ukupakisha kanye nokuphathwa komswakama/i-ESD njengoba kufanele, ulimi lokubuyekeza kanye nelebula, amadokhumenti okuhlola, ukwahlukaniswa kokuthunyelwa, indawo yokulethwa kanye nomuntu ogunyaziwe wokuvumela ushintsho lokukhiqiza.

Iphrojekthi ephethwe ngumhlinzeki ingaxhumanisa amabhodi angenalutho kanye ne-PCBA enamanani ahlukene, kodwa ukukhishwa kufanele kuqambe amaqembu angempela anomthwalo wemfanelo wokuthola ulwazi, ukwenziwa kwe-PCB, ukuhlanganiswa kwezingxenye kanye nokuhlolwa komkhiqizo othize. Ikhasimende kumele ligcine igunya lokugunyaza izinguquko zezinto ezibonakalayo, ama-IC angena esikhundleni, i-geometry yebhodi eshintshiwe kanye neziphakamiso zokuqeda okulinganayo. Lapho idatha yamakhasimende ilawulwa, vumelanani ngokuphathwa kanye nemikhawulo yokufinyelela ngaphambi kokudluliselwa kwamafayela.

Izinzuzo zomthombo onezingqimba eziyishumi nane osekelwe eShayina zibalulekile kuphela uma ibhodi eliqediwe lihlangabezana nezidingo zalo zikagesi/zemishini ezivunyiwe futhi lifika nobufakazi obuthenjisiwe. Ubudlelwano obuwusizo bomhlinzeki wamazwe ngamazwe bakhelwe phezu kwezinguquko ezibhalwe phansi kanye nokubuyekezwa okuphindaphindwayo, hhayi izimangalo ezingasekelwa zokungalungi nhlobo, izikhathi zokuhola eziqinisekisiwe emhlabeni wonke noma isitifiketi sayo yonke imikhiqizo yokugcina.

Ingabe ukwenziwa nokuhlanganiswa kungafakwa ku-oda elifanayo lokuthenga?

Yebo, uma isivumelwano sihlanganisa ngokusobala ukwamukelwa kwebhodi elingenalutho, ubunikazi be-BOM, inqubo ye-stencil kanye nokuhlanganiswa, uhlelo, ukuhlolwa kokusebenza, ukupakisha kanye nokulandelela indawo. Insizakalo yokuhlanganiswa kwe-PCB ye-Highleap ichaza ububanzi be-EMS. Ukukhishwa kwe-PCBA okuningiliziwe kuhlukile ekwamukelweni kwebhodi elingenalutho, futhi lokhu kokubili kufanele kuvunyelwe ngokuzimela ngisho nangaphansi kwe-oda elilodwa lezentengiselwano.

Cela Isilinganiso Sokukhiqiza se-PCB esinezingqimba eziyi-14

I-Highleap ingacaphuna inani le-prototype, i-pilot kanye ne-repeating-production uma iqhathaniswa nephakheji yobunjiniyela ehambisanayo. Thumela idatha yebhodi yamanje, imephu yezendlalelo eziyi-14, izinhloso zezinto/i-stackup noma i-fixed impedance, ubukhulu bebhodi lokugcina, imidwebo yokubhoboza kanye nezimpawu ezikhethekile, ukuqeda kwendawo, inani, indawo yokulethwa kanye nemibhalo yokuhlola eceliwe. Isibikezelo sokukhiqiza siwusizo ekuhloleni ukuqhubeka kwezinto kanye nokusetshenziswa kwephaneli.

Izindleko eziningiliziwe kanye nokuguquguquka kwezindleko kanye nezidingo zokukhishwa kwe-prototype kuya ekukhiqizweni kungabuyekezwa ngokwehlukana ngaphandle kokuhlanganisa izibikezelo zentengo nencazelo yokukhiqiza. Ikhotheshini yokukhiqiza ikhishwa ngemuva kokuthi okuhlukile kobuchwepheshe kanye nokufakwa kwezinto ezishintshiwe sekuchaziwe futhi kwavunyelwa.