I-BT Resin PCB: Izakhiwo, Ukusetshenziswa, kanye Nokulawula Ukukhiqiza

I-resin ye-Bismaleimide Triazine (BT) iyi-laminate esebenza kahle kakhulu ebiza kakhulu lapho i-FR-4 evamile iphelelwa khona yi-headroom yokushisa nekagesi — edume kakhulu njenge-substrate ngaphakathi kwamaphakheji e-BGA kanye ne-chip-scale IC. Inikeza izinga lokushisa eliphakeme lokushintsha kwengilazi, ukulahlekelwa okuphansi kwe-dielectric, kanye nokuqina okuhle kakhulu. Lo mhlahlandlela uchaza ukuthi iyini i-resin ye-BT, ukuthi iqhathaniswa kanjani ne-FR-4 kanye namanye ama-laminate asebenza kahle, lapho isetshenziswa khona, nokuthi i-Highleap Electronics yakha kanjani amabhodi nama-substrate asekelwe ku-BT ngokwezidingo.

1. Iyini i-resin ye-BT futhi kungani isetshenziswa kuma-PCB?

I-BT resin iyinto eyenziwe nge-thermosetting laminate eyenziwe nge-Bismaleimide Triazine, esetshenziswa kuma-PCB lapho ukumelana nokushisa okuphezulu, ukulahleka kwesignali okuphansi, kanye nokuqina okuqinile kuyadingeka ngaphezu kwalokho okunikezwa yi-FR-4 ejwayelekile. Isici sayo esichazayo izinga lokushisa eliphakeme lokuguquka kwengilazi, elivumela ibhodi ukuthi libambe izakhiwo zalo zemishini kanye nezikagesi emazingeni okushisa aphezulu kunokuba lithambise ngendlela ama-epoxy laminates avamile enza ngayo.

Izinto zokwakha zathola indawo yazo kuqala njenge-substrate yephakheji ye-IC — ibhodi elincane, eliminyene ngaphakathi kwephakheji ye-BGA noma ye-chip-scale evunguza ukuxhumana kwedayi ebhodini elingezansi. Lapho, ukuzinza kwe-BT ngaphansi kokushisa kwe-die-attach kanye ne-reflow, kanye nokulahlekelwa kwayo okuphansi ngemvamisa ephezulu, kuyenza ifaneleke kahle ekupakisheni okudingakalayo. Ihlala emndenini ofanayo osebenza kahle njengamanye ama-laminate athuthukile ambozwe kulokhu kubuka konke kwezinto zebhodi le-PCB , futhi ukuyikhetha ngokuyisisekelo kuyisinqumo sezinto zebhodi lesekethe esiqhutshwa izidingo zokushisa nezogesi.

2. Izakhiwo ze-resin ye-BT: i-Tg, i-Dk, ne-CTE ezibalulekile

Izakhiwo ezintathu ze-resin ye-BT eziqhuba ukukhethwa kwayo izinga lokushisa eliphakeme le-glass-transition (Tg), i-dielectric constant ephansi, ezinzile kanye nokulahlekelwa, kanye ne-coefficient ephansi yokwanda kokushisa (CTE). Lokhu kunikeza ibhodi elihlala liqinile futhi linembile ngokobukhulu ngenkathi lisebenza ngokushisa futhi liphethe izimpawu ezisheshayo. Lokho okushiwo yilowo nalowo ekusebenzeni:

Iphuzu le-CTE eliphansi libaluleke kakhulu ekupakisheni: lapho i-substrate ikhula cishe ngesivinini esifanayo ne-silicon kanye nama-solder joints, inciphisa ukucindezeleka kokujikeleza kokushisa okuqhekeka ukuxhumana okuhle. Uhlangothi lukagesi lubopha ngqo kwi- dielectric constant kanye ne-loss tangent — amapharamitha anquma ukuthi izimpawu ezisheshayo zifika zihlanzekile yini. Njalo klama amanani aqondile kudathashethi yamanje ye-BT laminate ethile.

3. I-BT resin vs FR-4 vs polyimide: iyiphi i-laminate okufanele uyikhethe

Khetha i-BT resin yokusebenza kwe-substrate ephansi, i-FR-4 yamabhodi angabizi kakhulu, kanye ne-polyimide yokusetshenziswa okungapheli kokushisa okuphezulu kanye nokuguquguquka. I-laminate ngayinye iyibhalansi yamandla okushisa, ukusebenza kukagesi, kanye nezindleko, ngakho-ke efanele incike kulokho ibhodi okumele ikubekezelele:

• FR-4 kuyisinqumo esijwayelekile, esingabizi kakhulu samabhodi amaningi, esine-Tg ephakathi nendawo kanye nokulahlekelwa okwamukelekayo — kulungile kuze kube yilapho izidingo zokushisa noma zemvamisa ephezulu zidlula.
• I-resin ye-BT iphakamisa i-Tg, yehlisa ukulahlekelwa, futhi yengeza ukuzinza kobukhulu, okwenza ifaneleke kuma-substrates e-IC, amabhodi anemvamisa ephezulu, kanye nokuthembeka okuphezulu lapho i-FR-4 ingaphumeleli khona.
• I-Polyimide ibekezelela amazinga okushisa aphezulu kakhulu futhi iyisisekelo samasekethe amaningi aguquguqukayo, asetshenziswa lapho ukushisa okukhulu noma ukugoba kuvimbela ama-laminate e-epoxy aqinile.

Imiklamo eminingi ebheka i-BT inesisindo samabanga athuthukile e-FR-4 kanye nezinto ezikhethekile ze-RF, ngakho-ke isinqumo kufanele sithathwe njengento ebanzi kunokuba sihlukaniswe. Lapho okubaluleke kakhulu ukusebenza kwesignali, ukuqhathanisa kudlulela ezintweni ezifana nalezo ezikulesi sihloko se- FR-4 uma kuqhathaniswa nengxoxo ekhethekile ye-laminate yokulahlekelwa okuncane ; lapho kuyi-packaging density, i-BT incintisana nezingxenye ezingezansi.

4. Lapho kusetshenziswa khona ama-PCB e-resin e-BT (ama-substrate e-BGA nangale kwalokho)

I-resin ye-BT isetshenziswa kakhulu kuma-substrate e-IC-package — ama-substrate angaphakathi kwe-BGA, i-chip-scale, namaphakheji afanayo — kanye nasemamojuleni e-high-frequency, amabhodi anokwethenjelwa okuphezulu, kanye nezinhlelo zokusebenza ezinengcindezi enkulu yokushisa. Ingxoxo evamile ukuthi konke lokhu kujezisa i-laminate ebuthakathaka, kungaba ngokushisa noma ngogesi, ngakho ukuzinza kwe-BT kuyavuza:

• Izingxenye zephakheji ye-IC. I-substrate ebanzi ngaphakathi kwephakheji ye-BGA noma ye-chip-scale, lapho ukuzinza kobukhulu be-BT kanye nokumelana nokushisa kusekela i-fan-out enhle nethembekile — kuhlobene kakhulu ne Izingxenye ze-BGA futhi Ama-PCB e-substrate ye-IC.
• Amamojula asebenza ngesivinini esiphezulu. Imiklamo ye-RF kanye nesivinini esikhulu iyazuza ekulahlekelweni okuphansi kwe-BT, lapho ubuqotho besiginali bubaluleke kakhulu.
• Amabhodi anokwethenjelwa okuphezulu. Imikhiqizo ebhekene nokushintshashintsha kokushisa kanye nokuphila okudinga isikhathi esiningi isebenzisa ukuzinza kwe-BT ukumelana nokukhathala.

Ngenxa yokuthi izinhlelo zokusebenza eziningi ze-BT zihlobene nokupakisha, izinto zokwakha ngokwemvelo ziyingxenye yokwakha okuthuthukisiwe, okunezici ezinhle kunokuba kube amabhodi alula - yingakho kuhambisana nokwakhiwa okunobuningi obukhulu kanye nokuhlanganiswa ngokucophelela.

5. Ukwakha amabhodi e-resin e-BT: okufanele kulawulwe

Ukwakha amabhodi e-resin e-BT kudinga ukulawula izinqubo ze-lamination kanye nokubhoboza ubulukhuni bezinto kanye ne-Tg ephezulu, ukuphatha izici ezinhle zobuningi be-substrate-grade, kanye nokuhlanganisa i-plating kanye nokuqedwa kwendawo nomklamo. I-BT iziphatha ngendlela ehlukile kune-FR-4 ecutshungulwayo, ngakho-ke umenzi onolwazi ngayo ubalulekile ukuze athole umphumela onokwethenjelwa. Izilawuli ezibalulekile:

• Yokuvikela ngocwazi. I-Tg ephezulu ye-BT isho umjikelezo wokucindezela ohlukile kune-FR-4, futhi ukwenza kahle yikho okuletha ukuzinza kobukhulu bezinto ezikhethelwe zona.
• Ukubhoboza. I-resin eqinile kanye nezici ezincane zidinga imingcele efanele yokubhoboza ukuze kutholakale imigodi ehlanzekile nethembekile.
• Ikhono lokubonisa izici ezinhle. Umsebenzi wezinga le-substrate udinga ububanzi bemigqa eqinile kanye nesikhala, okuyindawo yokuxhumana kwabantu abaningi.
• Ukubeka nokuqeda. Izimbobo eziqinile nezimboziwe kanye nesiphetho esifanele ukusetshenziswa kuvikela kokubili ukusebenza kanye nomphumela wokuhlanganiswa.

Lezi yizifundo ezifanayo ezilawula noma iyiphi i-laminate ethuthukisiwe, futhi yilokho kanye okuqinisekiswa ukubuyekezwa kokwenziwa kwangaphambi kokwakhiwa ngaphambi kokufaka izinto — okuqinisekisa ukuthi i-stackup, izici, kanye nezimbobo kuyenzeka ku-BT.

6. Indlela i-Highleap ekhiqiza ngayo amabhodi asekelwe ku-BT

I-Highleap yakha amabhodi e-resin e-BT kanye nama-laminate asebenza kahle kakhulu nge-lamination, ukubhoboza, kanye nesici esihle sokulawula lezi zinto ezidingekayo, bese izisekela ngokuhlanganiswa. Ukukhethwa kwezinto kuthathwa njengesinqumo sobunjiniyela: lapho umklamo udinga i-Tg ephezulu ye-BT, ukulahleka okuphansi, kanye nokuqina, ukwakheka kuyalungiselelwa; lapho i-FR-4 noma enye i-laminate ifanelana kangcono, lokho kunconywa esikhundleni salokho, kusetshenziswa uhla oluphelele lwezinto ze -PCB laminate.

Ngenxa yokuthi i-BT ivame ukusetshenziswa kakhulu ekwakhiweni okuqinile, okunesici esincane kanye nezinga lokupakisha, i-Highleap ihlanganisa ukwenziwa nokuhlanganiswa kwe -turnkey okuhlanganisa i-fine-pitch kanye nokubekwa kwe-BGA kanye nokuhlolwa kwe-X-ray, ngakho-ke i-substrate kanye nezingxenye ezikuyo zombili ziyaqinisekiswa. Uma ucela ikhotheshini, chaza i-BT laminate eqondile (noma i-Tg, i-Dk, kanye nezinhloso zakho zokulahlekelwa), inani lezingqimba kanye nezici ezinhle kakhulu, nokuthi ngabe ibhodi liyizinga le-substrate noma isakhiwo esijwayelekile, ukuze inqubo ifaniswe kahle.

7. Imibuzo Evame Ukubuzwa Nge-BT resin PCB

I-BT imele ini ku-resin ye-BT?

I-BT imele i-Bismaleimide Triazine, amakhemikhali amabili ahlanganiswe ukuze akhe i-thermosetting resin. Igama libonisa ukwakheka kwayo, futhi le nto ivame ukuhlanganiswa ne-epoxy kuma-laminate e-BT ebhizinisi.

Ingabe i-resin ye-BT ibiza kakhulu kune-FR-4?

Yebo — i-BT laminate ibiza ngaphezu kwe-FR-4 ejwayelekile ngenxa yokusebenza kwayo okuphezulu kanye nokucutshungulwa kwayo okudinga kakhulu. Ikhethwa lapho kudingeka khona izinzuzo zayo zokushisa kanye nogesi, hhayi njengokufakwa esikhundleni kwamabhodi ajwayelekile ngokuzenzakalelayo.

Ingabe i-resin ye-BT ingasetshenziswa ne-FR-4 evamile ku-hybrid stackup?

Ezimweni eziningi yebo — ama-stackup e-hybrid ahlanganisa i-laminate esebenza kahle lapho idingeka khona ne-FR-4 kwenye indawo ukuze kulinganiswe izindleko nokusebenza. Ukuthi iyafaneleka yini kuncike ekwakhiweni futhi kufanele kuqinisekiswe ngumenzi wakho.

Iyini i-Tg ejwayelekile ye-resin ye-BT?

Ama-laminate e-BT anikeza izinga lokushisa eliphakeme kakhulu lokushintsha kwengilazi kune-FR-4 ejwayelekile, okuyisona sizathu esiyinhloko sokusetshenziswa kwawo. Inani eliqondile liyahlukahluka ngokwezinga lomkhiqizo, ngakho-ke klama ishidi ledatha le-laminate elithile kunenani elijwayelekile.

Ingabe i-BT resin ayinayo i-halogen noma ihambisana ne-RoHS?

Amagreyidi amaningi e-BT laminate atholakala ngezinguqulo ezingenayo i-halogen kanye ne-RoHS, kodwa kuncike kumkhiqizo othize. Uma ukuhambisana nomthetho kubalulekile emakethe yakho, qinisekisa izimemezelo zegreyidi eliqondile ngaphambi kokulicacisa.

Kungani i-resin ye-BT isetshenziswa kuma-substrate ephakethe le-BGA?

I-CTE yayo ephansi kanye nokuzinza kwayo okulinganiselwe kugcina izici ezinhle ze-substrate zibhalisiwe futhi kunciphisa ukucindezeleka kokujikeleza kokushisa emajoyintini ephakheji, kuyilapho ukulahleka kwayo okuphansi kusekela izimpawu zesivinini esikhulu - konke kubalulekile ngaphakathi kwephakheji ye-BGA eqinile.