Izinsizakalo Zokukhiqiza ze-PCB Yesisekelo Se-Ceramic kanye Nokuhlanganiswa kwe-SMT

I -PCB yesisekelo se-ceramic isebenzisa i-alumina (Al₂O₃), i-aluminium nitride (AlN), noma i-silicon nitride (Si₃N₄) njengesisekelo somshini kanye nesivikelo sikagesi — akukho ungqimba lwe-dielectric phakathi kwesekethe yethusi kanye nendawo yokufaka. Ukumelana nokushisa kuhluka kusuka ku-0.3°C/W (AlN DBC) kuya ku-0.8°C/W (alumina DBC), uma kuqhathaniswa no-3°C/W we-aluminium MCPCB kanye no-15°C/W we-FR4.

Lo mhlahlandlela ugxile kulokho okuza ngemuva kokukhethwa kwezinto: ukuhlanganiswa kwe-thermal stack, ukujiya kwe-substrate, ukuqeda ubuso, izindlela zokwehluleka, ukuhlanganiswa, kanye nokubhala imininingwane.

1) I-PCB Eyisisekelo Se-Ceramic ku-Thermal Stack

I-substrate ye-ceramic ayisona isisombululo sokushisa esizimele. Yingqimba eyodwa esigxotsheni esiqala kusukela ekuhlanganeni kwedivayisi kuya emshinini wokupholisa — futhi izendlalelo ezingaphezulu nangaphansi kwayo zithinta ngqo ukumelana nokushisa kwesistimu.

Iphedi le-silicone TIM elingu-50 µm ku-3 W/m·K lengeza u-0.5–1.0°C/W phezu kwebhodi le-AlN DBC elingu-0.3°C/W, okucishe kuphindwe kabili i-total impedance. Ezinhlelweni eziningi, ukushintsha kusuka ku-silicone TIM kuya ku-phase-change material kubuyisa izinga lokushisa elingaphezulu lokuhlangana kunokuthuthukisa kusuka ku-alumina kuya ku-AlN.

Izinqumo ezintathu zokucaciswa ezithinta yonke i-stack:

• Ukumbozwa kwethusi okuphansi: Ithusi elingaphansi elimbozwe ngokuphelele linciphisa ukumelana kokusabalala esibonakalayo se-ceramic-to-TIM. Ukumbozwa okuyingxenye kudala izindawo ezifile zokushisa kungakhathaliseki ukuthi i-substrate ingakanani.
• Ubucaba bethusi obuphansi: I-TIR engu-≤25 µm ivumela i-TIM encane, ene-conductivity ephezulu (ushintsho lwesigaba, i-solder, i-silver sinter). Lokhu kucaciswa okukodwa kungashintsha i-conductivity ye-TIM kusuka ku-3 W/m·K kuya ku-150+ W/m·K.
• Ubukhulu be-substrate: Ukunciphisa kunciphisa ukumelana kokuqhuba okuqondile kodwa futhi kunciphisa ukusabalala kwezinhlangothi. Kumadivayisi amakhulu, ukunciphisa kungcono njalo. Kumadivayisi amancane asebenzisa i-substrate enkulu, model ngaphambi kokunquma.

2) Ukukhetha Ubukhulu Be-Substrate

Ubukhulu bulawula izinto ezimbili ngesikhathi esisodwa: ukumelana nokushisa (okuncane = okungcono) kanye nokuqina komshini (okukhulu = okunamandla). I-0.635 mm ezenzakalelayo ilungele izinhlelo zokusebenza eziningi — kodwa hhayi zonke.

Isithiyo esisodwa sidlula ukulungiswa kokushisa: i-voltage yokuhlukanisa. Kumandla e-dielectric angu-17 kV/mm, i-substrate ye-alumina engu-0.635 mm inikeza cishe i-10 kV yokuhlukanisa okusebenzayo. Izinhlelo zokusebenza ezidinga i->10 kV azikwazi ukusebenzisa i-substrate encane kungakhathaliseki ukuthi isabelomali sokushisa singakanani.

3) Izinketho Zokuqeda Okungaphezulu

Ukuphela kwendawo kunquma ukushintshwa kwensimbi, ukubopha kwentambo, kanye nesikhathi sokuphelelwa yisikhathi. Kumele kuchazwe ezindaweni eziphezulu nezingezansi ngokuzimela — futhi kumele kuhambisane nochungechunge oluphelele lokuhlanganiswa, hhayi nje umsebenzi wokuqala.

Uma kudingeka kokubili i-SMT kanye ne-wire bonding ebhodini elifanayo, chaza igolide eliqinile kuwo wonke ama-pad. Ukuqeda kwe-Zonal (i-ENIG kuma-pads e-SMT, igolide eliqinile kuma-pads e-bond) kubiza kakhulu ekubunzimeni kwenqubo kunokuba ukonga kwegolide kukufanele.

4) Izindlela Zokwehluleka Kwensimu

Ukwehluleka kwe-PCB okusekelwe ku-ceramic kungokwemishini futhi kuhlobene nobuso — akuhlobene namakhemikhali noma umswakama njenge-FR4. Zonke izindlela ezintathu ezinkulu zokwehluleka zingavinjelwa ngomklamo.

Ukuqhekeka okubangelwa ukufakwa kwezintambo yikona okuvamile kakhulu. Ukufakwa kwe-screw engenalutho ngaphandle kwezinsimbi zensimbi kusebenzisa imithwalo yamaphuzu engeke ikwazi ukuthwala i-alumina (ukuqina kokuphuka okungu-3–4 MPa·m½). Ukulungiswa: izinsimbi zensimbi eziboshwe nge-braced noma ze-epoxy kuzo zonke izindawo ze-screw; umkhawulo we-torque ongu-0.3–0.5 N·m we-M3 ngokusebenzisa izinsimbi ze-aluminium ku-alumina engu-0.635 mm. Ukunamathela okunamathelayo epuletini elibandayo kuqeda ngokuphelele imithwalo yamaphuzu okufakwa.

Ukuhlukaniswa kwe-DBC ngaphansi kokujikeleza kokushisa kwenzeka lapho ikhwalithi yebhondi ingaphansi noma i-geometry yethusi idala ukugxila kokucindezeleka. Iziqhingi ezinkulu zethusi ezihlukanisiwe ezinemiphetho engazelelwe ziyingozi enkulu. Lungisa: gwema izilinganiso zesici se-copper patch >5:1; chaza amandla amancane ebhondi ≥20 N/cm²; dinga ukuhlolwa kokushaqeka kokushisa ku-JEDEC JESD22-A104 ekuqinisekisweni kwesihloko sokuqala.

Ukuqhekeka komphetho kanye nokusabalala kwemifantu kuqala ngomonakalo wokuphatha — ukuqhekeka okuncane okwethulwa ngesikhathi sokugoba noma ibhodi eliwile. Ukuqhekeka akubonakali lapho kuhlolwa kodwa kusakazeka kusekethe evulekile ngaphansi kokujikeleza kokushisa. Ukulungisa: amakhona aqhekekile (irediyasi ≥0.3 mm); ≥0.5 mm ukuvuleka kwethusi kuya emaphethelweni; ukutholwa kwemifantu ekhanyayo yezindawo ezinokwethenjelwa okuphezulu.

Ukukhathala kwe-die-attach solder kuthinta ama-silicon dies ahlanganiswe ne-alumina — Ukungafani kwe-CTE okungu-~3.5 ppm/°C kudala ukucindezeleka kwe-shear okuqeda amalunga e-SAC305 ngaphakathi kwemijikelezo yokushisa yezimoto eyi-1,000–3,000. Lungisa: sebenzisa ama-substrate e-AlN kumadivayisi e-GaN/SiC (ukungafani kwe-CTE ~1.1 ppm/°C); chaza i-silver sintering ye-automotive die-attach — isiliva esihlanganisiwe sisinda imijikelezo eyi-10,000+ ku-ΔT = 150°C; dinga ingxenye engu-≤5% ye-void nge-X-ray.

5) Ukuhlanganiswa Nokuhlanganiswa

Amapharamitha ajwayelekile okuhlanganisa i-FR4 azolimaza i-substrates ze-ceramic. Umehluko awulona ushintsho olukhethwayo — uvimbela ukuqhekeka kanye nokwehluleka kwamalunga okunzima ukukuthola ngemva kokwenzeka.

Iphrofayili yokugeleza kabusha: Yehlisa izinga lokuma liye ku-1–2°C/s (uma kuqhathaniswa no-3°C/s we-FR4). Nweba indawo yokucwilisa ku-150–180°C kuya kumasekhondi angu-90–120 ukuze ulinganise izinga lokushisa kulo lonke i-ceramic ngaphambi kokungena ekugelezeni kabusha. Izinga lokushisa eliphakeme kanye nesikhathi esingaphezu koketshezi akukashintshi.

Izinketho zokunamathisela nge-die ngokwemfuneko yokuthembeka:

• I-solder ye-SAC305: Izinga elijwayelekile lezinhlelo zokusebenza ezingezona ezezimoto; ≤10% ingxenye engenalutho nge-X-ray; ifanele imijikelezo engaphansi kuka-3,000 ku-ΔT ≤ 100°C
• I-AuSn / AuGe eutectic: Amaphakheji e-hermetic kanye nokusetshenziswa kwezinga lokushisa eliphezulu; kudinga ama-pad aqediwe ngegolide; ukuqina kwamalunga okuphezulu kune-silver sinter
• Ukusika isiliva: Kungcono kakhulu kwezimoto kanye nezindiza; Ukuhanjiswa kwamalunga angu-150–250 W/m·K; akukho bungozi bokuncibilika emisebenzini elandelayo; kudinga ukuqeda ithusi elingenalutho noma i-Ag kuma-pad anamathiselwe nge-die-attach

Ukuxhumana kukagesi — izixhumi ezifanelana nokucindezela azikwazi ukusetshenziswa ku-ceramic. Izinketho ezijwayelekile: izinhloko zephini ezifakwe i-soldered; izixhumi ezisemaphethelweni ezinezixhumi zasentwasahlobo; ukubopha ikhebula leribhoni/eligobile; ukunamathisela ngqo ku-PCB yesistimu (phatha i-ceramic module njengengxenye, klama i-thermal pad kanye nevolumu ye-solder yesisindo se-ceramic kanye ne-CTE).

Ukunamathiselwa kwepuleti elibandayo, ukumelana nokushisa okuphansi kuya kokuphezulu: i-solder/i-braze → i-silver sinter → i-phase-change TIM ene-clamp → i-thermal grease ene-screw clamp.

6) Indlela Yokubhala Imininingwane Ephelele

Imininingwane engaphelele iyimbangela eyinhloko yokubambezeleka kokucaphuna kanye nokwehluleka kwento yokuqala — hhayi ikhono lokukhiqiza. I-PCB RFQ yesisekelo se-ceramic idinga la mapharamitha ayi-12, wonke:

1. Izinto ezingaphansi komhlaba kanye nobumsulwa — Al₂O₃ 96%, Al₂O₃ 99.6%, AlN, noma Si₃N₄
2. Ubukhulu be-substrate ± ukubekezelelana — isib., 0.635 mm ± 0.05 mm
3. Inqubo yokwenza insimbi — I-DBC, ifilimu ejiyile, ifilimu encane, noma i-AMB
4. Ubukhulu bethusi, phezulu naphansi — kuchazwe ngokuzimela; isib., 0.3 mm / 0.3 mm ye-DBC
5. Ukuqeda umphezulu, phezulu naphansi — ngokuvamile ayishiywa; ukuqeda phansi kumele kuhambisane nendlela yokunamathisela ipuleti elibandayo
6. Ubukhulu bebhodi kanye nokubekezelelana — faka i-chamfer noma i-radius ekhoneni uma kudingeka
7. Ububanzi obuncane bokulandelela kanye nesikhala — qinisekisa ngokumelene nekhono lomkhiqizi ngaphambi kokuqedela ukwakheka
8. Ngezidingo — ububanzi, izinto zokugcwalisa, ukuqeda
9. Izidingo zokuhlolwa kukagesi — i-voltage yokuqhubeka/yokuhlukanisa; i-voltage ye-hi-pot uma kudingeka; insimu yesibili evame ukushiywa ngaphandle
10. Izidingo zokufaneleka — ububanzi bokujikeleza kokushisa kanye nemijikelezo; amandla ebhondi; indinganiso esebenzayo (AEC-Q101, IEC 60068-2-14, MIL-PRF-38534)
11. Ukwahlukaniswa kwenani — uhlobo lomkhiqizo kanye nokukhiqiza kungase kusebenze ngezindlela ezahlukene ngamanani ahlukene kanye nezikhathi zokuhola
12. Ukuhlanganiswa kwezingqimba (imiklamo yezingqimba eziningi) — uchungechunge lwezendlalelo ze-ceramic kanye ne-conductor; ngokugcwalisa kanye nesivalo se-LTCC noma ngokubambisana

7) Imikhiqizo Ehlobene

• I-DBC Substrate: Ukwakhiwa kwe-PCB yesisekelo se-ceramic okuvame kakhulu kwe-elekthronikhi yamandla — ithusi eliboshwe kwi-ceramic ku-~1,065°C. Lapho onjiniyela bethi “i-PCB yesisekelo se-ceramic” yamamojula wamandla, ngokuvamile basho i-substrate ye-DBC enephethini.
• I-PCB Eqinile Ye-Ceramic Yefilimu: Ama-conductor aprintiwe esikrinini (5–20 µm) asebenza ku-850–1,000°C. Izindleko eziphansi kune-DBC yezinhlelo zokusebenza zamandla aphakathi nendawo; ivumela ama-resistor nama-capacitor ahlanganisiwe ngaphakathi kwesisekelo se-ceramic.
• I-AMB Substrate: I-Active Metal Brazing isebenzisa i-Ag-Cu-Ti braze ku-800–900°C. Isibopho sethusi ne-ceramic esiqinile kune-DBC; ikhethwa kakhulu kuma-substrate esisekelo se-Si₃N₄ namamojula ezimoto adinga impilo yomjikelezo wokushisa engaphezu kwe-10,000.
• I-LTCC: I-ceramic enezingqimba eziningi enama-conductor afakiwe kanye nama-vias asebenza ngokubambisana ku-850–900°C. Isetshenziselwa amamojula e-RF kanye namaphakheji e-multi-chip lapho isisekelo se-ceramic siyisakhiwo sokuxhumana esinezinhlangothi ezintathu, hhayi nje i-substrate yokushisa.
• I-PCB ye-IMS / Metal-Core: Inketho engabizi kakhulu uma isabelomali sokushisa se-ceramic singadingeki. Ukumelana nokushisa okuphezulu okungu-3–5× kune-alumina DBC. Ukukhetha okulungile uma isabelomali sokushisa sokusetshenziswa sikuvumela.
• Umhlangano we-PCB wesisekelo se-Ceramic: Ukufakwa kwe-die, ukubopha ucingo, kanye nokugeleza kabusha kwezinga lokushisa eliphezulu okutholwa kanye nokwakhiwa kwe-substrate kunciphisa ubungozi bokuphatha futhi kuqinisekisa ukuhambisana kwenqubo.

imibuzo ejwayelekile ukubuzwa

Uyini umehluko phakathi kwe-PCB yesisekelo se-ceramic kanye ne-substrate ye-DBC?

I-DBC (i-Direct Bonded Copper) iyindlela yokwenza insimbi — i-copper foil eboshelwe ku-ceramic ku-~1,065°C. Zonke izisekelo ze-DBC ziyi-ceramic base PCB, kodwa ama-ceramic base PCB nawo afaka ifilimu ejiyile kanye nokwakhiwa kwefilimu encane. Kuma-electronics anamandla la magama amabili avame ukusetshenziswa ngokushintshana; kuzinhlelo zokusebenza ze-RF, ifilimu encane esisekelweni se-ceramic ivame kakhulu kune-DBC.

Ingabe i-PCB yesisekelo se-ceramic ingayithatha indawo ye-PCB yensimbi eyinhloko ngokuqondile?

Akuyona ngaphandle kokuklama kabusha. I-Ceramic idinga ama-bushing ensimbi emigodini yokufaka, amazinga okugeleza kabusha kancane (1–2°C/s), azikho izixhumi ezifanelana nokucindezela, kanye nemithetho ehlukene yokushintshashintsha. Ukwanda kokushisa kungokoqobo — 0.3–0.8°C/W vs. 3°C/W ye-aluminium MCPCB — kodwa ukushintshana kudinga izinguquko ezicacile enqubweni yokufaka, yokuxhumanisa, kanye neyokuhlanganisa.

Yikuphi ukuqeda kobuso okudingekayo kokubili i-SMT kanye nokubopha ucingo?

Kudingeka igolide eliqinile (3–5 µm Ni / 0.5–2.0 µm Au electroplated). Ingqimba yegolide ye-ENIG engu-~0.05 µm incane kakhulu ekubophweni kwentambo futhi ikhiqiza ukwehluleka kokuphakamisa izibopho. Cacisa igolide eliqinile kuwo wonke ama-pad lapho kokubili i-SMT kanye ne-wire bonding kusekulandeleni kokuhlanganiswa.

Kungani ama-PCB esisekelo se-ceramic eqhekeka ngemva kokudlula ukuhlolwa okungenayo?

Iningi lokuqhekeka ngemva kokuhlolwa livela enkambisweni yokuhlanganisa, hhayi amaphutha e-substrate: ukufakwa kwezikulufo ezingenalutho, izinamathiselo ezigobile kakhulu, noma izindawo ezibandayo ezingalingani. Ukuqhekeka okuncane okungaphansi kokubalulekile okuvela ekusingeni - okungabonakali ekuhlolweni okujwayelekile - nakho kusakazeka kumasekethe avulekile ngaphansi kokujikeleza kokushisa. Ukutholwa kokuqhekeka kwe-fluorescent ekufakweni kwe-bushing engenayo kanye ne-metal bushing kuvimbela zombili izindlela zokwehluleka.

Isikhathi sokuhola sama-prototype e-PCB esisekelo se-ceramic singakanani?

I-Alumina DBC: amasonto ama-2–4. I-AlN DBC: amasonto ama-3–5. Ifilimu ejiyile: amasonto ama-3–4. Ifilimu encane: amasonto ama-4–6. Ubukhulu obungokwezifiso bunezela amasonto ama-1–2. Ukunikeza wonke amapharamitha angu-12 okucaciswa ku-RFQ kususa umthombo ovame kakhulu wokulibaziseka.

Ingabe i-PCB eyisisekelo se-ceramic iyafana ne-PCB eshisa kakhulu?

Cha. I-PCB enokushisa okuphezulu ihlanganisa i-ceramic, i-PTFE/ingilazi, i-polyimide, kanye ne-metal-core substrates — noma yiliphi ibhodi elilinganiswe ngaphezu komkhawulo we-FR4 ongu-130–150°C. Isisekelo se-ceramic yisigaba esisebenza kahle kakhulu: amazinga okushisa okusebenza angaphezu kuka-300°C, ukuhanjiswa kokushisa okungu-60–600× okuphezulu kune-polymer dielectrics. I-PTFE inokushisa okuphezulu kodwa ayinikezi inzuzo yokuhanjiswa kokushisa.

Caphuna i-PCB yakho yesisekelo se-Ceramic